JPH04339294A - Small-sized electronic appratus equipped with sensor - Google Patents
Small-sized electronic appratus equipped with sensorInfo
- Publication number
- JPH04339294A JPH04339294A JP3204946A JP20494691A JPH04339294A JP H04339294 A JPH04339294 A JP H04339294A JP 3204946 A JP3204946 A JP 3204946A JP 20494691 A JP20494691 A JP 20494691A JP H04339294 A JPH04339294 A JP H04339294A
- Authority
- JP
- Japan
- Prior art keywords
- circuit board
- connection
- sensor
- board
- holding member
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000758 substrate Substances 0.000 abstract description 11
- 238000004513 sizing Methods 0.000 abstract 1
- 125000006850 spacer group Chemical group 0.000 description 13
- 230000035939 shock Effects 0.000 description 6
- 238000001514 detection method Methods 0.000 description 3
- 230000007257 malfunction Effects 0.000 description 3
- 239000003990 capacitor Substances 0.000 description 2
- 238000006073 displacement reaction Methods 0.000 description 2
- 239000013013 elastic material Substances 0.000 description 2
- 238000005476 soldering Methods 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- 239000002390 adhesive tape Substances 0.000 description 1
- 230000008602 contraction Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000005389 magnetism Effects 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 238000012856 packing Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 239000000779 smoke Substances 0.000 description 1
- 229920003002 synthetic resin Polymers 0.000 description 1
- 239000000057 synthetic resin Substances 0.000 description 1
Landscapes
- Electric Clocks (AREA)
Abstract
Description
【0001】0001
【産業上の利用分野】本発明は温度,圧力等を検出する
センサを備えた小型電子機器に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a small electronic device equipped with a sensor for detecting temperature, pressure, etc.
【0002】0002
【従来の技術】小型電子機器の一種である電子腕時計に
は時刻表示,時刻アラームなどの本来の機能に加えて、
外気温や水圧などを検出して表示する付加機能を備えた
ものが知られている。このような付加機能を備える小型
電子機器では、温度センサ,圧力センサなどの所定のセ
ンサを収納したセンサユニットを機器ケース内に取り付
ける必要があり、このため機器ケースに開口部を形成し
て、この開口部内にセンサユニットを収納し、パッキン
等によって防水している。この機器ケース内に取り付け
られたセンサユニットは機能を制御する電子回路、例え
ばLSI等が取付けられた回路基板と配線によって電気
的に接続されることにより、温度,圧力等の所定の検出
を行う。これにより、検出内容が機器の表示装置に可視
表示等される。[Prior Art] Electronic wristwatches, which are a type of small electronic device, have other functions such as time display and time alarm.
Some devices are known that have additional functions that detect and display outside temperature, water pressure, etc. In small electronic devices with such additional functions, it is necessary to install a sensor unit that houses specified sensors such as temperature sensors and pressure sensors inside the device case. The sensor unit is housed inside the opening and is waterproofed with packing etc. The sensor unit installed inside the equipment case is electrically connected by wiring to a circuit board on which an electronic circuit for controlling functions, such as an LSI, is attached, thereby detecting predetermined values such as temperature and pressure. As a result, the detected contents are visually displayed on the display device of the device.
【0003】0003
【発明が解決しようとする課題】しかしながら従来の小
型電子機器では、センサユニットと機器側の回路基板と
の電気的接続を行う配線が外部衝撃によってずれたり、
外れることが多く、これによりセンサユニットが機能し
なかったり、誤った電気的接続状態となって誤動作する
ことがあった。また、センサユニットのセンサ回路には
例えば温度補償用の抵抗やコンデンサなどの電子部品を
必要とするが、これらのセンサユニット用の電子部品は
外部衝撃からの保護の必要上、センサユニット側に取り
付けることなく、機器側の回路基板に実装されている。
このため、必然的に回路基板が大きくなるため、機器全
体としても大型化する問題を有していた。[Problems to be Solved by the Invention] However, in conventional small electronic devices, the wiring that makes the electrical connection between the sensor unit and the circuit board on the device side may become displaced due to external impact.
This often causes the sensor unit to become disconnected, resulting in the sensor unit not functioning, or resulting in incorrect electrical connections and malfunctions. In addition, the sensor circuit of the sensor unit requires electronic components such as temperature compensation resistors and capacitors, but these electronic components for the sensor unit are attached to the sensor unit side in order to protect them from external shocks. It is mounted on the circuit board of the device without any problems. As a result, the circuit board inevitably becomes larger, which poses the problem of increasing the size of the device as a whole.
