JPH0433954A - Polyamide composition - Google Patents
Polyamide compositionInfo
- Publication number
- JPH0433954A JPH0433954A JP13877390A JP13877390A JPH0433954A JP H0433954 A JPH0433954 A JP H0433954A JP 13877390 A JP13877390 A JP 13877390A JP 13877390 A JP13877390 A JP 13877390A JP H0433954 A JPH0433954 A JP H0433954A
- Authority
- JP
- Japan
- Prior art keywords
- polyamide
- semi
- film
- formula
- acid
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000203 mixture Substances 0.000 title claims abstract description 25
- 239000004952 Polyamide Substances 0.000 title claims abstract description 23
- 229920002647 polyamide Polymers 0.000 title claims abstract description 23
- 229920006012 semi-aromatic polyamide Polymers 0.000 claims abstract description 23
- 239000004953 Aliphatic polyamide Substances 0.000 claims abstract description 11
- 229920003231 aliphatic polyamide Polymers 0.000 claims abstract description 11
- 125000003118 aryl group Chemical group 0.000 claims abstract description 4
- 239000000126 substance Substances 0.000 claims description 4
- 125000004432 carbon atom Chemical group C* 0.000 claims description 3
- 230000004888 barrier function Effects 0.000 abstract description 13
- 238000002156 mixing Methods 0.000 abstract description 9
- 239000004677 Nylon Substances 0.000 abstract description 2
- 229920001778 nylon Polymers 0.000 abstract description 2
- 230000001588 bifunctional effect Effects 0.000 abstract 1
- 238000000034 method Methods 0.000 description 15
- 239000007789 gas Substances 0.000 description 13
- 229920005989 resin Polymers 0.000 description 12
- 239000011347 resin Substances 0.000 description 12
- 238000002844 melting Methods 0.000 description 10
- 230000008018 melting Effects 0.000 description 10
- QTBSBXVTEAMEQO-UHFFFAOYSA-N Acetic acid Chemical compound CC(O)=O QTBSBXVTEAMEQO-UHFFFAOYSA-N 0.000 description 9
- 229920002292 Nylon 6 Polymers 0.000 description 8
- WNLRTRBMVRJNCN-UHFFFAOYSA-N adipic acid Chemical compound OC(=O)CCCCC(O)=O WNLRTRBMVRJNCN-UHFFFAOYSA-N 0.000 description 6
- 230000000052 comparative effect Effects 0.000 description 6
- IVSZLXZYQVIEFR-UHFFFAOYSA-N m-xylene Chemical group CC1=CC=CC(C)=C1 IVSZLXZYQVIEFR-UHFFFAOYSA-N 0.000 description 6
- 238000005259 measurement Methods 0.000 description 6
- -1 polyethylene Polymers 0.000 description 5
- 238000006116 polymerization reaction Methods 0.000 description 5
- OFOBLEOULBTSOW-UHFFFAOYSA-N Malonic acid Chemical compound OC(=O)CC(O)=O OFOBLEOULBTSOW-UHFFFAOYSA-N 0.000 description 4
- 238000006243 chemical reaction Methods 0.000 description 4
- 229920000642 polymer Polymers 0.000 description 4
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 4
- QEVGZEDELICMKH-UHFFFAOYSA-N Diglycolic acid Chemical compound OC(=O)COCC(O)=O QEVGZEDELICMKH-UHFFFAOYSA-N 0.000 description 3
- 239000000654 additive Substances 0.000 description 3
- 239000001361 adipic acid Substances 0.000 description 3
- 235000011037 adipic acid Nutrition 0.000 description 3
- 239000007864 aqueous solution Substances 0.000 description 3
- 229920001577 copolymer Polymers 0.000 description 3
- 150000004985 diamines Chemical class 0.000 description 3
- 150000001991 dicarboxylic acids Chemical class 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 238000004806 packaging method and process Methods 0.000 description 3
- 150000003839 salts Chemical class 0.000 description 3
- DNXOCFKTVLHUMU-UHFFFAOYSA-N 2-[4-(carboxymethoxy)phenoxy]acetic acid Chemical compound OC(=O)COC1=CC=C(OCC(O)=O)C=C1 DNXOCFKTVLHUMU-UHFFFAOYSA-N 0.000 description 2
- 241000251468 Actinopterygii Species 0.000 description 2
- PAYRUJLWNCNPSJ-UHFFFAOYSA-N Aniline Chemical compound NC1=CC=CC=C1 PAYRUJLWNCNPSJ-UHFFFAOYSA-N 0.000 description 2
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
- 229920000219 Ethylene vinyl alcohol Polymers 0.000 description 2
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- NBIIXXVUZAFLBC-UHFFFAOYSA-N Phosphoric acid Chemical compound OP(O)(O)=O NBIIXXVUZAFLBC-UHFFFAOYSA-N 0.000 description 2
- 239000004698 Polyethylene Substances 0.000 description 2
- 239000004743 Polypropylene Substances 0.000 description 2
- 239000002253 acid Substances 0.000 description 2
