JPH04343652A - Floor polishing machine and floor polishing method - Google Patents

Abstract

PURPOSE:To prevent step-shaped scratches from being left and require no manual post-treatment by providing positioning sections for individual processes displaced at a constant interval from the inside to the outside in the order of the processes, and positioning and fixing tools with the grain size ranging from a rough grain size to a fine grain size in sequence in the order of the processes. CONSTITUTION:In the first process, the roughest polishing tool T1 for the first process is coupled with a positioning projection A1 for the first process and fixed with a tool fitting pad 11. A protective cover is set along a wall, and the floor face near the wall is polished. In the second process, the polishing tool T1 for the first process is removed, and a polishing tool T2 for the second process with the grain size finer than before is fitted to a positioning projection A2 for the second process. When the floor is polished with the protective cover set along the wall, the polishing area is overlapped with the first process and expanded, and scratches generated in the first process are removed. Scratches generated in the previous process are removed as the process advances, and scratches themselves have little steps and are continued with very smooth slant faces.

Description

[Detailed description of the invention]

0001

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a floor polishing machine used for repolishing stone tile floors and a floor polishing method using the same.

0002

[Prior Art] Conventionally, this type of floor polishing machine has a tool mounting pad fixed to a rotating shaft, a polishing tool removably fixed to the pad, and a protective cover covering the periphery of the tool mounting pad. The floor is polished by rotating the polishing tool together with the pad. As for the polishing method, as the process progresses from the first step, a tool with coarse grain size is replaced with a tool with fine grain size, and finally polishing is performed by buffing.

[0003] There are generally two types of rotational drive mechanisms for tool mounting pads: one-axis type and three-axis type (planetary type).
In the 3-axis system, for example, rotating shafts are placed at three locations inside the protective cover, a small tool mounting pad is fixed to each rotating shaft so that it rotates independently, and a small tool mounting pad is fixed to the bottom of each tool mounting pad. The structure is such that a small polishing tool having approximately the same diameter as the tool mounting pad is fixed, and each polishing tool is rotated independently. Although this has good polishing performance, the rotation mechanism is relatively complicated and the cost is high.

[0004] In the single-axis method, one vertical rotating shaft is arranged in the center of the protective cover, and a tool mounting pad that is large enough to spread over the entire area inside the protective cover is fixed to the rotating shaft and rotated. ing. In this single-axis system, there are several mounting structures for the polishing tool. For example, there is a structure in which a large polishing tool with approximately the same diameter as the pad is attached and rotates around the rotation axis, and a tool mounting pad as shown in Figure 12. 3 to 5 relatively small polishing tools T on the bottom surface of 31
There is a structure in which each polishing tool T is fixed around the rotating shaft 32 at intervals in the circumferential direction, and each polishing tool T is made to revolve around the rotating shaft 32. Among the uniaxial systems, the former structure in which a large polishing tool with the same diameter as the tool mounting pad is attached is difficult to handle due to the large size of the polishing tool, and the polishing tool itself tends to wear unevenly.

Among the uniaxial methods, the latter one shown in FIG. 12 has a structure in which a plurality of relatively small-diameter polishing tools T revolve around each other.
It can be said that the rotation mechanism is relatively simple, and the uneven wear of the polishing tool itself is small.

[0006]

[Problems to be Solved by the Invention] In a structure in which a plurality of polishing tools T are rotated around the rotational axis in a single-axis system as shown in FIG. Since the protective cover 34 is provided, the floor surface at a certain distance from the edge of the wall W cannot be polished. In addition, tools for each process, from coarse-grained tools to fine-grained tools, are always mounted at the same mounting position. When repolishing the floor surfaces near the walls and corners of each stone tile under these conditions, if the protective cover 34 is placed along the wall W and the polishing work is performed, tools ranging from coarse grains to fine grains can be polished. Since both draw a circle with the same radius from the rotation axis, it is not possible to remove the polishing allowance sequentially.
As shown in FIG. 13, a band-like rough step-like scratch S remains at a boundary portion at a certain distance from the wall surface or corner. Conventionally, these scratches S have been removed manually using a hand polisher, but this requires a lot of effort and can actually take more than twice as long as using a polisher, increasing costs. It was the cause of

[0007]

[Object of the Invention] The present invention prevents step-like scratches from remaining by automatically removing scratches from the previous process in each step during polishing work on walls or corners, and eliminates the need for polishing by hand polisher. The purpose is to eliminate the need for post-processing.