【0004】本発明はこのような問題点を考慮してなさ
れたものであり、外部衝撃が作用してもセンサユニット
と回路基板との電気的接続を良好に保ことができると共
にセンサユニット用の電子部品を回路基板に実装するこ
となく、機器の小型化を可能とした構造のセンサを備え
た小型電子機器を提供することを目的とする。The present invention has been made in consideration of these problems, and it is possible to maintain good electrical connection between the sensor unit and the circuit board even when an external shock is applied, and also to provide a structure for the sensor unit. An object of the present invention is to provide a small electronic device equipped with a sensor having a structure that allows the device to be miniaturized without mounting electronic components on a circuit board.
【0005】[0005]
【課題を解決するための手段】本発明の小型電子機器は
、電子回路が取付けられた回路基板と、この回路基板を
収納した機器ケースと、この機器ケース内に取り付けら
れるセンサユニットと、このセンサユニットと前記回路
基板とを電気的に接続する接続基板と、この接続基板の
周囲を回路基板に押え付けて両基板の電極の接触状態を
保持する保持部材と、この保持部材を前記機器ケースに
固定する固定部材とを備えていることを特徴とする。[Means for Solving the Problems] A small electronic device of the present invention includes a circuit board on which an electronic circuit is attached, a device case housing the circuit board, a sensor unit installed in the device case, and a sensor unit mounted in the device case. A connection board that electrically connects the unit and the circuit board, a holding member that presses the periphery of the connection board against the circuit board to maintain contact between the electrodes of both boards, and a holding member that is attached to the equipment case. It is characterized by comprising a fixing member for fixing.
【0006】また、本発明の小型電子機器は、電子回路
が取付けられた回路基板と、この回路基板を収納した機
器ケースと、この機器ケース内に取り付けられるセンサ
ユニットと、このセンサユニット用の電子部品が実装さ
れると共に前記回路基板とセンサユニットとを電気的に
接続する接続基板と、少なくともこの接続基板における
前記電子部品の実装部位を回路基板に押え付けながら接
続基板および回路基板の電極相互の接触状態を保持する
保持部材とを備えていることをも特徴としている。The small electronic device of the present invention also includes a circuit board on which an electronic circuit is attached, a device case housing the circuit board, a sensor unit installed in the device case, and an electronic device for the sensor unit. A connection board that electrically connects the circuit board and the sensor unit while the component is mounted, and a connection board that connects the electrodes of the connection board and the circuit board to each other while pressing at least the mounting part of the electronic component on the connection board to the circuit board. It is also characterized by comprising a holding member that maintains the contact state.
【0007】この場合、保持部材は接続基板における電
子部品の実装部位の両側部分を回路基板に押え付ける押
え片を形成しても良く、また、この押え片としては弾性
を有するように保持部材に形成しても良い。さらに保持
部材と接続基板との間に弾性部材を設けて接続基板を回
路基板に弾性的に押圧しても良い。In this case, the holding member may form a holding piece that presses both sides of the mounting area of the electronic component on the connection board against the circuit board. It may be formed. Furthermore, an elastic member may be provided between the holding member and the connection board to elastically press the connection board against the circuit board.
【0008】[0008]
【作用】上記構成では、保持部材がセンサユニットから
の接続基板の周囲を回路基板に押え付けて両基板の接触
状態を保持すると共に、この保持部材の保持状態を固定
部材が固定するため、外部衝撃があっても接続基板と回
路基板との電気的接続を良好に保つことができる。[Operation] In the above configuration, the holding member presses the periphery of the connection board from the sensor unit to the circuit board to maintain the contact state between both boards, and the holding member fixes the holding state of the holding member, so that the external Good electrical connection between the connection board and the circuit board can be maintained even if there is an impact.
【0009】またセンサユニット用の電子部品を接続基
板に実装する構成では、回路基板への電子部品の実装が
削減または不要となり、回路基板を小型にすることがで
きる。しかも接続基板における電子部品実装部位を回路
基板に押え付けるため、電子部品の実装状態を良好に保
ことができる。Furthermore, in the configuration in which electronic components for the sensor unit are mounted on the connection board, mounting of electronic components on the circuit board is reduced or unnecessary, and the circuit board can be made smaller. Furthermore, since the electronic component mounting portion of the connection board is pressed against the circuit board, the electronic component mounting state can be maintained in good condition.
