JPH0438543Y2 - - Google Patents

Info

Publication number
JPH0438543Y2
JPH0438543Y2 JP331887U JP331887U JPH0438543Y2 JP H0438543 Y2 JPH0438543 Y2 JP H0438543Y2 JP 331887 U JP331887 U JP 331887U JP 331887 U JP331887 U JP 331887U JP H0438543 Y2 JPH0438543 Y2 JP H0438543Y2
Authority
JP
Japan
Prior art keywords
wiring board
wiring
boards
cover sheet
bonded
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP331887U
Other languages
Japanese (ja)
Other versions
JPS63112370U (en
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP331887U priority Critical patent/JPH0438543Y2/ja
Publication of JPS63112370U publication Critical patent/JPS63112370U/ja
Application granted granted Critical
Publication of JPH0438543Y2 publication Critical patent/JPH0438543Y2/ja
Expired legal-status Critical Current

Links

Description

【考案の詳細な説明】 (産業上の利用分野) 本考案は複数の配線基板を重ね合せてひとつに
まとめた複合配線基板に関するものである。
[Detailed Description of the Invention] (Industrial Application Field) The present invention relates to a composite wiring board in which a plurality of wiring boards are stacked and combined into one.

(従来の技術) 従来この種の複合配線基板は第4図のように、
少なくとも一面に配線パターンおよび絶縁層をも
うけた複数の配線基板1,2,3のおのおのの間
に両面粘着テープ4を挟んで貼着することにより
重ね合せ固定される構造が一般的であつた。
(Prior art) Conventionally, this type of composite wiring board is as shown in Figure 4.
Generally, a plurality of wiring boards 1, 2, and 3 each having a wiring pattern and an insulating layer on at least one surface are stacked and fixed by sandwiching and pasting double-sided adhesive tape 4 between each of the wiring boards 1, 2, and 3.

(考案が解決しようとする問題点) しかしながら前記従来構造においては重ね合せ
る配線基板の数が多くなればなる程両面粘着テー
プを多く使い、従つて部品点数が多くなり重ね合
せするのに時間がかかり、かつ前記両面テープを
各配線基板の間に配置しなければならないので組
立自動化がしにくかつた。
(Problem that the invention aims to solve) However, in the conventional structure, the more wiring boards to be stacked, the more double-sided adhesive tape is used, which means that the number of parts increases and it takes time to stack them. Moreover, since the double-sided tape must be placed between each wiring board, it is difficult to automate assembly.

従つて、本考案の目的は、上記した従来技術の
欠点を除き、部品点数を少なくして組立の時間を
短縮し、なおかつ組立自動化をし易くすることに
ある。
Therefore, an object of the present invention is to eliminate the drawbacks of the prior art described above, reduce the number of parts, shorten assembly time, and facilitate automation of assembly.

(問題点を解決するための手段) 上記の目的を達成するため、本考案は配線基板
を少なくとも2枚重ね合せ一方の配線基板面が露
出する他方の配線基板の開口部において接着シー
トにより両者を貼着した構造とした。
(Means for Solving the Problems) In order to achieve the above object, the present invention stacks at least two wiring boards and attaches them together using an adhesive sheet at the opening of the other wiring board where the surface of one wiring board is exposed. It has a pasted structure.

(実施例) 以下本考案の一実施例を第1図、第3図によつ
て説明する。可撓性の配線基板11,12,13
は夫々表面に配線パターンが形成され、かつ所望
の位置が絶縁性保護膜にて絶縁されている。配線
基板11,12には丸孔11a,12a、及び長
方形の孔11b,12bが同一位置に設けられて
おり、配線基板11には上記した孔の他に長方形
の孔11cが設けられている。カバーシート14
の下面には接着層が設けられている。カバーシー
ト14及び前記可撓性の配線基板11,12,1
3を重ね合せ貼着すると、配線基板12は配線基
板11に設けられた前記孔11cを介してカバー
シートと接着され、前記配線基板13は配線基板
11,12の同位置に設けられた前記丸孔11
a,12a及び長方形の孔11b,12bを介し
てカバーシートと接着される。このようにして、
前記配線基板11,12,13は重ね合せ貼着固
定され複合配線基板が形成される。
(Example) An example of the present invention will be described below with reference to FIGS. 1 and 3. Flexible wiring boards 11, 12, 13
A wiring pattern is formed on each surface, and desired positions are insulated with an insulating protective film. The wiring boards 11 and 12 are provided with round holes 11a and 12a and rectangular holes 11b and 12b at the same position, and the wiring board 11 is provided with a rectangular hole 11c in addition to the above-mentioned holes. cover sheet 14
An adhesive layer is provided on the lower surface of. Cover sheet 14 and the flexible wiring board 11, 12, 1
3 are superimposed and pasted together, the wiring board 12 is bonded to the cover sheet through the hole 11c provided in the wiring board 11, and the wiring board 13 is bonded to the cover sheet through the hole 11c provided in the wiring board 11, and the wiring board 13 is bonded to the hole 11c provided in the wiring board 11, 12. Hole 11
a, 12a and rectangular holes 11b, 12b to be bonded to the cover sheet. In this way,
The wiring boards 11, 12, and 13 are stacked and fixed together to form a composite wiring board.

第3図はこの複合配線基板の構造を模式的に示
した断面図である。
FIG. 3 is a cross-sectional view schematically showing the structure of this composite wiring board.

