JPH04332784A - Bonding sheet of sealing epoxy resin composition - Google Patents

Abstract

PURPOSE:To obtain a bonding sheet of a sealing epoxy resin composition excellent in blocking and heat resistance, punchability, toughness, airtightness and adhesion by impregnating a polyeter nonwoven fabric with the aforementioned sealing epoxy resin composition. CONSTITUTION:A bonding sheet of a sealing epoxy resin composition is obtained by impregnating a polyester nonwoven fabric with the above-mentioned sealing epoxy resin composition consisting essentially of an ortho-novolak type epoxy resin, a curing agent and phenolic hydroxyl group-containing-polybutadiene- acrylonitrile block copolymer.

Description

[Detailed description of the invention]

0001

[Industrial Application Field] The present invention relates to a sealing epoxy resin adhesive sheet used for hermetically sealing a substrate mounted with a semiconductor element, etc. in a case, and it has excellent airtightness and toughness. The present invention relates to an epoxy resin composition adhesive sheet for sealing that has excellent properties and punching processability.

0002

[Prior Art] The methods for sealing semiconductor devices can be broadly divided into
There are "hermetic sealing" and "resin sealing". The latter is low cost,
Although it is characterized by high productivity, since the materials used come into direct contact with semiconductor elements, consideration must be given to the resin's internal stress, coefficient of thermal expansion, adhesion, impurities, etc. On the other hand, the hermetic sealing method is a method in which the board with the element mounted is placed in a case made of metal, ceramics, glass, etc. and sealed, and although it is highly reliable, it is expensive and uses low melting point glass as a sealing material. When Au/Sn or the like is used, high-temperature heat treatment is required, and it is necessary to pay attention to the heat resistance of the substrate, built-in parts, and their joints. For this reason, recently, an airtight sealing method using an epoxy resin composition as a sealing material has been developed.
Compared to conventional methods, this method is attracting attention because of its low cost, low-temperature sealing process, and low equipment costs.

0003

[Problems to be Solved by the Invention] However, when punching out this adhesive sheet into the shape of the adhesive surface, a large amount of punching resin powder is generated, which interferes with continuous punching work and post-processing. To solve this problem, adding a liquid epoxy resin to the resin composition prevents the generation of resin powder, but on the other hand, the blocking resistance of the adhesive sheet deteriorates, and the punched sheet adheres to the mold, making it difficult to punch out. becomes worse. On the other hand, it is necessary to raise the glass transition point (hereinafter referred to as Tg) of this cured product for the purpose of improving sealing performance, but when such a structure is created, internal stress increases in proportion to this Tg, It is also known that as a result, adhesiveness deteriorates, causing problems such as peeling and brittleness at the adhesive surface during heat cycle tests and moisture/heat resistance tests.

0004

[Means for Solving the Problems] As a result of extensive research in order to solve the above problems, the present inventors have developed a novolac type epoxy resin with the general formula (I ) is a reaction product of a phenolic hydroxyl group-containing aramid-polybutadiene-acrylonitrile block copolymer and an epoxy resin, and an epoxy resin composition mainly composed of a curing agent is impregnated into a polyester nonwoven fabric. The present invention was completed after discovering that the material has good blocking properties, excellent punching workability with a mold, high Tg, and excellent toughness.

The present invention provides (A) an ortho-novolac type epoxy resin, (B) a reaction product of a phenolic hydroxyl group-containing aramid-polybutadiene-acrylonitrile block copolymer represented by general formula (I) and an epoxy resin, and (
C) A hardening agent as a main component, and the phenolic hydroxyl group-containing aramid in (B) is added to 100 parts by weight of the total epoxy resin containing 10 to 99% by weight of the ortho-novolac type epoxy resin in (A). -Polybutadiene-
This is an epoxy resin composition adhesive sheet for sealing, characterized in that (D) a polyester nonwoven fabric is impregnated with an epoxy resin composition containing 1 to 18 parts by weight of an acrylonitrile block copolymer.

