JPH043500A - Suction nozzle for electronic-component mounting machine - Google Patents

Suction nozzle for electronic-component mounting machine

Info

Publication number
JPH043500A
JPH043500A JP2104137A JP10413790A JPH043500A JP H043500 A JPH043500 A JP H043500A JP 2104137 A JP2104137 A JP 2104137A JP 10413790 A JP10413790 A JP 10413790A JP H043500 A JPH043500 A JP H043500A
Authority
JP
Japan
Prior art keywords
suction
suction nozzle
hole
air
electronic component
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2104137A
Other languages
Japanese (ja)
Inventor
Hiroshi Hirano
平野 廣
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP2104137A priority Critical patent/JPH043500A/en
Publication of JPH043500A publication Critical patent/JPH043500A/en
Pending legal-status Critical Current

Links

Landscapes

  • Manipulator (AREA)
  • Supply And Installment Of Electrical Components (AREA)

Abstract

PURPOSE:To improve suction force, to stabilize the attitude of suction and to prevent the leakage of air by notching a groove directed outward from a suction hole to the suction surface of an suction nozzle. CONSTITUTION:A suction nozzle is composed by providing a suction hole 3 allowing the flowing of air and a flat adsorption surface 4 abutted against the upper section of an electronic part 1. A plurality of dead-end grooves 6 radially directed to the outside centering around the suction hole 3 are notched to said suction surface 4, and the grooves 6 have a function enlarging the working range of air. Even when the suction surface 4 and an annular groove 7 positioned at the outside of the suction hole 3 are notched while a plurality of relay grooves 8 communicating the annular groove 7 and the adsorption hole 3 are notched, the same working effect can be expected.

Description

【発明の詳細な説明】 (産業上の利用分野〕 本発明は、電子部品を真空吸着する電子部品実装機の吸
着ノズルの改良に関するものである。
DETAILED DESCRIPTION OF THE INVENTION (Field of Industrial Application) The present invention relates to an improvement in a suction nozzle for an electronic component mounting machine that vacuum suctions electronic components.

〔従来の技術〕[Conventional technology]

第5図〜第7図は特開昭63−143900号公報等に
示された従来の電子部品実装機の吸着ノズルを示すもの
で、図中、(1)は電子回路基板(図示せず)に実装さ
れるフラットバックICからなる電子部品、(2)はこ
の電子部品(1)を真空吸着する筒状の吸着ノズルで、
この吸着ノズル(2)は一般に第5図及び第6図に示す
如く、空気の流通を許容する吸着孔(3)と、電子部品
(1)の上部に当接する平坦な吸着面(4)とを備えて
構成されている。
Figures 5 to 7 show the suction nozzle of a conventional electronic component mounting machine disclosed in Japanese Patent Application Laid-Open No. 63-143900, etc. In the figure, (1) is an electronic circuit board (not shown). (2) is a cylindrical suction nozzle that vacuum-suctions this electronic component (1),
This suction nozzle (2) generally has a suction hole (3) that allows air circulation and a flat suction surface (4) that comes into contact with the top of the electronic component (1), as shown in Figures 5 and 6. It is configured with.

然して、吸着ノズル(2)は、電子部品(1)の上部に
当接後、吸着孔(3)の内部が負圧(真空)にされるこ
とにより、該電子部品(1)を真空吸着するか、これだ
けでは、大形の電子部品(1)を確実に真空吸着し得な
い場合がある。その場合には第7図に示す如く、吸着面
(4)に、吸着孔(3)に連通ずる円状の凹み穴(5)
を凹設して対処していた。
After the suction nozzle (2) contacts the top of the electronic component (1), negative pressure (vacuum) is created inside the suction hole (3), thereby vacuum suctioning the electronic component (1). Or, with this alone, the large electronic component (1) may not be able to be vacuum-adsorbed reliably. In that case, as shown in Fig. 7, there is a circular recessed hole (5) in the suction surface (4) that communicates with the suction hole (3).
This was dealt with by making a recess.

〔発明が解決しようとする課題〕[Problem to be solved by the invention]

従来の電子部品実装機の吸着ノズルは以上のように構成
されていたので、第5図及び第6図に示す構造の吸着ノ
ズル(2)では吸着力が不足する場合があった。また、
第7図に示す構造の吸着ノズル(2)の場合、吸着力は
向上するが、吸着面(4)の作用面積が小さいので、電
子部品(1)の吸着姿勢の不安定化や空気の漏泄を招く
といった問題点があった。
Since the suction nozzle of the conventional electronic component mounting machine was constructed as described above, the suction nozzle (2) having the structure shown in FIGS. 5 and 6 sometimes lacked suction force. Also,
In the case of the suction nozzle (2) having the structure shown in Fig. 7, the suction force is improved, but since the action area of the suction surface (4) is small, the suction position of the electronic component (1) may become unstable and air may leak. There were problems such as inviting

本発明は上記に鑑みなされたもので、吸着力の向上、吸
着姿勢の安定化、及び空気の漏泄防止を図ることのでき
る電子部品実装機の吸着ノズルを提供することを目的と
している。
The present invention has been made in view of the above, and an object of the present invention is to provide a suction nozzle for an electronic component mounting machine that can improve the suction force, stabilize the suction posture, and prevent air leakage.

