JPH04337913A - Chip-shaped noise removing filter - Google Patents

Chip-shaped noise removing filter

Info

Publication number
JPH04337913A
JPH04337913A JP11008891A JP11008891A JPH04337913A JP H04337913 A JPH04337913 A JP H04337913A JP 11008891 A JP11008891 A JP 11008891A JP 11008891 A JP11008891 A JP 11008891A JP H04337913 A JPH04337913 A JP H04337913A
Authority
JP
Japan
Prior art keywords
chip
conductor
sheet
laminate
removing filter
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP11008891A
Other languages
Japanese (ja)
Inventor
Takeshi Oda
武司 織田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Holdings Corp
Original Assignee
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Industrial Co Ltd filed Critical Matsushita Electric Industrial Co Ltd
Priority to JP11008891A priority Critical patent/JPH04337913A/en
Publication of JPH04337913A publication Critical patent/JPH04337913A/en
Pending legal-status Critical Current

Links

Landscapes

  • Coils Or Transformers For Communication (AREA)
  • Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
  • Filters And Equalizers (AREA)

Abstract

PURPOSE:To provide a satisfactory chip-shaped noise removing filter without directivity, to facilitate the thinning/miniaturization of the chip shape in a chip- shaped noise removing filter which absorbs electromagnetic fault noise in the signal line of an electronic equipment and is suitable for loading to an image mounting printed circuit board. CONSTITUTION:A laminated body is constituted by overlapping a dielectric sheet 1 respectively forming conductors 2 on the front and rear sides, first magnetic substance sheet 4a forming a hole conductor 3 for electrically connecting the front and rear sides of a hole 5 provided on the center and second magnetic substance sheet 4b forming a conducting path 6 on the surface so as to be connected to the conductor 3, outside electrodes 7 are provided on both end faces of this laminated body, and a ground outside electrode 8 is provided on the outer periphery of the central part of the laminated body.

Description

【発明の詳細な説明】[Detailed description of the invention]

【0001】0001

【産業上の利用分野】本発明は電子機器の信号ラインに
おける電磁障害ノイズを吸収するとともに、面実装プリ
ント基板に装着するのに適したチップ形ノイズ除去フィ
ルタに関するものである。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a chip-type noise removal filter that absorbs electromagnetic interference noise in signal lines of electronic equipment and is suitable for mounting on a surface-mounted printed circuit board.

【0002】0002

【従来の技術】近年、プリント基板の面実装化が益々盛
んになってきており、この種のノイズ除去フィルタ部品
の面実装タイプも製品化されてきた。
BACKGROUND OF THE INVENTION In recent years, surface-mounting of printed circuit boards has become more and more popular, and surface-mounting types of noise removal filter parts of this type have also been commercialized.

【0003】以下に従来のチップ形ノイズ除去フィルタ
について説明する。図5は従来のチップ形ノイズ除去フ
ィルタの構成を示すものである。図5において、21は
凹形フェライトコア、22はチップコンデンサで、凹形
フェライトコア21のくぼみに埋設される。23はチッ
プコンデンサ22の電極と凹形フェライトコア21に設
けた導体25を接続する導電片で、24は凹形フェライ
トコアの両端部に設けられた外部電極であり、凹形フェ
ライトコアに設けられたスルーホールを通して導体25
と接続することにより、T形の回路に構成されている。
A conventional chip type noise removal filter will be explained below. FIG. 5 shows the configuration of a conventional chip-type noise removal filter. In FIG. 5, 21 is a concave ferrite core, and 22 is a chip capacitor, which is embedded in a recess of the concave ferrite core 21. 23 is a conductive piece that connects the electrode of the chip capacitor 22 and the conductor 25 provided on the concave ferrite core 21; 24 is an external electrode provided on both ends of the concave ferrite core; Conductor 25 through the through hole
A T-shaped circuit is formed by connecting the

【0004】0004

【発明が解決しようとする課題】しかしながら上記従来
の構成では、チップコンデンサ22と凹形フェライトコ
ア21の組み合わせのため、外形寸法がチップコンデン
サ22の大きさに左右され、部品の薄型化・小形化が困
難であった。
However, in the conventional configuration described above, since the chip capacitor 22 and the concave ferrite core 21 are combined, the external dimensions depend on the size of the chip capacitor 22, and it is difficult to make the component thinner and smaller. was difficult.

