JPH04352611A - Electronic part emboss taping device - Google Patents

Abstract

PURPOSE:To obtain an emboss tape wherein dispersion of separation strength of a cover tape is minimized by performing sealing by means of a sealing mold provided with heat pipes in an emboss taping device. CONSTITUTION:Since temperature dispersion on the heat generation surface of a heater 22 and temperature dispersion due to uneven contact between the heater 22 and a sealing mold 18 are equalized by heat equalizing property of a heat pipe 24 and temperature dispersion on a sealing surface 23 is minimized, separation strength of a cover tape of emboss tape which has been thermally bonded by means of the mold 18 has smaller dispersing in comparison with conventional one.

Description

[Detailed description of the invention]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a sealing technique for an embossed taping device for electronic parts.

2. Description of the Related Art Embossed tape for shipping and packaging electronic components, as shown in FIG. The cover tape 4 is heat-sealed onto the carrier tape 2 after the electronic component 1 is inserted into the embossed portion 3. What is important in terms of the quality of embossed tape is the cover, which is the force required to peel off the cover tape 4 from the carrier tape 2 when installing the electronic component 1 in the embossed tape onto the circuit board. The purpose is to reduce the variation in tape peel strength, which is shown in Fig. 2 when heat-sealing the carrier tape 2 and the cover tape 4 on top of the sealing mold 5.
This is achieved by reducing the temperature variations of the sealing surface 6 of the. Usually, as a heat source for cover tape thermal sealing, a cartridge heater having a cylindrical heating surface, a space heater having a flat heating surface, or the like is fitted into the sealing mold 5 and heated to perform sealing. However, the heaters themselves already have temperature variations on the heater surface, and furthermore, the sealing mold 5
, temperature variations also occur on the sealing surface 6 due to uneven corrosion with the sealing mold 5 when fitted to the sealing mold 5, and this temperature variation can be eliminated by increasing the length of the sealing surface 6. As the peel strength of the sealed cover tape increases, the variation in peel strength of the sealed cover tape also increases. Therefore, the more you try to reduce the variation in peel strength of the cover tape, the shorter the length of the sealing surface will have to be compared to the heat generation length of the heater. There is a problem with having to use a heater. Furthermore, when the heater is removed from the inside of the sealing mold 5 and replaced during maintenance such as replacing the heater, the temperature variation on the sealing surface 6 cannot be reproducible.
There is a problem in that it is difficult to set the sealing temperature conditions.

[Problems to be Solved by the Invention] The problem to be solved is that the sealing mold of the embossed taping device using the conventional method has a large temperature variation on the sealing surface, which causes variation in the peel strength of the cover tape, and the tendency is The longer the sealing length, the longer it becomes, which makes it difficult to increase the length of the sealing surface, and it is difficult to set the sealing temperature conditions because it is difficult to reproduce temperature variations on the sealing surface during maintenance such as heater replacement. That is the point.

[Means for Solving the Problems] In order to solve the above-mentioned problems, the present invention provides a sealing mold in which a heat pipe is fitted in a sealing mold, and the heat uniformity of the sealing surface is achieved by the heat uniformity of the heat pipe. To provide an electronic component emboss taping device with a mold.

