JPH043725Y2 - - Google Patents

Description

[Detailed explanation of the invention] (a) Industrial application field This invention relates to the tip of a soldering iron, and in particular,
This invention relates to a soldering iron tip structure suitable for soldering flat package ICs and the like.

(b) Prior Art As the structure of the tip of a conventional soldering iron, for example, one constructed as shown in the side view of the main part in FIG. 3 has been used.

The soldering iron tip 1 shown in FIG. 3 is constructed by attaching a cylindrical rod with a thinly shaved tip portion 1a to a heater portion 2. As shown in FIG.

(c) Problems that the invention aims to solve However, the structure of the conventional example described above does not hold the solder on the tip of the soldering iron, or sucks up excess solder from the soldered surface. The disadvantage was that it was difficult to

Therefore, the applicant of this invention solved the drawbacks of the tip of the conventional soldering iron as shown in the perspective view of FIG. 4 and the side view of FIG. The iron tip structure is proposed first.

The iron tip structure shown in FIGS. 4 and 5 is as follows:
It is structured as follows.

In the figure, 11 is a soldering iron tip, and 11a is a tapered portion, which is formed by cutting the tip of one side surface 11a of the soldering iron tip 11 by slanting it inward. 1
Reference numeral 1c denotes a soldering surface, which is formed by cutting an inwardly inclined end portion of a side surface 11d opposite to the side surface on which the tapered portion 11a is formed.

Reference numeral 12 denotes a plate-shaped spring member which is bent into a dogleg shape, and one end 12a of which is attached to one side 11b of the soldering iron tip 11 with a screw 13.

The free end portion 12b of this spring member 12 is arranged so as to cover the tapered portion 11a while forming a slight gap with the tapered portion 11a.
The gap formed by the free end portion 12b of the spring member 12 and the tapered portion 11a is formed in a V-shape. That is, it is narrower as it approaches the attached end 12a, and wider as it approaches the tip 12c of the free end 12b. Furthermore, the tip 1 of the free end portion 12b of this spring member 12
2c is arranged to slightly protrude from the tip 11e of the soldering iron tip 11. Note that the spring member 1
2 uses a metal plate with solder and a spring effect. 2 is a heater section.

With the above configuration, when performing a soldering operation, for example, thread solder is brought into contact with the side wall surface next to the soldering iron tip 11 and melted, and a certain amount is poured into the gap. By pouring the melted solder into the gap in this way, the soldering iron tip 11 can hold a certain amount of solder. In this state, when the iron tip 11 is pressed against a predetermined soldering part, the spring member 12 is pressed in the direction of the tapered part 11a, and the gap narrows.
The solder held in the gap is removed by the spring member 1.
It is pushed out from the tip 12c of the soldering iron tip 11, wraps around from the tip 11e of the soldering iron tip 11 toward the soldering surface 11c, and adheres thereto. This pushed out leading edge part 11e
By using the solder adhered to the solder drawing surface 11c, soldering can be performed at a predetermined position.

After the above soldering, when the soldering iron tip 11 is slightly removed from the soldering surface, the pressure of the spring member 12 that has been pressed until now is released, and it returns to its old position due to its own restoring force, opening this gap to the previous wide area. During the restoration process, excess solder on the solder surface can be absorbed into the gap using capillary action. In addition, the tip 12c of the spring member 12 is arranged to slightly protrude from the tip 11e of the soldering iron tip 11. Therefore, the extrusion operation of the solder held in the gap can be ensured, and the extruded solder can be reliably transferred from the tip 11e of the soldering iron tip 11 to the solder drawing surface 11c.
It can be turned around.

However, in the iron tip structure shown in FIGS. 4 and 5 above, the thickness of the spring member 12 is, for example,
It is about 0.2mm to 0.3mm, and when the soldering iron tip 11 is separated from the soldering surface and a gap is formed,
Since it is naturally away from the tapered portion 11a, the amount of heat flowing into the spring member 12 is reduced, and the temperature of the spring member 12 is therefore lowered, making it easy for solder bridges to occur, so some kind of countermeasure was required. .

This idea was made in view of the above-mentioned points, and its purpose is to make it possible to keep the spring members warm even when the spring members are in a state where a gap is formed. To provide a soldering iron tip structure capable of suppressing temperature changes.

