JPH04348118A - Photo-setting resin composition - Google Patents
Photo-setting resin compositionInfo
- Publication number
- JPH04348118A JPH04348118A JP3038867A JP3886791A JPH04348118A JP H04348118 A JPH04348118 A JP H04348118A JP 3038867 A JP3038867 A JP 3038867A JP 3886791 A JP3886791 A JP 3886791A JP H04348118 A JPH04348118 A JP H04348118A
- Authority
- JP
- Japan
- Prior art keywords
- clasp
- pts
- pattern
- weight
- parts
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
- 239000011342 resin composition Substances 0.000 title claims description 11
- 229920000620 organic polymer Polymers 0.000 claims abstract description 10
- RAOOAOZYRPCNFM-UHFFFAOYSA-N bis(oxiran-2-ylmethyl) benzene-1,2-dicarboxylate;2-methylprop-2-enoic acid Chemical compound CC(=C)C(O)=O.C=1C=CC=C(C(=O)OCC2OC2)C=1C(=O)OCC1CO1 RAOOAOZYRPCNFM-UHFFFAOYSA-N 0.000 claims abstract description 9
- 239000000843 powder Substances 0.000 claims abstract description 8
- 239000002245 particle Substances 0.000 claims abstract description 6
- 239000003505 polymerization initiator Substances 0.000 claims description 3
- 239000012188 paraffin wax Substances 0.000 abstract description 16
- 238000005266 casting Methods 0.000 abstract description 6
- 229920003229 poly(methyl methacrylate) Polymers 0.000 abstract description 6
- 239000004926 polymethyl methacrylate Substances 0.000 abstract description 6
- 238000002156 mixing Methods 0.000 abstract description 4
- 239000000203 mixture Substances 0.000 abstract description 4
- VNQXSTWCDUXYEZ-UHFFFAOYSA-N 1,7,7-trimethylbicyclo[2.2.1]heptane-2,3-dione Chemical compound C1CC2(C)C(=O)C(=O)C1C2(C)C VNQXSTWCDUXYEZ-UHFFFAOYSA-N 0.000 abstract description 3
- 229930006711 bornane-2,3-dione Natural products 0.000 abstract description 3
- 238000003756 stirring Methods 0.000 abstract description 2
- 239000007870 radical polymerization initiator Substances 0.000 abstract 2
- 239000000463 material Substances 0.000 description 23
- 239000001993 wax Substances 0.000 description 10
- 230000014759 maintenance of location Effects 0.000 description 9
- 238000004519 manufacturing process Methods 0.000 description 8
- 238000000034 method Methods 0.000 description 7
- 239000011347 resin Substances 0.000 description 5
- 229920005989 resin Polymers 0.000 description 5
- 239000000853 adhesive Substances 0.000 description 4
- 230000001070 adhesive effect Effects 0.000 description 4
- 229910052751 metal Inorganic materials 0.000 description 4
- 239000002184 metal Substances 0.000 description 4
- 150000001875 compounds Chemical class 0.000 description 3
- 230000000717 retained effect Effects 0.000 description 3
- KWOLFJPFCHCOCG-UHFFFAOYSA-N Acetophenone Chemical compound CC(=O)C1=CC=CC=C1 KWOLFJPFCHCOCG-UHFFFAOYSA-N 0.000 description 2
- QIGBRXMKCJKVMJ-UHFFFAOYSA-N Hydroquinone Chemical compound OC1=CC=C(O)C=C1 QIGBRXMKCJKVMJ-UHFFFAOYSA-N 0.000 description 2
- 230000009477 glass transition Effects 0.000 description 2
- 229910052602 gypsum Inorganic materials 0.000 description 2
- 239000010440 gypsum Substances 0.000 description 2
- 239000011505 plaster Substances 0.000 description 2
- 238000006116 polymerization reaction Methods 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- 229910001316 Ag alloy Inorganic materials 0.000 description 1
