JPH0438575U - - Google Patents

Info

Publication number
JPH0438575U
JPH0438575U JP8024190U JP8024190U JPH0438575U JP H0438575 U JPH0438575 U JP H0438575U JP 8024190 U JP8024190 U JP 8024190U JP 8024190 U JP8024190 U JP 8024190U JP H0438575 U JPH0438575 U JP H0438575U
Authority
JP
Japan
Prior art keywords
test
under test
unit
unit under
main body
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP8024190U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP8024190U priority Critical patent/JPH0438575U/ja
Publication of JPH0438575U publication Critical patent/JPH0438575U/ja
Pending legal-status Critical Current

Links

Landscapes

  • Testing Of Individual Semiconductor Devices (AREA)
  • Testing Electric Properties And Detecting Electric Faults (AREA)
  • Tests Of Electronic Circuits (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)

Description

【図面の簡単な説明】[Brief explanation of drawings]

第１図は、本考案の一実施例の構成を示すブロ
ツク図である。 １……指令部、２……表示部、３……試験装置
本体、４……冷熱部、５……温度調節部、６……
テスト・プログラム、７……被試験ユニツト。 FIG. 1 is a block diagram showing the configuration of an embodiment of the present invention. 1...Command section, 2...Display section, 3...Test device main body, 4...Cooling section, 5...Temperature adjustment section, 6...
Test program, 7...Unit under test.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 試験条件を指令する指令部と、試験結果を表示
する表示部と、マイクロ・コンピユータである中
央演算処理装置を実装した試験装置本体と、前記
マイクロ・コンピユータを起動させて、前記試験
装置本体内に収納された被試験ユニツトを試験す
るテスト・プログラムと、被試験ユニツトの雰囲
気を低高温にする冷熱部と、この冷熱部を制御し
被試験ユニツトの雰囲気を一定にする温度調節部
とで構成し、前記被試験ユニツトの雰囲気温度を
監視しながら試験装置本体内の複数種のパツケー
ジ試験を低高温状態で同時に行なうことを特徴と
するパツケージの試験装置。 A test equipment main body is equipped with a command unit that commands test conditions, a display unit that displays test results, and a central processing unit that is a microcomputer. It consists of a test program that tests the housed unit under test, a cooling section that lowers the temperature of the atmosphere of the unit under test, and a temperature adjustment section that controls this cooling section and keeps the atmosphere of the unit under test constant. A package testing apparatus characterized in that a plurality of types of package tests are simultaneously conducted in a low and high temperature state within the test apparatus main body while monitoring the ambient temperature of the unit under test.
JP8024190U 1990-07-27 1990-07-27 Pending JPH0438575U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP8024190U JPH0438575U (en) 1990-07-27 1990-07-27

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP8024190U JPH0438575U (en) 1990-07-27 1990-07-27

Publications (1)

Publication Number Publication Date
JPH0438575U true JPH0438575U (en) 1992-03-31

Family

ID=31625122

Family Applications (1)

Application Number Title Priority Date Filing Date
JP8024190U Pending JPH0438575U (en) 1990-07-27 1990-07-27

Country Status (1)

Country Link
JP (1) JPH0438575U (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0815238A (en) * 1994-07-05 1996-01-19 Nec Corp Ic package evaluation system

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0815238A (en) * 1994-07-05 1996-01-19 Nec Corp Ic package evaluation system

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