【0010】0010
【実施例】図1ないし図7は本発明の小型電子機器を電
子腕時計に適用した第1実施例を示す。図1に示すよう
に、時刻をデジタルやアナログによって表示する表示部
2を上面に有すると共に、複数のスイッチ3,3・・・
を側面部分に有して機器ケース1が構成されている。こ
の機器ケース1は図2に示す時計モジュール4を収納す
ると共に、時計モジュール4に接続されるセンサユニッ
ト5を収納するようになっている。図2は時計モジュー
ル4の底面部分を示し、合成樹脂製のハウジング6と、
ハウジング6下面にねじ止めされた地板7と、ハウジン
グ6内に挿入されたボタン型電池8とを備えている。ま
た、時計モジュール4はハウジング6および地板7に覆
われた回路基板9(図3参照)を内部に有している。こ
の回路基板9には電子腕時計本来の機能を制御するため
のLSI等の電子回路(図示省略)が取付けられている
。このような時計モジュール4が収納される機器ケース
1は図1に示すように、3時側の側面部分10が外側に
幾分、長く延びている。そして、この3時側の側面部分
10に開口部(図示省略)が形成され、この開口部内に
センサユニット5が収納されるようになっている。図1
において、11はセンサユニット5収納後の開口部を封
鎖するため、側面部分10にねじ止めされる蓋プレート
である。センサユニット5は時刻表示などの電子腕時計
の本来の機能に対し、他の機能を電子腕時計に付与する
ものであり、金属ケース5a内に所定のセンサを収納し
たユニット形態となっている。この場合、センサユニッ
ト5に収納されるセンサとしては、外気温を検出する温
度センサ(サーミスタ等),水圧等を検出する半導体圧
力センサ(ブリッジ抵抗体)等である。このセンサユニ
ット5は図2に示すように、フレキシブルな接続基板1
2を介して時計モジュール4の回路基板9と電気的に接
続されて、検出データを回路基板9に出力する。DESCRIPTION OF THE PREFERRED EMBODIMENTS FIGS. 1 to 7 show a first embodiment in which a small electronic device of the present invention is applied to an electronic wristwatch. As shown in FIG. 1, it has a display section 2 on the top surface that displays the time digitally or analogously, and has a plurality of switches 3, 3...
The equipment case 1 is configured by having the side surface of the device. This equipment case 1 accommodates a clock module 4 shown in FIG. 2, and also accommodates a sensor unit 5 connected to the clock module 4. FIG. 2 shows the bottom part of the watch module 4, which includes a housing 6 made of synthetic resin,
It includes a base plate 7 screwed to the lower surface of the housing 6 and a button-type battery 8 inserted into the housing 6. Furthermore, the timepiece module 4 has inside thereof a circuit board 9 (see FIG. 3) covered by a housing 6 and a base plate 7. This circuit board 9 is attached with an electronic circuit (not shown) such as an LSI for controlling the original functions of the electronic wristwatch. As shown in FIG. 1, a device case 1 in which such a timepiece module 4 is housed has a side surface portion 10 on the 3 o'clock side that extends somewhat outward. An opening (not shown) is formed in the side surface portion 10 on the 3 o'clock side, and the sensor unit 5 is housed within this opening. Figure 1
In the figure, reference numeral 11 denotes a lid plate screwed to the side portion 10 in order to close the opening after the sensor unit 5 is housed. The sensor unit 5 provides other functions to the electronic wristwatch in addition to the original functions of the electronic wristwatch, such as time display, and is in the form of a unit in which a predetermined sensor is housed within a metal case 5a. In this case, the sensors housed in the sensor unit 5 include a temperature sensor (such as a thermistor) that detects outside temperature, and a semiconductor pressure sensor (bridge resistor) that detects water pressure and the like. As shown in FIG. 2, this sensor unit 5 has a flexible connection board 1.
It is electrically connected to the circuit board 9 of the timepiece module 4 via 2 and outputs detection data to the circuit board 9.
【0011】図4および図5は接続基板12の平面図(
上面図)および底面図(下面図)を、図6はこの接続基
板12と電気的に接続される回路基板9の接続部位の平
面図を示す。接続基板12は右端部がセンサユニット5
に接続されるセンサ側接続部12a,左端部が回路基板
9に接続される機器側接続部12bとなっている。接続
基板12におけるセンサ側接続部12aの上面には図4
に示すように、センサユニット5下面の電極に接触する
電極パッド13,13・・・が形成される一方、機器側
接続部12bの下面には図5に示すように回路基板9の
電極パッドに接触する電極パッド14,14・・・が形
成されている。そして、これらの電極パッドは接続基板
12に形成された接続回路およびスルーホール15を介
して電気的に導通している。また、接続基板12の上面
には後述する電子部品を半田付けなどにより実装するた
めのランド部16,16が形成されている。これに対し
、回路基板9の接続部位には、図6に示すように、接続
基板12下面の電極パッド14,14が接触する電極パ
ッド17,17・・・が形成されている。FIGS. 4 and 5 are plan views of the connection board 12 (
6 shows a top view) and a bottom view (bottom view), and FIG. 6 shows a plan view of a connection portion of the circuit board 9 that is electrically connected to the connection board 12. The right end of the connection board 12 is the sensor unit 5
The sensor side connecting portion 12a is connected to the sensor side connecting portion 12a, and the left end portion is the device side connecting portion 12b connected to the circuit board 9. The upper surface of the sensor side connection part 12a on the connection board 12 is shown in FIG.