[Chemical formula 2] (where x=an integer of 3 to 7, y=an integer of 1 to 4, y/(
x+y) = 0.1 to 0.3, z = integer of 5 to 15, m =
An integer from 1 to 400, n=an integer from 1 to 400, n/(m+
n) = 0.01 to 0.50, 1 = integer of 1 to 50, Ar
1, Ar3 represents a divalent aromatic group, and Ar2 represents a divalent aromatic group containing a phenolic hydroxyl group. )

00
[06] The reason why ortho-novolac type epoxy resin is used in the present invention is that this resin has good heat resistance, chemical resistance, moisture resistance, and adhesiveness, and is also highly reactive, so it is suitable as an airtight sealing material for semiconductors, etc. This is because it is excellent. Furthermore, the inclusion of the reaction product of the phenolic hydroxyl group-containing aramid-polybutadiene-acrylonitrile copolymer represented by general formula (I) and the epoxy resin is because the aramid component in this copolymer can only provide toughness. This is because heat resistance can be improved. Furthermore, thermal and mechanical stress relaxation is achieved by the polybutadiene-acrylonitrile component, and the toughness of the epoxy matrix itself is improved. Furthermore, since the polybutadiene-acrylonitrile component has a fine island structure in the epoxy matrix, it does not lose its toughening effect even when composited with polyester fibers. By introducing it into the epoxy resin in the form of such a reaction product, compatibility with the epoxy resin is improved and finer dispersion is obtained, so it is presumed that more effective toughness can be achieved. The polyester nonwoven fabric used as the base material has excellent punching properties, impregnation properties, moisture resistance, etc., and can produce good results as a reinforcing material for hermetically sealing semiconductors, etc., which is the object of the present invention.

[0007] In the present invention, the above-mentioned object can be achieved by blending the above-mentioned components in the specific mixing ratio shown above. The epoxy resin composition adhesive sheet for sealing obtained in this way has no tackiness at room temperature, so there is not only no blocking caused by overlapping sheets, but also prevention of bleed-out of the rubber component during storage or heating. The epoxy resin composition adhesive sheet for sealing is prevented and easy to handle.

The epoxy resin used in the present invention is not limited as long as it is an ortho-novolac type epoxy resin, but preferably has an epoxy equivalent of about 80 to 230 g/eq. Various grades of commercially available products are available from many manufacturers. For example Sumiepoxy ESCN
-195XHH, Sumiepoxy ESCN-220XHH
(manufactured by Sumitomo Chemical Industries, Ltd.), etc. The content of the ortho-novolac type epoxy resin is 10 to 90 parts by weight per 100 parts by weight of the total amount of components A and B.

Block copolymer (I) used in the present invention
) can be synthesized by the following method. That is, the general formula (I
) A divalent aromatic group having a phenolic hydroxyl group Ar
Excess amount of divalent aromatic dicarboxylic acid in general formula (I) with respect to aromatic dicarboxylic acid having 2 and aromatic dicarboxylic acid having no phenolic hydroxyl group having divalent aromatic group Ar1 in general formula (I). An aromatic diamine having an aromatic group Ar3 is added, and these are mixed, for example, in an organic solvent represented by N-methyl-2-pyrrolidone in the presence of a phosphite and a pyridine derivative under an inert atmosphere such as nitrogen. , heat and stir. The resulting phenolic hydroxyl group-containing polyaramid oligomer solution with aminoaryl groups at both ends is mixed with polybutadiene having carboxyl groups at both ends.
Block copolymer (I) is obtained by adding an acrylonitrile copolymer and polycondensing it.

[0010] In addition, a polybutadiene-acrylonitrile copolymer having elbow groups at both ends is available from Goodr
It is commercially available as Hycar CTBN from ic company, and these can be used.

