JPH0434734U - - Google Patents

Info

Publication number
JPH0434734U
JPH0434734U JP7580290U JP7580290U JPH0434734U JP H0434734 U JPH0434734 U JP H0434734U JP 7580290 U JP7580290 U JP 7580290U JP 7580290 U JP7580290 U JP 7580290U JP H0434734 U JPH0434734 U JP H0434734U
Authority
JP
Japan
Prior art keywords
hoop
lead frame
shaped lead
encapsulation
preheating section
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP7580290U
Other languages
English (en)
Japanese (ja)
Other versions
JP2551100Y2 (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1990075802U priority Critical patent/JP2551100Y2/ja
Publication of JPH0434734U publication Critical patent/JPH0434734U/ja
Application granted granted Critical
Publication of JP2551100Y2 publication Critical patent/JP2551100Y2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Landscapes

  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
JP1990075802U 1990-07-17 1990-07-17 半導体素子封入装置 Expired - Lifetime JP2551100Y2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1990075802U JP2551100Y2 (ja) 1990-07-17 1990-07-17 半導体素子封入装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1990075802U JP2551100Y2 (ja) 1990-07-17 1990-07-17 半導体素子封入装置

Publications (2)

Publication Number Publication Date
JPH0434734U true JPH0434734U (en:Method) 1992-03-23
JP2551100Y2 JP2551100Y2 (ja) 1997-10-22

Family

ID=31616703

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1990075802U Expired - Lifetime JP2551100Y2 (ja) 1990-07-17 1990-07-17 半導体素子封入装置

Country Status (1)

Country Link
JP (1) JP2551100Y2 (en:Method)

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5599729A (en) * 1979-01-26 1980-07-30 Hitachi Ltd Resin molding method of electronic part

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5599729A (en) * 1979-01-26 1980-07-30 Hitachi Ltd Resin molding method of electronic part

Also Published As

Publication number Publication date
JP2551100Y2 (ja) 1997-10-22

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Legal Events

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EXPY Cancellation because of completion of term