- 229910001020 Au alloy Inorganic materials 0.000 description 1
- FEXQDZTYJVXMOS-UHFFFAOYSA-N Isopropyl benzoate Chemical compound CC(C)OC(=O)C1=CC=CC=C1 FEXQDZTYJVXMOS-UHFFFAOYSA-N 0.000 description 1
- 229930040373 Paraformaldehyde Natural products 0.000 description 1
- 229910001252 Pd alloy Inorganic materials 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- 229920002472 Starch Polymers 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 210000001909 alveolar process Anatomy 0.000 description 1
- RWCCWEUUXYIKHB-UHFFFAOYSA-N benzophenone Chemical compound C=1C=CC=CC=1C(=O)C1=CC=CC=C1 RWCCWEUUXYIKHB-UHFFFAOYSA-N 0.000 description 1
- 239000012965 benzophenone Substances 0.000 description 1
- 125000001797 benzyl group Chemical group [H]C1=C([H])C([H])=C(C([H])=C1[H])C([H])([H])* 0.000 description 1
- 238000009933 burial Methods 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 239000003999 initiator Substances 0.000 description 1
- 210000001847 jaw Anatomy 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- QPJVMBTYPHYUOC-UHFFFAOYSA-N methyl benzoate Chemical compound COC(=O)C1=CC=CC=C1 QPJVMBTYPHYUOC-UHFFFAOYSA-N 0.000 description 1
- 239000000178 monomer Substances 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 210000000214 mouth Anatomy 0.000 description 1
- GYVGXEWAOAAJEU-UHFFFAOYSA-N n,n,4-trimethylaniline Chemical compound CN(C)C1=CC=C(C)C=C1 GYVGXEWAOAAJEU-UHFFFAOYSA-N 0.000 description 1
- 229920002866 paraformaldehyde Polymers 0.000 description 1
- 230000003239 periodontal effect Effects 0.000 description 1
- 229920001490 poly(butyl methacrylate) polymer Polymers 0.000 description 1
- 229920001483 poly(ethyl methacrylate) polymer Polymers 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 238000007788 roughening Methods 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 239000003381 stabilizer Substances 0.000 description 1
- 235000019698 starch Nutrition 0.000 description 1
- 239000008107 starch Substances 0.000 description 1
- YRHRIQCWCFGUEQ-UHFFFAOYSA-N thioxanthen-9-one Chemical class C1=CC=C2C(=O)C3=CC=CC=C3SC2=C1 YRHRIQCWCFGUEQ-UHFFFAOYSA-N 0.000 description 1
- 210000001519 tissue Anatomy 0.000 description 1
- 150000004992 toluidines Chemical class 0.000 description 1
Landscapes
- Graft Or Block Polymers (AREA)
Abstract
Description
【0001】0001
【産業上の利用分野】本発明は、光硬化性樹脂組成物に
関する。さらに詳しくは部分床義歯を製性作するに当た
り、義歯の把持(側方運動に対する抵抗)と維持(着脱
に対する抵抗)と、支持(咬合圧に対する抵抗)とを授
ける金属構成部分である鋳造クラスプをロストワックス
法にて製作するに当り維持力、耐久性などに対する理論
的な形状を示す鋳造クラスプの原型即ちクラスプのパタ
ーンを造るための光硬化性樹脂組成物に関するものであ
る。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a photocurable resin composition. More specifically, when fabricating partial dentures, cast clasps are metal components that provide grip (resistance to lateral movement), retention (resistance to attachment and removal), and support (resistance to occlusal pressure) to the denture. The present invention relates to a photocurable resin composition for making a cast clasp prototype, ie, a clasp pattern, which exhibits a theoretical shape with respect to retention strength, durability, etc. when manufactured by the lost wax method.