[0008]

[Means for Solving the Problems] In order to achieve the above object, the floor polishing machine of the present invention includes: a vertical rotating shaft interlockingly connected to a drive source; a tool mounting pad fixed to the rotating shaft; A plurality of polishing tools are detachably fixed to positions apart from the axis of the tool mounting pad, and a protective cover surrounds the rotational polishing range of the polishing tools, and the rotation axis is adjusted by rotation of the tool mounting pad. In a floor polishing machine that revolves around the polishing tool, the tool mounting pad has primary and secondary
Positioning parts for each process for positioning the polishing tools for the next,..., and n-th processes are provided at regular intervals from the inner side to the outer side in the radial direction in the order of the above steps, and are replaced for each process. This polishing tool is characterized by positioning and fixing tools with coarse grain size to fine grain size tools in the order of the above-mentioned steps.

Further, a hook-and-loop fastener layer is provided on the bottom surface of the tool mounting pad, and each tool is provided with a fastener layer that can be freely attached to the hook-and-loop layer, and a positioning hole formed in the polishing tool is provided as a tool positioning portion. A fitting positioning projection is formed on the tool mounting pad, or a positioning hole is formed on the tool mounting pad into which a positioning projection formed on the polishing tool as a positioning portion fits.

[0010] In a floor polishing method in which a floor surface is polished using a plurality of polishing tools that are driven by a rotating shaft and revolve around the rotating shaft within a protective cover, each time the polishing process changes from the first polishing process, the grain size becomes coarser. The polishing tools are replaced with polishing tools of finer grain size, and their mounting positions are sequentially shifted outward in the radial direction so that the polishing range approaches the outer protective cover side.

[0011]

[Operation] When polishing the edge of a wall with the protective cover along the wall surface, each time the process is changed and the polishing tool is replaced with a finer grained polishing tool, the polishing tool is set to the outside position in order, so Scratches from the previous process are sequentially removed. In the end, the area near the wall is not polished, but the polished and unpolished surfaces are connected by an extremely gentle and scratch-free polished slope.

0012

DESCRIPTION OF THE PREFERRED EMBODIMENTS FIGS. 1 to 3 show a floor polishing machine to which the present invention is applied, in which the total polishing process is six steps. The polishing machine main body 1 includes a motor 2, a protective cover 3, wheels 4, etc.
A handle portion 6 having a switch and the like is provided at the upper end of an arm 5 extending diagonally rearward and upward from the polishing machine main body 1. In addition, a water storage tank 7 is attached to the arm 5.
A water supply pipe 17 connected to the lower end of the water storage tank 7 extends downward and is connected to a water supply pipe 18 inside the cover 3. 19 is a water supply pipe opening/closing cock.

In FIG. 2, a rotating shaft 8 of the motor 2 projects vertically into the lower protective cover 3, and a pad mounting flange 10 is attached to the tool mounting pad 1 at the lower end of the rotating shaft 8.
1 and is fixed. Tool mounting pad 11
A hook-and-loop fastener layer 12 is provided on substantially the entire lower surface of the holder, and a plurality of cylindrical tool positioning protrusions A1, . . . , A6 are formed as tool positioning portions. The tool mounting pad 11 is made of a rigid material such as metal, and weighs approximately 10 to 15 kg.

On the other hand, polishing tools T1 (T2, T3,
A hole 16 for positioning is formed in the center of each of T4, T5, T6), and a hook-and-loop fastener layer 13 that can be freely attached to the hook-and-loop layer 12 of the pad 11 is provided on the top surface of the polishing tool T1. There is. double-sided fastener layer 12,
The fastener structure consisting of 13 is called Velcro (trademark) or something similar. For example, one hook-and-loop fastener layer is provided with a large number of annular protrusions made of reinforcing fibers, and the other hook-and-loop fastener layer is provided with a large number of annular protrusions made of reinforcing fibers. is provided with a protrusion having a bulging tip, and the annular protrusion and the bulging tip are engaged to fasten the two. The protective cover 3 integrally has a generally cylindrical peripheral wall part 3a surrounding the outer periphery of the tool mounting pad 11 and an upper wall part 3b, and the outer periphery of the lower end of the peripheral wall part 3a is made of resin, for example, so as not to damage the wall. A protective member such as the following is attached. The water supply pipe 18 extends toward the rotating shaft 8 inside the cover 3, and a discharge portion 18a opens near the rotating shaft 8 to supply water to the tool mounting pad 11 and the floor surface.