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 2
- WPYMKLBDIGXBTP-UHFFFAOYSA-N benzoic acid Chemical compound OC(=O)C1=CC=CC=C1 WPYMKLBDIGXBTP-UHFFFAOYSA-N 0.000 description 2
- 230000006866 deterioration Effects 0.000 description 2
- 238000001125 extrusion Methods 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 238000000465 moulding Methods 0.000 description 2
- 239000001301 oxygen Substances 0.000 description 2
- 229910052760 oxygen Inorganic materials 0.000 description 2
- 229920000728 polyester Polymers 0.000 description 2
- 229920001155 polypropylene Polymers 0.000 description 2
- 238000003756 stirring Methods 0.000 description 2
- 229920005992 thermoplastic resin Polymers 0.000 description 2
- BMVXCPBXGZKUPN-UHFFFAOYSA-N 1-hexanamine Chemical compound CCCCCCN BMVXCPBXGZKUPN-UHFFFAOYSA-N 0.000 description 1
- OEPOKWHJYJXUGD-UHFFFAOYSA-N 2-(3-phenylmethoxyphenyl)-1,3-thiazole-4-carbaldehyde Chemical compound O=CC1=CSC(C=2C=C(OCC=3C=CC=CC=3)C=CC=2)=N1 OEPOKWHJYJXUGD-UHFFFAOYSA-N 0.000 description 1
- PPZYHOQWRAUWAY-UHFFFAOYSA-N 2-[2-(carboxymethoxy)phenoxy]acetic acid Chemical compound OC(=O)COC1=CC=CC=C1OCC(O)=O PPZYHOQWRAUWAY-UHFFFAOYSA-N 0.000 description 1
- YCJKTVXHIFVHHB-UHFFFAOYSA-N 2-[6-(carboxymethoxy)naphthalen-2-yl]oxyacetic acid Chemical compound C1=C(OCC(O)=O)C=CC2=CC(OCC(=O)O)=CC=C21 YCJKTVXHIFVHHB-UHFFFAOYSA-N 0.000 description 1
- NLHHRLWOUZZQLW-UHFFFAOYSA-N Acrylonitrile Chemical compound C=CC#N NLHHRLWOUZZQLW-UHFFFAOYSA-N 0.000 description 1
- GVNWZKBFMFUVNX-UHFFFAOYSA-N Adipamide Chemical compound NC(=O)CCCCC(N)=O GVNWZKBFMFUVNX-UHFFFAOYSA-N 0.000 description 1
- 239000005711 Benzoic acid Substances 0.000 description 1
- 229920000305 Nylon 6,10 Polymers 0.000 description 1
- 229920002302 Nylon 6,6 Polymers 0.000 description 1
- REYJJPSVUYRZGE-UHFFFAOYSA-N Octadecylamine Chemical compound CCCCCCCCCCCCCCCCCCN REYJJPSVUYRZGE-UHFFFAOYSA-N 0.000 description 1
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 1
- 239000004793 Polystyrene Substances 0.000 description 1
- 229920003776 Reny® Polymers 0.000 description 1
- 235000021355 Stearic acid Nutrition 0.000 description 1
- 235000011054 acetic acid Nutrition 0.000 description 1
- 150000007513 acids Chemical class 0.000 description 1
- 239000012790 adhesive layer Substances 0.000 description 1
- 229910000147 aluminium phosphate Inorganic materials 0.000 description 1
- 235000010233 benzoic acid Nutrition 0.000 description 1
- 235000013361 beverage Nutrition 0.000 description 1
- 229920006233 biaxially oriented polyamide Polymers 0.000 description 1
- 239000002981 blocking agent Substances 0.000 description 1
- 150000001732 carboxylic acid derivatives Chemical class 0.000 description 1
- 238000005266 casting Methods 0.000 description 1
- 229920006026 co-polymeric resin Polymers 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 238000007334 copolymerization reaction Methods 0.000 description 1
- 229920006039 crystalline polyamide Polymers 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 239000000975 dye Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000004715 ethylene vinyl alcohol Substances 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- 235000013305 food Nutrition 0.000 description 1
- 239000012760 heat stabilizer Substances 0.000 description 1
- RZXDTJIXPSCHCI-UHFFFAOYSA-N hexa-1,5-diene-2,5-diol Chemical compound OC(=C)CCC(O)=C RZXDTJIXPSCHCI-UHFFFAOYSA-N 0.000 description 1
- NBZBKCUXIYYUSX-UHFFFAOYSA-N iminodiacetic acid Chemical compound OC(=O)CNCC(O)=O NBZBKCUXIYYUSX-UHFFFAOYSA-N 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 238000003475 lamination Methods 0.000 description 1
- 239000000314 lubricant Substances 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- QIQXTHQIDYTFRH-UHFFFAOYSA-N octadecanoic acid Chemical compound CCCCCCCCCCCCCCCCCC(O)=O QIQXTHQIDYTFRH-UHFFFAOYSA-N 0.000 description 1
- OQCDKBAXFALNLD-UHFFFAOYSA-N octadecanoic acid Natural products CCCCCCCC(C)CCCCCCCCC(O)=O OQCDKBAXFALNLD-UHFFFAOYSA-N 0.000 description 1
- 239000000049 pigment Substances 0.000 description 1
- 239000004417 polycarbonate Substances 0.000 description 1
- 229920000515 polycarbonate Polymers 0.000 description 1