【0002】0002
【従来の技術】部分床義歯の主及び間接維持装置として
はその90%以上にクラスプが用いられている。しかし
、特に鋳造クラスプではその製作方法が煩雑であってそ
の維持力や適合精度、与えられたアーム部の形態などが
必ずしも満足しうるものでないのが現状である。2. Description of the Related Art Clasps are used in more than 90% of partial dentures as main and indirect retaining devices. However, the manufacturing method for cast clasps in particular is complicated, and the current situation is that the retention force, fitting accuracy, and form of the given arm portion are not always satisfactory.
【0003】従来の鋳造クラスプの製作方法は、先ず第
一に患者の口腔内の顎印象を採取し、超硬石膏などで作
業模型を造る。次に維持装置となるクラスプの設計を行
なうために、この作業模型上の維持歯部分にサーベイン
グを行なう。サーベイングとは模型上の残存歯や顎堤の
最大豊隆部を求めると同時に、相互の平行関係などを調
べるために行なう作業で、義歯着脱方向の決定、維持歯
の決定、ブロツクアウト部の明示、アンダーカット量の
測定、クラスプ位置の決定などを行う義歯製作上極めて
重要な作業である。[0003] In the conventional manufacturing method of a cast clasp, first, an impression of the patient's jaw inside the oral cavity is taken, and a working model is made of superhard plaster or the like. Next, in order to design a clasp that will serve as a retainer, the retainer tooth portion on this working model is surveyed. Surveying is a task performed to find the maximum bulge of the remaining teeth and alveolar ridge on the model, as well as to examine their mutual parallel relationships.It is used to determine the direction of denture attachment/removal, the determination of teeth to be retained, and the identification of block-out areas. This is an extremely important task in denture manufacturing, as it involves measuring the amount of undercut, determining the position of the clasp, etc.
【0004】クラスプの維持力を左右する重要な因子と
しては、クラスプアームの長さ、太さ、断面形態、使用
合金のヤング率、設定されたアンダーカット量、維持歯
歯面の曲率、などが挙げられる。[0004] Important factors that influence the retention force of the clasp include the length, thickness, cross-sectional form of the clasp arm, Young's modulus of the alloy used, the set amount of undercut, and the curvature of the tooth surface of the retention tooth. Can be mentioned.
【0005】鋳造クラスプをパラフィン系のワックスパ
ターンを利用して製作する場合、クラスプの維持力は、
利用するアンダーカット量、パターンの太さ、異種断面
形態の選択によりコントロールすることが可能であり、
サーベイング時及び義歯設計時は維持歯歯周組織の状態
に対応したクラスプの設計が要求されることになる。[0005] When making a cast clasp using a paraffin wax pattern, the retention force of the clasp is as follows:
It is possible to control the amount of undercut used, the thickness of the pattern, and the selection of different cross-sectional forms.
At the time of surveying and denture design, it is necessary to design a clasp that corresponds to the condition of the periodontal tissue of the retained tooth.
【0006】作業模型に対する設計・ブロックアウトが
終了すると次にクラスプのワックスパターンを製作する
ために設計に従ってブロックアウトされた維持歯部分を
再度印象採取(複印象)し、作業模型を模型用埋没材に
置き換える。次にクラスプの維持力を正確にコントロー
ルすることを考慮した上でパラフイン系ワックスのクラ
スプパターンを手指で曲げながら接着剤を用いて模型用
埋没材に貼り付け、レスト部、脚部の成形を行ない、ス
プルーの植立を行なう。次にこのパラフィン系ワックス
のクラスプパターンを模型用埋没材から取り外ずさずに
模型用埋没材ごと鋳造用埋没材で埋没し、埋没材が硬化
した後、パラフィン系のクラスプパターンをファーネス
で加熱焼却し、その後に出来たクラスプパターンの鋳型
に溶けた金属を流し込み冷却後、割り出し研磨を行なっ
てクラスプを完成させる(以後、この方法を「型ごと埋
没法」と称す)。When the design and blockout for the working model are completed, next, in order to produce the wax pattern of the clasp, an impression is taken again (double impression) of the retained tooth part that was blocked out according to the design, and the working model is used as an investment material for the model. Replace with Next, taking into consideration the precise control of the retention force of the clasp, the paraffin wax clasp pattern is bent with fingers and attached to the investment material for the model using adhesive, and the rest and legs are formed. , planting sprue. Next, without removing this paraffin wax clasp pattern from the model investment material, the entire model investment material is buried in casting investment material, and after the investment material has hardened, the paraffin wax clasp pattern is heated in a furnace. After incineration, the molten metal is poured into a mold with the resulting clasp pattern, cooled, and indexed and polished to complete the clasp (hereinafter, this method is referred to as the ``embedding method'').