The carboxylic acids having a phenolic hydroxyl group used in the production of the block copolymer (I) of the present invention include 5-hydroxyisophthalic acid, 4-hydroxyisophthalic acid, 2-hydroxyphthalic acid, 3-hydroxy Phthalic acid, 2-hydroxyterephthalic acid, carboxylic acids without phenolic hydroxyl groups include phthalic acid, isophthalic acid, terephthalic acid, 4,4'-biphenylcarboxylic acid, 3,3'-methylene dibenzoic acid, 4, 4'-methylene dibenzoic acid, 4,4'-oxydibenzoic acid, 4,
4'-thiodibenzoic acid, 3,3'-carbonyl dibenzoic acid, 4,4'-carbonyl dibenzoic acid, 4,4'-sulfonyl dibenzoic acid, 1,4-naphthalene dicarboxylic acid,
Examples include 1,5-naphthalene dicarboxylic acid and 2,6-naphthalene dicarboxylic acid, but are not limited thereto.

The aromatic diamines used in the production of the block copolymer (I) of the present invention include m-phenylene diamine, p-phenylene diamine, metatolylene diamine, 4,4'-diaminodiphenyl ether, 3, 3
'-Dimethyl-4,4'-diaminodiphenyl ether, 3,3'-diaminodiphenyl ether, 3,4'-
Diaminodiphenyl ether, 4,4'-diaminodiphenylthioether, 3,3'-dimethyl-4,4'-
Diaminodiphenylthioether, 3,3'-diethoxy-4,4'-diaminodiphenylthioether, 3,
3'-diaminodiphenylthioether, 4,4'-diaminobenzophenone, 3,3'-dimethyl-4,4'
-Diaminobenzophenone, 3,3'-diaminodiphenylmethane, 4,4'-diaminodiphenylmethane, 3
, 3'-dimethoxy-4,4'-diaminodiphenylmethane, 2,2'-bis(3-aminophenyl)propane, 2,2'-bis(4-aminophenyl)propane, 4
, 4'-diaminodiphenylsulfoxide, 4,4'-
Diaminodiphenylsulfone, benzidine, 3,3'-
Dimethylbenzidine, 3,3'-dimethoxybenzidine, 3,3'-diaminobiphenyl, p-xylylene diamine, m-xylylene diamine and the like can be used alone or in combination.

The reaction product of the epoxy resin and the block copolymer (I) of the present invention can be obtained by reacting the epoxy resin and the block copolymer (I) in an amide solvent or the like. As the amide solvent, N,N-dimethylformamide, N,N-dimethylacetamide, N-methyl-2-pyrrolidone, etc. are used. The amount of epoxy resin used is 1 to 20 times equivalent, preferably 5 to 15 times equivalent, relative to block copolymer (I). In this reaction,
Reaction in the presence of a catalyst such as an alkali metal hydroxide, tertiary amine, quaternary ammonium salt, imidazole, phosphine, phosphonium salt, etc. at a reaction temperature of 50°C or higher, preferably 70°C or higher for about 1 to 30 hours. It can be manufactured by

The epoxy resin used in the reaction with block copolymer (I) is preferably one having two or more epoxy groups in one molecule. For example, glycidyl ethers, glycidyl esters, glycidyl amines,
Examples include linear aliphatic epoxides, alicyclic epoxides, and hydantoin type epoxy resins. Examples of glycidyl ethers include glycidyl ether of bisphenol, polyglycidyl ether of phenol novalac, glycidyl ether of alkylene glycol or polyalkylene glycol, and the like. Examples of the glycidyl ether of bisphenol include bisphenol A, bisphenol F, bisphenol AD, bisphenol S, tetramethylbisphenol A, tetramethylbisphenol F, tetramethylbisphenol AD, tetramethylbisphenol S, tetrachlorobisphenol A, and tetrabromobisphenol A. Examples of diglycidyl ethers of dihydric phenols include diglycidyl ethers of phenol novolaks, such as polyglycidyl ethers of novolac resins such as phenol novolaks, cresol novolaks, and brominated phenol novolaks, and diglycidyl ethers of alikylene glycols or polyalkylene glycols. Examples of the diglycidyl ether include diglycidyl ethers of glycols such as polyethylene glycol, polypropylene glycol, and butanediol.