- 229920000573 polyethylene Polymers 0.000 description 1
- 239000002952 polymeric resin Substances 0.000 description 1
- 229920002223 polystyrene Polymers 0.000 description 1
- 239000004800 polyvinyl chloride Substances 0.000 description 1
- 229920000915 polyvinyl chloride Polymers 0.000 description 1
- 230000035936 sexual power Effects 0.000 description 1
- 239000003381 stabilizer Substances 0.000 description 1
- 239000008117 stearic acid Substances 0.000 description 1
- QAOWNCQODCNURD-UHFFFAOYSA-N sulfuric acid Substances OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 1
- 229920003002 synthetic resin Polymers 0.000 description 1
- KKEYFWRCBNTPAC-UHFFFAOYSA-L terephthalate(2-) Chemical compound [O-]C(=O)C1=CC=C(C([O-])=O)C=C1 KKEYFWRCBNTPAC-UHFFFAOYSA-L 0.000 description 1
- ISIJQEHRDSCQIU-UHFFFAOYSA-N tert-butyl 2,7-diazaspiro[4.5]decane-7-carboxylate Chemical compound C1N(C(=O)OC(C)(C)C)CCCC11CNCC1 ISIJQEHRDSCQIU-UHFFFAOYSA-N 0.000 description 1
- UVZICZIVKIMRNE-UHFFFAOYSA-N thiodiacetic acid Chemical compound OC(=O)CSCC(O)=O UVZICZIVKIMRNE-UHFFFAOYSA-N 0.000 description 1
- NCPXQVVMIXIKTN-UHFFFAOYSA-N trisodium;phosphite Chemical compound [Na+].[Na+].[Na+].[O-]P([O-])[O-] NCPXQVVMIXIKTN-UHFFFAOYSA-N 0.000 description 1
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明はポリアミド組成物に関する。更に詳しくは、高
いガスバリヤ−性を有すると同時に成形性、延伸作業性
、柔軟性に優れるポリアミド組成物に関する。DETAILED DESCRIPTION OF THE INVENTION [Industrial Field of Application] The present invention relates to polyamide compositions. More specifically, the present invention relates to a polyamide composition that has high gas barrier properties and is also excellent in moldability, stretching workability, and flexibility.
[従来の技術〕
近年、ガスバリヤ−性が要求される食品や飲料の包装用
に各種の樹脂、具体的にはエチレン−ビニルアルコール
共重合樹脂、塩化ビニリデン系樹脂、アクリロニトリル
系共重合樹脂、およびポリメタキシリレンアジパミド(
以下MXD・6と略記する)等のポリアミドがその用途
に応じて使われている。[Prior Art] In recent years, various resins, specifically ethylene-vinyl alcohol copolymer resins, vinylidene chloride resins, acrylonitrile copolymer resins, and polymer resins have been used for packaging food and beverages that require gas barrier properties. Taxylylene adipamide (
Polyamides such as MXD-6 (hereinafter abbreviated as MXD-6) are used depending on the purpose.
これらのガスバリヤ−性樹脂のうち、MXD・6はPE
Tとの共射出による多層容器、ポリエチレンやポリプロ
ピレンなと種々の熱可塑性樹脂との共押出による多層フ
ィルム等に用いられている。Among these gas barrier resins, MXD・6 is PE.
It is used for multilayer containers co-injected with T and multilayer films co-extruded with various thermoplastic resins such as polyethylene and polypropylene.
ところでMXD・6の融点は240°Cと高いため、溶
融成形する際には樹脂温度を250°C以上とする必要
があった。ところが、かかる高温は共押出する他の樹脂
あるいは接着層として用いる樹脂の劣化を誘起し昌く、
得られる成形品にフィッシュアイやゲル状物の発注トラ
ブルが頻発する問題があった。By the way, since the melting point of MXD-6 is as high as 240°C, it was necessary to set the resin temperature to 250°C or higher during melt molding. However, such high temperatures induce deterioration of other resins to be coextruded or of the resin used as the adhesive layer.
There was a problem in that the resulting molded products often had fish eyes and trouble ordering gel-like materials.
更に、MXD・6は、延伸作業性や柔軟性にも問題があ
ったため、必ずしも十分満足される材料とはいえなかっ
た。Furthermore, MXD-6 had problems in drawing workability and flexibility, so it could not necessarily be said to be a fully satisfactory material.
一般に結晶性ポリアミドの融点を降下させる手法及び延
伸作業性を向上させる手法としてジアミンあるいはジカ
ルボン酸のどちらか一方あるいは両者に対し適当量の共
重合成分を追加することが知られている。しかしながら
、MXD・6に関してその優れたガスバリヤ−性を維持
しつつ融点降下及び延伸作業性向上を達成することは極
めて困難とされていた。またMXD・6の柔軟性を改良
する手法としてナイロン−6等の脂肪族ポリアミドを混
合する方法が知られているがMXD・6の融点が240
°Cと高いため、溶融混合する際には樹脂温度を250
°C以上にする必要があった。かかる温度では混合する
脂肪族ポリアミドの劣化を誘起しやすく、得られた混合
物のフィルムにフィッシュアイやゲル状物の発生トラブ
ルが頻発する問題があった。Generally, it is known as a method to lower the melting point of crystalline polyamide and to improve stretching workability by adding an appropriate amount of a copolymer component to either diamine or dicarboxylic acid, or both. However, it has been extremely difficult to lower the melting point and improve the drawing workability of MXD-6 while maintaining its excellent gas barrier properties. Also, as a method to improve the flexibility of MXD-6, it is known to mix an aliphatic polyamide such as nylon-6, but the melting point of MXD-6 is 240.