〔課題を解決するための手段〕[Means to solve the problem]

本発明においては、上述の目的を達成するため、電子部
品を真空吸着する吸着ノズルの吸着面に、吸着孔から外
側に指向した溝を刻設したことを特徴としている。
In order to achieve the above-mentioned object, the present invention is characterized in that a groove directed outward from the suction hole is carved on the suction surface of the suction nozzle for vacuum suctioning the electronic component.

〔作用) 本発明によれば、吸着面の作用面積を減らすことなく、
空気の作用範囲を拡大することができるので、吸着力の
向上、吸着姿勢の安定化、及び空気の漏泄を確実に防止
することができる。
[Function] According to the present invention, without reducing the action area of the suction surface,
Since the range of action of air can be expanded, the suction force can be improved, the suction posture can be stabilized, and air leakage can be reliably prevented.

(実施例) 以下、第1図及び第2図に示す一実施例に基づき本発明
を詳述すると、図中、(2)は電子部品実装機の吸着ノ
ズルで、この略筒形の吸着ノズル(2)は、空気の流通
を許容する吸着孔(3)と、電子部品(1)の上部に当
接する平坦な吸着面(4)とを備えて構成されている。
(Example) Hereinafter, the present invention will be described in detail based on an example shown in FIGS. 1 and 2. In the figure, (2) is a suction nozzle of an electronic component mounting machine, and this approximately cylindrical suction nozzle (2) includes a suction hole (3) that allows air to circulate, and a flat suction surface (4) that comes into contact with the top of the electronic component (1).

また、該吸着面(4)には、吸着孔(3)を中心として
外側に放射状に指向した複数の行き止まりの溝(6)が
刻設されており、この溝(6)か空気の作用範囲を拡大
する機能を有している。
In addition, the suction surface (4) has a plurality of dead-end grooves (6) oriented radially outward with the suction hole (3) as the center, and these grooves (6) define the area in which the air acts. It has the function to enlarge.

以上のように本発明によれは、吸着孔(3)に連通した
複数の溝(6)を吸着面(4)に刻設しているのて、空
気が負圧にされる部分を拡大することかでき、吸着力の
著しい向上を図ることかてぎる。
As described above, according to the present invention, the suction surface (4) is provided with a plurality of grooves (6) communicating with the suction holes (3), thereby enlarging the area where air is brought into negative pressure. It is possible to significantly improve the suction power.

また、第1図と第7図を対比すれば明白な様に、吸着面
(4)の作用面積の減少を防止することかできるので、
吸着姿勢の安定化、及び空気の漏泄防止を図ることが可
能となる。
Furthermore, as is clear from comparing Figures 1 and 7, it is possible to prevent the area of action of the suction surface (4) from decreasing.
It becomes possible to stabilize the suction posture and prevent air leakage.

次に、第3図及び第4図は本発明の他の実施例を示すも
ので、この場合には、吸着面(4)に、吸着孔(3)の
外側に位置する環状の環状溝(7)を刻設するとともに
、この環状溝(7)と吸着孔(3)とを連通ずる複数の
中継溝(8)を刻設している。
Next, FIGS. 3 and 4 show another embodiment of the present invention. In this case, the suction surface (4) has an annular groove located outside the suction hole (3). 7) and a plurality of relay grooves (8) that communicate the annular groove (7) and the suction hole (3).

本実施例によっても上記実施例と同様の作用効果か期待
できるのは明白である。
It is clear that the same effects as those of the above embodiment can be expected from this embodiment as well.

〔発明の効果〕〔Effect of the invention〕

以上のように本発明によれば、電子部品を真空吸着する
吸着ノズルの吸着面に、吸着孔から外側に指向した溝を
刻設しているので、吸着面の作用面積の減少を防止しつ
つ空気の作用範囲を拡大することができ、従って、吸着
力の向上、吸着姿勢の安定化、及び空気の漏泄防止を図
ることのできる電子部品実装機の吸着ノズルを提供する
ことができる。
As described above, according to the present invention, the grooves directed outward from the suction holes are carved on the suction surface of the suction nozzle that vacuum-suctions electronic components, thereby preventing a decrease in the active area of the suction surface. It is possible to provide a suction nozzle for an electronic component mounting machine that can expand the range of action of air, thereby improving the suction force, stabilizing the suction posture, and preventing air leakage.