As shown in FIG. 5, electrode pads 13, 13, . Contacting electrode pads 14, 14, . . . are formed. These electrode pads are electrically connected via a connection circuit formed on the connection substrate 12 and a through hole 15 . Furthermore, land portions 16, 16 are formed on the upper surface of the connection board 12 for mounting electronic components, which will be described later, by soldering or the like. On the other hand, as shown in FIG. 6, electrode pads 17, 17, . . . are formed at the connection portion of the circuit board 9, with which the electrode pads 14, 14 on the lower surface of the connection board 12 come into contact.
【0012】次に、この接続基板12と回路基板9の接
続構造を図2および図3により説明する。接続基板12
の機器側接続部12bと回路基板9との接続は保持部材
18により行われる。保持部材18はその電極パッド1
4が回路基板9の各電極パッド17に接触した状態の接
続基板12上に当接して、これらの電極パッド14,1
7の接触状態を保持するものである。本実施例において
、この保持部材18は図2に示すように、接続基板12
の機器側接続部12bの全体を覆う形状および大きさに
成形されており、図3に示すように、その下端面が接続
基板12の機器側接続部12bの周囲全体に当接してい
る。そして、この状態の保持部材18に対し、ビス19
を挿通させて、時計モジュール4のハウジング6に螺合
することにより、保持部材18の固定が行われる。ビス
19はハウジング6に嵌め込まれたクリップ20に螺合
することにより、保持部材18をハウジング6(機器ケ
ース1)に固定する固定部材として作用しており、ビス
19の取り付けにより、保持部材18は接続基板12の
機器側接続部12bの周囲全体をハウジング6(機器ケ
ース1)に押し付けた状態となる。図3において、21
は保持部材18と接続基板12との間に介挿されたスペ
ーサである。このスペーサ21は図7に示すように、全
体が弾性材に成形されており、下面に形成された突起部
21aが接続基板12に当接するように、接続基板12
の機器側接続部12bと保持部材18との間に介挿され
る。そして、ビス19により保持部材18を固定すると
、弾性的に圧縮変形して接続基板12をハウジング6に
押え付ける。このためスペーサ21はその弾性により衝
撃等を緩和するように作用する。また、スペーサ21に
形成された貫通孔21c内にビス19を挿入するととも
に、貫通孔21d内にビス22を挿入するようにしてい
るので、スペーサ21自体の水平方向の位置ずれを未然
に防止することができる。Next, the connection structure between the connection board 12 and the circuit board 9 will be explained with reference to FIGS. 2 and 3. Connection board 12
The connection between the device side connecting portion 12b and the circuit board 9 is performed by the holding member 18. The holding member 18 holds the electrode pad 1
4 is in contact with the connection board 12 which is in contact with each electrode pad 17 of the circuit board 9, and these electrode pads 14, 1
The contact state of 7 is maintained. In this embodiment, this holding member 18 is attached to the connection board 12 as shown in FIG.
The lower end surface is in contact with the entire periphery of the device-side connection portion 12b of the connection board 12, as shown in FIG. Then, with respect to the holding member 18 in this state, the screw 19
The holding member 18 is fixed by inserting the holding member 18 and screwing it into the housing 6 of the timepiece module 4. By screwing into the clip 20 fitted into the housing 6, the screw 19 acts as a fixing member that fixes the holding member 18 to the housing 6 (device case 1).By attaching the screw 19, the holding member 18 is fixed. The entire periphery of the device-side connection portion 12b of the connection board 12 is pressed against the housing 6 (device case 1). In FIG. 3, 21
is a spacer inserted between the holding member 18 and the connection board 12. As shown in FIG. 7, this spacer 21 is entirely molded from an elastic material, and is attached to the connecting board 12 so that the protrusion 21a formed on the lower surface comes into contact with the connecting board 12.
It is inserted between the device side connecting portion 12b and the holding member 18. When the holding member 18 is fixed with the screws 19, it is elastically compressed and deformed to press the connection board 12 against the housing 6. For this reason, the spacer 21 acts to alleviate the impact etc. due to its elasticity. Further, since the screw 19 is inserted into the through hole 21c formed in the spacer 21, and the screw 22 is inserted into the through hole 21d, horizontal displacement of the spacer 21 itself is prevented. be able to.