Examples of the glycidyl esters include glycidyl esters of hexahydrophthalic acid and glycidyl esters of dimer acid, and examples of the glycidyl amines include triglycidylaminodiphenylmethane, triglycidylaminophenol, and triglycidyl aminophenol. Examples include glycidyl isocyanurate. Further, examples of linear aliphatic epoxides include epoxidized polybutadiene and epoxidized soybean oil, and examples of alicyclic epoxides include 3,4-epoxy-6-methylcyclohexylmethylcarboxylate, 3, Examples include 4-epoxycyclohexylmethylcarboxylate and hydrogenated bisphenol epoxide. Examples of hydantoin-type epoxies include diglycidylhydantoin, glycidylglycidoxyalkylhydantoin, and the like.

Examples of the curing agent used in the present invention include bis(4-aminophenyl)sulfone, bis(4-aminophenyl)methane, 1,5-diaminonaphthalene, p
-phenylenediamine, m-phenylenediamine, o-
Aromatic amine curing agents such as phenylenediamine, 2,6-dichloro-1,4-benzenediamine, 1,3-di(p-aminophenyl)propane, m-xylenediamine, ethylenediamine, diethylenetriamine, tetraethylenepentamine , aliphatic amine compounds such as diethylaminopropylamine, hexamethylene diamine, menzendiamine, isophorone diamine, bis(4-amino-3-methyldicyclohexyl)methane, polymethylene diamine, polyether diamine, polyaminoamide compounds, Aliphatic acid anhydrides such as dodecylsuccinic anhydride, polyadipic anhydride, and polyazelaic anhydride; alicyclic acid anhydrides such as hexahydrophthalic anhydride and methylhexahydrophthalic anhydride; phthalic anhydride; and trimellitic anhydride. Acids, aromatic acid anhydrides such as benzophenone tetracarboxylic anhydride, ethylene glycol bistrimelitate, glycerol tristrimelitate, phenolic compounds and phenolic resins, amino resins, urea resins, melamine resins, dicyandiamide, dihydrazines, imidazole Examples include, but are not limited to, Lewis acids, Bronsted acid salts, polymercaptons, isocyanates, and blocked isocyanates. The content of the curing agent (C) is preferably 5 to 110 parts by weight based on 100 parts by weight of the total epoxy resin.

[0017] The polyester nonwoven fabric used in the present invention is
The manufacturing method may be either wet or dry, and the basis weight is preferably 20 to 300 g/m2, but is not particularly limited.

The epoxy resin adhesive sheet for sealing of the present invention can be obtained, for example, by impregnating a polyester nonwoven fabric with an epoxy resin composition. As a method, a polyester nonwoven fabric is impregnated with a varnish prepared by dissolving an epoxy resin composition in an organic solvent such as methyl ethyl ketone, acetone, or toluene, or the epoxy resin composition is impregnated by a hot melt method. The amount of the epoxy resin composition impregnated is 30 to 300 parts by weight, preferably 60 to 200 parts by weight, per 100 parts by weight of the polyester nonwoven fabric.

The epoxy resin composition of the present invention may contain a curing accelerator, a coloring agent such as a dye or pigment, an oxidation stabilizer,
Light stabilizers, coupling agents, epoxy resins other than ortho-novolac type epoxy resins and other resins, reinforcing materials other than polyester nonwoven fabrics, reactive diluents for epoxy resins, etc. can also be blended. Examples of curing accelerators include phosphorus-based agents such as triphenylphosphine, tertiary amine-based agents such as triethylamine, tetraethanolamine, 1,8-diaza-
Bicyclo[5,4,0]-7-undecene (DBU),
N,N-dimethylbenzylamine, 1,1,3,3-tetramethylguanidine, 2-ethyl-4-methylimidazole, N-methylpiperazine, etc., boron-based compounds such as 1,
8-diaza-bicyclo[5,4,0]-7-undecenium tetraphenylborate and the like are used.

