JPH0436872A - Design backup system for electronic parts mounting process - Google Patents

Abstract

PURPOSE:To reduce the overall development cost and to obtain products of high reliability in a short time by automatizing the design backup system of the electronic parts mounting process throughout and to improve the reliability of the system to shorten the development period and reducing the labor in the trial manufacture stage. CONSTITUTION:Stored data related to a printed circuit board and various elements and temporary arrangement data of electronic parts is transferred to an analysis processing device by on-line. Electronic parts are virtually arranged on the printed circuit board on a CRT, and simulation is repeated till a desired reliability is obtained. Optimum arrangement data obtained after completion of simulation is transferred to a printed circuit board pattern design and producing device, and the printed circuit board is produced. Thus, products of high reliability are obtained in a short time because the process of simulation is performed by inline. Since the process of simulation is executed on the CRT, the trial manufacture stage is unnecessary to reduce the development design cost.

Description

DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to an electronic component mounting process design support system for manufacturing highly reliable modules in a short period of time.

[Conventional technology]

Conventional electronic component mounting process design support systems use a pattern design device for printed wiring boards based on empirical rules to create electrical wiring patterns for prototypes and generate placement data for electronic components. Prototype printed wiring boards are manufactured using normal manufacturing processes using
A component mounting machine recognized electronic components and wiring patterns through image processing, and mounted the components at predetermined positions based on the electronic component placement data. The prototype printed wiring boards that have been assembled and manufactured are evaluated through various reliability tests, and various simulations of heat, stress, vibration, and flow are conducted through separate batch processing to improve the reliability of the connections between electronic components. In order to reduce the stress applied to the connections of various electronic components, the placement and wiring patterns of electronic components are revised again and feedback is fed back to the printed wiring board pattern design and manufacturing equipment, and the process is repeated several times. After that, the final assembled printed wiring board was obtained. Related systems of this type include:
For example, JP-A-61-74399, JP-A No. 62-27164
．． This is discussed in No. 1, etc.

[Problem to be solved by the invention]

2. In the conventional technology, it is necessary to go through several trial production stages before obtaining the final product, which is a major obstacle to shortening the development period. Furthermore, since trial production is repeated using actual electronic components and printed wiring boards, there is a problem in that the overall development cost is increased.

The present invention aims to consistently automate and increase the reliability of the design support system for the electronic component mounting process, thereby shortening the development period and saving labor in the prototyping stage, thereby reducing the overall development cost and producing highly reliable products. The aim is to obtain it in a short period of time.

[Means to solve the problem]

To achieve the above purpose, printed wiring board.

The specifications and past placement data of electronic components are accumulated, and the data is transferred online to an analysis processing device that performs various simulations of heat, stress, vibration, and flow. After performing the analysis on the CRT, print the obtained optimal placement data]・
The data is transferred to the wiring board pattern design and manufacturing equipment, where the wiring is designed for the first time, the printed wiring board is manufactured using this data, and the mounting process of the component mounting machine is controlled based on the optimal layout data.・Electronic components are mounted on a wiring board to obtain a final product that has been assembled.

In addition, in order to achieve the other objectives mentioned above, the entire process of virtually arranging electronic components on a printed wiring board on a CRT and repeating simulations until the desired reliability is achieved is completely covered by CR.
This is done on T.

[Effect]

Accumulated data regarding specifications of printed wiring boards, electronic components, and temporary device data are transferred online to the analysis processing device. Electronic components are virtually placed on a printed wiring board on a CRT, and simulations are repeated until desired reliability is achieved.

After the simulation is completed, the obtained optimal layout data is transferred to the printed wiring board pattern design and manufacturing equipment, where the printed wiring board is manufactured for the first time. This allows the simulation process to be done in-line, making it possible to obtain highly reliable products in a short period of time. In addition, since all the simulation steps are performed on the CRTJ2, there is no need for a prototype stage, and development and design costs can be reduced.