【0007】[0007]
【発明が解決しょうとする課題】上記の鋳造クラスプの
製造方法は、クラスプパターンを作る材質がパラフィン
系ワックスであるため次の様な問題点を含んでいる。[Problems to be Solved by the Invention] The method for manufacturing the cast clasp described above has the following problems because the material for forming the clasp pattern is paraffin wax.
【0008】■パラフィン系ワックスは全く弾性変形出
来ず可塑変形するため作業模型上の維持歯のアンダーカ
ット部から最大豊隆部を通って取り外ずすことが出来な
い。[0008] Since paraffin wax cannot be elastically deformed at all and deforms plastically, it cannot be removed from the undercut portion of the retaining tooth on the working model through the maximum protrusion.
【0009】無理に取り外ずすと永久変形を生じ正確な
適合が得られない。このため維持力のコントロールされ
た正確なクラスプを造ることが出来ない。従ってパラフ
ィン系ワックスのクラスプパターンは必ず作業模型を複
印象し模型用埋没材に置き換えて模型用埋没材にクラス
プパターンを成形し模型用埋没材ごと鋳造用埋没材で埋
没する。所謂型ごと埋没法を行なわなければならない。
このためクラスプ製作工程が煩雑で長い製作時間を要し
、材料コストも多大なものとなる。Forcible removal will cause permanent deformation, making it impossible to obtain an accurate fit. For this reason, it is not possible to create an accurate clasp with controlled retention force. Therefore, the clasp pattern of paraffin wax is always made by making a double impression of the working model, replacing it with the investment material for the model, molding the clasp pattern on the investment material for the model, and burying it together with the investment material for the model in the investment material for casting. The so-called burial method must be performed for each type. For this reason, the clasp manufacturing process is complicated and requires a long manufacturing time, and the material cost is also large.
【0010】■パラフィン系ワックスのクラスプパター
ンは模型用埋没材や石膏と接着しないため、必ず専用の
接着剤を使用しなければならない。従って接着剤の厚み
が約50μmの誤差を有するクラスプとなり、適合の良
いクラスプを得ることが出来ない。[0010] Since the clasp pattern made of paraffin wax does not adhere to the investment material for the model or plaster, a special adhesive must be used. Therefore, the resulting clasp has an error in adhesive thickness of about 50 μm, making it impossible to obtain a well-fitting clasp.
【0011】■パラフィン系ワックスのクラスプパター
ンは接着剤を使用して手指で圧接し模型用埋没材に接着
させるが、その時の埋没材の強度が低いため埋没材の粒
子が剥がれ落ち維持歯の形態及び表面性状が悪くなる。
この埋没材の剥がれ落ちた粒子がパラフィン系ワックス
のクラスプパターンに付着し表面性状の良い鋳造クラス
プを造ることが出来ない。[0011] The paraffin wax clasp pattern is bonded to the investment material for the model by pressing it with the hands and fingers using an adhesive, but because the strength of the investment material is low at that time, the particles of the investment material fall off and maintain the shape of the tooth. and the surface quality deteriorates. The peeled off particles of the investment material adhere to the paraffin wax clasp pattern, making it impossible to create a cast clasp with good surface quality.