Examples of epoxy resins other than ortho-novolac type epoxy resins include glycidyl ethers, glycidyl esters, glycidyl amines, linear aliphatic epoxides, alicyclic epoxides, hydantoin type epoxies, and brominated epoxy resins. etc., and can be used together if necessary.

As the reaction diluent for epoxy resins, bisphenol compounds are preferred. Bisphenol compounds include 2,2'-bis(4-hydroxyphenyl)propane, 2,2'-bis(2-methyl-4-hydroxyphenyl)propane, 2,2'-bis(4-hydroxyphenyl)methane, 1,1'-bis(4-hydroxyphenyl)ethane, 1,1'-bis(4-hydroxyphenyl)hexane, 1,1'-bis(4-hydroxyphenyl)docosyl, 2,'2-bis(4 -hydroxyphenyl)butane, 2,2'-bis(4-hydroxyphenyl)hexane, bis(4-hydroxyphenyl)sulfone, bis(3-chloro-4-hydroxyphenyl)sulfone, bis(3,5-dimethyl- 4-hydroxyphenyl) sulfone, bis(4-hydroxy-3,5-dibromophenyl) sulfone, bis(4-hydroxyphenyl) sulfide, bis(3-methyl-4-hydroxyphenyl) sulfide, 1,1-(4 -hydroxyphenyl)cyclohexane, 4,4'-dihydroxybenzophenone, dihydroxynaphthalene, 1,4-(p-hydroxycumyl)benzene, and the like.

[0022]

[Examples] The present invention will be explained below with reference to Examples, but the present invention is not limited thereto. Synthesis Example 1 Phenolic hydroxyl group-containing aramid-polybutadiene-acrylonitrile block copolymer (2 mol% of phenolic hydroxyl groups contained in the aramid part): Isophthalic acid 19
．． 60g (118mmol), 3,4'-oxydianiline 26.4g (132mmol), 5-hydroxyisophthalic acid 0.41g (2.3mmol), lithium chloride 3.9g, calcium chloride 12.1g, N-methyl- 240 ml of 2-pyrrolidone and 54 ml of pyridine in 11
Pour into a 4-necked round bottom flask and stir to dissolve.
74 g of triphenyl phosphite was added and reacted at 90° C. for 4 hours to produce a phenolic hydroxyl group-containing aramid oligomer. In addition to this, a polybutadiene-acrylonitrile copolymer (Hyc
ar CTBN, manufactured by BF Goodrich. The acrylonitrile component contained in the polybutadiene acrylonitrile part is 17 mol% and the molecular weight is approximately 3600) 48 g
Add a solution dissolved in 240 ml of pyridine, and add 4 more
After reacting for an hour, the reaction solution was cooled to room temperature and poured into methanol 201 to produce polybutadiene used in the present invention.
Aramid containing approximately 2 mol% of phenolic hydroxyl groups with an acrylonitrile copolymer content of 50 wt%.
A polybutadiene-acrylonitrile block copolymer was precipitated. This precipitated polymer was further purified by washing with methanol and refluxing the methanol. The intrinsic viscosity of this polymer is 0.85
dl/g (dimethylacetamide, 30°C). When the infrared spectrum of the polymer powder was measured by the diffuse reflection method, it was found that the amide carbonyl group was found at 1674 cm-1 and the C- of the butadiene moiety was found at 2856-2975 cm-1.
Absorption based on H bonds and absorption based on nitrile groups were observed at 2245 cm-1.

