JPH04362925A - Wiring board - Google Patents

Wiring board

Info

Publication number
JPH04362925A
JPH04362925A JP3458891A JP3458891A JPH04362925A JP H04362925 A JPH04362925 A JP H04362925A JP 3458891 A JP3458891 A JP 3458891A JP 3458891 A JP3458891 A JP 3458891A JP H04362925 A JPH04362925 A JP H04362925A
Authority
JP
Japan
Prior art keywords
layer
transparent electrode
connection conductor
glass substrate
aluminum layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP3458891A
Other versions
JP3260770B2 (en
Inventor
Yasushi Matsumura
Takao Minami
Original Assignee
Kyocera Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kyocera Corp filed Critical Kyocera Corp
Priority to JP03458891A priority Critical patent/JP3260770B2/en
Publication of JPH04362925A publication Critical patent/JPH04362925A/en
Application granted granted Critical
Publication of JP3260770B2 publication Critical patent/JP3260770B2/en
Anticipated expiration legal-status Critical
Application status is Expired - Fee Related legal-status Critical

Links

Abstract

PURPOSE: To improve the reliability regarding electric and mechanical connections and suppress connection resistance as much as possible.
CONSTITUTION: A connection conductor 31 formed on a glass substrate 22 is a laminate of a transparent electrode 24, a chromium layer 32, and an aluminum layer 33, and the width W3 of the chromium layer 32 and aluminum layer 33 is less than the width W2 of the transparent electrode 24. Consequently, even when the connection conductor 31 is covered with an anisotropic conductive layer which has shrinkability accompanying curing and the layer is cured, peeling from the glass substrate 22 due to shrinkage stress extends only to the chromium layer 32 and aluminum layer 33 and the transparent electrode 24 is not peeled, thereby preventing the connection conductor 31 from being disconnected by peeling off the glass substrate 22. Further, the chromium layer 32 and aluminum layer 33 are formed on the transparent electrode 24, so the electric resistance of the connection conductor 31 can be suppressed.
COPYRIGHT: (C)1992,JPO&Japio
JP03458891A 1991-02-28 1991-02-28 The liquid crystal display device Expired - Fee Related JP3260770B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP03458891A JP3260770B2 (en) 1991-02-28 1991-02-28 The liquid crystal display device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP03458891A JP3260770B2 (en) 1991-02-28 1991-02-28 The liquid crystal display device

Publications (2)

Publication Number Publication Date
JPH04362925A true JPH04362925A (en) 1992-12-15
JP3260770B2 JP3260770B2 (en) 2002-02-25

Family

ID=12418488

Family Applications (1)

Application Number Title Priority Date Filing Date
JP03458891A Expired - Fee Related JP3260770B2 (en) 1991-02-28 1991-02-28 The liquid crystal display device

Country Status (1)

Country Link
JP (1) JP3260770B2 (en)

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6781109B2 (en) 1999-01-14 2004-08-24 Sharp Kabushiki Kaisha Active matrix substrate having transparent connecting terminals
JP2012053467A (en) * 2011-09-14 2012-03-15 Semiconductor Energy Lab Co Ltd Liquid crystal display device
JP2013033558A (en) * 2009-03-31 2013-02-14 Dainippon Printing Co Ltd Touch panel sensor, laminate for creating touch panel sensor, and method for manufacturing touch panel sensor
US9059045B2 (en) 2000-03-08 2015-06-16 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and manufacturing method thereof
JP2015176312A (en) * 2014-03-14 2015-10-05 凸版印刷株式会社 Touch panel sensor and manufacturing method therefor
JP2015201509A (en) * 2014-04-07 2015-11-12 株式会社東芝 Array substrate, radiation detector, and manufacturing method of radiation detector
US9189033B2 (en) 2010-09-29 2015-11-17 Dai Nippon Printing Co., Ltd. Touchscreen panel sensor film and manufacturing method thereof

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6781109B2 (en) 1999-01-14 2004-08-24 Sharp Kabushiki Kaisha Active matrix substrate having transparent connecting terminals
US9368514B2 (en) 2000-03-08 2016-06-14 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and manufacturing method thereof
US9786687B2 (en) 2000-03-08 2017-10-10 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and manufacturing method thereof
US9059045B2 (en) 2000-03-08 2015-06-16 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and manufacturing method thereof
JP2013033558A (en) * 2009-03-31 2013-02-14 Dainippon Printing Co Ltd Touch panel sensor, laminate for creating touch panel sensor, and method for manufacturing touch panel sensor
US9189033B2 (en) 2010-09-29 2015-11-17 Dai Nippon Printing Co., Ltd. Touchscreen panel sensor film and manufacturing method thereof
JP2012053467A (en) * 2011-09-14 2012-03-15 Semiconductor Energy Lab Co Ltd Liquid crystal display device
JP2015176312A (en) * 2014-03-14 2015-10-05 凸版印刷株式会社 Touch panel sensor and manufacturing method therefor
JP2015201509A (en) * 2014-04-07 2015-11-12 株式会社東芝 Array substrate, radiation detector, and manufacturing method of radiation detector

Also Published As

Publication number Publication date
JP3260770B2 (en) 2002-02-25

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