【0013】このような接続基板12と回路基板9との
接続構造では、保持部材18が接続基板12の機器側接
続部12bの周囲を回路基板9に押え付けると共に、こ
の状態をビス19が固定するため、接続基板12と回路
基板9との強固な電気的な接続ができ、外部衝撃があっ
ても、接続基板12が外れたり、ずれたりすることがな
い。このため、機器の作動不良や誤作動を防止すること
ができる。この場合、図示例においては、回路基板9,
接続基板12および保持部材18にそれぞれ形成された
ピン孔9a,12c,18a内に、図3に示すようにハ
ウジング6からのピン22,22が挿通して、これらの
横ずれが防止されており、これにより、さらに強固な電
気的接続がなされている。In such a connection structure between the connection board 12 and the circuit board 9, the holding member 18 presses the periphery of the device side connection part 12b of the connection board 12 against the circuit board 9, and the screws 19 fix this state. Therefore, a strong electrical connection can be made between the connection board 12 and the circuit board 9, and even if there is an external shock, the connection board 12 will not come off or shift. Therefore, malfunctions and malfunctions of the equipment can be prevented. In this case, in the illustrated example, the circuit board 9,
As shown in FIG. 3, pins 22, 22 from the housing 6 are inserted into pin holes 9a, 12c, 18a formed in the connection board 12 and the holding member 18, respectively, to prevent these from shifting laterally. This provides an even stronger electrical connection.
【0014】前記保持部材18は図3に示すように、中
空部18aが形成される一方、接続基板12はそのラン
ド部16(図4参照)が、この中空部18a内に位置す
るように位置決めされる。このランド部16には、半田
付け等によって電子部品23が実装されており、保持部
材18の中空部18a内に収納された状態となっている
。保持部材18はこの電子部品23を中空部18aに収
納すると共に、電子部品23の実装部位の接続基板12
の周囲を回路基板9に押え付けた状態でビス19により
固定されている。電子部品23はセンサユニット5用の
電子部品であり、例えばセンサの温度補償用抵抗あるい
は定電流供給用コンデンサなどが選択される。このセン
サユニット5用の電子部品23が接続基板12に実装さ
れることにより、電子部品23を回路基板9に実装する
必要がなくなり、これにより回路基板9を小さくするこ
とができ、機器全体の小型化が可能となる。しかも電子
部品23の実装部位の周囲が保持部材18によって回路
基板9に押え付けられるため、電子部品23の実装状態
を確実に維持することができる。これにより電子部品2
3の脱落がなく、センサユニット5の安定した作動を確
保することができる。As shown in FIG. 3, the holding member 18 is formed with a hollow portion 18a, and the connecting board 12 is positioned so that its land portion 16 (see FIG. 4) is located within the hollow portion 18a. be done. An electronic component 23 is mounted on the land portion 16 by soldering or the like, and is housed in the hollow portion 18a of the holding member 18. The holding member 18 stores the electronic component 23 in the hollow portion 18a, and also holds the connection board 12 at the mounting site of the electronic component 23.
The periphery of the circuit board 9 is pressed against the circuit board 9 and fixed with screws 19. The electronic component 23 is an electronic component for the sensor unit 5, and for example, a resistor for temperature compensation of the sensor or a capacitor for supplying constant current is selected. By mounting the electronic component 23 for the sensor unit 5 on the connection board 12, there is no need to mount the electronic component 23 on the circuit board 9, which allows the circuit board 9 to be made smaller and the overall device to be smaller. It becomes possible to Moreover, since the periphery of the mounting portion of the electronic component 23 is pressed against the circuit board 9 by the holding member 18, the mounted state of the electronic component 23 can be reliably maintained. As a result, electronic component 2
3 does not fall off, and stable operation of the sensor unit 5 can be ensured.