In FIG. 3 showing the bottom surface of the polishing machine main body 1,
The tool positioning protrusions formed on the lower surface of the tool mounting pad 11 are the positioning protrusions A1 to 6 for the primary process.
6 sets of protrusions A1 up to positioning protrusion A6 for the next process,
..., A6 is formed. Three positioning protrusions A1 for the primary process are arranged on three equal parts of the circumference, and are arranged on the innermost side among all the protrusions A1, ..., A6,
A polishing tool T1 for the first step with the coarsest grain size (for example, #60) is attached. Positioning protrusion A2 for secondary process
are formed at a position a certain distance outward from each positioning protrusion A1 for the first process and at a position shifted by a certain angle θ in the circumferential direction, and Also a second one with a slightly finer grain size (e.g. #200)
The positioning protrusion T2 for the next process is attached. 3rd, 4th
Positioning projections A3, A for the next, fifth and sixth steps
Similarly to the above, three A5, A6, and A6 are formed at positions a certain distance outward from the pre-process protrusion and shifted by a certain angle θ in the circumferential direction. The 3rd, 4th, and 5th stages become more detailed.
Next, polishing tools for the 6th step T3, T4, T5, T
6 is installed. The grain sizes of the polishing tools T3, T4, and T5 for the third, fourth, and fifth steps are, for example, #500, #1000, and #2000 in this order, and the polishing tool T6 for the sixth step is as follows: A polishing buff is set. That is, the three positioning protrusions for the same process are formed at three equal positions on the circumference with the same radius from the rotation axis, and as the process progresses from the first process, their mounting radius r1,...,r6 is gradually increasing. The increase in radius of each of the positioning protrusions A1, ..., A6 with respect to the previous process overlaps the maximum polishing range of the previous process by a certain distance, and the scratch portion left in the previous process is polished with a certain polishing allowance. Increase the amount as much as possible.

To give an example of specific numerical values of each part, the tool mounting pad 11 has a diameter of 48 cm, and the polishing tool T1 has a diameter of 48 cm.
, T2 , T3 , T4 , T5 , T6 have a diameter of 80
mm is used. The first process positioning protrusion A1 has an installation radius r1 of 140 mm from the rotation axis.
As a result, a scratch with a maximum radius of 180 mm is drawn. The positioning protrusion A2 for the secondary process has an installation radius of 150 mm from the rotation axis, and θ=22° in the circumferential direction with respect to each positioning protrusion A1 for the primary process.
A scratch with a maximum radius of 190 mm is drawn, creating an overlap of 10 mm with the first process. The mounting radius r3, r4, r5, r6 of the positioning protrusion A3 for the tertiary process is also 10.
increase by mm, and 22 mm for the positioning protrusion in the previous process.
It is formed so as to be shifted in the circumferential direction by 10 degrees, and is
They are set to overlap by mm.

Next, to explain in detail the structure of each polishing tool, FIGS. 5 and 6 show a polishing tool T1 for the first step, in which a hook-and-loop fastener layer is formed on the top surface of an annular elastic resin plate 20 made of ABS resin or the like. 13 is provided, and an annular grindstone portion 22 is provided on the lower surface of the elastic resin plate 20 with synthetic leather 21 interposed therebetween. The outer peripheral surface of the grindstone portion 22 is tapered so that the diameter is smaller on the lower side, and the inner peripheral surface is tapered so that the diameter is larger on the lower side. As shown in Fig. 6, the whetstone part is divided into six equal parts around the circumference, and a cylindrical metal bonded diamond whetstone 23 made of nickel, cobalt, etc.
It is coated in a ring shape with phenolic resin, porous material, and GC abrasive grains to protect the metal chips from coming into direct contact with the joining step portions of the stone tiles and causing chipping. Although the details of the polishing tool for the second process are not shown, it has a structure that is almost the same as that for the first process shown in FIGS. 5 and 6.
A metal bond diamond whetstone is embedded.