【0005】また、表面に導体25やチップコンデンサ
22が露出するため、これと同方向にグラウンド電極の
出る方向が設けられず、実装時の方向性を規制されると
いう問題があった。
Furthermore, since the conductor 25 and the chip capacitor 22 are exposed on the surface, there is a problem in that the direction in which the ground electrode comes out cannot be provided in the same direction as the conductor 25 and the chip capacitor 22, and the directionality during mounting is restricted.

【0006】本発明は上記従来の問題点を解決するもの
で、チップ形状の薄型化・小形化が容易にでき、さらに
実装時の方向性の規制がないチップ形ノイズ除去フィル
タを提供することを目的とする。
The present invention solves the above-mentioned conventional problems, and aims to provide a chip-type noise removal filter that can easily make the chip shape thinner and smaller, and has no restrictions on directionality during mounting. purpose.

【0007】[0007]

【課題を解決するための手段】この目的を達成するため
に本発明のチップ形ノイズ除去フィルタは、表裏面にそ
れぞれ導体を設けた誘電体シートと、中心部に設けた孔
の内壁に表裏面を電気的に接続する導体を形成した第1
の磁性体シートと、前記孔導体に接続するように表面に
導電路を設けた第2の磁性体シートとを重ね合わせて積
層体を構成し、この積層体の両端面に前記第2の磁性体
シートの導電路の両端に接続する外部電極を設けるとと
もに、積層体の中心部の外周上に前記誘電体シートの表
面の導体に接続するグラウンド外部電極を設けることに
より構成したものである。
[Means for Solving the Problems] In order to achieve this object, the chip-type noise removal filter of the present invention includes a dielectric sheet having a conductor on each of its front and back surfaces, and a dielectric sheet provided with a conductor on each of the front and back surfaces, and a The first
A laminate is formed by overlapping a magnetic sheet and a second magnetic sheet having a conductive path on its surface so as to be connected to the hole conductor, and the second magnetic sheet is formed on both end surfaces of the laminate. In addition to providing external electrodes connected to both ends of the conductive path of the dielectric sheet, a ground external electrode connected to the conductor on the surface of the dielectric sheet is provided on the outer periphery of the center of the laminate.

【0008】[0008]

【作用】この構成によって、チップ形状の薄型化・小形
化が容易にでき、さらに積層体のいずれの主面を上にし
ても実装することができるので、実装時の方向性のない
チップ形ノイズ除去フィルタを提供することができる。
[Function] With this configuration, the chip shape can be easily made thinner and smaller, and it can also be mounted with either main surface of the stack facing up, so there is no directionality in the chip shape during mounting. A removal filter can be provided.

【0009】[0009]

【実施例】以下本発明の一実施例のチップ形ノイズ除去
フィルタについて、図面を参照しながら説明する。図1
は本発明の一実施例におけるチップ形ノイズ除去フィル
タの分解斜視図を示すものである。図2はその分解した
状態の断面図であり、図3は外観を示す斜視図、図4は
その等価回路を示す。
DESCRIPTION OF THE PREFERRED EMBODIMENTS A chip type noise removal filter according to an embodiment of the present invention will be described below with reference to the drawings. Figure 1
1 is an exploded perspective view of a chip-type noise removal filter according to an embodiment of the present invention. FIG. 2 is a sectional view of the exploded state, FIG. 3 is a perspective view showing the external appearance, and FIG. 4 is an equivalent circuit.

