JPH04356954A - Multielectrode pin - Google Patents

Abstract

PURPOSE:To provide multielectrode pins capable of high-density mounting and easily replasable, by forming a plurality of conductors in one electric pin. CONSTITUTION:An insulator 20 is formed in the periphery of a supporter 10 made of metal and having a base 12 and a head 14 And a plurality of conductors 30 are formed in the periphery of the insulator 20. The tips 32 of the head 14 and the conductors 30 are joined to the conductive pads 42, 44 of board 40 with solder respectively.

Description

[Detailed description of the invention]

0001

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electrical pin that is connected to a circuit board such as a ceramic board on which electronic components such as an LSI are mounted via a brazing material, and is electrically connected to other circuit boards.

0002

BACKGROUND OF THE INVENTION As this type of electrical pin, an electrical pin 50 shown in FIG. 7 is known (Japanese Patent Laid-Open No. 18346/1983). This electric pin 50 is made of Kovar and has an elongated base 52 and a head 54 formed at one end of the base 52 with a larger diameter than the base 52.
and has. The head portion 54 is connected to a conductive pad 59 of a ceramic substrate 58 via a brazing material 56, and the base portion 52 is electrically connected to a contact on another circuit board (not shown).

[0003] With the recent trend toward high-density packaging of computers, attempts have been made to arrange electrical pins 50 in a high-density manner. One idea is that, for example, by arranging the electrical pins 50, which were conventionally arranged at a pitch of 2.54 mm, at a pitch of 1.27 mm, a four times higher density arrangement can be achieved.

However, when the electrical pins 50 are arranged in this manner, the area of the conductive pads 59 on the salamic substrate 58, which are connected to the head 54 via the brazing material 56, cannot be secured as much as in the conventional case. As a result, the diameter of the head 54 has to be made smaller in accordance with the area of the conductive pad 59.
There is a possibility that the connection strength between the head 54 and the conductive pad 59 will decrease, and the necessary connection strength will not be obtained. Furthermore, if the electrical pins 50 are arranged in a high density, repair becomes extremely difficult. Therefore, there is a limit to high-density mounting by narrowing the arrangement pitch of the electrical pins 50.

On the other hand, although the field is different from that of electrical pins, Japanese Patent Application Laid-Open No. 15576/1983 discloses a connector 60 in which contacts 64 are arranged in high density as shown in FIG. This connector 60 has a columnar protrusion 62a that stands upright on an insulating substrate 62, and a plurality of contacts 64 that are integrally molded around the periphery of the columnar protrusion 62a. With this configuration, the connector 60 can be made smaller and more dense.

However, in this connector 60, the insulating substrate 6
2 and the columnar protrusion 62a are integrally formed, this technique cannot be directly applied to electrical pins that are supposed to be manufactured separately from the ceramic substrate. Furthermore, it is difficult to form the ceramic into a columnar shape by protruding from the insulating substrate, and there are also problems from the viewpoint of strength. Furthermore, in the event that the contactor 64 is damaged, since the columnar protrusion 62a is formed integrally with the insulating substrate 62,
Repair (replacement) is not possible.

[0007] Accordingly, an object of the present invention is to provide an electrical pin which can realize high-density packaging and is easy to repair (replace).

[0008]

[Means for Solving the Problems] The multipolar electrical pin of the present invention is
a support having an elongated base and a head formed on at least one end of the base and soldered to a conductive pad of the substrate; an insulator formed along the outer periphery of the base; and an insulator formed approximately parallel to the base. The device includes a plurality of conductors formed on the outer periphery of the body and having at least one end extended to be soldered to a conductive pad different from the conductive pad.

[0009]

DESCRIPTION OF THE PREFERRED EMBODIMENTS Preferred embodiments of the multipolar electrical pin according to the present invention will be described in detail below with reference to the drawings. FIG. 1 is a perspective view showing a mounted state of a first embodiment of the multipolar electrical pin of the present invention, and FIG. 2 is an exploded perspective view of the multipolar electrical pin of FIG.