Embodiment 1 FIG. 3 is an overall view of an electronic component emboss taping apparatus according to an embodiment of the present invention. The sequence of steps is shown below. The carrier tape 2 with no electronic components inserted is pulled out from the carrier tape reel 10, the top of the chute 13 is fed by the feed roller 12, and the electronic components are transferred to the carrier tape embossed part 3 by the electronic component insertion unit 14.
The cover tape 4 pulled out from the cover tape reel 15 is placed over the carrier tape 2 by the guide roller 17, and the sealing mold 18 is heated to a constant temperature by the fitted heater. Lower cover tape 4
, is heat-sealed onto the carrier tape 2 and the take-up reel 19
, stored in. Next, FIG. 4 shows a peripheral view of a sealing mold, which is a central component of the present invention. Further, FIG. 5 is a sectional view taken along the line AA in FIG. 4. A heater 22 is fitted into the sealing mold 18 using a sealant such as heat-resistant grease to ensure thermal conductivity. The surface 23 is a sealing surface that comes into contact with the cover tape during heat fusion, and a heat pipe 24 parallel to the surface 23 is sealed with a sealant in the same way as the heater 22, and both ends are plugged and sealed. . 25
, is a heat insulating board that prevents heat conduction to the outside air. 28 indicates a cylinder that drives the sealing mold 18 up and down, but if it is a mechanism that drives the sealing surface 23 in the vertical direction, for example, a cam type up and down mechanism driven by a motor, etc.
It doesn't matter what kind of mechanism it is. 31 is a thermocouple that detects the temperature of the sealing surface 23, and the heater 2
2. The temperature of the sealing surface 23 is maintained at a set temperature using a temperature adjustment circuit. 2 indicates a carrier tape, and 4 indicates a cover tape. The effects of this embodiment will be described below. The heat generated by the heater 22 is conducted inside the sealing mold 18 and also heats the heat pipe 24, causing the sealing surface 23 to heat up.
, reaches. The thermocouple 31, 23 has the aforementioned temperature adjustment circuit that keeps the surface temperature constant, but the heat generation temperature of the heater 22 differs depending on each part of the surface of the heater 22. For example, the temperature of a plurality of arbitrary points on the surface of the heater 22 differs from one another. Similar to the heater 22, the heat conducted to the heat pipe 24 also causes temperature differences between different parts. The temperature difference at a plurality of arbitrary points on the heater 22 is smaller than that on the heater 22. Therefore, variations in the cover tape peel strength of the embossed tape sealed with the sealing surface 23 are smaller and more stable than in the case where sealing is performed with a conventional sealing mold without a heat pipe.

[Embodiment 2] The embodiment of the present invention shown in FIG. 6 differs from the first embodiment described above in that a plurality of heat pipes 24a, 24b are arranged and fitted in parallel, so that a plurality of sealing surfaces 23a , 23b.

[Embodiment 3] The embodiment of the present invention shown in FIG. 7 has a plurality of sealing surfaces 23a, 23b,
The heat pipe 24c is extended so as to be perpendicular to 1.
The sealing surfaces 23a and 23b are arranged to equalize the temperature difference between the plurality of sealing surfaces 23a and 23b.

[Effects of the Invention] The effects obtained by the present invention are briefly explained as follows. The heat uniformity effect of the heat pipe fitted inside the sealing mold compensates for variations in the heat generation temperature of the heater itself, and minimizes the temperature difference on the sealing surface, resulting in a consistently stable and reproducible product. An embossed tape with cover tape peel strength is obtained. Furthermore, the heat-uniforming effect allows the sealing surface to be made longer, making it possible to seal a plurality of electronic components at the same time. An electronic component emboss taping device having the above features can be provided. Although the invention made by the present inventor has been specifically explained based on Examples above, the present invention is not limited to the above Examples.
It goes without saying that various changes can be made without departing from the gist of the invention.

[Brief explanation of the drawing]

FIG. 1 is an explanatory diagram of an embossed tape for shipping and packaging electronic components, which is the field of application of the present invention.

FIG. 2 is an explanatory diagram of a conventional sealing mold.

FIG. 3 is an overall explanatory diagram of an electronic component emboss taping apparatus in an embodiment of the present invention.

FIG. 4 is an explanatory diagram of the vicinity of a sealing mold according to Embodiment 1 of the present invention.

FIG. 5 is a cross-sectional view taken along the line AA indicated in FIG. 4;

FIG. 6 is an explanatory diagram of a sealing mold according to a second embodiment of the present invention.

FIG. 7 is an explanatory diagram of a sealing mold according to a third embodiment of the present invention.

[Explanation of sign]

1... Electronic component inserted into the embossing 2... Carrier tape 3... Embossed part 4 into which the electronic component is inserted... Cover tape 5... Sealing mold 6... Sealing surface 10 ... Carrier tape reel 12 ... Feed roller 13 ... Chute 14 ... Electronic component insertion unit 15 ... Cover tape reel 17 ... Guide roller 18 ... Sealing mold 19 ... Winding Take-up reel 22... Heater 23, 23a, 23b... Sealing surface 24, 24a
, 24b, 24c... Heat pipe 25... Heat insulating plate 28... Mold vertical drive cylinder 31... Thermocouple

Claims (1)

[Claims] 1. An electronic component embossing taping device having a sealing mold fitted with a heat pipe.