Because the resin temperature is as high as 250 °C, the resin temperature is
The temperature had to be above °C. Such temperatures tend to induce deterioration of the aliphatic polyamide to be mixed, and there is a problem in that fish eyes and gel-like substances frequently occur in the film of the obtained mixture.
(発明の目的〕
本発明者等はかかる問題を解決すべく、特にMXD・6
に対するジアミンあるいはジカルボン酸といった共重合
成分について鋭意検討した結果、特定の構造を持つカル
ボン酸成分を導入することによりガスバリヤ−性を維持
しつつ融点降下と優れた延伸作業性を達成できることを
見出した。更に上記半芳香族ポリアミドに脂肪族ポリア
ミドを混合することにより、高いガスバリヤ−性を有す
ると同時に成形性、柔軟性に優れるポリアミド組成物を
見出し、本発明に到達した。(Purpose of the Invention) In order to solve this problem, the present inventors particularly aimed to
As a result of intensive studies on copolymerization components such as diamines and dicarboxylic acids, it was discovered that by introducing a carboxylic acid component with a specific structure, it is possible to lower the melting point and achieve excellent stretching workability while maintaining gas barrier properties. Furthermore, by mixing an aliphatic polyamide with the above-mentioned semi-aromatic polyamide, a polyamide composition having high gas barrier properties as well as excellent moldability and flexibility was discovered, and the present invention was achieved.
すなわち本発明は、半芳香族ポリアミド(A)99〜1
重量%と脂肪族ポリアミド(B)1〜99重量%からな
るポリアミド組成物であって、半芳香族ポリアミド(A
)が、
(a)5〜30モル%の下記−数式[1)で示される構
造単位
・・・ [1)
(〔11式中、Xは一〇−、−3−、−NH−Rは、炭
素数6〜15の2価の芳香族基を示し、nはOまたは1
である。)
(5) 95〜70モル%の下記式[11)で示される
構造単位
・・・ [I[)
から構成される半芳香族ポリアミドであることを特徴と
するポリアミド組成物に関する。That is, the present invention provides semi-aromatic polyamide (A) 99-1
A polyamide composition comprising 1 to 99% by weight of an aliphatic polyamide (B) and a semi-aromatic polyamide (A).
) is (a) 5 to 30 mol% of the structural unit represented by the following formula [1]... [1] ([In formula 11, X is 10-, -3-, -NH-R is , represents a divalent aromatic group having 6 to 15 carbon atoms, and n is O or 1
It is. ) (5) The present invention relates to a polyamide composition characterized in that it is a semi-aromatic polyamide composed of 95 to 70 mol% of the structural unit represented by the following formula [11]...[I[].
以下、本発明の詳細な説明する。The present invention will be explained in detail below.
本発明のポリアミド組成物を構成する(A)の半芳香族
ポリアミドとはメタキシレンジアミンとジカルボン酸と
して下記−数式[11[)で表わされるジカルボン酸、
およびアジピン酸から構成されるポリアミドである。The semi-aromatic polyamide (A) constituting the polyamide composition of the present invention is meta-xylene diamine and a dicarboxylic acid represented by the following formula [11],
and a polyamide composed of adipic acid.
HOzCCHzX (Rχ)、ICHzCOzH−[I
II )(ここでXは、−O−、−S−、あるいは−N
−好ましくは一〇−を表わす。nは0または1である。HOzCCHzX (Rχ), ICHzCOzH-[I
II) (where X is -O-, -S-, or -N
-preferably represents 10-. n is 0 or 1.
Rは炭素数6〜15の芳香族基を表わす。)Rとしては
具体的には、
−数式[1[r]で表わされるジカルボン酸としては具
体的には、イミノジ酢酸、オキシジ酢酸、チオジ酢酸、
1,4−フエニレンジオキシジ酢酸、1゜3−フェニレ
ンジオキシジ酢酸、2,6−ナフタレンシオキシジ酢酸
等が挙げられる。このうち特に好ましいのは、オキシジ
酢酸、1,4−フェニレンジオキシジ酢酸である。R represents an aromatic group having 6 to 15 carbon atoms. ) R is specifically: - The dicarboxylic acid represented by the formula [1[r] is iminodiacetic acid, oxydiacetic acid, thiodiacetic acid,
Examples include 1,4-phenylenedioxydiacetic acid, 1°3-phenylenedioxydiacetic acid, and 2,6-naphthalenedioxydiacetic acid. Among these, particularly preferred are oxydiacetic acid and 1,4-phenylenedioxydiacetic acid.
また、本発明のポリアミド組成物を構成する半芳香族ポ
リアミド(A)はメタキシレンジアミン以外の他のジア
ミンおよび前記以外の他のジカルボン酸を少量共重合さ
せても良い。Further, the semi-aromatic polyamide (A) constituting the polyamide composition of the present invention may be copolymerized with a small amount of other diamines other than metaxylene diamine and other dicarboxylic acids other than those mentioned above.