【0010】図において、容量をもたせるための導体2
を表裏面にそれぞれ形成した誘電体シート1と、中心部
に設けた孔5の内壁に表裏面を電気的に接続する孔導体
3を形成した第1の磁性体シート4aと、インダクタを
形成しかつ導体3に接続するように表面に導電路6を形
成した第2の磁性体シート4bを重ね合わせて積層体を
構成している。この積層体の両端面に第2の磁性体シー
ト4bの導電路6の両端に接続する外部電極7を設ける
とともに、積層体の中心部の外周上に前記誘電体シート
の表面の導体に接続するグラウンド外部電極8を設けて
図3に示すLC複合部品9としている。
In the figure, a conductor 2 for providing capacitance
An inductor is formed by forming an inductor with a dielectric sheet 1 having a dielectric sheet 1 formed on each of the front and back surfaces, and a first magnetic sheet 4a having a hole conductor 3 formed thereon to electrically connect the front and back surfaces to the inner wall of a hole 5 provided in the center. The second magnetic sheet 4b having a conductive path 6 formed on its surface so as to be connected to the conductor 3 is stacked on top of each other to form a laminate. External electrodes 7 connected to both ends of the conductive path 6 of the second magnetic sheet 4b are provided on both end faces of this laminate, and external electrodes 7 are provided on the outer periphery of the center of the laminate to be connected to the conductor on the surface of the dielectric sheet. A ground external electrode 8 is provided to form an LC composite component 9 shown in FIG.

【0011】上記の誘電体シート1及び磁性体シート4
a,4bは、誘電体または磁性体とバインダー可塑剤か
らなり、引き上げ形成方法等によりシート状に形成した
もので、導体2,孔導体3,導電路6は銀やパラジュー
ム等のペーストまたはインキを用い、印刷あるいは塗布
して形成する。
The above dielectric sheet 1 and magnetic sheet 4
a and 4b are made of a dielectric or magnetic material and a binder plasticizer, and are formed into a sheet shape by a pulling method, etc., and the conductor 2, hole conductor 3, and conductive path 6 are made of a paste or ink such as silver or palladium. It is formed by printing or coating.

【0012】そして第1,第2の磁性体シート4a,4
bを重ね合わせ、さらにその上に上記誘電体シート1を
重ね、加熱圧着等の手段で結合させ、積層化する。
[0012]The first and second magnetic sheets 4a, 4
b are superimposed, and the above-mentioned dielectric sheet 1 is further superimposed thereon, and bonded by means such as heat compression bonding to form a laminate.

【0013】そして、積層体を焼成炉中で加熱すること
により、誘電体シート1及び磁性体シート4a,4bの
バインダー等の有機結合剤を除去し、焼結する。その後
、図3のように銀ペースト等を用いて外部電極7とグラ
ウンド外部電極8を形成することにより、図4に示した
等価回路に示す構成のチップ形ノイズ除去フィルタを得
ることができる。
[0013]Then, by heating the laminate in a firing furnace, the organic binder such as the binder of the dielectric sheet 1 and the magnetic sheets 4a, 4b is removed and sintered. Thereafter, by forming the external electrode 7 and the ground external electrode 8 using silver paste or the like as shown in FIG. 3, it is possible to obtain a chip-type noise removal filter having the configuration shown in the equivalent circuit shown in FIG.

【0014】本実施例によれば、LとCをシート状にす
ることでチップ形ノイズ除去フィルタを薄型化・小形化
することができ、さらにグラウンド外部電極8を積層体
の外周部に形成しているため積層体のいずれの主面を上
にしても実装することができるので実装時の方向性が規
制されない。
According to this embodiment, the chip type noise removal filter can be made thinner and smaller by forming L and C into sheets, and furthermore, the ground external electrode 8 is formed on the outer periphery of the laminate. Since it can be mounted with either main surface of the laminate facing up, the directionality during mounting is not restricted.

【0015】[0015]

【発明の効果】以上のように本発明によれば、LとCの
積層複合体を形成することによってチップ形状の薄型化
・小形化が容易にでき、さらに実装時の方向性のない優
れたチップ形ノイズ除去フィルタを提供することができ
る。
[Effects of the Invention] As described above, according to the present invention, by forming a laminated composite of L and C, it is possible to easily reduce the thickness and size of the chip, and furthermore, it is possible to easily reduce the thickness and size of the chip. A chip-type noise removal filter can be provided.