【0012】■パラフィン系ワックスのクラスプパター
ンは結晶性が高く比較的分子量の低いポリマーであり、
ガラス転移温度Tgと融点Tmが非常に近いが金属のよ
うにガラス転移点が無いような物質であるため、ワック
スの加熱焼却時の温度上昇速度が大きすぎると溶けたワ
ックスが沸騰し、気体となったワックスが膨張するので
埋没材が急加圧され埋没材に亀裂が発生したり埋没材内
面の荒れが生じたりする。■The clasp pattern of paraffin wax is a polymer with high crystallinity and relatively low molecular weight.
Although the glass transition temperature Tg and melting point Tm are very close to each other, it is a substance that does not have a glass transition point like metals, so if the rate of temperature rise during heating and incineration of wax is too high, the melted wax will boil and turn into gas. As the wax expands, the investment material is suddenly pressurized, causing cracks in the investment material and roughening of the inner surface of the investment material.
【0013】本発明はこれらの問題点を解決するためパ
ラフィン系ワックスに代わる新しい材質のクラスプパタ
ーンを開発しようとするものである。The present invention aims to solve these problems by developing a clasp pattern made of a new material to replace paraffin wax.
【0014】一方、パターン用ワックスの代わりにパタ
ーン用レジンを使う方法もある。パターン用レジンは、
PMMA系の即時重合型レジンで、これはパターン用ワ
ックスに比べ弾性は大きいが、硬化が遅く、弾性も十分
でない為作業時間内に作業模型のアンダーカット部から
外すときパターン用ワックスの場合と同様永久変形を伴
う。On the other hand, there is also a method of using pattern resin instead of pattern wax. The resin for the pattern is
This is a PMMA-based instant-polymerizing resin, and although it has greater elasticity than pattern wax, it cures slowly and does not have sufficient elasticity, so it must be removed from the undercut part of the working model during the working time, similar to pattern wax. with permanent deformation.
【0015】化学重合に変えて、光重合型化合物を用い
れば硬化の速いパターンレジンが得られる可能性がある
。特開平1−110609号には、常温で固体のエチレ
ン性二重結合を少なくとも1個含有する光重合可能な化
合物を用いた光重合パターン用レジン組成物が開示され
ている。同公報にはレジンの操作性、強度、鋳造性が記
載されているが、操作性、鋳造性は十分でなく、特に鋳
造用の埋没材に石膏系埋没材を用いた場合、鋳造物表面
のはだあれはひどく、実用上とても使用に耐えるもので
はない。従来、このようなロストワックスの技術は歯科
用のみならず、一般工業用にも要望が多かったにもかか
わらず達成されていなかったものである。[0015] If a photopolymerizable compound is used instead of chemical polymerization, it is possible to obtain a pattern resin that hardens quickly. JP-A-1-110609 discloses a resin composition for photopolymerizable patterns using a photopolymerizable compound containing at least one ethylenic double bond that is solid at room temperature. Although the same publication describes the operability, strength, and castability of resin, the operability and castability are not sufficient, and especially when a gypsum-based investment material is used for casting, the surface of the cast It's so bad that it's practically unusable. Conventionally, such lost wax technology has not been achieved, although there have been many requests not only for dental applications but also for general industrial applications.
【0016】[0016]
【課題を解決するための手段】本発明の目的は、一般工
業分野においておよび歯科用に有用な、新規な光硬化性
樹脂組成物を提供することにある。SUMMARY OF THE INVENTION It is an object of the present invention to provide a novel photocurable resin composition useful in the general industrial field and in dentistry.
【0017】本発明の他の目的は、部分床義歯を製作す
るに当たり、義歯の把持と維持と、支持とを授ける金属
構成部分である鋳造クラスプをロストワックス法にて製
作する際に、維持力、耐久性などに対する理論的な形状
を示す鋳造クラスプの原型即ちクラスプのパターンを造
るための光硬化性樹脂組成物を提供することにある。Another object of the present invention is to reduce the retention force when manufacturing a cast clasp, which is a metal component that provides gripping, maintenance, and support for the denture, by the lost wax method when manufacturing a partial denture. It is an object of the present invention to provide a photocurable resin composition for making a prototype of a cast clasp, that is, a clasp pattern, which exhibits a theoretical shape with respect to durability and the like.
