JPH04334057A - Contact type linear sensor unit - Google Patents

Abstract

PURPOSE:To miniaturize the package of a contact type linear sensor. CONSTITUTION:A package wherein a resin plate 4, an IC substrate 5, and the FAP 2 are bonded, which plate 4 has the same size as the FAP 2 and is provided with a penetrating hole 3 at the central part which hole 3 is capable of accommodating a linear sensor 1, or a package wherein the FAP 2 is bonded to a resin package (MID package) 7 which has the same size as the FAP 2 and is provided with a hole 6 at the central part which hole 6 is capable of accommodating the linear sensor 1 and mounts an LED 8 on the bottom part. The miniaturization of the package, the cost reduction by reducing the number of parts are intended, and the requirement concerning miniaturization presented from the OA machine side can be satisfied.

Description

[Detailed description of the invention]

0001

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a contact type linear sensor unit in a semiconductor device.

0002

BACKGROUND OF THE INVENTION In recent years, contact type linear sensors have come into widespread use as image reading sensors (hereinafter referred to as image sensors) used in office automation (hereinafter referred to as OA) equipment. Various contact type linear sensors are now being used. Furthermore, with the miniaturization of office automation equipment, the demand for miniaturization of image sensors is also becoming stricter.

As shown in a cross-sectional view in FIG. 3, the conventional contact type linear sensor package includes a fiber array plate 2 (hereinafter abbreviated as FAP) on which the linear sensor 1 is mounted on the bottom surface. It is mounted on an integrated circuit board (hereinafter referred to as an IC board) 5 that is larger than the FAP 2 and has a built-in circuit for extracting signals from the FAP2. ) support substrate 10
A contact type linear sensor unit supporting an IC board 5 was sealed in a resin unit case 11 for attachment to OA equipment.

0004

[Problems to be Solved by the Invention] However, in the case of the contact type linear sensor package of the prior art, the outside of the support substrate 10, which is larger than the FAP 2, is further connected to the unit case 11.
Therefore, the size of the package is approximately 3 to 4 times the width of FAP2 in the width direction, and the OA
It has been insufficient to satisfy the demand for miniaturization of contact type linear sensors for use in equipment.

[0005]

[Means for Solving the Problems] In order to solve the above-mentioned problems, the present invention proposes the following three types of contact type linear sensor packages.

[0006] ■ A package in which the FAP is bonded to a resin plate that is the same size as the FAP and has a through hole in the center that can accommodate a linear sensor, and an IC board that is the same size as the FAP and has a built-in signal circuit in the center.

[0007] ■ A package in which a resin package with a hole of the same size as the FAP and a hole in the center capable of housing a linear sensor and a light emitting diode (hereinafter abbreviated as LED) built into the hole is bonded to the FAP.

[0008] ■ A package in which an injection molded circuit component package with a hole of the same size as the FAP and a hole in the center capable of accommodating a linear sensor and an LED built into the hole is joined to the FAP.

[0009]

[Operation] According to the present invention, the width of the package of the contact type linear sensor can be made the same size as the width of the FAP, regardless of which of the three types of packages described above is adopted.

0010

Embodiments Hereinafter, embodiments of the present invention will be described with reference to the drawings.

FIG. 1 is a sectional view of a contact type linear sensor package according to a first embodiment of the invention, and FIG. 2 is a sectional view of a contact type linear sensor package according to second and third embodiments of the invention.

As shown in FIG. 1, the contact type linear sensor package of the first embodiment of the present invention includes a FAP 2 with a linear sensor 1 mounted at the center of the bottom surface, and a linear sensor 1 of the same size as the FAP 2 in the center. A resin plate 4 made of glass epoxy or the like is provided with a through hole 3 with enough space to accommodate the FAP 2, and a resin plate 4, which is also the same size as the FAP 2, drives the linear sensor 1 in the center and has a signal output. The package is composed of three parts: an IC board 5 containing a circuit to be taken out, and the package is completed by joining the FAP 2, the resin plate 4, and the IC board 5. Although not shown in the drawings, the package of the first embodiment of the present invention is naturally equipped with leads or lead frames for power supply, circuit driving, and signal output.

As shown in FIG. 2, the close-contact linear sensor package of the second embodiment of the present invention includes a FAP 2 with a linear sensor 1 mounted at the center of the bottom surface, and an LED 8 of the same size as the FAP 2 mounted at the center. and the hole 6 with enough space to accommodate the linear sensor 1.
The package is completed by joining the FAP 2 and the resin package 7. In the package of this second embodiment, it is possible to provide illumination for capturing image information into the image sensor using the built-in LED 8, but since the IC board 5 is not built-in, it is difficult to drive the circuit and output signals. Requires external circuit.

In the third embodiment, instead of the resin package 7 of the second embodiment shown in FIG.
The third embodiment of the contact type linear sensor package uses package 7 (see "MID (injection molded circuit parts) and their applications, which are becoming more and more multi-functional", April 1991 issue of Electronic Materials, p. 73). In the case of the contact type linear sensor package of this third embodiment, it is possible to not only light up the LED 8 using the MID package 7 but also incorporate various circuits built into the IC board 5 shown in the first embodiment. Therefore, it is possible to realize a compact and multifunctional close-contact linear sensor.

[0015]

As described above, according to the present invention, the width of the package of the contact type linear sensor can be made the same size as the width of the FAP, regardless of which of the three types of packages is adopted as described above. This not only makes it possible to satisfy the demand for downsizing on the OA equipment side, but also provides a cost reduction effect by reducing the number of parts.

[Brief explanation of the drawing]

FIG. 1 is a sectional view of a contact type linear sensor package according to a first embodiment of the present invention.

FIG. 2 is a sectional view of a contact type linear sensor package according to second and third embodiments of the present invention.

FIG. 3 is a sectional view of a conventional contact type linear sensor package.

[Explanation of symbols]

1 Linear sensor 2 FAP 3 Through hole 4 Resin plate 5 IC board 6 Hole 7 Resin package (MID package) 8
LED

Claims (3)

[Claims] 1. A fiber array plate having a linear sensor mounted at the center of its lower surface; a resin plate having the same size as the fiber array plate and having a through hole in the center capable of accommodating the linear sensor; and the fiber array. It is composed of an integrated circuit board that has the same size as the plate and has a built-in circuit in the center that drives the linear sensor and takes out the signal output.The resin plate is bonded onto the integrated circuit board, and the resin board A close-contact linear sensor unit, characterized in that the fiber array plate is bonded thereto. 2. A fiber array plate having a linear sensor mounted at the center of its lower surface, a resin package having the same size as the fiber array plate and having a hole in the center capable of accommodating the linear sensor, and a light emitting diode array. A close-contact type linear sensor unit, characterized in that the fiber array plate is bonded to the resin package in which the light emitting diode array is mounted in the center of the hole. 3. A fiber array plate having a linear sensor mounted at the center of its lower surface; an injection molded circuit component package having a hole the same size as the fiber array plate and capable of accommodating the linear sensor in the center; A close-contact type linear sensor unit characterized in that the fiber array plate is bonded to the injection molded circuit component package which is constituted by a diode array and has the light emitting diode array mounted in the center of the hole.