JPH0440444U - - Google Patents
Info
- Publication number
- JPH0440444U JPH0440444U JP8155190U JP8155190U JPH0440444U JP H0440444 U JPH0440444 U JP H0440444U JP 8155190 U JP8155190 U JP 8155190U JP 8155190 U JP8155190 U JP 8155190U JP H0440444 U JPH0440444 U JP H0440444U
- Authority
- JP
- Japan
- Prior art keywords
- fixed contact
- base
- thick part
- case
- contact plate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 230000037431 insertion Effects 0.000 claims description 2
- 238000003780 insertion Methods 0.000 claims description 2
- 239000000853 adhesive Substances 0.000 claims 2
- 230000001070 adhesive effect Effects 0.000 claims 2
- 239000003795 chemical substances by application Substances 0.000 claims 1
- 230000000149 penetrating effect Effects 0.000 claims 1
- 229920001187 thermosetting polymer Polymers 0.000 claims 1
- 239000011800 void material Substances 0.000 description 1
Description
第１図は、本考案の一実施例を示す正面図、第
２図は、同上の左側面図、第３図は、同上の分解
斜視図、第４図は、従来例を示す正面図、第５図
は、同上の左側面図である。
１，２……固定接点板、１ａ，２ａ……固定接
点、１ｂ，２ｂ……接点部、１ｃ，２ｃ……端子
部、３……可動ばね、３ａ，３ｂ……可動接点、
４……ボビン、４ａ……鍔部、４ｂ，４ｃ……厚
肉部、４ｄ，４ｅ……一方面、４ｆ，４ｇ……他
方面、４ｈ，４ｉ，４ｊ，４ｋ……溝、５……ベ
ース、５ａ，５ｂ……挿通穴、６……ケース、６
ａ，６ｂ……内面、６ｃ，６ｄ……空隙。
FIG. 1 is a front view showing an embodiment of the present invention, FIG. 2 is a left side view of the same, FIG. 3 is an exploded perspective view of the same, and FIG. 4 is a front view of a conventional example. FIG. 5 is a left side view of the same as above. 1, 2... Fixed contact plate, 1a, 2a... Fixed contact, 1b, 2b... Contact part, 1c, 2c... Terminal part, 3... Movable spring, 3a, 3b... Movable contact,
4... Bobbin, 4a... Flange part, 4b, 4c... Thick wall part, 4d, 4e... One side, 4f, 4g... Other side, 4h, 4i, 4j, 4k... Groove, 5... Base, 5a, 5b...Insertion hole, 6...Case, 6
a, 6b...Inner surface, 6c, 6d...Void.
Claims (1)
とからなる固定接点板と、可動接点を設け電磁石
装置により駆動される可動ばねと、貫通した溝を
有した厚肉部を鍔部の外方に設けその溝に固定接
点板の接点部を圧入固定して厚肉部の一方面の外
部に固定接点を位置させ他方面を接点部の端面と
ほぼ一致させるようにしたボビンと、挿通穴に固
定接点板の端子部を挿通してボビンを搭載したベ
ースと、ベースに嵌着されるケースと、を有して
なり、前記ベースの挿通穴及び／又は前記ベース
とケースの嵌着部を熱硬化性の接着剤により封止
した電磁リレーにおいて、 前記ボビンの厚肉部の他方面と前記ケースの内
面との間に空隙を形成し、その空隙に前記接着剤
を充填してなることを特徴とする電磁リレー。[Scope of Claim for Utility Model Registration] A fixed contact plate consisting of a contact part with fixed contacts and a terminal part for external connection, a movable spring with movable contacts and driven by an electromagnetic device, and a penetrating groove. A thick part is provided outside the flange, and the contact part of the fixed contact plate is press-fitted into the groove of the thick part, and the fixed contact is positioned outside one side of the thick part so that the other side almost coincides with the end face of the contact part. a base on which the bobbin is mounted by inserting the terminal portion of a fixed contact plate into the insertion hole, and a case fitted on the base, In an electromagnetic relay in which a fitting portion between a base and a case is sealed with a thermosetting adhesive, a gap is formed between the other side of the thick part of the bobbin and the inner surface of the case, and the adhesive is applied to the gap. An electromagnetic relay characterized by being filled with an agent.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8155190U JPH0440444U (en) | 1990-07-31 | 1990-07-31 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8155190U JPH0440444U (en) | 1990-07-31 | 1990-07-31 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0440444U true JPH0440444U (en) | 1992-04-06 |
Family
ID=31627604
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP8155190U Pending JPH0440444U (en) | 1990-07-31 | 1990-07-31 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0440444U (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH10162710A (en) * | 1996-11-28 | 1998-06-19 | Matsushita Electric Works Ltd | Electromagnetic relay and manufacture of it |
| JP2014175163A (en) * | 2013-03-08 | 2014-09-22 | Omron Corp | Electromagnetic relay |
| WO2018159065A1 (en) * | 2017-02-28 | 2018-09-07 | オムロン株式会社 | Seal structure of electronic device, electronic device provided with seal structure, and manufacturing method of electronic device |
-
1990
- 1990-07-31 JP JP8155190U patent/JPH0440444U/ja active Pending
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH10162710A (en) * | 1996-11-28 | 1998-06-19 | Matsushita Electric Works Ltd | Electromagnetic relay and manufacture of it |
| JP2014175163A (en) * | 2013-03-08 | 2014-09-22 | Omron Corp | Electromagnetic relay |
| WO2018159065A1 (en) * | 2017-02-28 | 2018-09-07 | オムロン株式会社 | Seal structure of electronic device, electronic device provided with seal structure, and manufacturing method of electronic device |
| CN110073459A (en) * | 2017-02-28 | 2019-07-30 | 欧姆龙株式会社 | The manufacturing method of the seal construction of electronic equipment, the electronic equipment for having seal construction and electronic equipment |
| CN110073459B (en) * | 2017-02-28 | 2021-09-28 | 欧姆龙株式会社 | Sealing structure for electronic device, electronic device provided with sealing structure, and method for manufacturing electronic device |
| US11170957B2 (en) | 2017-02-28 | 2021-11-09 | Omron Corporation | Seal structure of electronic device, electronic device provided with seal structure, and manufacturing method of electronic device |