JPH04351235A - Working table in plate working machine - Google Patents

Abstract

PURPOSE:To solve the problem that, ordinarily, a space by a work size is necessary since an operator carries a work onto a working table from, e.g. a work loading device provided adjacently on the working table in order to carry the work to the work table in a plate working machine, such as a laser beam machine. CONSTITUTION:On one side of the working table 5 in the plate working machine 1, plural steps of shelves 21 for housing the works W are provided, and arranged as vertically movably with, e.g. a lifter 29 so that each step in this shelves 21 becomes the same height level as the table face.

Description

[Detailed description of the invention]

0001

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a work table in a plate processing machine such as a laser processing machine or a turret punch press.

0002

[Prior Art] Conventionally, in a laser beam processing machine of the 1-axis optical, 1-axis work movement type, which is used as a plate processing machine, the work to be processed is supported on a work table, and the work is moved in the X-axis direction. , the laser processing head was moved in the Y-axis direction to perform laser processing on a desired position on the workpiece.

[0003] In order to support the workpiece on the worktable, a workpiece loading device or the like is disposed adjacent to the worktable, and the workpiece is carried onto the worktable from the workpiece loading device.

0004

[Problems to be Solved by the Invention] As mentioned above, since the workpiece loading device is placed adjacent to the worktable and the worker, for example, carries the workpiece from the workpiece loading device onto the worktable, it takes up a lot of space. There is a problem in that the size of the workpiece is required, and additional space is required. Additionally, there is a dead zone below the left and right sides of the work table.

[0005] In view of the above circumstances, an object of the present invention is to provide a workpiece processing machine for a plate material processing machine in which the lower position of the worktable is effectively used to save space and the workpieces can be automatically loaded. It's about providing a table.

[0006]

[Means for Solving the Problems] In order to achieve the above object, the present invention provides a work table for a plate processing machine that supports and moves a work, the work being stored on one side of the work table. A work table for a plate material processing machine was constructed by having a shelf consisting of a plurality of tiers, and each tier of the shelf being movable up and down so that each tier was at the same height as the table surface.

[0007]

[Operation] By employing the work table in the plate processing machine of the present invention, one side of the work table is provided with a shelf consisting of a plurality of stages for storing work pieces. Moreover, since this shelf is vertically movable, each tier can be set at the same height as the table surface by moving the shelf up and down.

[0008] Workpieces at each stage set at the same height as the table surface are supported by the work table surface, and plate material processing is performed. Therefore, there is no need to arrange a workpiece loading device or the like adjacent to the worktable, thereby saving space, and the workpieces are automatically carried onto the worktable.

[0009]

Embodiments Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings.

Referring to FIG. 3, for example, a laser processing machine 1 as a plate processing machine is equipped with a C-shaped frame 3, and a work table 5 is mounted on a lower frame 3D of this frame 3 in the X-axis direction ( It is provided extending in the left-right direction in FIG. A laser oscillator 7 is provided on one side of the upper frame 3U of the frame 3 (on the right side in FIG. 3).
are integrally installed.

Furthermore, a laser processing head 9 is provided within the upper frame 3U, which is movable in the Y-axis direction by a known ball screw, drive motor, or the like. This laser processing head 9 is equipped with a bend mirror 11 and a condenser lens 13. Furthermore, the upper frame 3
A bend mirror 15 is provided on the left end side of the U.

A processing groove 17 extending in the Y-axis direction is formed in a substantially central portion 5C of the work table 5 in the X-axis direction. Further, on the right side portion 5R of the work table 5, a plurality of support balls 1 for supporting the work W are provided.
9 is rotatably supported. On the left side of the work table 5, a shelf 21 consisting of a plurality of stages storing workpieces W is provided so as to be movable up and down.

A carriage base 23 extending in the X-axis direction is integrally attached to one end side (rear end side in FIG. 3) of the work table 5. This carriage base 23 is already provided with a carriage 25 that is movable in the X-axis direction by a known ball screw, drive motor, or the like. A plurality of work clamps 27 for clamping the work W are attached to the carriage 25. Furthermore, this work clamp 27 is freely movable forward and backward, as is already known.

With the above configuration, a desired position in the X-axis direction of the workpiece W supported on the worktable 5 and clamped by the workpiece clamp 27 can be set by moving the carriage 25 to the X-axis direction.
It is positioned in the machined groove 17 by moving it in the axial direction. Further, the laser processing head 9 is moved in the Y-axis direction to position the workpiece positioned in the processing groove 17 at a desired position.

In this state, the laser beam LB oscillated by the laser oscillator 7 is bent by the bend mirror 15, further bent by the bend mirror 11, and condensed by the condenser lens 13. The laser beam LB focused by the condensing lens 13 is irradiated onto the workpiece on the processing groove 17 to be laser-processed.

Referring to FIGS. 1 and 2 together, the shelf 21 is provided with a lifter 29, for example, which is vertically movable at its lower part, and on this lifter 29, for example, four poles 31A are mounted.
〜31D is erected. These four poles 31A~
31D is provided with a support table 35 that rotatably supports a plurality of support balls 33 for supporting workpieces of various thicknesses at appropriate intervals in the vertical direction.