全ジカルボン酸のうち一般式(II[)で表わされるジ
カルボン酸の使用割合は5ないし30モル%、好ましく
はマないし25モル%である。すなわち5モル%未満で
は得られるポリマーの融点降下の程度は低く本発明の目
的を達成できない、一方30モル%を超えると、実質的
に非晶質のポリマーとなり、延伸配向時のガスバリヤ−
性向上が望めないので、商業的価値が低い。The proportion of the dicarboxylic acid represented by the general formula (II[) among all dicarboxylic acids is 5 to 30 mol%, preferably 5 to 25 mol%. That is, if it is less than 5 mol %, the melting point of the obtained polymer will be lowered to a low degree and the object of the present invention cannot be achieved. On the other hand, if it exceeds 30 mol %, the polymer will be substantially amorphous and the gas barrier during stretching or orientation will be reduced.
It has low commercial value because it cannot improve sexual performance.
以上に述べた組成の半芳香族ポリアミド(A)を製造す
るには、常法に従いナイロン塩またはその水溶液から溶
融重合を行なえばよい。重合に際しては酢酸、安息香酸
、ステアリン酸等の一塩基酸、ヘキシルアミン、ステア
リルアミン、アニリン等の一酸塩基を分子量調節剤とし
て加えても良い。また亜リン酸ソーダ、亜リン酸、リン
酸やヒンダードフェノールに代表される熱安定剤、その
他重合添加剤を加えることも可能である。In order to produce the semi-aromatic polyamide (A) having the composition described above, melt polymerization may be carried out from a nylon salt or an aqueous solution thereof according to a conventional method. During polymerization, monobasic acids such as acetic acid, benzoic acid, and stearic acid, and monoacid bases such as hexylamine, stearylamine, and aniline may be added as molecular weight regulators. It is also possible to add heat stabilizers such as sodium phosphite, phosphorous acid, phosphoric acid, hindered phenol, and other polymerization additives.
この様にして得られる共重合ポリアミドは、その相対粘
度(ηrel)が1.7〜3.5dl/gであり特に1
.8〜3.0dl/gのものが好ましい。The copolyamide obtained in this way has a relative viscosity (ηrel) of 1.7 to 3.5 dl/g, especially 1
.. 8 to 3.0 dl/g is preferred.
次に、本発明のポリアミド組成物を構成する脂肪族ポリ
アミド(B)としては、例えばナイロン−6、ナイロン
−6,6,ナイロン−6,10゜ナイロン−6/6.6
共重合体、ナイロンー6/6、lO共重合体等を挙げる
ことができる。Next, examples of the aliphatic polyamide (B) constituting the polyamide composition of the present invention include nylon-6, nylon-6,6, nylon-6,10° nylon-6/6.6
Copolymers, nylon-6/6, IO copolymers, etc. can be mentioned.
本発明のポリアミド組成物は、上述した半芳香族ポリア
ミド(A)99〜1重量%と脂肪族ポリアミド1〜99
重量%(B)とを混合してなるものである。両者の混合
比としては、(A)及び(B)の合計量に対して、(A
)の割合が99〜5重量%であるのが特に好ましい。更
に好ましくは95〜10重量%である。(A)及び(B
)の合計量に対する(A)の割合が1重量%未満の場合
にはガスバリヤ−性が充分でないからである。The polyamide composition of the present invention comprises 99 to 1% by weight of the above-mentioned semi-aromatic polyamide (A) and 1 to 99% by weight of the aliphatic polyamide.
% (B) by weight. The mixing ratio of the two is (A) relative to the total amount of (A) and (B).
) is particularly preferably from 99 to 5% by weight. More preferably, it is 95 to 10% by weight. (A) and (B
This is because if the ratio of (A) to the total amount of (A) is less than 1% by weight, gas barrier properties will not be sufficient.
また(A)及び(B)の合計量に対する(A)の割合が
99重量%を越える場合には半芳香族ポリアミド(A)
の柔軟性が充分改良されないからである。In addition, if the ratio of (A) to the total amount of (A) and (B) exceeds 99% by weight, semi-aromatic polyamide (A)
This is because the flexibility of the material is not sufficiently improved.
本発明の半芳香族ポリアミド(A)と脂肪族ポリアミド
(B)の混合方法は通常夫々のチップを均一に混ぜ合わ
せ、要すれば更に1回以上押出機等により溶融混練する
方法がとられるが、特にこれらに限定されるものではな
い、必要に応じて(A)成分と(B)成分を混合する際
に、あるいはフィルム成形する際に各種の安定剤、フィ
ラー顔料、染料、滑剤、ブロッキング防止剤あるいは各
種熱可塑樹脂等の周知の添加剤を配合することができる
。The method for mixing the semi-aromatic polyamide (A) and the aliphatic polyamide (B) of the present invention is usually to uniformly mix the respective chips and, if necessary, melt-knead them one or more times using an extruder or the like. , Various stabilizers, filler pigments, dyes, lubricants, anti-blocking agents may be used when mixing components (A) and (B) or when forming a film as necessary, but are not limited to these. Well-known additives such as additives or various thermoplastic resins can be blended.
本発明のポリアミド組成物の成膜方法については特に限
定されるものではなく、Tダイ法、イン71z−ジョン
法等の公知の成膜方法によりフィルム、シートとするこ
とが可能である。The method for forming a film of the polyamide composition of the present invention is not particularly limited, and films and sheets can be formed by known film forming methods such as the T-die method and the 71z-john method.
特に、本発明のポリアミド組成物は、−軸あるいは二輪
方向に延伸したフィルムとして好適に利用できる。In particular, the polyamide composition of the present invention can be suitably used as a film stretched in the -axis or two-wheel direction.