Synthesis Example 2 Phenolic hydroxyl group-containing aramid-polybutadiene-acrylonitrile block copolymer (phenolic hydroxyl group contained in the aramid part: 14 mol%): 19.60 g (118 mmol) of isophthalic acid from Synthesis Example 1, 3,
4'-oxydianiline 26.4g (132mmol)
, 5-hydroxyisophthalic acid 0.41g (2.3m
mol) and 48 g of polybutadiene-acrylonitrile copolymer having carboxyl groups at both ends, and 19.93 g (120 mmol) of isophthalic acid, 3,4
'-oxydianiline 30.63g (153mmol)
and 3.64 g of 5-hydroxyisophthalic acid (20 mm
ol) and polybutadiene-acrylonitrile copolymer with carboxyl groups at both ends (Hycar CTBN
, made by BF Goodrich, acrylonitrile contained in the polybutadiene acrylonitrile part is 17 mol%
Polymerization was carried out in the same manner except that the molecular weight was changed to 55.5 g (about 3600), and the same post-treatment was carried out to obtain aramid-polybutadiene containing about 14 mol% of phenolic hydroxyl groups for use in the present invention. An acrylonitrile block copolymer was precipitated. The intrinsic viscosity of this polymer is 0
．． It was 82 dl/g (dimethylacetamide, 30°C). When the infrared spectrum of the polymer powder was measured using the diffuse radiation method, it was found that an amide carbonyl group was observed at 1675 cm-1, an absorption based on the C-H bond of the butadiene moiety was observed at 2854-2971 cm-1, and an absorption based on a nitrile group was observed at 2243 cm-1. acknowledged.

<Synthesis of reaction product (A) of epoxy resin and block copolymer> 200 g of dimethylformamide
After dissolving 24 g of the phenolic hydroxyl group-containing aramid-polybutadiene acrylonitrile block copolymer containing 2 mol% of phenolic hydroxyl groups obtained in Synthesis Example 1, an epoxy resin (AER667, bisphenol A type epoxy resin, average molecular weight : 2600, epoxy equivalent: 2000, manufactured by Asahi Kasei Kogyo Co., Ltd.) 21 g, and triphenylphosphine 0.08 g as a reaction accelerator were added.
The reaction was carried out at 90°C for 2 hours. This was added to water to precipitate the resin, washed repeatedly with warm water, and then tetrahydrofuran was added to azeotrope these solvents under reduced pressure.
A resin composition in which the epoxy resin reacted with the aramid portion was obtained by vacuum drying. To a solution of 1 mg of this product dissolved in about 30 ml of pyridine, 1 g of an anhydrous iron(III chloride) coloring indicator for phenolic hydroxyl groups was added to 10 g of chloroform.
After adding 8 ml of pyridine and filtering the precipitate to prepare a red solution, a few drops of pyridine (obtained) were added and stirred, but no discoloration was observed. It was confirmed that all hydroxyl groups reacted with glycidyl groups and that no unreacted phenol residues were contained.

<Synthesis of reaction product (B) of epoxy resin and block copolymer> 24 g of the aramid-polybutadiene acrylonitrile block copolymer containing about 14 mol% of phenolic hydroxyl groups obtained in Synthesis Example 2, epoxy 133g of resin (AER667, bisphenol A
type epoxy resin, average molecular weight: 2600, epoxy equivalent: 2000, manufactured by Asahi Kasei Corporation), 0.64 g of triphenylphosphine as a curing agent was mixed with 20 g of dimethylformamide.
The reaction product of the aramid-polybutadiene acrylonitrile block copolymer and the epoxy resin was obtained by dissolving it in 0 g and performing the same operation as in Example 1. In a solution of 1 mg of this product dissolved in about 30 ml of pyridine,
Color indicator for phenolic hydroxyl group (anhydrous iron chloride (II)
Dissolve 1 g of I) in 100 ml of chloroform, add 8 ml of pyridine, filter the precipitate, prepare a red solution, and stir. However, no discoloration was observed. It was confirmed that all phenolic hydroxyl groups in the resin reacted with glycidyl groups and that no unreacted phenol residues were contained.

