JPH0435025Y2 - - Google Patents

Info

Publication number
JPH0435025Y2
JPH0435025Y2 JP1985005644U JP564485U JPH0435025Y2 JP H0435025 Y2 JPH0435025 Y2 JP H0435025Y2 JP 1985005644 U JP1985005644 U JP 1985005644U JP 564485 U JP564485 U JP 564485U JP H0435025 Y2 JPH0435025 Y2 JP H0435025Y2
Authority
JP
Japan
Prior art keywords
electronic component
marking
suction duct
laser beam
laser
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP1985005644U
Other languages
Japanese (ja)
Other versions
JPS61122087U (en
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1985005644U priority Critical patent/JPH0435025Y2/ja
Publication of JPS61122087U publication Critical patent/JPS61122087U/ja
Application granted granted Critical
Publication of JPH0435025Y2 publication Critical patent/JPH0435025Y2/ja
Expired legal-status Critical Current

Links

Description

【考案の詳細な説明】 (産業上の利用分野) 本考案は、印刷標印しにくい小型の電子部品の
表面に、レーザービームを照射して所望の標印を
形成するための、レーザーマーキング装置に関す
る。
[Detailed description of the invention] (Field of industrial application) This invention is a laser marking device for forming a desired mark by irradiating a laser beam on the surface of a small electronic component that is difficult to mark by printing. Regarding.

(従来の技術) 従来のこの種のレーザーマーキング装置として
は、一定の倒立姿勢で電子部品を連続的に移送
し、この移送経路の所定位置において、レンズに
より集光されたレーザービームを電子部品の標印
面に照射して移動させ、レーザービームの照射点
が高温変色することで所望の標印を形成するよう
構成したものである。
(Prior Art) This type of conventional laser marking device continuously transports electronic components in a fixed inverted position, and at a predetermined position on this transport path, a laser beam focused by a lens is directed onto the electronic components. The marking surface is irradiated and moved, and the irradiated point of the laser beam changes color at high temperature, thereby forming a desired mark.

(考案が解決しようとする問題点) 電子部品の標印は、樹脂モールド部の表面に付
されるので、レーザービームが照射された箇所で
は、モールド樹脂が焼けてガスが発生して周囲に
ただよい、このガスの煙がレーザービームのエネ
ルギを吸収して標印不良や無標印が発生すること
があつた。このようなトラブルは、電子部品の移
送速度を高くして高能率化を図るほど発生しやす
いものであつた。
(Problem that the invention aims to solve) Marks for electronic components are attached to the surface of the resin mold, so in the area where the laser beam is irradiated, the mold resin burns and gas is generated, which spreads around the area. Unfortunately, this gas smoke absorbed the energy of the laser beam, resulting in defective or unmarked markings. Such troubles are more likely to occur as the transfer speed of electronic components is increased to improve efficiency.

また、モールド樹脂部が暗色でレーザー標印が
直接見にくいものにあつては、予め標印面にカラ
コーテイングしてレーザー標印を行うことがある
が、この場合は、コーテイングしたインクが焼け
て発生するガスが多くなり、一層前述のトラブル
が発生しやすくなるものであつた。
In addition, if the mold resin part is dark and the laser marking is difficult to see directly, the marking surface may be coated in color in advance and the laser marking is performed, but in this case, the coated ink may burn and cause This would increase the amount of gas, making the above-mentioned problems even more likely to occur.

本考案は、このような事情に鑑みてなされたも
のであつて、レーザービームの照射により発生し
たガスの煙が原因となる前述の標印トラブルを解
消することを目的とする。
The present invention was developed in view of the above circumstances, and aims to solve the above-mentioned marking trouble caused by gas smoke generated by laser beam irradiation.

(問題点を解決するための手段) 本考案は、このような目的を達成するために、
レンズにより集光されたレーザービームを倒立姿
勢で連続移送される電子部品1の標印面に照射す
る電子部品のレーザーマーキング装置であつて、
前記電子部品の近傍に発生ガスの吸引ダクトを配
設し、この吸引ダクトには前記電子部品の標印面
上方及びその背面に対向する開口部を形成したこ
とを特徴とするものである。
(Means for solving the problem) In order to achieve this purpose, the present invention
A laser marking device for electronic components that irradiates a laser beam focused by a lens onto a marking surface of an electronic component 1 that is continuously transported in an inverted position,
The invention is characterized in that a suction duct for the generated gas is disposed near the electronic component, and the suction duct has openings facing above and on the back surface of the marking surface of the electronic component.

