JPH0438518Y2 - - Google Patents

Description

[Detailed description of the invention] (Technical field) The present invention is a semiconductor cleaning jig that can easily clean semiconductor wafers that have been cut and divided into smaller external dimensions without making any changes to existing semiconductor cleaning equipment. It is related to.

(Prior Art) In the semiconductor manufacturing process, a large number of monitor wafers are used to set conditions for the equipment used and to monitor conditions during wafer processing. In this case, in order to monitor wafers forming transistors, diodes, etc. as faithfully as possible, wafers from the same lot are usually extracted and used. However, since the unit price of a single wafer is high, it is preferable to divide a single wafer into small pieces and use them as a monitor in order to reduce manufacturing costs. , it is necessary to clean the wafer after it has been divided.

On the other hand, silicon semiconductor wafers are made in a circular shape for ease of handling, so cleaning jigs are designed to mount circular wafers, and this cleaning jigs can be handled rationally. The cleaning device is configured as follows. FIG. 1 is an external perspective view of a well-known cleaning jig, and FIG. 2 is a longitudinal sectional front view in the -' direction. In general, there are 25 pockets 3 that are stored adjacent to each other with a pitch of about 3 to 5 mm, and by opening a plurality of windows 4 between each pocket 3, the flow of the cleaning solution and the wafer can be controlled. It has a structure that enhances the draining effect when drying 2. The plurality of windows 4 provided on the outside of the kerf 3 are made as large as possible without causing any hindrance in order to enhance the flow of the cleaning liquid and the draining effect. Therefore, since wafers whose external dimensions have become smaller due to damage or cutting fall through the plurality of windows 4, this cleaning jig 1 is used to clean them.
cannot be used. Therefore, it became necessary to prepare another odd-shaped cleaning jig for cleaning divided wafers, and as a result of the different cleaning jigs, it became impossible to clean with the existing cleaning equipment, and a new cleaning equipment for small monitor pieces was installed. It had to be installed, which had the drawback of increasing costs and man-hours.

(Purpose of the invention) The purpose of the invention is to solve these drawbacks.
By removably attaching a support having a cut groove capable of supporting divided wafers whose outer dimensions have become smaller to approximately the center of the inner surface of the cleaning jig, the divided wafers can be handled with the same cleaning jig as the wafers before division. This will be described in detail below.

(Structure and operation of the invention) Fig. 3 is an external perspective view of a cleaning jig embodying the present invention, and Fig. 4 is a vertical sectional front view in the -' direction. 7 is a support for the divided wafer, and 7 is a pin for fixing the support 6 to the cleaning jig main body 5. The cleaning jig main body 5 has the same external shape as the conventional cleaning jig 1 that is compatible with existing cleaning equipment, and has a plurality of grooves 8 and a plurality of windows 4 for storing the circular wafers 2 before being divided. There is. A pair of supports 6 are disposed at approximately the center of both inner surfaces of the cleaning jig main body 5, facing each other over the entire length in the longitudinal direction, and are removably fixed from the sides with pins 7. . The support body 6 has a center angle A of the divided wafer 9.
A plurality of kerf grooves 1 having cutting angles tailored to
0, and as shown in FIG. 4, the split wafer 9 is inserted into the cut groove 10 and supported with the straight part having the central angle A facing down and the tip part protruding to the lower part of the support. do it like this. There are many different shapes for dividing a wafer as a monitor depending on the purpose, but if the shape is an acute angle with two straight sides that intersect, for example, the support has a cut groove 10 with a cut angle that matches the intersecting angle. Once the body 6 is prepared, divided wafers 9 of various shapes can be supported by replacing it with pins 7. Furthermore, if the cut grooves 10 are provided so that the split wafer 9 supported by the support 6 is parallel to the wafer 2 supported by the cut grooves 8 of the main body 5, the water draining effect when cleaning the split wafer 9 can be improved. can be increased.

The material of the support body 6 is not particularly limited as long as it is easy to machine and does not contaminate the wafer during cleaning, but it is preferably the same material as the cleaning jig main body 5.

Further, in this embodiment, the support body 6 is fixed by the pin 7 embedded from the side, but there is no particular restriction as long as the support body 6 can be detachably fixed.

When cleaning the divided wafer 9, as described above, by inserting the wafer 9 into the cut groove 10 of the support 6 with the center angle A facing downward, the wafer 9 can be cleaned without falling from the cleaning jig main body 5. Kerf 10
It is possible to stably support the same number of wafers at the same time, and since the external shape of the main body 5 is compatible with existing cleaning equipment, the divided wafers 9 can be cleaned using the existing cleaning equipment as is. can. Further, the present jig can also be used for cleaning undivided circular wafers 2 by removing the support 6.

In the above explanation, the wafer to be cleaned using the jig of the present invention is a split wafer for monitoring purposes used in semiconductor device manufacturing, but the wafers that can be cleaned with the jig of the present invention are not limited to split wafers for monitoring purposes. For example, even if a wafer is damaged from time to time during the manufacture of semiconductor devices, the damaged portion can be cut out and cleaned using the jig of the present invention. In the past, wafers that were damaged during semiconductor device cleaning were usually discarded because they could not be cleaned with conventional cleaning jigs as mentioned above, but wafers that were damaged during semiconductor device cleaning were usually discarded. Since damaged wafers can be completed as semiconductor devices without being discarded during the manufacturing process, manufacturing costs can be reduced.

(Effects of the invention) As explained above, according to the invention, a support body having a cut groove for supporting divided wafers having a reduced external size is removably attached to approximately the center of the inner surface of the cleaning jig. , the existing cleaning and drying equipment manufacturing line can be cleaned as is without any slight modification, and not only round wafers before division, but also divided monitor wafers and wafers damaged during process processing can be cleaned without discarding them. This makes it possible to reduce expenses and manufacturing costs.

[Brief explanation of the drawing]

Fig. 1 is an external perspective view of a conventional cleaning jig, Fig. 2 is a longitudinal sectional front view in the -' direction, Fig. 3 is an external perspective view of the embodiment of the present invention, and Fig. 4 is its -'
It is a longitudinal sectional front view of the direction. 5... Cleaning jig main body, 6... Support for divided wafer, 7... Pin, 8... Cut groove, 9... Divided wafer, 10... Cut groove.

Claims (1)

[Scope of utility model registration request] A cleaning jig main body for semiconductor wafers, and a pair of left and right supports removably provided opposite to each other at the center of the inner surface of the main body. 1. A semiconductor wafer cleaning jig comprising a pair of left and right supports each having a plurality of grooves in the longitudinal direction on the end faces of opposing surfaces, and a mounting member for mounting the main body and the supports.