【0015】図8ないし図14は本発明の第2実施例を
示し、前記第1実施例と同一の要素は同一の符号で対応
させることにより、重複する説明を省略する。この第2
実施例においても、図8および図9に示すように、ビス
19をハウジング6に取り付けることにより、保持部材
18が固定されて接続基板12が回路基板9に押え付け
られるが、この保持部材18は図10ないし図12に示
す形状に成形されている。これらの図において、18c
および18dはピン22,ビス19がそれぞれ挿入され
るように本体18bに形成されたピン孔およびビス孔で
あり、これらピン孔18c,ビス孔18dの左側の本体
部分が電子部品23に臨んでいる(図9および図13参
照)。そして、この電子部品23に臨む本体18bの長
手方向両側部分には下方に屈曲された押え片18eが形
成されている。この押え片18eは本体18bの下面よ
りも幾分下方に延びるように本体18bの両側部分に形
成されており(図11参照)、図14に示すようにその
下面が接続基板12における電子部品23の実装部位両
側部分に当接している。この当接により電子部品実装部
位の接続基板12が押圧されて、確実に回路基板9に押
し付けられる。これにより接続基板12における電子部
品23の実装部位が強固に固定され、振動,衝撃等が作
用しても電子部品23が接続基板12から外れることが
ないと共に、接続基板12の接続回路が断線,破損する
ことがなくなり、電気的接続および実装の信頼性が向上
する。この場合、各押え片18eの両サイドにはスリッ
ト18fが形成されており、このスリット18fにより
各押え片18eが弾性を有しており、この弾性によって
振動,衝撃等を吸収あるいは減衰するため、電子部品2
3の実装の信頼性がさらに向上している。なお、押え片
18eとしては、電子部品23の実装部位を押え付ける
ものであれば、複数に分割して電子部品の数に合わせて
も良く、また、図示例のように弾性を有した構造とする
必要もない。図13において、24は保持部材18の本
体18bと接続基板12との間に介挿入された両面接着
テープであり、これらを相互に固定して、相対的なずれ
を防止している。FIGS. 8 to 14 show a second embodiment of the present invention, and the same elements as in the first embodiment are designated by the same reference numerals, thereby omitting redundant explanation. This second
In the embodiment as well, as shown in FIGS. 8 and 9, by attaching the screws 19 to the housing 6, the holding member 18 is fixed and the connection board 12 is pressed against the circuit board 9. It is molded into the shape shown in FIGS. 10 to 12. In these figures, 18c
and 18d are pin holes and screw holes formed in the main body 18b so that the pin 22 and the screw 19 can be inserted, respectively, and the main body portion on the left side of the pin hole 18c and the screw hole 18d faces the electronic component 23. (See Figures 9 and 13). Further, downwardly bent presser pieces 18e are formed on both sides of the main body 18b in the longitudinal direction facing the electronic component 23. The holding pieces 18e are formed on both sides of the main body 18b so as to extend slightly below the lower surface of the main body 18b (see FIG. 11), and as shown in FIG. It is in contact with both sides of the mounting part. This contact presses the connection board 12 at the electronic component mounting site and reliably presses it against the circuit board 9. As a result, the mounting area of the electronic component 23 on the connection board 12 is firmly fixed, and the electronic component 23 will not come off from the connection board 12 even if vibration, shock, etc. are applied, and the connection circuit of the connection board 12 will not be disconnected. No more damage and more reliable electrical connections and mounting. In this case, slits 18f are formed on both sides of each holding piece 18e, and each holding piece 18e has elasticity due to the slit 18f, and this elasticity absorbs or damps vibrations, shocks, etc. Electronic parts 2
The reliability of the implementation of 3 has been further improved. Note that the holding piece 18e may be divided into a plurality of pieces to match the number of electronic parts as long as it holds down the mounting portion of the electronic component 23, or may have an elastic structure as shown in the illustrated example. There's no need to. In FIG. 13, 24 is a double-sided adhesive tape inserted between the main body 18b of the holding member 18 and the connection board 12, and fixes them to each other to prevent relative displacement.
【0016】図15ないし図17は本発明の第3実施例
を示す。この実施例においては、第1実施例と同様に保
持部材18におけるビス19側にスペーサ21が設けら
れるが(図16参照)、このスペーサ21は図18に示
すように、肉厚状の本体21bと、本体21bの下面に
肉厚状に突出した突起部21aとを備えている。このス
ペーサ21は全体がゴム,弾性プラスチックなどの弾性
材により形成されており、ビス19をハウジング6に取
り付けて保持部材18を固定すると、保持部材18によ
り押圧されて接続基板12を回路基板9に弾性的に押し
付ける弾性部材として作用する。このようなスペーサ2
1を設けることにより、接続基板12に常時、押圧力が
作用すると共に、温度変化による各部材の膨張,収縮を
吸収するため,接続基板12と回路基板9との電気的接
続をさらに確実に行うことができるメリットがある。な
お、図17において、21cはスペーサ21に形成され
たビス19挿通用の貫通孔であり、この貫通孔21cに
ビス19を挿入することにより、スペーサ21自体の位
置ずれを防止するようになっている。FIGS. 15 to 17 show a third embodiment of the present invention. In this embodiment, a spacer 21 is provided on the screw 19 side of the holding member 18 as in the first embodiment (see FIG. 16), but as shown in FIG. and a protrusion 21a that protrudes thickly from the lower surface of the main body 21b. This spacer 21 is entirely made of an elastic material such as rubber or elastic plastic. When the screw 19 is attached to the housing 6 and the holding member 18 is fixed, the spacer 21 is pressed by the holding member 18 and the connection board 12 is attached to the circuit board 9. It acts as an elastic member that presses elastically. Spacer 2 like this
1, a pressing force is constantly applied to the connection board 12 and the expansion and contraction of each member due to temperature changes is absorbed, thereby making the electrical connection between the connection board 12 and the circuit board 9 more reliable. There is an advantage that it can be done. In FIG. 17, 21c is a through hole formed in the spacer 21 for inserting the screw 19, and by inserting the screw 19 into the through hole 21c, the spacer 21 itself is prevented from shifting. There is.