FIGS. 7 and 8 show a polishing wheel T3 for the tertiary process.
The grindstone portion 22 is made of a resin-bonded diamond grindstone made of phenol resin or the like. Grinding wheel part 22
As in the first step, the outer circumferential surface and the inner circumferential surface are tapered, and the circumference is divided into 12 equal parts. The polishing tools T4 and T5 for the fourth and fifth steps have the same basic structure as the structure for the third step shown in FIGS. 7 and 8, except for the difference in grain size as described above. The polishing buff for the sixth step is composed of metal oxide (e.g. chromium oxide), elastic bond (e.g. synthetic rubber) and animal hair.
Its basic structure is the same as that shown in FIGS. 7 and 8.

Next, the polishing method will be explained. In the first process, three first process positioning protrusions A are placed as shown in Figure 3.
1. Polishing tool T for the first process with the coarsest grain size.
1 is fitted and fixed to the tool mounting pad 11 by the engagement of the hook-and-loop fastener layers 12 and 13. In this state, Figure 4
Polish the floor near the wall while placing the protective cover 3 along the wall W as shown in the figure. Then, a scratch is drawn at a position corresponding to the maximum diameter of polishing, as indicated by L1.

In the second step, the first step polishing tool T1 is removed, and the second step polishing tool T2 is attached to the second step positioning protrusion A2 instead. As you sand the floor while placing the protective cover 3 along the wall,
The polishing range is expanded to L2 with an overlap of, for example, 10 mm between the polishing and the first step, and the scratches L1 from the first step are removed. At the same time, the above scratch L1
A scratch L2 with a gentler step is drawn.

[0021] Similarly, after the third step, the third, fourth, and fifth steps are performed.
, positioning protrusions for the sixth step A3, A4, A5, A
6. Polishing tool T3 for 3rd, 4th, 5th, and 6th steps in order
, T4, T5, and T6 are replaced and installed, and the protective cover 3 is polished along the surface of the wall W. Then, the polishing tool itself is gradually replaced with a finer tool, so as the scratches from each previous process are removed, the scratches themselves gradually become smaller in level. Finally, as shown in FIG. 9, the polished and unpolished surfaces are connected by an extremely gentle slope with almost no scratches, and the surfaces are finally finished by buffing.

[0022]

[Another embodiment] Fig. 10 shows a positioning protrusion 37 on the tool side.
, a positioning hole B is formed on the tool mounting pad 11 side, and the protrusion 37 on the polishing tool side is fitted into the positioning hole B on the tool mounting pad side. Of course, positioning holes B are provided for each polishing tool for each process, and their arrangement is similar to that of the positioning protrusions (A1,...,A6) shown in FIG.
). This structure in which the positioning protrusion is provided on the polishing tool side is convenient when the thickness of the tool is thin, and the strength of the polishing tool can be maintained.

FIG. 11 shows an example in which holes are formed on both the tool side and the tool mounting pad side. That is, the positioning hole 16 is formed on the tool side, and the positioning hole B is formed on the tool mounting pad side, and both the positioning hole 16 on the tool side and the positioning hole B on the tool mounting pad side are formed. Both are equally formed. The positioning holes B are provided for each polishing tool for each process, and their arrangement is similar to the positioning protrusions (A1, . . . , A6) shown in FIG. When attaching the polishing tool to the tool attachment pad 11,
It is attached to a predetermined position using a guide rod 40 that fits into the positioning hole B and the positioning hole 16.

[0024]

Effects of the Invention As explained above, according to the present invention, when polishing a floor surface near a wall by replacing the polishing tool from one with a coarse grain size to one with a finer grain size, the first, second, . . . Since the mounting position of the polishing tool for the n-th step is shifted from radially inward to outward in the order of the above steps by a fixed interval, scratches generated in the previous step can be avoided by polishing the protective cover along the wall surface. can be removed using a polishing tool with a finer grain size, eliminating the need for scratches with large differences in the same location as in the past, and eliminating the need to manually remove scratches with a hand polisher after polishing.

[Brief explanation of drawings]

FIG. 1 is an overall perspective view, partially in section, of a floor polishing machine to which the present invention is applied.

FIG. 2 is an enlarged vertical cross-sectional view of the main body of the polishing machine.

FIG. 3 is a bottom view of the polishing machine main body.

FIG. 4 is an operation explanatory diagram showing the floor polishing method according to the present invention.

FIG. 5 is a front view of the polishing tool for the first step.

FIG. 6 is a plan view of the polishing tool for the first step.