The reaction product was mixed with an ortho-novolac resin, a curing agent, and a silane coupling agent in the formulation shown in Table 1 (Examples 1 to 3, Comparative Example 1) and dissolved in a methyl ethyl ketone solvent. After the % concentration solution,
A polyester nonwoven fabric with a basis weight of 40 g/m2, a thickness of 0.12 mm, and a fiber thickness of 1 to 2 denier was impregnated and dried in a hot air dryer at a temperature of 110°C for 20 minutes, so that the amount of epoxy resin composition impregnated was 70%. An adhesive sheet was obtained. Thermal curing of this epoxy resin composition was carried out at 100°C for 4 hours, 18
The test was carried out at 0°C for 6 hours. The composition of the materials added to the reaction product is as follows. Ortho-novolac type epoxy resin: Sumiepoxy ESCN-220HH, epoxy equivalent 205 g/eq, softening point 80°C, manufactured by Sumitomo Chemical Co., Ltd. Curing agent: 4,4'-diaminophenyl sulfone coupling agent: KBM-403, manufactured by Shin-Etsu Chemical Co., Ltd.

This adhesive sheet was evaluated using the following method. (1) Punching processability: An adhesive sheet is formed on a 50 mm tape, and this is cut at 5 mm intervals with a push-cutting blade.
After repeating this operation 100 times, the generation of powder was examined. ◎: Good, ○: Little powder generation, ×: Lots of powder generation. The presence or absence of blocking of the sample was examined after being left in a constant temperature bath at a temperature of 30° C. for 12 hours. ○: No blocking, ×: Blocking (3) Sealing performance evaluation: Adhesive sheet with outer frame of 40 mm in length and 40 mm in width
, the inner frame is cut out into a frame shape with a length of 35 mm and a width of 35 mm, and through this, a vertical 50 mm with an overcoat glass treatment is applied.
It was bonded to an aluminum plate with a width of 50 mm and a thickness of 1 mm. After fixing this sample with binder clips,
A sample for evaluation was prepared by heating and curing at 180°C for 4 hours and 6 hours at 180°C. This sample was heated at a temperature of 85°C and a relative humidity of 85%.
The adhesive was left in a constant temperature bath for 1000 hours, and peeling of the adhesive surface was examined. ○: No change in adhesive surface, ×: Peeling of adhesive surface occurred

002
8]

[Table 1]

Since the epoxy resin composition adhesive sheet of the present invention has excellent sealing properties, punching properties, and blocking properties, it can be effectively applied as an adhesive sheet for sealing semiconductor devices.

Claims (1)

[Claims] Claim 1: (A) an ortho-novolac type epoxy resin, (B) a reaction product of a phenolic hydroxyl group-containing aramid-polybutadiene-acrylonitrile block copolymer represented by general formula (I) and an epoxy resin, and (C) The phenolic hydroxyl group-containing aramid-polybutadiene in (B) is added to 100 parts by weight of the total epoxy resin containing a curing agent as a main component and containing 10 to 99% by weight of the ortho-novolac type epoxy resin in (A). - An epoxy resin composition adhesive sheet for sealing, characterized in that (D) a polyester nonwoven fabric is impregnated with an epoxy resin composition containing 1 to 18 parts by weight of an acrylonitrile block copolymer. [Formula 1] (where x=an integer of 3 to 7, y=an integer of 1 to 4, y/(
x+y) = 0.1 to 0.3, z = integer of 5 to 15, m =
An integer from 1 to 400, n=an integer from 1 to 400, n/(m+
n) = 0.01 to 0.50, 1 = integer of 1 to 50, Ar
1, Ar3 represents a divalent aromatic group, and Ar2 represents a divalent aromatic group containing a phenolic hydroxyl group).