【0018】本発明のさらに他の目的および利点は以下
の説明から明らかとなろう。Further objects and advantages of the invention will become apparent from the following description.
【0019】本発明によれば、本発明の上記目的および
利点は、
(A)下記式1According to the present invention, the above objects and advantages of the present invention are as follows: (A) The following formula 1
【0020】[0020]
【化2】[Case 2]
【0021】で表わされるフタル酸ジグリシジルメタク
リレート30〜60重量部と(B)平均粒径1〜50μ
、分子量1万〜200万の有機高分子の微粉末40〜7
0重量部と(C)光ラジカル重合開始剤(A)成分と(
B)成分の合計100重量部当り0.04〜6重量部を
含む光硬化性樹脂組成物によって達成される。30 to 60 parts by weight of diglycidyl phthalate methacrylate represented by: and (B) an average particle size of 1 to 50 μm.
, fine organic polymer powder with a molecular weight of 10,000 to 2 million 40 to 7
0 parts by weight and (C) radical photopolymerization initiator (A) component and (
This is achieved by a photocurable resin composition containing 0.04 to 6 parts by weight of component B) per 100 parts by weight in total.
【0022】本発明の光硬化性樹脂組成物は、上記のと
おり、(A),(B)および(C)の3成分をそれぞれ
特定割合で含有する。As described above, the photocurable resin composition of the present invention contains the three components (A), (B) and (C) in specific proportions.
【0023】フタル酸ジグリシジルメタクリレート(A
)は、上記式1で表わされる化合物である。フタル酸ジ
グリシジルメタクリレートは30〜60重量部、好まし
くは35〜55重量部で用いられる。Diglycidyl phthalate methacrylate (A
) is a compound represented by the above formula 1. Diglycidyl phthalate methacrylate is used in an amount of 30 to 60 parts by weight, preferably 35 to 55 parts by weight.
【0024】有機高分子の微粉末(B)の該有機高分子
としては、フタル酸ジグリシジルメタクリレートに溶解
しないかあるいは溶解性が非常に小さいものであり、例
えばパラフィンワックス、ポリメチルメタクリレート、
ポリエチルメタクリレート、ポリブチルメタクリレート
、デンプン、パラホルムアルデヒド等を好ましいものと
して挙げることができる。The organic polymer of the organic polymer fine powder (B) is one that does not dissolve in diglycidyl phthalate methacrylate or has very low solubility, such as paraffin wax, polymethyl methacrylate,
Preferred examples include polyethyl methacrylate, polybutyl methacrylate, starch, and paraformaldehyde.
【0025】これらの有機高分子は、好ましくは100
0ppm以下、より好ましくは500ppm以下の灰分
しか含有していないことが望ましい。[0025] These organic polymers preferably have a molecular weight of 100
It is desirable that the ash content is 0 ppm or less, more preferably 500 ppm or less.
【0026】また、これらの有機高分子は数平均分子量
が1万〜200万のものであり、2万〜100万のもの
が好ましい。Further, these organic polymers have a number average molecular weight of 10,000 to 2,000,000, preferably 20,000 to 1,000,000.
【0027】かかる有機高分子の微粉末は平均粒径1〜
50μを有し、好ましくは2〜30μを有する。[0027] The fine powder of organic polymer has an average particle size of 1 to
50μ, preferably 2 to 30μ.
【0028】有機高分子の微粉末は40〜70重量部の
割合で用いられ、好ましくは45〜65重量部の割合で
用いられる。The fine powder of organic polymer is used in an amount of 40 to 70 parts by weight, preferably 45 to 65 parts by weight.