フィルムの成形は通常インフレーション法、T−ダイ法
によって、半芳香族ポリアミド(A)および脂肪族ポリ
アミド(B)のいずれの融点よりも高い成形温度におい
て可塑化され、ダイスより押出されたフィルムは通常8
0℃以下の温度に急冷し、未延伸フィルムを得る。The film is usually plasticized by the inflation method or T-die method at a molding temperature higher than the melting point of either the semi-aromatic polyamide (A) or the aliphatic polyamide (B), and the film extruded from the die is usually 8
It is rapidly cooled to a temperature of 0° C. or lower to obtain an unstretched film.
逐次二輪延伸フィルムを得るには、T−ダイより押出さ
れた未延伸フィルムをキャスティングロールにより縦延
伸し、次いでテンター中において横延伸する方法等が用
いられる。同時二輪延伸の場合は、テンター法、チュブ
ラ−法による方法等が用いられる。未延伸フィルムは延
伸工程へ移る際調湿、あるいは乾燥しても良い。In order to obtain a sequential two-wheel stretched film, a method is used in which an unstretched film extruded from a T-die is longitudinally stretched using a casting roll, and then transversely stretched in a tenter. In the case of simultaneous two-wheel stretching, a tenter method, a tubular method, etc. are used. The unstretched film may be subjected to humidity control or drying before proceeding to the stretching step.
延伸温度は、120 ”Cを越えると作業性が悪くなる
ので120°C以下、特に110〜80°C程度が好ま
しい。The stretching temperature is preferably 120°C or less, particularly about 110 to 80°C, since workability deteriorates if it exceeds 120''C.
延伸速度は、5.000%/ s e c未満では延伸
によるガスバリヤ−性の向上が見られないため、500
0%/ s e c以上、特に、io、ooo%/ s
e c以上が好ましい。The stretching speed was set at 500%/sec because no improvement in gas barrier properties was observed when stretching was less than 5.000%/sec.
0%/sec or more, especially io, ooo%/s
ec or more is preferable.
延伸倍率は、1.5 X 1.5を下まわる場合には延
伸によるガスバリヤ−性の向上が見られないため、1、
5 X 1.5以上特に2.OX2.0以上が好ましい
。When the stretching ratio is less than 1.5 x 1.5, no improvement in gas barrier properties is observed due to stretching, so 1.
5 x 1.5 or more especially 2. OX2.0 or more is preferable.
以上のようにして得られる本発明の組成物による二軸延
伸ポリアミドフィルムは高いガスバリヤ−性を有すると
同時に柔軟性に優れている。The biaxially oriented polyamide film of the composition of the present invention obtained as described above has high gas barrier properties and at the same time is excellent in flexibility.
なお、本発明の組成物は他の包装樹脂と共押出法、ラミ
ネート法によって容易に多層化できる。The composition of the present invention can be easily multilayered with other packaging resins by coextrusion or lamination.
ここで包装用樹脂としてはポリエステル、ポリプロピレ
ン、ポリエステルテレフタレート、ポリカーボネート、
ポリアミド、ポリスチレン、ポリ塩化ビニル、エチレン
−ビニルアルコール共li合樹脂等が挙げられる。Here, packaging resins include polyester, polypropylene, polyester terephthalate, polycarbonate,
Examples include polyamide, polystyrene, polyvinyl chloride, ethylene-vinyl alcohol co-lipolymer resin, and the like.
〔実施例] 以下本発明を実施例により具体的に説明する。〔Example] The present invention will be specifically explained below using examples.
なお、実施例中の下記測定値は、次のようにして測定し
た。In addition, the following measured values in Examples were measured as follows.
・ポリアミドの相対粘度(ηreり:
98%濃硫酸を使用し、濃度1 g/d lとし、25
°Cで測定した。・Relative viscosity of polyamide (ηre: 98% concentrated sulfuric acid is used, the concentration is 1 g/dl, 25
Measured at °C.
・酸素透過量:
米国MODERN C0NTR0L社製0X−TRA
N 10150Hにより、23℃、100%RHにて
測定した。・Oxygen permeation rate: 0X-TRA manufactured by MODERN C0NTR0L in the United States
Measured with N 10150H at 23° C. and 100% RH.
・融点(Tm): 示差走査熱量計(DSC)により測定した。・Melting point (Tm): It was measured using a differential scanning calorimeter (DSC).
・引張弾性率、引張伸度: ASTM D−688に準じ測定した。・Tensile modulus, tensile elongation: Measured according to ASTM D-688.
参考例1
〈半芳香族ポリアミド(A)の製造〉
・メタキシレンジアミン 2.45kg・水
5.3kg
・アジピン酸 2.24kg1.3−
フエニレンジオキシジ酢酸
0.61kg
からなる塩水溶液に酢酸11.0gを添加し攪拌機付き
反応槽に仕込み、充分N2置換した後、18kg/cd
に系内圧力がなる迄加熱昇圧を行なった。Reference example 1 <Manufacture of semi-aromatic polyamide (A)> Metaxylene diamine 2.45 kg Water
5.3kg ・Adipic acid 2.24kg1.3-
11.0 g of acetic acid was added to a salt aqueous solution consisting of 0.61 kg of phenylenedioxydiacetic acid, and the mixture was charged into a reaction tank equipped with a stirrer.