〔Example〕

An embodiment of the present invention will be described below with reference to FIG. 1st
The figure shows an example of the basic configuration of an electronic component mounting process design support system for implementing the present invention. In the figure, first, the stored data section 1 has nine types of dimensions, patterns, and other specifications of electronic components and printed wiring boards to be mounted as a data base. The analysis section 2 creates a model based on each data provided from the accumulated data section 1, performs various simulations such as heat, stress, vibration, flow, heat and stress, heat and flow achievement problems, and reports the results. Graphically displayed on the CRTSa. The design section 5 generates a wiring pattern for a printed wiring board, lays out electrical connections and electronic components, and displays the results graphically on the CRT 3b. An example of the configuration of the component mounting machine 13 is the component suction device 12.
．． Stage 11 for electronic components. Image processing device 10. Processing unit 6. It consists of a stage 91 for printed wiring boards, an arm 8° for mounting parts, etc. The processing unit 6 recognizes the printed wiring board and electronic components using the image processing device 10, and sets the stage 1 for electronic components.
1 is driven to pick up a predetermined electronic component with a component suction device 12. Next, the component mounting arm 8 and the printed wiring board stage 9 are driven and moved to a predetermined position, and then alignment is performed to control the mounting of electronic components on the printed wiring board. The manufacturing department 14 manufactures wiring and other pattern films based on the optimal placement data of electronic components, and transfers them to a normal printed wiring board manufacturing process.

Next, an electronic component mounting process using the design support system shown in FIG. 1 will be explained with reference to FIGS. 2 and 3.

First, from the stored data section 1-, virtual arrangement data, dimensions, number of bins, material property values, etc. of electronic components are obtained, as well as various specifications such as virtual wiring data of the printed wiring board, number of layers of peer hole positions, material property values, etc. The data is transferred to the analysis section 2 online. The analysis unit 2 calculates CR, T g based on the data.
[Electronic components and printed circuit board] - Model the wiring board and virtually place electronic components on the printed wiring board. FIG. 2(a) is a layout diagram of a model of a printed wiring board in which electronic components are virtually arranged. In the figure, on the printed wiring board 21 are various logic circuit elements 24 that generate a large amount of heat.
゜27, various memory elements 22.26. Resistance 25. Capacitors 23° are arranged in a mixed manner. Various analyzes of heat, stress, vibration, flow, etc. are performed on this model assuming the usage environment, and the results are displayed graphically on the CRT 3a. As a result of the analysis, if a large stress value or high temperature distribution occurs in the part 24a and exceeds the allowable value, move to 24b and perform the analysis again to confirm that the large stress value or high temperature distribution occurring in the part 24,a is The analysis is repeated until a configuration that reduces the amount below the allowable value is achieved. At that time, analysis is performed within the range where the wiring pattern can be routed. Here are the actual usage environment conditions.

The logic circuit element 24. ．． 21 junction temperature Jc is about 150°C or less, and the temperature difference △T at the soldering part is about 80'C or less, and the frequency characteristics for vibration are kept except about 1.0Hz to 200Hz. It is necessary to design and arrange electronic components.

Therefore, as an example of the analysis procedure, in the case of thermal analysis, the logic circuit elements 2 are virtually arranged as shown in FIG. 2(a).
When analyzing Jc and ΔT in 4, Jc is approximately 150°C.
In addition, the 8T reached about 25"C or higher. Therefore, as shown in FIG. 2(b), when the logic circuit elements 24 and 27, which generate a large amount of heat, are moved and distributed and the analysis is performed again, J
c was reduced to approximately 1.25''C, and 8T was reduced to approximately 100°C.Furthermore, as shown in Figure 2(C), the logic circuit elements 24 and 27 were moved and distributed and the analysis was repeated. Finally, Jc becomes about 100°C, and 8T becomes about 60°C.
We were able to determine the rearrangement of the electronic components to fully achieve the desired specifications. Examples of thermal analysis have been given above, and FIG. 3 shows the results of a simulation as a practice problem for thermal analysis and stress analysis. In FIG. 3(a), the temperature of the printed wiring board 21 in the portion where the logic circuit elements 24 which generate a large amount of heat are concentrated is extremely high, and the temperature distribution is uneven. The printed wiring board 21 is locally significantly deformed due to the thermal stress generated based on this temperature distribution, and a large thermal stress is applied to the logic circuit element 24 and its solder connection portion. Therefore, as shown in FIG. 3(b), CR,
By moving the logic circuit elements 24 on T 3 a and distributing them at both ends of the printed wiring board 21, the resulting temperature distribution is also made uniform.