The multipolar electric pin 1 includes a support 10 and an insulator 2.
0 and a plurality of conductors 30. As shown in FIG. 2, the support 10 is made of a metal material, and includes a base 12 that is elongated and rectangular in cross section, a head 14 formed at one end of the base 12, and a head 14 formed at the other end of the base 12. A pyramidal portion 16 is provided. The head 14 is connected to the base 12 in order to be mechanically stably soldered to the conductive pad 42 of the ceramic substrate 40.
It is formed larger than the cross-sectional area of . The other pyramid part 16
is formed to facilitate insertion of a contact provided on another board (not shown).

Next, the insulator 20 is formed in the form of a film from an insulating material such as Teflon, Kapton, or polyimide. Four pieces 2 corresponding to each side of the base 12 of the support 10
2 are integrally connected. One end of each piece 22 is provided with an extension 24 to prevent shorting between the conductor 32 and the head 12 of the support 10 and the conductive pad 42 of the substrate 40. Conductor 3
0 is a metal film such as copper foil, which is formed on each piece 22 of the insulator 20 so as to be parallel to the base 12 of the support 10. An extension part 32 extending beyond the extension part 24 of the insulator 20 is formed at one end of the conductor 30 and is soldered to a signal conductive pad 44 of the substrate 40 .

The electrical pin 1 is manufactured by the following steps. First, the support 10 shown in FIG. 2 is created from a square piece of Kovar or the like by header processing or the like. Next, conductors 30 are formed in stripes on the surface of each piece 22 of the insulator 20 by plating, pasting foil, or the like. When forming the conductor 30 by plating, the tip of the extension 24 of each piece 22 is removed with a solvent so that the extension 32 of the conductor 30 is not supported by the extension 24 . Subsequently, the insulator 20 is wrapped around the base 12 of the support 10 and bonded. Note that the insulator 20 may be formed into a cylindrical shape, and may be attached and bonded from the pyramidal portion 16 side.

[0013] When the electrical pin 1 manufactured by the above process is bonded to the conductive pads 42 and 44 of the substrate 40, the following advantages are obtained. That is, by connecting one electrical pin 1 to the board, electrical connection of a plurality of poles (four poles in this embodiment) can be realized, and high-density packaging can be achieved. In addition, since the head 14 is formed to have a relatively large diameter, the necessary connection strength is ensured. Furthermore, if the electrical pin 1 is damaged, it can be easily replaced. Note that the support 10 can also be used as one of the conductors.

FIG. 3 is a perspective view showing a mounted state of a second embodiment of the multipolar electric pin 1' of the present invention. FIG. 4 is an exploded perspective view of the multipolar electrical pin of FIG. 3. Reference numbers corresponding to the first embodiment are appended with a prime (').

The electric pin 1' of this embodiment is composed of a metal support 10', an insulator 20' and a conductor 30', as in the first embodiment. The support 10' has a hexagonal prism-shaped base 12' and a head 14'. The difference from the first embodiment is that one end of the film-like insulator 20' comes into contact with the head 14' of the support 10' and does not have an extension. Instead, the extensions 32' of each of the six conductors 30' are bent away from one end of the insulator 20';
As a result, the head 14' of the support 10' and the conductor 3
0' is insulated from the extension part 32'. Another difference is the number of conductors 30' and their shapes. Since six conductors 30' are provided, higher density packaging can be realized. Further, since the conductor 30' is formed from a square wire material, it is possible to realize a solder joint with a three-dimensional bulge, which improves the connection strength, and also strengthens the strength of the conductor 30' itself.

In the manufacturing process of the electrical pin 1' of this embodiment, a conductor 30' whose extension part 32' is bent in advance is connected to an insulator 2.
It is substantially the same as the first embodiment except that it is glued to each piece 22' of 0'.