The heating and pressure were increased until the system pressure reached .
18kg/cillに到達後、系内圧力が18)cg/
cdになる様に放圧させながら攪拌し重合反応を開始さ
せた。その間、内温は210°Cよりゆるやかに昇温し
た。5時間後にほとんど水の留出はなくなり、この時点
で内温は240℃を指示した。更に放圧し、最終的に系
内圧力が200mHHになる迄減圧した後、圧戻しを行
ない、反応槽底より溶融ポリマーを抜き出した。After reaching 18 kg/cil, the system pressure becomes 18) cg/
The polymerization reaction was started by stirring while releasing the pressure so as to reach cd. During that time, the internal temperature rose slowly from 210°C. After 5 hours, almost no water was distilled out, and at this point the internal temperature was 240°C. The pressure was further released, and after the pressure was reduced until the system internal pressure finally reached 200 mHH, the pressure was returned and the molten polymer was extracted from the bottom of the reaction tank.
こうして得られたポリアミドの相対粘度(ηrel)は
、2.51であり、融点(Trn)は216°Cであっ
た。The polyamide thus obtained had a relative viscosity (ηrel) of 2.51 and a melting point (Trn) of 216°C.
参考例2
〈半芳香族ポリアミド(A)の製造〉
・メタキシレンジアミン 2.45kg、水
5.1kg
・アジピン酸 2.24kg・オキシ
ジ酢酸 0.36kgからなる塩水溶液
に酢酸11.0gを添加し攪拌機付き反応槽に仕込み、
充分N、置換した後、18kg/dに系内圧力がなる迄
加熱昇圧を行なった。Reference example 2 <Manufacture of semi-aromatic polyamide (A)> Meta-xylene diamine 2.45 kg, water
11.0 g of acetic acid was added to a salt aqueous solution consisting of 5.1 kg, 2.24 kg of adipic acid, and 0.36 kg of oxydiacetic acid, and the mixture was charged into a reaction tank equipped with a stirrer.
After replacing with sufficient nitrogen, heating and pressure increase were carried out until the system pressure reached 18 kg/d.
18kg/c′Iilに到達後、系内圧力が18kg/
cfl!になる様に放圧させながら攪拌し重合反応を開
始させた。その間、内温は210°Cよりゆるやかに昇
温した。5時間後にほとんど水の留出はなくなり、この
時点で内温は240°Cを指示した。更に放圧し、最終
的に系内圧力が200閣Hgになる迄減圧した後、圧戻
しを行ない、反応槽底より溶融ポリマーを抜き出した。After reaching 18 kg/c'Iil, the system pressure increases to 18 kg/c'Iil.
cfl! The polymerization reaction was started by stirring while releasing the pressure so that the temperature of the mixture was 100%. During that time, the internal temperature rose slowly from 210°C. After 5 hours, almost no water was distilled out, and at this point the internal temperature was 240°C. The pressure was further released until the system internal pressure finally reached 200 Hg, and then the pressure was returned and the molten polymer was extracted from the bottom of the reaction tank.
こうして得られたポリアミドの相対粘度(ηrel)は
、2.49であり、融点(Tm)は219°Cであった
。The polyamide thus obtained had a relative viscosity (ηrel) of 2.49 and a melting point (Tm) of 219°C.
実施例1
参考例1で得られた半芳香族ポリアミド(A)95重量
部とナイロン−6(三菱化成社製1020CA)5重量
部とを、チップ状でV型タンブラ−により混合した後、
Tダイ付きの40鵬押出し機(部員鉄工(株)製ES−
40型)を用い、押出し温度240″Cで未延伸フィル
ムを得た。このフィルムを95°Cに加熱しインフレー
ション方式で延伸した後85℃で30秒間熱固定して厚
さ25μのフィルムを得た。こうして得られたフィルム
の酸素透過量、引張弾性率、引張伸度を表1に示した。Example 1 After mixing 95 parts by weight of the semi-aromatic polyamide (A) obtained in Reference Example 1 and 5 parts by weight of nylon-6 (1020CA manufactured by Mitsubishi Kasei Corporation) in the form of chips in a V-shaped tumbler,
40-ho extruder with T-die (manufactured by Bumen Tekko Co., Ltd. ES-
40 type) to obtain an unstretched film at an extrusion temperature of 240"C. This film was heated to 95°C, stretched by an inflation method, and then heat-set at 85°C for 30 seconds to obtain a film with a thickness of 25μ. The oxygen permeation amount, tensile modulus, and tensile elongation of the film thus obtained are shown in Table 1.
実施例2〜4
参考例1で得られた半芳香族ポリアミド(A)と、ナイ
ロン−6(三菱化成社製102 OCA)を表1に示す
割合でトライブレンドした後、実施例1と同様の操作で
フィルム化し、各種測定を行なった。結果を表1に示し
た。Examples 2 to 4 After tri-blending the semi-aromatic polyamide (A) obtained in Reference Example 1 and nylon-6 (102 OCA manufactured by Mitsubishi Kasei Corporation) in the proportions shown in Table 1, the same procedure as in Example 1 was carried out. It was made into a film and various measurements were performed. The results are shown in Table 1.
比較例1
参考例1で得られた半芳香族ポリアミド(A)を実施例
1と同様の操作でフィルム化し、各種測定を行なった。Comparative Example 1 The semi-aromatic polyamide (A) obtained in Reference Example 1 was formed into a film in the same manner as in Example 1, and various measurements were performed.