Thermal stress generated based on this temperature distribution reduces the deformation of the printed wiring board 21, and also reduces the thermal stress generated in the logic circuit element 24 and its solder connections. In the manner described above, the electronic components 24 on the printed wiring board are rearranged, and the rearrangement data of the electronic components with low thermal stress is obtained. This relocation data is then transferred to the design department 5 online. The design section 5 corrects the wiring pattern of the printed wiring board based on the rearrangement data from the analysis section 2.

The finally obtained wiring pattern data is transferred to the manufacturing department 14. After manufacturing the pattern film, an actual printed wiring board is manufactured for the first time through a normal printed wiring board manufacturing process. [Component mounting machine] The processing section 6 of 3 mounts various electronic components on the printed wiring board obtained from the manufacturing section 14 based on the wiring pattern and optimal placement data of electronic components transferred online from the design section 5. Then, the electronic component mounting process is completed.

A flowchart of the above analysis procedure is shown in FIG. First, various data on electronic components and circuit boards are input using the specification database of electronic components and circuit boards in the stored data section 1. Next, modeling and automatic division are performed in the analysis section 2 while looking at the CRT display. After the division is completed, the finite element method, boundary element method,
Various analyzes of heat, stress, vibration, and flow are performed using numerical analysis such as the finite difference method, and the analysis results are displayed on a CRT. It is determined from the analysis results whether the required specifications of the printed circuit board and electronic components are satisfied, and if it passes, the design department 5 designs the wiring pattern of the printed circuit board, and if it fails, it is modeled again and automatically divided by looking at the CRT display. Do it while doing it. When creating a wiring pattern for a printed circuit board in the design section 5, if there is great difficulty in manufacturing the printed circuit board or if the electrical characteristics cannot satisfy the desired values, the analysis section 2
This feedback is fed back to the model, the model is modified, simulations are performed, and the process is repeated until the optimal layout is possible. The finally obtained wiring pattern data is transferred to the printed wiring board manufacturing section 14 and the processing section 6 of the component mounting machine, and the overall analysis is completed. According to this embodiment, it is possible to arrange electronic components that satisfy the required specifications on the printed wiring board, so that a highly reliable product can be obtained. Furthermore, since the simulation part is inline, there is no need to make a prototype of the product, so the period from development to manufacturing can be shortened, and the development costs associated with prototyping can be reduced.

Next, a second embodiment of the present invention will be described using FIG. 5. This figure shows a flowchart of the design procedure in the stored data section 1 and the analysis section 2. As shown in the figure, the accumulated data section 1 has past design cases as a database, and data on each of the 12 dimensions of the target electronic components and printed wiring boards, including six types of dimensions and patterns, is stored for each case. is registered with. When data regarding electronic components and wiring boards to be mounted are input, a search and matching is performed in the database registered in the stored data section 1, and the most similar design example is output on the CRT. The designer creates a desired design object by adding missing electronic components or deleting excess electronic components on the CRT, and transfers the data to the analysis section 2. After modeling, the analysis section 2 designs and manufactures a desired printed wiring board and mounts electronic components using the same design procedure as in the first embodiment. According to this embodiment, the work of inputting data to be provided to the stored data section can be greatly reduced, and the number of calculation repetitions of the analysis section can be reduced, so that the design period can be shortened.

Next, a third embodiment of the present invention will be described using FIG. 6. 2(a) shows a layout diagram when various electronic components are mounted on a printed wiring board, and FIG. 2(b) shows a portion thereof. In the stored data section 1, the reliability required for each electronic component is classified into ranks and compiled into a data base along with specifications such as seven types of dimensions and patterns of electronic components and printed wiring boards.

When the designer inputs data regarding the electronic component and wiring board to be mounted, the required reliability of the input electronic component is displayed on the CRT, divided into ranks, as shown in FIG. 6(a).

Here, the required reliability is summarized for each condition in Table 1.