【図面の簡単な説明】[Brief explanation of drawings]

【図1】本発明の一実施例におけるチップ形ノイズ除去
フィルタの分解斜視図
FIG. 1: An exploded perspective view of a chip-type noise removal filter in an embodiment of the present invention.

【図2】同実施例の分解した状態の断面図[Figure 2] Cross-sectional view of the same embodiment in an exploded state

【図3】同実
施例の外観斜視図
[Figure 3] External perspective view of the same example

【図4】同実施例の等価回路図[Figure 4] Equivalent circuit diagram of the same example

【図5】従来のチップ形ノイズ除去フィルタの分解斜視
[Figure 5] Exploded perspective view of a conventional chip-type noise removal filter

【符号の説明】[Explanation of symbols]

1  誘電体シート 2  導体 3  孔導体 4a,4b  第1,第2の磁性体シート5  孔 6  導電路 7  外部電極 8  グラウンド外部電極 9  LC複合部品 1 Dielectric sheet 2 Conductor 3 Hole conductor 4a, 4b First and second magnetic sheets 5 Holes 6 Conductive path 7 External electrode 8 Ground external electrode 9 LC composite parts

Claims (1)

【特許請求の範囲】[Claims] 【請求項1】表裏面にそれぞれ導体を設けた誘電体シー
トと、中心部に設けた孔の内壁に表裏面を電気的に接続
する孔導体を形成した第1の磁性体シートと、前記第1
の磁性体シートの孔導体に接続するように表面に導電路
を設けた第2の磁性体シートとを重ね合わせて積層体を
構成し、この積層体の両端面に前記第2の磁性体シート
の導電路の両端に接続する外部電極を設けるとともに、
積層体の中心部の外周上に前記誘電体シートの表面の導
体に接続するグラウンド外部電極を設けたチップ形ノイ
ズ除去フィルタ。
1. A dielectric sheet having a conductor provided on each of the front and back surfaces, a first magnetic sheet having a hole conductor formed on the inner wall of a hole provided in the center to electrically connect the front and back surfaces, 1
A second magnetic sheet having a conductive path on the surface so as to be connected to the hole conductor of the magnetic sheet is stacked to form a laminate, and the second magnetic sheet is attached to both end surfaces of the laminate. In addition to providing external electrodes connected to both ends of the conductive path,
A chip-type noise removal filter including a ground external electrode connected to the conductor on the surface of the dielectric sheet on the outer periphery of the center of the laminate.
JP11008891A 1991-05-15 1991-05-15 Chip-shaped noise removing filter Pending JPH04337913A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP11008891A JPH04337913A (en) 1991-05-15 1991-05-15 Chip-shaped noise removing filter

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP11008891A JPH04337913A (en) 1991-05-15 1991-05-15 Chip-shaped noise removing filter

Publications (1)

Publication Number Publication Date
JPH04337913A true JPH04337913A (en) 1992-11-25

Family

ID=14526724

Family Applications (1)

Application Number Title Priority Date Filing Date
JP11008891A Pending JPH04337913A (en) 1991-05-15 1991-05-15 Chip-shaped noise removing filter

Country Status (1)

Country Link
JP (1) JPH04337913A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000209057A (en) * 1999-01-14 2000-07-28 Fuji Electric Co Ltd Noise filter
US7169684B2 (en) 2002-03-05 2007-01-30 Samsung Electronics Co., Ltd. Device having inductors and capacitors and a fabrication method thereof
JP2007124172A (en) * 2005-10-27 2007-05-17 Ube Ind Ltd High-frequency low pass filter

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000209057A (en) * 1999-01-14 2000-07-28 Fuji Electric Co Ltd Noise filter
US7169684B2 (en) 2002-03-05 2007-01-30 Samsung Electronics Co., Ltd. Device having inductors and capacitors and a fabrication method thereof
US7939909B2 (en) 2002-03-05 2011-05-10 Samsung Electronics Co., Ltd. Device having inductors and capacitors
JP2007124172A (en) * 2005-10-27 2007-05-17 Ube Ind Ltd High-frequency low pass filter

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