【0017】本発明は上記実施例に限定されることなく
、種々変更が可能である。例えば、センサユニット5を
機器ケース1の3時側以外に収納しても良い。また、セ
ンサユニット5に収納されるセンサは磁気を検出する磁
気センサ,脈拍を測定する脈拍を測定する脈拍検出セン
サ,歩数をカウントする歩数検出センサ,煙や放射能等
を検出するその他のセンサであっても良い。さらに本発
明は電子腕時計以外の他の電子機器、例えば小型電子計
算機,ゲーム機,ラジオ装置,ページャ等の無線装置,
玩具などに対しても、同様に適用することができる。The present invention is not limited to the above-mentioned embodiments, but can be modified in various ways. For example, the sensor unit 5 may be housed in a location other than the 3 o'clock side of the device case 1. The sensors housed in the sensor unit 5 include a magnetic sensor that detects magnetism, a pulse detection sensor that measures pulse, a step detection sensor that counts the number of steps, and other sensors that detect smoke, radioactivity, etc. It's okay. Furthermore, the present invention is applicable to other electronic devices other than electronic wristwatches, such as small electronic computers, game machines, radio devices, pagers, and other wireless devices,
The same can be applied to toys and the like.
【0018】[0018]
【発明の効果】本発明はセンサユニットと回路基板とを
電気的に接続する接続基板を保持部材により回路基板に
押え付ける構成としているため、接続基板と回路基板と
の強固な電気的接続ができ、外部衝撃があっても強固な
電気的接続を確保することができる。また、センサユニ
ット用の電子部品を接続基板上に実装し、その代わり、
回路基板に実装しない構成としているので、その分、回
路基板および機器全体を小型化することができる。[Effects of the Invention] Since the present invention has a structure in which the connection board that electrically connects the sensor unit and the circuit board is pressed against the circuit board by the holding member, a strong electrical connection between the connection board and the circuit board can be achieved. , ensuring a strong electrical connection even in the presence of external shocks. In addition, the electronic components for the sensor unit are mounted on the connection board, and instead,
Since the structure is such that it is not mounted on a circuit board, the circuit board and the entire device can be made smaller accordingly.
【図面の簡単な説明】[Brief explanation of drawings]
【図1】本発明の第1実施例の全体の平面図。FIG. 1 is an overall plan view of a first embodiment of the present invention.
【図2】機器ケースに収納される時計モジュールおよび
センサユニットを示す底面図。FIG. 2 is a bottom view showing a timepiece module and a sensor unit housed in a device case.
【図3】接続基板と回路基板との接続構造を示す断面図
。FIG. 3 is a sectional view showing a connection structure between a connection board and a circuit board.
【図4】接続基板の平面図。FIG. 4 is a plan view of the connection board.
【図5】接続基板の底面図。FIG. 5 is a bottom view of the connection board.
【図6】回路基板の接続部位の平面図。FIG. 6 is a plan view of the connection portion of the circuit board.
【図7】スペーサの斜視図。FIG. 7 is a perspective view of a spacer.
【図8】本発明の第2実施例の底面図。FIG. 8 is a bottom view of the second embodiment of the present invention.
【図9】図8の矢印A部分の拡大図。9 is an enlarged view of the arrow A portion in FIG. 8. FIG.
【図10】第2実施例の保持部材の平面図。FIG. 10 is a plan view of the holding member of the second embodiment.
【図11】第2実施例の保持部材の断面図。FIG. 11 is a cross-sectional view of the holding member of the second embodiment.
【図12】第2実施例の保持部材の底面図[Fig. 12] Bottom view of the holding member of the second embodiment.
【図13】図
9のB−B線断面図。FIG. 13 is a sectional view taken along line BB in FIG. 9;
【図14】図9のC−C線断面図。14 is a sectional view taken along the line CC in FIG. 9. FIG.
【図15】本発明の第3実施例の底面図。FIG. 15 is a bottom view of the third embodiment of the present invention.
【図16】本発明の第3実施例の断面図。FIG. 16 is a sectional view of a third embodiment of the present invention.
【図17】第3実施例のスペーサの斜視図。FIG. 17 is a perspective view of a spacer according to a third embodiment.