Table 1 Required Reliability Here, as shown in Table 1, the reliability is in the order of A>B>C. As needed, the designer sequentially extracts electronic components from around electronic components that require the highest reliability and transfers the data to the analysis unit 2, as shown in FIG. 2(b). Furthermore, if optimum placement is difficult due to wiring standards, etc., the reliability rank is sequentially lowered and the data is transferred to the analysis unit 2. After modeling, the analysis section 2 designs and manufactures a desired printed wiring board and mounts electronic components using the same design procedure as in the first embodiment.

According to this embodiment, the amount of data provided to the analysis section is significantly reduced, the calculation load on the analysis section is reduced, and the design period can be shortened.

〔Effect of the invention〕

Since the present invention is configured as described above, it produces the effects described below. First, each control part that makes up the manufacturing process is connected online and the specifications and layout data of electronic components and printed wiring boards are transferred, reducing errors and labor associated with re-entering data, and achieving high precision. Design can be done. In addition, the simulation part is done inline, eliminating the need for product prototypes, so the period from development to manufacturing can be shortened to less than 172 seconds compared to conventional products. Furthermore, since the process of temporarily mounting electronic components on a print/wiring board is all performed on a CRT, no parts are required and the number of prototypes is less than 172, reducing re-costs. Further, by simulation, the layout is designed so that the stress of the electronic components on the printed wiring board and their connections under the usage environment is below the allowable value, so a highly reliable product can be obtained.

[Brief explanation of drawings]

FIG. 1 is a basic configuration diagram of an electronic component mounting process design support system according to an embodiment of the present invention. FIG. 2 is a model diagram for thermal analysis of a printed wiring board on which electronic components are virtually arranged. FIG. 3 is a model diagram showing a thermal analysis in the case where semiconductor elements that generate a large amount of heat are virtually arranged in a concentrated manner on a printed wiring board, and an example of a thermal stress analysis based on the results. FIG. 4 is a flowchart of an analysis procedure for an electronic component mounting process based on the first embodiment of the present invention. FIG. 5 is a flowchart of the analysis procedure in the stored data section and the analysis section. FIG. 6 is a layout diagram of various electronic components on a printed wiring board when the reliability of the components is also displayed. [Explanation of symbols] ■...Accumulated data section 2...Analysis section 3...CR
T 4...Memory 5...Design Department
6... Processing section for component mounting machine 8... Arm for electronic component mounting 9... Stage 10 for printed wiring board... Image processing device 1]... Stage 12 for electronic components... Electronic component Adsorption device 14... Manufacturing department 21... Printed wiring boards 22 and 26... Various memory elements 23... Capacitors 24 and 27... Various logic circuit elements 25... Resistor 28... Logic Movable area of circuit element Kei 3 mouth
(tQ) [Figure of η needle ψ of Kazenkan] (b) 4th figure title■

Claims (3)

[Claims] 1. In a series of processes from the wiring design of printed wiring boards to the assembly and manufacturing process in which electronic components are mounted, we have an accumulated data department related to the specifications of electronic components and printed wiring boards, an analysis department that performs numerical calculations, and a wiring creation process for printed wiring boards. The production department consists of a design department, a manufacturing department that makes the actual printed wiring boards, and a processing department that actually mounts the parts on the printed wiring boards.Based on specifications and temporary placement data from the accumulated data department,
The analysis section analyzes heat, stress, vibration, flow, and heat and stress on a printed wiring board on which electronic components are virtually arranged.
After simulating the coupling problem of heat and flow, etc., and rearranging the electronic components to reduce the stress applied to various electronic components and increase the heat dissipation efficiency of the entire board, electrical connections are made by the design department. to prepare the wiring for the printed wiring board, and the processing section mounts various electronic components on the printed wiring board actually obtained by the manufacturing section based on the electronic component mounting position data generated by the design section. An electronic component mounting process design support system featuring: 2. A claim characterized in that electronic component placement data and printed wiring board wiring pattern data based on past similar analysis cases are registered in the accumulated data section as a knowledge database and provided to the analysis section as temporary placement data. The electronic component mounting process design support system according to item 1. 3. In the accumulated data section, electronic components to be designed are ranked according to required reliability, and boards around the electronic components are sequentially taken out from the highest rank and provided to the analysis section;
Claim 1 characterized in that various simulations are performed.
The electronic component mounting process design support system described.