【図面の簡単な説明】[Brief explanation of drawings]

第1図は本発明に係る電子部品実装機の吸着ノズルの一
実施例を示す説明図、第2図は第1図の縦断面図、第3
図は本発明に係る電子部品実装機の吸着ノズルの他の実
施例を示す説明図、第4図は第3図の縦断面図、第5図
及び第6図は従来の電子部品実装機の吸着ノズルを示す
説明図、第7図は従来における電子部品実装機の吸着ノ
ズルの他の例を示す説明図である。 図中、(1) は電子部品、(2)は吸着ノズル、(3
)は吸着孔、(4)は吸着面、(6)は溝、(7)は環
状溝、(8)は中継溝である。 尚、図中同一符号は同−又は相当部分を示す。 @1図 第2図 第3図 @4図 51Q”ji!漏 第 図 第 図 第 図
FIG. 1 is an explanatory diagram showing one embodiment of a suction nozzle of an electronic component mounting machine according to the present invention, FIG. 2 is a longitudinal cross-sectional view of FIG. 1, and FIG.
The figure is an explanatory diagram showing another embodiment of the suction nozzle of the electronic component mounter according to the present invention, FIG. 4 is a longitudinal cross-sectional view of FIG. 3, and FIGS. FIG. 7 is an explanatory diagram showing another example of a suction nozzle for a conventional electronic component mounting machine. In the figure, (1) is an electronic component, (2) is a suction nozzle, and (3) is a suction nozzle.
) is a suction hole, (4) is a suction surface, (6) is a groove, (7) is an annular groove, and (8) is a relay groove. Note that the same reference numerals in the figures indicate the same or corresponding parts. @1 Figure 2 Figure 3 @4 Figure 51Q"ji! Leakage Figure Figure Figure

Claims (1)

【特許請求の範囲】[Claims]  電子部品を真空吸着する吸着ノズルの吸着面に、吸着
孔から外側に指向した溝を刻設したことを特徴とする電
子部品実装機の吸着ノズル。
A suction nozzle for an electronic component mounting machine, characterized in that a suction surface of the suction nozzle for vacuum suctioning an electronic component has a groove oriented outward from a suction hole.
JP2104137A 1990-04-19 1990-04-19 Suction nozzle for electronic-component mounting machine Pending JPH043500A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2104137A JPH043500A (en) 1990-04-19 1990-04-19 Suction nozzle for electronic-component mounting machine

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2104137A JPH043500A (en) 1990-04-19 1990-04-19 Suction nozzle for electronic-component mounting machine

Publications (1)

Publication Number Publication Date
JPH043500A true JPH043500A (en) 1992-01-08

Family

ID=14372714

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2104137A Pending JPH043500A (en) 1990-04-19 1990-04-19 Suction nozzle for electronic-component mounting machine

Country Status (1)

Country Link
JP (1) JPH043500A (en)

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60173459A (en) * 1984-02-20 1985-09-06 Matsushita Electric Ind Co Ltd Biosensor
WO1999064209A1 (en) * 1998-06-08 1999-12-16 Kuraitekku Co., Ltd. Chuck and suction cup for platy material
KR100454894B1 (en) * 2002-01-11 2004-11-06 미래산업 주식회사 Head Nozzle of Surface Mounting Device
KR100490840B1 (en) * 2002-05-23 2005-05-19 미래산업 주식회사 Head Nozzle of Surface Mounting Device
WO2005061188A1 (en) * 2003-12-19 2005-07-07 Matsushita Electric Industrial Co., Ltd. Part mounting head, pick-up nozzle, pick-up nozzle manufacturing method
US7163397B2 (en) 1998-06-19 2007-01-16 Karl Storz Gmbh & Co. Apparatus for applying material for selectively modifying the optical properties of metabolically different cells

Cited By (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60173459A (en) * 1984-02-20 1985-09-06 Matsushita Electric Ind Co Ltd Biosensor
JPH0640086B2 (en) * 1984-02-20 1994-05-25 松下電器産業株式会社 Biosensor
WO1999064209A1 (en) * 1998-06-08 1999-12-16 Kuraitekku Co., Ltd. Chuck and suction cup for platy material
US7163397B2 (en) 1998-06-19 2007-01-16 Karl Storz Gmbh & Co. Apparatus for applying material for selectively modifying the optical properties of metabolically different cells
KR100454894B1 (en) * 2002-01-11 2004-11-06 미래산업 주식회사 Head Nozzle of Surface Mounting Device
KR100490840B1 (en) * 2002-05-23 2005-05-19 미래산업 주식회사 Head Nozzle of Surface Mounting Device
WO2005061188A1 (en) * 2003-12-19 2005-07-07 Matsushita Electric Industrial Co., Ltd. Part mounting head, pick-up nozzle, pick-up nozzle manufacturing method
JPWO2005061188A1 (en) * 2003-12-19 2007-12-13 松下電器産業株式会社 Component mounting head, suction nozzle, and manufacturing method of suction nozzle
JP4559970B2 (en) * 2003-12-19 2010-10-13 パナソニック株式会社 Manufacturing method of component mounting head and suction nozzle
US7886427B2 (en) 2003-12-19 2011-02-15 Panasonic Corporation Component mounting head

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