(作用) この構造によれば、レーザービームの照射によ
つて電子部品の標印面で発生したガスの煙は、こ
の標印面上方及びその背面に対向した吸引ダクト
の開口部によつて直ちに吸引して除去されること
になる。そこで、次の電子部品がレーザービーム
の照射位置に至つた際に、前の処理によつて発生
したガスの煙がそのまま残留していることはなく
なる。
(Function) According to this structure, the gas smoke generated on the marking surface of the electronic component by the laser beam irradiation is immediately sucked in by the opening of the suction duct facing above and behind the marking surface. will be removed. Therefore, when the next electronic component reaches the laser beam irradiation position, the gas smoke generated by the previous treatment will not remain as it is.

(実施例) 以下、本考案を図面に示す実施例に基づいて詳
細に説明する。図は、本考案の実施例に係る装置
の概略が示される。図において、1は樹脂モール
ドされた電子部品であつて、この電子部品1のリ
ード端子部1aはフープ状に連続され、図外の適
宜の移送手段により紙面表裏方向に一定ピツチず
つ連続的に移送される。2は、電子部品1の移送
経路の側方に配設されたレーザービーム発生装置
であり、この装置2で発生したレーザービーム
は、照射制御部3を経て該移送経路に向けて発射
され、レンズ4で集光されて電子部品1の標印面
に集中照射され、前記制御部3による照射方向制
御により、標印面上でレーザービームの焦点が移
動され所望のレーザー標印が行なわれる。
(Example) Hereinafter, the present invention will be described in detail based on an example shown in the drawings. The figure schematically shows an apparatus according to an embodiment of the present invention. In the figure, 1 is a resin-molded electronic component, and the lead terminal portion 1a of this electronic component 1 is continuous in a hoop shape, and is continuously transferred at a constant pitch in the front and back directions of the paper by an appropriate transfer means (not shown). be done. Reference numeral 2 denotes a laser beam generating device disposed on the side of the transfer path of the electronic component 1. The laser beam generated by this device 2 is emitted toward the transfer path via the irradiation control section 3, and is emitted to the transfer path through the lens. 4 and irradiates the marking surface of the electronic component 1 in a concentrated manner, and by controlling the irradiation direction by the control section 3, the focal point of the laser beam is moved on the marking surface to perform desired laser marking.

そして、このレーザービームの照射を受ける電
子部品1の近傍には、図外の吸引フアンに接続さ
れた発生ガスの吸引ダクト5が配設されており、
この吸引ダクト5の開口部は電子部品1の標印面
上方及びその背面に対向している。そこで、レー
ザービームの照射によつて電子部品1の標印面で
発生したガスの煙は、吸引ダクト5の開口部によ
つて直ちに吸引されて除去されてしまうことにな
る。また、電子部品1の前方下部には、清浄な空
気を標印面に向けて吹き付けるノズルが臨設され
ていて、標印面付近の雰囲気の清浄化が図られて
いる。
A generated gas suction duct 5 connected to a suction fan (not shown) is arranged near the electronic component 1 that is irradiated with this laser beam.
The opening of this suction duct 5 faces above the marking surface of the electronic component 1 and the back surface thereof. Therefore, the gas smoke generated on the marking surface of the electronic component 1 by the laser beam irradiation is immediately sucked and removed by the opening of the suction duct 5. Furthermore, a nozzle is provided at the front lower part of the electronic component 1 to blow clean air toward the marking surface, thereby purifying the atmosphere near the marking surface.

なお、この空気ノズル6は必ずしも必要ではな
く、特に発生ガスが多い場合には有効である。
Note that this air nozzle 6 is not necessarily necessary, and is particularly effective when a large amount of gas is generated.

(効果) 以上説明したように、本考案においては、電子
部品の近傍に発生ガスの吸引ダクトを配設すると
ともに、この吸引ダクトには電子部品の標印面上
方及びその背面に対向した開口部を形成している
ので、レーザービームの照射によつて電子部品の
標印面で発生したガスの煙は、吸引ダクトの開口
部によつて直ちに吸引されて標印面の少なくとも
下方を除く全周囲方向に沿つて流れることにな
り、速やかに除去されてしまうことになる。そこ
で、電子部品の移送経路を大きくしてもガスの煙
による標印トラブルが生じることはなくなり、レ
ーザーマーキング作業の高能率化を図ることがで
きるようになつた。また、ガスの煙が発生しやす
いカラコーテイング部品のレーザー標印も良好に
行えるようになつた。
(Effects) As explained above, in the present invention, a suction duct for the generated gas is provided near the electronic components, and this suction duct has openings facing above and on the back surface of the marking surface of the electronic components. As a result, the gas smoke generated on the marking surface of the electronic component by laser beam irradiation is immediately sucked in by the opening of the suction duct and spreads along the entire circumference of the marking surface except at least below. Therefore, it will flow and be quickly removed. Therefore, even if the transfer route for electronic components is enlarged, marking problems caused by gas fumes will no longer occur, making it possible to improve the efficiency of laser marking work. It has also become possible to perform laser marking of color-coated parts that tend to generate gas smoke.