FIG. 5 is a perspective view showing the mounting state of a third embodiment of the multipolar electrical pin of the present invention. FIG. 6 is an exploded perspective view of the multipolar electrical pin of FIG. 5. Reference numbers corresponding to the first embodiment are marked with a double prime ('').

The electric pin 1'' of this embodiment includes a metal support 10'', an insulator 20'' and six conductors 30'.
A metal tube 18 is provided outside the '. The support 10'' includes a cylindrical base 12'', a head 14'' and a warhead-like portion 16'.
' and inserted into the hollow 19 of the metal tube 18. An insulator 20'' is coated on the outer circumference of the metal tube 18. Each conductor 30'' is a cladding, foil, or plating of copper or the like formed on the outer periphery of the insulator 20''.

The manufacturing process of the electrical pin 1'' of this embodiment is as follows. That is, first, an insulator 20'' is coated around the outer circumference of the metal tube 18. Next, each conductor 30'' is bonded or clad on the outer periphery of the insulator 20'' so that the six conductors 30'' are substantially parallel to the support 10''. Note that each conductor 30'' may be formed by plating. Support body 10'' pre-formed by header processing etc.
whose head 14'' is one end of the metal tube 18 and the insulator 20
'' into the hollow 19 so as to abut one end of the ''. The support body 10'' and the metal tube 18 are coupled by press fitting or adhesive.

The multipolar electrical pin of the present invention has been described above based on each embodiment. However, the present invention should not be limited to the above embodiments, and various modifications and changes can be made depending on the application. For example, the number of conductors may be other than four or six. Further, the base of the support body in the first and second embodiments may be formed on a cylinder, or an insulator may be formed in a cylindrical shape, and the support body may be inserted into the insulator. Furthermore, a multipolar electric pin may be formed by directly coating the outer periphery of the support with an insulator and adhering a conductor to the outer periphery. Alternatively, the support and the insulator may be integrated, that is, the support may be made of an insulator and the conductor may be directly formed on the outer periphery of the support. In this case, a metal film that can be soldered to the head is formed. Furthermore, when a multipolar electrical pin is directly soldered to two substrates, heads may be formed at both ends of the base of the support and extensions thereof may be formed at both ends of the conductor.

[0021]

[Effects of the Invention] According to the multi-pole pin of the present invention, electrical connection of multiple poles can be realized by connecting one electrical pin to the board,
High density packaging is achieved. Further, since the support body is provided at the center, which can be soldered, the required mechanical connection strength can be obtained by connecting the head of the support body and the pads of the substrate. Furthermore, since high-density packaging can be achieved without arranging the electrical pins at narrow pitches, repair (replacement) is easy if the electrical pins are damaged. Furthermore, if the support is made of a highly conductive material, a microstrip line with regular intervals between each conductor is formed, which is suitable for a high frequency signal transmission path.

[Brief explanation of the drawing]

FIG. 1 is a perspective view showing a mounted state of a first embodiment of a multipolar electrical pin of the present invention.

FIG. 2 is an exploded perspective view of the multipolar electrical pin of FIG. 1;

FIG. 3 is a perspective view showing a mounting state of a second embodiment of the multipolar electrical pin of the present invention.

FIG. 4 is an exploded perspective view of the multipolar electrical pin of FIG. 3;

FIG. 5 is a perspective view showing the mounting state of a third embodiment of the multipolar electrical pin of the present invention.

FIG. 6 is an exploded perspective view of the multipolar electrical pin of FIG. 5;

FIG. 7 is a sectional view showing a conventional electrical pin.

FIG. 8 is a perspective view showing a conventional connector.

[Explanation of symbols]

Claims (1)

[Claims] 1. A support having an elongated base, a head formed on at least one end of the base and soldered to a conductive pad of a substrate, an insulator formed along the outer periphery of the base, and an insulator formed along the outer periphery of the base; A multipolar electrical pin comprising a plurality of conductors formed approximately in parallel on the outer periphery of the insulator, at least one end of which extends and is row-bonded to a conductive pad different from the conductive pad.