結果を表1に示した。The results are shown in Table 1.
実施例5〜8
参考例2で得られた半芳香族ポリアミド(B)とナイロ
ン−6(三菱化成社製1020 CA)を表1に示す割
合でトライブレンドした後、実施例1と同様の操作でフ
ィルム化し、各種測定を行なった。結果を表1に示した
。Examples 5 to 8 After tri-blending the semi-aromatic polyamide (B) obtained in Reference Example 2 and nylon-6 (1020 CA manufactured by Mitsubishi Kasei Corporation) in the proportions shown in Table 1, the same operation as in Example 1 was carried out. It was made into a film and various measurements were performed. The results are shown in Table 1.
比較例2
参考例2で得られた半芳香族ポリアミド(B)を実施例
1と同様の操作でフィルム化し、各種測定を行なった。Comparative Example 2 The semi-aromatic polyamide (B) obtained in Reference Example 2 was formed into a film in the same manner as in Example 1, and various measurements were performed.
結果を表1に示した。The results are shown in Table 1.
比較例3
MXD・6(三菱ガス化学(株)製、商品名:Reny
6007.ηrel=2.53.Tm=237°C
)80重量部と、ナイロン−6(三菱化成社製102O
CA)20重量部とを、チップ状でV型タンブラ−によ
り混合した後、Tダイ付きの40mm押出し機(部員鉄
工(株)製ES−40型)を用い、押出し温度261°
Cで未延伸フィルムを得た。このフィルムを105°C
に加熱しインフレーション方式で延伸した後90°Cで
30秒間熱固定して厚さ25μのフィルムを得た。こう
して得られたフィルムを用い各種測定を行なった。Comparative Example 3 MXD・6 (manufactured by Mitsubishi Gas Chemical Co., Ltd., product name: Reny
6007. ηrel=2.53. Tm=237°C
) 80 parts by weight, and nylon-6 (102O manufactured by Mitsubishi Chemical Corporation)
After mixing 20 parts by weight of CA) in the form of chips in a V-shaped tumbler, extrusion temperature was 261° using a 40 mm extruder with a T-die (Model ES-40 manufactured by Member Iron Works Co., Ltd.).
An unstretched film was obtained in step C. This film was heated to 105°C.
The film was heated to 100° C., stretched by an inflation method, and then heat-set at 90° C. for 30 seconds to obtain a film with a thickness of 25 μm. Various measurements were performed using the film thus obtained.
結果を表1に示した。The results are shown in Table 1.
比較例4
比較例3で用いたMXD・6を比較例1と同様の操作で
フィルム化し、各種測定を行なった。結果を表1に示し
た。Comparative Example 4 MXD-6 used in Comparative Example 3 was formed into a film in the same manner as in Comparative Example 1, and various measurements were performed. The results are shown in Table 1.
(発明の効果)
表1に示されるように、本発明のポリアミド組成物、従
来のポリアミド組成物と比較し、ガスバリヤ−性、成形
性、延伸作業性に優れていると同時に、柔軟性を有する
ことよりその商業的価値は高い。(Effects of the Invention) As shown in Table 1, the polyamide composition of the present invention has excellent gas barrier properties, moldability, and stretching workability as well as flexibility compared to conventional polyamide compositions. Moreover, its commercial value is high.
Claims (1)
族ポリアミド(B)1〜99重量%からなるポリアミド
組成物であって、 半芳香族ポリアミド(A)が、 (a)5〜30モル%の下記一般式〔 I 〕で示される
構造単位 ▲数式、化学式、表等があります▼・・・〔 I 〕 (〔 I 〕式中、Xは−O−、−S−、−NH−、Rは
、炭素数6〜15の2価の芳香族基を示し、nは0また
は1である。) (b)95〜70モル%の下記式〔II〕で示される構造
単位 ▲数式、化学式、表等があります▼・・・〔II〕 から構成される半芳香族ポリアミドであることを特徴と
するポリアミド組成物。(1) A polyamide composition consisting of 99 to 1% by weight of semi-aromatic polyamide (A) and 1 to 99% by weight of aliphatic polyamide (B), wherein the semi-aromatic polyamide (A) is (a) 5 to 1% by weight; 30 mol% structural unit represented by the following general formula [I]▲There are mathematical formulas, chemical formulas, tables, etc.▼... [I] (In the [I] formula, X is -O-, -S-, -NH -, R represent a divalent aromatic group having 6 to 15 carbon atoms, and n is 0 or 1.) (b) 95 to 70 mol% of the structural unit represented by the following formula [II] ▲ Formula , chemical formula, table, etc. ▼...[II] A polyamide composition characterized by being a semi-aromatic polyamide composed of the following.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP13877390A JPH0433954A (en) | 1990-05-29 | 1990-05-29 | Polyamide composition |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP13877390A JPH0433954A (en) | 1990-05-29 | 1990-05-29 | Polyamide composition |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH0433954A true JPH0433954A (en) | 1992-02-05 |
Family
ID=15229862
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP13877390A Pending JPH0433954A (en) | 1990-05-29 | 1990-05-29 | Polyamide composition |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH0433954A (en) |
-
1990
- 1990-05-29 JP JP13877390A patent/JPH0433954A/en active Pending
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