本考案の他の実施例を第4図によつて説明す
る。可撓性の配線基板21,22,23は夫々表
面に配線パターンが形成されかつ所望の位置が絶
縁性保護膜により絶縁されている。配線基板2
1,22には切欠25a,25bが同一位置に形
成され、配線基板21には上記した切欠の他に切
欠24が形成されている。カバーシート20の下
面には接着層が設けられている。カバーシート2
0および前記可撓性の配線基板21,22,23
を重ね合せ接着すると配線基板22は配線基板2
1の側辺に設けられた前記切欠24を介して前記
カバーシートと接着され、前記配線基板23は前
記配線基板21,22の同じ位置に設けられた前
記切欠25a,25bを介してカバーシートと接
着される。このようにして前記配線基板21,2
2,23が重ね合せ貼着固定され、複合配線基板
が形成される。以上の実施例においては配線基板
が可撓性のものについて説明したが、配線基板は
可撓性に限定されるものではなく、硬質の配線基
板であつてもよいし、又硬質の配線基板と可撓性
の配線基板との組み合わせであつてもよい。又実
施例では3枚の配線基板を重ね合せ貼着したもの
について説明したが、配線基板の枚数は3枚に限
定されるものでないことは勿論であり、又各配線
基板のおおきさも任意に設定できる。又カバーシ
ートは1枚に限定する必要はなく、数枚に分けて
も良い。
Another embodiment of the present invention will be described with reference to FIG. Each of the flexible wiring boards 21, 22, and 23 has a wiring pattern formed on its surface and is insulated at a desired position by an insulating protective film. Wiring board 2
Notches 25a and 25b are formed at the same position in 1 and 22, and a notch 24 is formed in wiring board 21 in addition to the above-mentioned notches. An adhesive layer is provided on the lower surface of the cover sheet 20. cover sheet 2
0 and the flexible wiring boards 21, 22, 23
When the wiring board 22 is overlaid and bonded, the wiring board 2
The wiring board 23 is bonded to the cover sheet through the notch 24 provided on the side of the wiring board 21, 22, and the wiring board 23 is bonded to the cover sheet through the notch 25a, 25b provided at the same position on the wiring boards 21, 22. Glued. In this way, the wiring boards 21, 2
2 and 23 are stacked and fixed together to form a composite wiring board. In the above embodiments, the wiring board was described as being flexible, but the wiring board is not limited to being flexible; it may be a hard wiring board, or it may be a hard wiring board. It may also be combined with a flexible wiring board. Furthermore, in the embodiment, three wiring boards are laminated and bonded together, but it goes without saying that the number of wiring boards is not limited to three, and the size of each wiring board can also be set arbitrarily. can. Further, the number of cover sheets need not be limited to one, and may be divided into several sheets.

[考案の効果] 上記に説明したように本考案によれば、配線基
板を少なくとも2枚重ね合せ、一方の配線基板面
が露出する他方の配線基板の開口部において接着
シートにより両者を貼着することにより両面貼着
テープを使う必要がなく、取扱いが容易でありし
かも部品点数が減るので組立の時間を短縮するこ
とができかつ組立の自動化がし易くなる。
[Effect of the invention] As explained above, according to the invention, at least two wiring boards are stacked one on top of the other, and the two are pasted together using an adhesive sheet at the opening of the other wiring board where the surface of one wiring board is exposed. This eliminates the need to use double-sided adhesive tape, making it easier to handle and reducing the number of parts, which shortens assembly time and facilitates assembly automation.

【図面の簡単な説明】[Brief explanation of the drawing]

第1図は本考案の複合配線基板の一実施例を示
す分解斜視図。第2図は第1図のものの模式的な
断面図。第3図は本考案の複合配線基板の他の実
施例を示す分解斜視図。第4図は従来の複合配線
基板を示す分解斜視図。 14,20……カバーシート、1,2,3,1
1,12,13,21,22,23……可撓性の
配線基板、4……両面粘着テープ、15……粘着
剤、11a,11b,11c,12a,12b…
…孔、24,25a,25b……切欠。
FIG. 1 is an exploded perspective view showing an embodiment of the composite wiring board of the present invention. FIG. 2 is a schematic cross-sectional view of the one shown in FIG. FIG. 3 is an exploded perspective view showing another embodiment of the composite wiring board of the present invention. FIG. 4 is an exploded perspective view showing a conventional composite wiring board. 14,20...Cover sheet, 1,2,3,1
1, 12, 13, 21, 22, 23... Flexible wiring board, 4... Double-sided adhesive tape, 15... Adhesive, 11a, 11b, 11c, 12a, 12b...
...hole, 24, 25a, 25b...notch.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 配線基板を少なくとも2枚重ね合せ、一方の配
線基板面が露出する他方の配線基板の開口部にお
いて接着シートにより両者を貼着したことを特徴
とする複合配線基板。
A composite wiring board characterized in that at least two wiring boards are stacked one on top of the other, and both are adhered with an adhesive sheet at an opening in the other wiring board where the surface of one wiring board is exposed.
JP331887U 1987-01-13 1987-01-13 Expired JPH0438543Y2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP331887U JPH0438543Y2 (en) 1987-01-13 1987-01-13

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP331887U JPH0438543Y2 (en) 1987-01-13 1987-01-13

Publications (2)

Publication Number Publication Date
JPS63112370U JPS63112370U (en) 1988-07-19
JPH0438543Y2 true JPH0438543Y2 (en) 1992-09-09

Family

ID=30782969

Family Applications (1)

Application Number Title Priority Date Filing Date
JP331887U Expired JPH0438543Y2 (en) 1987-01-13 1987-01-13

Country Status (1)

Country Link
JP (1) JPH0438543Y2 (en)

Also Published As

Publication number Publication date
JPS63112370U (en) 1988-07-19

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