【0029】光ラジカル重合開始剤(C)としては公知
のものが区別なく使用しうるが、好ましくはカンファー
キノン、ベンジル、ベンゾイルメチルエーテル、ベンゾ
イルイソプロピルエーテル、チオキサントン誘導体、ベ
ンゾフェノン、アセトフェノン等を好ましいものとして
挙げることができる。この他さらに重合促進剤、安定剤
等を併用してもよい。また、必要に応じ、上記(A)成
分以外の他のラジカル重合性モノマーを(A)成分と(
B)成分の合計100重量部当り40重量部以下の割合
で使用することもできる。As the photoradical polymerization initiator (C), any known one may be used without distinction, but camphorquinone, benzyl, benzoyl methyl ether, benzoyl isopropyl ether, thioxanthone derivatives, benzophenone, acetophenone, etc. are preferred. can be mentioned. In addition to these, polymerization accelerators, stabilizers, etc. may be used in combination. In addition, if necessary, other radically polymerizable monomers other than the above component (A) may be added to the component (A) and (
It can also be used in a proportion of 40 parts by weight or less per 100 parts by weight of component B).
【0030】かかる光ラジカル重合開始剤は、(A)成
分と(B)成分の合計100重量部当り0.04〜6重
量部の割合で用いられ、好ましくは0.1〜4重量部の
割合で用いられる。The photoradical polymerization initiator is used in an amount of 0.04 to 6 parts by weight, preferably 0.1 to 4 parts by weight, per 100 parts by weight of components (A) and (B). used in
【0031】本発明の光硬化性樹脂組成物は、上記(A
),(B)および(C)の3成分を、任意の順序で経時
的にあるいは同時に、充分に攪拌混合することにより製
造することができる。The photocurable resin composition of the present invention has the above-mentioned (A
), (B) and (C) can be produced by thoroughly stirring and mixing the three components in any order over time or simultaneously.
【0032】以下実施例により本発明を詳述する。本発
明はこれらの実施例により何ら制限されるものではない
。The present invention will be explained in detail with reference to Examples below. The present invention is not limited in any way by these Examples.
【0033】[0033]
実施例1
フタル酸ジグリシジルメタクリレート(ナガセ化成(株
)、デナコールDA721)1g、ポリメチルメタクリ
レート(新中村化学(株)、ハイパールD−250M)
0.6g、パラフィンワックス粉末(日本精鑞(株)、
フローセンUF80)0.65g、ハイドロキノン0.
002g、カンファーキノン0.01g、ジメチル−p
−トルイジン0.01gをスパチュラで混合し、真空下
脱泡してペースト状物とした。Example 1 Diglycidyl phthalate methacrylate (Nagase Kasei Co., Ltd., Denacol DA721) 1 g, polymethyl methacrylate (Shin Nakamura Chemical Co., Ltd., Hypal D-250M)
0.6g, paraffin wax powder (Nippon Seirin Co., Ltd.)
Frosene UF80) 0.65g, hydroquinone 0.
002g, camphorquinone 0.01g, dimethyl-p
- 0.01 g of toluidine was mixed with a spatula and defoamed under vacuum to form a paste.
【0034】実施例2
フタル酸ジグリシジルメタクリレート1g、ポリメチル
メタクリレート(新中村化学(株)、ハイパールD−2
50M)0.6g、ポリメチルメタクリレート架橋品(
新中村化学(株)、ハイパールTM−150)0.45
g、パラフィンワックス(日本精鑞(株)、LUVAX
0321)0.25g、カンファーキン0.01g,ジ
メチル−p−トルイジン0.01gをスパチュラで混合
し、真空下脱泡してペースト状物とした。Example 2 1 g of diglycidyl phthalate methacrylate, polymethyl methacrylate (Shin Nakamura Chemical Co., Ltd., Hyperal D-2)
50M) 0.6g, polymethyl methacrylate crosslinked product (
Shin Nakamura Chemical Co., Ltd., Hyperal TM-150) 0.45
g, Paraffin wax (Nippon Seirin Co., Ltd., LUVAX
0321), 0.01 g of camphorquine, and 0.01 g of dimethyl-p-toluidine were mixed with a spatula and defoamed under vacuum to form a paste.