【図面の簡単な説明】[Brief explanation of drawings]

図は、本考案の実施例に係る電子部品のレーザ
ーマーキング装置の概略構成図である。 図中、符号1は電子部品、4はレンズ、5は吸
引ダクト。
The figure is a schematic configuration diagram of a laser marking device for electronic components according to an embodiment of the present invention. In the figure, numeral 1 is an electronic component, 4 is a lens, and 5 is a suction duct.

Claims (1)

【実用新案登録請求の範囲】 レンズ4により集光されたレーザービームを倒
立姿勢で連続移送される電子部品1の標印面に照
射する電子部品のレーザーマーキング装置であつ
て、 前記電子部品1の近傍に発生ガスの吸引ダクト
5を配設し、この吸引ダクト5には前記電子部品
1の標印面上方及びその背面に対向する開口部を
形成したことを特徴とする電子部品のレーザーマ
ーキング装置。
[Claims for Utility Model Registration] A laser marking device for an electronic component that irradiates a laser beam focused by a lens 4 onto a marking surface of an electronic component 1 that is continuously transported in an inverted position, the laser marking device being in the vicinity of the electronic component 1. A laser marking device for electronic parts, characterized in that a suction duct 5 for the generated gas is disposed in the suction duct 5, and openings are formed in the suction duct 5 to face above and on the back surface of the marking surface of the electronic part 1.
JP1985005644U 1985-01-18 1985-01-18 Expired JPH0435025Y2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1985005644U JPH0435025Y2 (en) 1985-01-18 1985-01-18

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1985005644U JPH0435025Y2 (en) 1985-01-18 1985-01-18

Publications (2)

Publication Number Publication Date
JPS61122087U JPS61122087U (en) 1986-08-01
JPH0435025Y2 true JPH0435025Y2 (en) 1992-08-19

Family

ID=30482337

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1985005644U Expired JPH0435025Y2 (en) 1985-01-18 1985-01-18

Country Status (1)

Country Link
JP (1) JPH0435025Y2 (en)

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5726955A (en) * 1980-07-25 1982-02-13 Hitachi Ltd Backup control system
JPS60199660A (en) * 1984-03-24 1985-10-09 Toshiba Corp Laser marking apparatus

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5726955A (en) * 1980-07-25 1982-02-13 Hitachi Ltd Backup control system
JPS60199660A (en) * 1984-03-24 1985-10-09 Toshiba Corp Laser marking apparatus

Also Published As

Publication number Publication date
JPS61122087U (en) 1986-08-01

Similar Documents

Publication Publication Date Title
KR101299042B1 (en) Laser processing apparatus and laser processing method as well as debris extraction mechanism and debris extraction method
EP1080821A4 (en) Method and apparatus for laser marking, and object with marks
JPH0435025Y2 (en)
DK35090D0 (en) PROCEDURE FOR FOCUSED VENTILATION IN A WORKPLACE AND APPARATUS FOR USING THE PROCEDURE
JP3287209B2 (en) Lens dirt prevention device
JPS5987996A (en) Laser and gas cutter
JPH08118053A (en) Workpiece cutting process
JP2006205178A (en) Machining method and machining device
JPH01114187U (en)
JPS5483445A (en) Laser recorder
JPH0241423B2 (en)
JPS63192586A (en) Laser beam machining method
JPS62116600U (en)
JPS60137592A (en) Laser marking method
JPH11145314A (en) Marking method to electronic unit
JPS61262187A (en) Marking method by laser
JPH0649430Y2 (en) Laser printer
JPS59129172A (en) Laser printing apparatus
JPS6120684A (en) Laser drilling device
JPH0243584Y2 (en)
JPH0388374U (en)
JPS561532A (en) Method and device for correcting white spot defect of photomask
JPS61143778U (en)
JPS6039181Y2 (en) Laser processing equipment
JPH08279529A (en) Electronic part packaging device and soldering method