(d) Means for solving the problem The soldering iron tip structure according to this invention has a tapered part formed by tilting the tip of the soldering iron tip inward, and a gap is formed between this tapered part. A plate-shaped spring member is provided, and an auxiliary heating plate is provided on the outside of this spring member.

(e) Action A certain amount of solder melted with the soldering iron tip is poured into the gap formed between the tapered part formed at the tip of the soldering iron tip and the spring member and held there.

Next, when the tip of the iron is pressed against the part to be soldered, the spring member is pressed against the tapered part, narrowing the gap, and at the same time, the held solder is pushed out and soldering can be performed. .

When the tip of the iron is slightly removed from the soldering surface,
The pressure on the spring member is released, the spring member returns to its old position, the previously narrow gap widens, and the excess solder on the soldering surface can be absorbed into this widened gap using capillary action.

In addition, the spring member that has returned to its previous position can contact the auxiliary heating plate provided on the outside and maintain the same temperature as when it contacted the tapered part.
The occurrence of solder brittle etc. can be prevented.

(F) Embodiment An embodiment of the soldering iron tip structure according to this invention will be described based on FIGS. 1 and 2.
FIG. 1 is a perspective view of the main part, and FIG. 2 is a side view.

It should be noted that the applicant of this invention proposed the fourth
The same parts as those in the soldering iron tip structure shown in the drawings and FIG.

In the figure, 14 is an auxiliary heating plate, and the spring member 1
2, the spring member 12 is formed in a dogleg shape.
It is attached to the side surface 11b of the soldering iron tip 11 with a screw 13 together with a spring member 12 on the outside of the soldering iron tip 11. The auxiliary heating plate 14 is made of copper that is sufficiently thicker than the spring member 12. Furthermore, this auxiliary heating plate 14 has its tip 14a connected to the spring member 1.
It is formed slightly shorter than the spring member 12 so that the tip 12c of the spring member 2 can be exposed.

By configuring as described above, the spring member 12 is kept warm by contacting the auxiliary heating plate 14 when a gap is formed between the spring member 12 and the tapered portion 11a. Furthermore, when performing soldering work by pressing the soldering iron tip against the soldering surface, the spring member 12 is in a state of being pressed against the tapered part 11a.
It is kept warm by the heat from a.

In this way, the spring member 12 is connected to the auxiliary heating plate 14.
Except when moving between and the tapered part 11a,
The spring member 12 can be kept warm.
temperature changes can be suppressed.

(g) Effects of the invention According to the soldering iron tip structure of this invention, a large amount of solder can be held in the soldering iron tip.

There is no need to supply solder every time you solder.

Excess solder on the soldering surface can be absorbed by capillary action due to the gap formed between the tapered part and the spring member.

You can easily solder even in places where the terminal pin spacing is narrow, such as on flat package ICs.

By providing the auxiliary heating plate, even if the spring member is in a state where a gap is formed, temperature changes in the spring member can be suppressed, and the occurrence of solder bridges and the like can be prevented.

There are other effects.

[Brief explanation of the drawing]

1 and 2 show an embodiment of the tip structure of a soldering iron according to this invention, in which FIG. 1 is a perspective view of the main part, and FIG. 2 is a side view of the main part.
FIG. 3 is a side view of main parts showing a conventional example. Figures 4 and 5 show the tip structure of the soldering iron previously proposed by the applicant of this invention.
The figure is a perspective view of the main part, and FIG. 5 is a side view of the main part. Explanation of main drawing numbers, 11... Solder tip, 11a...
Tapered part, 11c...Soldering surface, 12...
Spring member, 14...Auxiliary heating plate,...Gap.

Claims (1)

[Claims for Utility Model Registration] A tapered part formed by tilting the tip of a soldering iron tip inward, and a plate-shaped spring member attached to form a gap between the tapered part, The tip of a soldering iron is configured such that solder can be held and sucked from the soldering iron tip using a gap between the tapered part and the spring member, and an auxiliary heating plate is provided outside the spring member, and the spring member A tip structure of a soldering iron, characterized in that it is configured so that it comes into contact with a taper and is heated when a gap is formed between the soldering iron and the taper.