FIG. 7 is a front view of the polishing tool for the tertiary process.

FIG. 8 is a plan view of the polishing tool for the tertiary process.

FIG. 9 is a schematic vertical cross-sectional view showing the state during polishing work.

FIG. 10 is a perspective view showing a modification of the tool positioning section.

FIG. 11 is a perspective view showing another modification of the tool positioning section.

FIG. 12 is a bottom view of a conventional floor polishing machine.

FIG. 13 is a schematic vertical cross-sectional view showing a state during polishing work according to a conventional example.

[Explanation of symbols]

2 Motor 3 Protective cover 8 Rotation axis 11 Tool mounting pad 12 Hook and loop fastener layer 13　Loop fastener layer 16 Positioning hole T1　　　First process polishing tool T2 Polishing tool for secondary process T3 Polishing tool for tertiary process T4　　　Fourth process polishing tool T5 Polishing tool for the 5th process T6　　6th process polishing tool A1 Positioning protrusion for primary process A2 Positioning protrusion for secondary process A3 Positioning protrusion for tertiary process A4 Positioning protrusion for 4th process A5 Positioning protrusion for 5th process A6 Positioning protrusion for the 6th process

Claims (7)

[Claims] 1. A vertical rotating shaft interlockingly connected to a drive source, a tool mounting pad fixed to the rotating shaft, and a tool mounting pad detachably fixed to a position away from the axis of the tool mounting pad. A floor polishing machine is equipped with a plurality of polishing tools and a protective cover that surrounds the rotating polishing range of the polishing tools, and the polishing tools revolve around the rotation axis by rotation of a tool mounting pad. 1st, 2nd,…
, a polishing tool in which positioning parts for each process for positioning the polishing tools for the n-th process are provided so as to be shifted by a fixed interval from the inner side to the outer side in the radial direction in the order of the above steps, and are replaced for each process. A floor polishing machine characterized by positioning and fixing tools with coarse grain size to fine grain size tools in the above process order. 2. The floor polishing machine according to claim 1, wherein a hook and loop fastener layer is provided on the lower surface of the tool mounting pad, and each polishing tool has a hook and loop fastener layer that can be freely attached to the hook and loop fastener layer of the tool mounting pad. A floor polishing machine characterized in that a positioning hole is formed at the same time as a positioning hole, and a positioning protrusion that fits into the positioning hole of the polishing tool is formed on the lower surface of the tool mounting pad as a positioning part. 3. The floor polishing machine according to claim 1, wherein a hook-and-loop layer is provided on the lower surface of the tool mounting pad, and each polishing tool is provided with a hook-and-loop layer that can be freely attached to the hook-and-loop layer, and a hook-and-loop layer for positioning. A floor polishing machine characterized in that a protrusion is formed on the tool mounting pad, and a positioning hole is formed as a positioning portion on the lower surface of the tool mounting pad to fit into the positioning protrusion of the polishing tool. 4. The floor polishing machine according to claim 1, wherein a hook-and-loop layer is provided on the lower surface of the tool mounting pad, and each polishing tool is provided with a hook-and-loop layer that can be freely attached to the hook-and-loop layer; A hole for positioning is formed in the
A floor polishing machine characterized in that a positioning hole corresponding to the positioning hole of the polishing tool is formed as a positioning part on the lower surface of the tool mounting pad. 5. The floor polishing machine according to claim 1, wherein the tool mounting pad is made of a rigid material such as a metal material, and the weight of the tool mounting pad is approximately 1.
A floor polishing machine characterized by being 0 to 15 kg. 6. The floor polishing machine according to claim 1, further comprising a polishing water supply mechanism, wherein a polishing water discharge portion of the polishing water supply mechanism is disposed near a vertical rotating shaft interlockingly connected to a drive shaft. A floor polishing machine characterized in that polishing water is supplied from the discharge portion to a plurality of polishing tools fixed to a tool mounting pad. 7. In a floor polishing method in which a floor surface is polished by a plurality of polishing tools driven by a rotating shaft and revolving around the rotating shaft within a protective cover, each time the polishing process changes from the first polishing process, the grain size is increased. A floor characterized in that the polishing tools are sequentially replaced with polishing tools of finer grain size, and the mounting positions of these tools are sequentially shifted radially outward so that the polishing range approaches the outer protective cover side. Polishing method.