【0035】実施例1、2のペーストを0.5mmのア
ンダーカットを持つ直径5mmの円柱に3/4周まで巻
きつけ、光照射器(歯科用、(株)モリタ、α−ライト
)で5分間光照射後、アンダーカットから抜いて、石膏
系埋没材(徳山曹達(株)、ホワイトベストM)で埋没
し、通常の方法に従って、歯科用金、銀、パラジウム合
金で鋳造物を作成した。ペーストの操作性、鋳造物の表
面状態、変形は表1のごとくであった。[0035] The pastes of Examples 1 and 2 were wrapped around a cylinder with a diameter of 5 mm having an undercut of 0.5 mm up to 3/4 of the circumference, and heated with a light irradiator (for dental use, Morita Co., Ltd., α-Light) for 50 minutes. After being irradiated with light for a minute, it was removed from the undercut and buried with a gypsum-based investment material (Tokuyama Soda Co., Ltd., White Best M), and a cast made of dental gold, silver, and palladium alloy was created according to a conventional method. The operability of the paste, the surface condition of the casting, and the deformation were as shown in Table 1.
【0036】[0036]
【表1】[Table 1]
【0037】[0037]
【発明の効果】本発明の光硬化性樹脂組成物は歯科用鋳
造クラスプのパターンを製造するのに好適に使用される
。INDUSTRIAL APPLICABILITY The photocurable resin composition of the present invention is suitably used for producing patterns for dental casting clasps.
【0038】すなわち、本発明の組成物は鋳造クラスプ
のパターンを製造する際の操作性に優れ、また表面特性
に優れ変形性がないか極めて少ない鋳造クラスプのパタ
ーンを与える。That is, the composition of the present invention has excellent operability in producing a cast clasp pattern, and provides a cast clasp pattern with excellent surface properties and no or very little deformability.
Claims (1)
〜60重量部と(B)平均粒径1〜50μ、分子量1万
〜200万の有機高分子の微粉末40〜70重量部と(
C)光ラジカル重合開始剤(A)成分と(B)成分の合
計100重量部当り0.04〜6重量部を含む光硬化性
樹脂組成物。Claim 1: (A) Diglycidyl phthalate methacrylate 30 represented by the following formula 1:
~60 parts by weight; (B) 40 to 70 parts by weight of an organic polymer fine powder with an average particle size of 1 to 50 μ and a molecular weight of 10,000 to 2 million;
C) A photocurable resin composition containing 0.04 to 6 parts by weight per 100 parts by weight of the photoradical polymerization initiator (A) and (B).
Priority Applications (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP3038867A JPH04348118A (en) | 1991-02-12 | 1991-02-12 | Photo-setting resin composition |
EP19920301102 EP0499435A3 (en) | 1991-02-12 | 1992-02-10 | Photo-curable resin composition |
US07/833,744 US5338769A (en) | 1991-02-12 | 1992-02-11 | Photo-curable resin composition |
CA002061002A CA2061002A1 (en) | 1991-02-12 | 1992-02-11 | Photo-curable resin composition |
KR1019920001986A KR950013820B1 (en) | 1991-02-12 | 1992-02-12 | Photo curable resin composition |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP3038867A JPH04348118A (en) | 1991-02-12 | 1991-02-12 | Photo-setting resin composition |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH04348118A true JPH04348118A (en) | 1992-12-03 |
Family
ID=12537164
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP3038867A Withdrawn JPH04348118A (en) | 1991-02-12 | 1991-02-12 | Photo-setting resin composition |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH04348118A (en) |
-
1991
- 1991-02-12 JP JP3038867A patent/JPH04348118A/en not_active Withdrawn
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