1 機器ケース 5 センサユニット 9 回路基板 12 接続基板 18 保持部材 19 ビス 23 電子部品 1 Equipment case 5 Sensor unit 9 Circuit board 12 Connection board 18 Holding member 19 screw 23 Electronic parts
Claims (5)
この回路基板を収納した機器ケースと、この機器ケース
内に取り付けられるセンサユニットと、このセンサユニ
ットと前記回路基板とを電気的に接続する接続基板と、
この接続基板の周囲を前記回路基板に押え付けて両基板
の電極の接触状態を保持する保持部材と、この保持部材
を前記機器ケースに固定する固定部材とを備えているこ
とを特徴とするセンサを備えた小型電子機器。[Claim 1] A circuit board on which an electronic circuit is attached;
a device case that houses the circuit board; a sensor unit that is installed in the device case; a connection board that electrically connects the sensor unit and the circuit board;
A sensor comprising: a holding member that presses the periphery of the connection board against the circuit board to maintain contact between the electrodes of both boards; and a fixing member that fixes the holding member to the device case. A small electronic device with
この回路基板を収納した機器ケースと、この機器ケース
内に取り付けられるセンサユニットと、このセンサユニ
ット用の電子部品が実装されると共に前記回路基板と前
記センサユニットとを電気的に接続する接続基板と、少
なくともこの接続基板における前記電子部品の実装部位
を前記回路基板に押え付けながら前記接続基板および前
記回路基板の電極相互の接触状態を保持する保持部材と
を備えていることを特徴とするセンサを備えた小型電子
機器。[Claim 2] A circuit board on which an electronic circuit is attached;
A device case that houses this circuit board, a sensor unit that is installed inside this device case, and a connection board that has electronic components for this sensor unit mounted thereon and that electrically connects the circuit board and the sensor unit. A sensor comprising: a holding member that holds at least a mounting portion of the electronic component on the connection board against the circuit board while maintaining a state of contact between the electrodes of the connection board and the circuit board; A small electronic device equipped with
る電子部品の実装部位の両側部分を前記回路基板に押え
付ける押え片を有していることを特徴とする請求項2記
載のセンサを備えた小型電子機器。3. The sensor according to claim 2, wherein the holding member has holding pieces that press both sides of a mounting portion of the electronic component on the connection board against the circuit board. Small electronic equipment.
板に当接するように前記保持部材に形成されていること
を特徴とする請求項3記載のセンサを備えた小型電子機
器。4. A small electronic device equipped with a sensor according to claim 3, wherein the holding piece is formed on the holding member so as to have elasticity and come into contact with the connection board.
に押圧する弾性部材が前記保持部材と前記接続基板との
間に設けられていることを特徴とする請求項1または2
記載のセンサを備えた小型電子機器。5. An elastic member for elastically pressing the connection board against the circuit board is provided between the holding member and the connection board.
A small electronic device with the described sensor.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP03204946A JP3134377B2 (en) | 1991-03-08 | 1991-07-19 | Small electronic devices with sensors |
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP6903991 | 1991-03-08 | ||
JP3-69039 | 1991-03-08 | ||
JP03204946A JP3134377B2 (en) | 1991-03-08 | 1991-07-19 | Small electronic devices with sensors |
Publications (2)
Publication Number | Publication Date |
---|---|
JPH04339294A true JPH04339294A (en) | 1992-11-26 |
JP3134377B2 JP3134377B2 (en) | 2001-02-13 |
Family
ID=26410217
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP03204946A Expired - Fee Related JP3134377B2 (en) | 1991-03-08 | 1991-07-19 | Small electronic devices with sensors |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP3134377B2 (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP1043637A2 (en) * | 1999-04-06 | 2000-10-11 | Seiko Instruments Inc. | Small-sized electronic appliance with a sensor |
KR100444187B1 (en) * | 2000-09-26 | 2004-08-16 | 가시오게산키 가부시키가이샤 | Electronic watch |
-
1991
- 1991-07-19 JP JP03204946A patent/JP3134377B2/en not_active Expired - Fee Related
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP1043637A2 (en) * | 1999-04-06 | 2000-10-11 | Seiko Instruments Inc. | Small-sized electronic appliance with a sensor |
EP1043637A3 (en) * | 1999-04-06 | 2003-11-05 | Seiko Instruments Inc. | Small-sized electronic appliance with a sensor |
KR100444187B1 (en) * | 2000-09-26 | 2004-08-16 | 가시오게산키 가부시키가이샤 | Electronic watch |
Also Published As
Publication number | Publication date |
---|---|
JP3134377B2 (en) | 2001-02-13 |
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