JPH04335597A - Heat-dissipating device of electronic-apparatus enclosure - Google Patents

Abstract

PURPOSE:To obtain a heat-dissipating device which spreads cooling air coming from an intake port to the whole of an enclosure and which performs a cooling operation efficiently by installing the following inside a venthole in an electronic- apparatus enclosure: a convection guide plate; and a convection guide blade which changes the flow of the cooling wind. CONSTITUTION:In this heat-dissipating device, cooling air 8 which has entered a venthole 8 from an intake port 5 flows to convection directions A and B by using a convection guide blade 4 attached to a convection guide plate 3. The cooling air 8 flowing to the convection direction A flows in a housed board unit 2 and discharges heat from an evacuation port 6. On the other hand, the cooling air 8 in the convection direction B discharges heat from the evacuation port 6 by the same flow as that in conventional cases. Thereby, the convection directions are changed by the convection guide blade 4, and heat inside an enclosure can be cooled without increasing the amount of air.

Description

[Detailed description of the invention]

0001

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a heat dissipation device for electronic equipment housings.

0002

2. Description of the Related Art Conventionally, a heat radiating device of this type has a structure as shown in FIG. In FIG. 3, 1 is an electronic device housing, 2 is a board unit, 3 is a convection guide plate, 5 is an intake port, 6 is an exhaust port, 7 is a ventilation hole, and 8 is a cooling air,
Cooling air 8 entering from the intake port 5 flows through the ventilation hole 7 along the convection guide plate 3. Thereafter, the heat flows in the convection direction B, passes between the substrate units 2, and exhausts the heat from the exhaust port 6. In this way, even with the conventional heat dissipation device described above, it is possible to cool a case that generates a small amount of heat.

0003

[Problems to be Solved by the Invention] However, in the structure of the conventional heat dissipation device described above, since the convection guide plate is flat, the wind flow as shown in Fig. 3 occurs, and the cooling air does not spread throughout the entire housing. First, there was a problem in that efficient cooling was not possible. The present invention is intended to solve these conventional problems, and aims to provide a heat dissipation device that efficiently cools the housing by distributing the cooling air that enters from the intake port throughout the housing.

0004

[Means for Solving the Problems] In order to achieve the above object, the present invention provides a convection guide plate in a ventilation hole with a vane to change the direction of cooling air.

[0005]

[Operation] Therefore, according to the present invention, the direction of the cooling air can be changed by the blades provided on the convection guide plate.
Cooling air can be guided to the parts of the board unit where it is most difficult for air to flow.

[0006]

DESCRIPTION OF THE PREFERRED EMBODIMENTS FIG. 1 shows a cross-sectional view of the structure of a heat dissipation device for an electronic device housing according to an embodiment of the present invention. In FIG. 1, 1 is an electronic device housing, 2 is a board unit, 3 is a convection guide plate, 4 is a convection guide vane, 5 is an intake port, 6 is an exhaust port,
7 is a ventilation hole, 8 is a cooling air, and the structure other than the convection guide vane 4 is the same as that of a conventional heat dissipation device for an electronic device case. The cooling air 8 entering the ventilation hole 7 from the intake port 5 is directed in the convection direction A by the convection guide vane 4 attached to the convection guide plate 3.
The cooling air 8 flowing in the convection direction A, which flows in the convection direction A, flows through the housed substrate unit 2 and exhausts heat from the exhaust port 6. On the other hand, the cooling air 8 in the convection direction B discharges heat from the exhaust port 6 through the same flow as in the conventional case. Note that FIG. 2 shows an example of the shape of the convection guide vanes 4 installed in the ventilation hole 7. As described above, according to the above embodiment, the convection direction can be changed by the convection guide vanes 4, and the entire heat inside the housing can be cooled without increasing the air volume.

[0007]

Effects of the Invention As is clear from the above embodiments, the present invention is capable of dispersing a constant flow of cooling air by changing the shape of the convection guiding vanes in the ventilation holes, and is particularly useful for casings where heat tends to accumulate. Cooling air can also be supplied to the upper part, and has the effect of being able to be discharged without increasing the air volume. In addition, since a housing that requires exhaust by a fan for heat dissipation requires only a small number of fans, there is an effect that costs can be reduced.

[Brief explanation of drawings]

FIG. 1 is a cross-sectional view of a heat dissipation device for an electronic device housing according to an embodiment of the present invention.

FIG. 2 is a perspective view showing an example of the shape of a convection guiding vane in an embodiment of the present invention.

FIG. 3 is a sectional view of a conventional heat dissipation device for an electronic device housing.

[Explanation of symbols]

1... Electronic device housing, 2... Board unit, 3... Convection guide plate, 4... Convection guide vane, 5... Inlet port,
6...Exhaust port, 7...Vent hole, 8...Cooling air.

Claims (1)

[Claims] 1. A heat dissipation device for an electronic device housing, comprising a convection guide plate in a vent hole of the electronic device case and a convection guide vane for changing the flow of cooling air.