With the above configuration, by raising the lifter 29 from the position indicated by the solid line shown in FIG. 1, it is raised to the position indicated by the two-dot chain line. Therefore, the height of each arbitrary support table 35 is positioned at the same height as the work surface of the work table 5.

Now, a plurality of support tables 3 on the shelves 21
When the workpieces W stored on the top 3 are to be taken out one after another, for example from the upper stage, and subjected to laser processing, the plurality of workpiece clamps 27, which are waiting at the position indicated by the two-dot chain line in Fig. 1, are moved forward to the position indicated by the solid line. At least one side of the workpiece W is clamped. Next, the carriage 25 is moved to the right end in the X-axis direction, stopped, and the origin is determined using an origin positioning pin (not shown). After the origin search is completed, the carriage 25 is moved to the left in the X-axis direction to position the desired position of the workpiece W in the processing groove 17, and the laser processing head 9 is moved in the Y-axis direction to remove the laser beam LB.
Laser processing is performed by irradiating the workpiece W with the laser beam. When the laser processing is completed, the carriage 25 is moved to above the support table 35 of the shelf 21 and stopped. Unclamp the work clamp 27 and
The processed workpiece W is supported and stored on the support table 35 by retreating to the position shown by the two-dot chain line.

Next, the second stage support table 35 is raised to the height of the table surface of the work table 5 by the lifting of the lifter 29, and then stopped. After moving the work clamp 27 forward and clamping the work W, the carriage 25
When moved to the right in the X-axis direction, work clamp 2
7 interferes with the pole 31D, as shown in FIG.
After sequentially unclamping the workpiece W and moving it backward to avoid the pole 31D, the workpiece W is clamped again. Therefore, the work clamp 27 is connected to the pole 31D.
If there are, at least three are required.

After the plurality of workpiece clamps 27 are avoided from the pole 31D in this manner, when the right end is reached, the workpiece is stopped and the origin search is performed. Next, the carriage 25 is moved to the left in the X-axis direction, and the laser processing head 9 is moved in the Y-axis direction to perform laser processing at a desired position on the workpiece W. After the laser processing is completed, the workpiece W is stored on the support table 35, and each workpiece clamp 27 operates to avoid the pole 31D.

[0021] In the above manner, the lowermost support table 35
Laser processing is continuously and automatically performed on the work W stored above. After laser processing is performed on the work W stored on each support table 35,
The shelf 21 is lowered to the position shown by the solid line in FIGS. 1 and 3, and replaced with the next shelf 21.

For example, continuous nighttime operation can be carried out unattended by simply storing the work W on the support table 35, which is arranged in multiple stages on the shelf 21.

As described above, by providing the shelf 21 on one side of the work table 5 with workpieces W stored in a plurality of stages, there is no need to arrange a workpiece loading device adjacent to the worktable 5, and space can be saved. In addition, the work W can be automatically carried onto the work table 5 and laser processing can be performed automatically. Moreover, since workpieces W of various materials and thicknesses can be stored on each support table 35, laser processing can be performed not only on workpieces W of the same thickness but also on workpieces W of various materials and thicknesses. can be done.

It should be noted that the present invention is not limited to the embodiments described above, but can be implemented in other embodiments by making appropriate changes. In this embodiment, an example has been described in which the four poles 31A to 31D constitute the vertical shelf 21, but if the pole 31D is removed, the three poles 31A,
31B and 31C are also applicable. In this case, there is no need to avoid the workpiece clamp 27, and there is no re-clamping operation, which is more effective. Moreover, if each support table 35 is slightly inclined toward the work clamp 27 side so that the work W can slide, positioning of the work W in the Y-axis direction becomes easy.

[0025]Although the description has been made using a 1-axis optical and 1-axis workpiece movement type laser processing machine as a plate material processing machine, the work table of other laser processing machines such as an optical movement type and plate material processing machines such as a turret punch press can also be used. is also possible. Further, although the example in which the shelf 21 is moved up and down by the lifter 29 has been described, it may be moved up and down by other driving members such as a ball screw, a gear, a rank and pinion, or the like. Moreover, it is also possible to stack the works W on the lifter 29 of the shelf 21 and take them out one by one.

[0026]

[Effects of the Invention] As can be understood from the above description of the embodiments, according to the present invention, since the structure is as described in the claims, the workpiece can be stored on one side of the worktable. By having multiple shelves that can move up and down, there is no need to place a workpiece loading device next to the worktable, which saves space and allows workpieces to be automatically transferred to the worktable. be able to. Therefore, it becomes possible to process plate materials unmanned by scheduled operation.

[Brief explanation of drawings]

FIG. 1 is a left side view in FIG. 3.

FIG. 2 is a plan view of the left side of the work table in FIG. 3;

FIG. 3 is a perspective view of an embodiment of a laser processing machine equipped with a work table of the present invention.

[Explanation of symbols]

1 Laser processing machine (plate processing machine) 5 Work table 21 Shelf 25 Carriage 27 Work clamp 29 Lifter 31A-31D Pole 33 Support ball 35 Support table

Claims (1)

[Claims] Claim 1: A work table for use in a plate processing machine that supports and moves a work, the work table being provided with a shelf on one side of the work table consisting of a plurality of tiers for storing the work, each tier of the shelf being close to the table surface. A work table for a plate material processing machine, characterized in that a shelf is provided so as to be movable up and down so as to be as high as possible.