JPH04329130A - Preparation of laminated sheet and precuring method - Google Patents
Preparation of laminated sheet and precuring methodInfo
- Publication number
- JPH04329130A JPH04329130A JP3098564A JP9856491A JPH04329130A JP H04329130 A JPH04329130 A JP H04329130A JP 3098564 A JP3098564 A JP 3098564A JP 9856491 A JP9856491 A JP 9856491A JP H04329130 A JPH04329130 A JP H04329130A
- Authority
- JP
- Japan
- Prior art keywords
- active energy
- base material
- laminate
- metal foil
- energy ray
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000000034 method Methods 0.000 title claims description 29
- 239000003822 epoxy resin Substances 0.000 claims abstract description 49
- 229920000647 polyepoxide Polymers 0.000 claims abstract description 49
- 239000000463 material Substances 0.000 claims abstract description 47
- 229910052751 metal Inorganic materials 0.000 claims abstract description 42
- 239000002184 metal Substances 0.000 claims abstract description 42
- 239000011888 foil Substances 0.000 claims abstract description 37
- 239000000203 mixture Substances 0.000 claims abstract description 31
- 239000011521 glass Substances 0.000 claims abstract description 16
- 229920005989 resin Polymers 0.000 claims abstract description 15
- 239000011347 resin Substances 0.000 claims abstract description 15
- 238000010438 heat treatment Methods 0.000 claims abstract description 13
- 239000004744 fabric Substances 0.000 claims abstract description 9
- 230000001678 irradiating effect Effects 0.000 claims abstract description 9
- 239000011342 resin composition Substances 0.000 claims abstract description 4
- 238000004519 manufacturing process Methods 0.000 claims description 15
- 239000002253 acid Substances 0.000 claims description 8
- 238000010030 laminating Methods 0.000 claims description 3
- 239000002657 fibrous material Substances 0.000 claims 2
- 150000008065 acid anhydrides Chemical class 0.000 abstract description 5
- 238000005265 energy consumption Methods 0.000 abstract 1
- 238000001723 curing Methods 0.000 description 34
- -1 glycidyl ether ester Chemical class 0.000 description 33
- 150000001875 compounds Chemical class 0.000 description 20
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 description 17
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 17
- 239000011889 copper foil Substances 0.000 description 16
- 238000006243 chemical reaction Methods 0.000 description 15
- 229920006241 epoxy vinyl ester resin Polymers 0.000 description 14
- 239000004593 Epoxy Substances 0.000 description 10
- 239000005056 polyisocyanate Substances 0.000 description 9
- 229920001228 polyisocyanate Polymers 0.000 description 9
- 239000002904 solvent Substances 0.000 description 9
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 description 8
- 239000007788 liquid Substances 0.000 description 8
- 229920002799 BoPET Polymers 0.000 description 7
- 125000003118 aryl group Chemical group 0.000 description 7
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 7
- 238000000465 moulding Methods 0.000 description 7
- ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 description 6
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 6
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 6
- 238000013007 heat curing Methods 0.000 description 6
- 125000003700 epoxy group Chemical group 0.000 description 5
- IQPQWNKOIGAROB-UHFFFAOYSA-N isocyanate group Chemical group [N-]=C=O IQPQWNKOIGAROB-UHFFFAOYSA-N 0.000 description 5
- 238000002156 mixing Methods 0.000 description 5
- 239000000843 powder Substances 0.000 description 5
- 229910000679 solder Inorganic materials 0.000 description 5
- DVKJHBMWWAPEIU-UHFFFAOYSA-N toluene 2,4-diisocyanate Chemical compound CC1=CC=C(N=C=O)C=C1N=C=O DVKJHBMWWAPEIU-UHFFFAOYSA-N 0.000 description 5
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 5
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 4
- BRLQWZUYTZBJKN-UHFFFAOYSA-N Epichlorohydrin Chemical compound ClCC1CO1 BRLQWZUYTZBJKN-UHFFFAOYSA-N 0.000 description 4
- WYURNTSHIVDZCO-UHFFFAOYSA-N Tetrahydrofuran Chemical compound C1CCOC1 WYURNTSHIVDZCO-UHFFFAOYSA-N 0.000 description 4
- 238000010521 absorption reaction Methods 0.000 description 4
- 125000001931 aliphatic group Chemical group 0.000 description 4
- 239000003795 chemical substances by application Substances 0.000 description 4
- HGCIXCUEYOPUTN-UHFFFAOYSA-N cyclohexene Chemical compound C1CCC=CC1 HGCIXCUEYOPUTN-UHFFFAOYSA-N 0.000 description 4
- 230000032050 esterification Effects 0.000 description 4
- 238000005886 esterification reaction Methods 0.000 description 4
- 150000002148 esters Chemical class 0.000 description 4
- 239000000178 monomer Substances 0.000 description 4
- 238000012360 testing method Methods 0.000 description 4
- LXBGSDVWAMZHDD-UHFFFAOYSA-N 2-methyl-1h-imidazole Chemical compound CC1=NC=CN1 LXBGSDVWAMZHDD-UHFFFAOYSA-N 0.000 description 3
- PEDCQBHIVMGVHV-UHFFFAOYSA-N Glycerine Chemical compound OCC(O)CO PEDCQBHIVMGVHV-UHFFFAOYSA-N 0.000 description 3
- DNIAPMSPPWPWGF-UHFFFAOYSA-N Propylene glycol Chemical compound CC(O)CO DNIAPMSPPWPWGF-UHFFFAOYSA-N 0.000 description 3
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 3
- ZJCCRDAZUWHFQH-UHFFFAOYSA-N Trimethylolpropane Chemical compound CCC(CO)(CO)CO ZJCCRDAZUWHFQH-UHFFFAOYSA-N 0.000 description 3
- 238000007259 addition reaction Methods 0.000 description 3
- 150000008064 anhydrides Chemical class 0.000 description 3
- 239000003054 catalyst Substances 0.000 description 3
- MTHSVFCYNBDYFN-UHFFFAOYSA-N diethylene glycol Chemical compound OCCOCCO MTHSVFCYNBDYFN-UHFFFAOYSA-N 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 239000003365 glass fiber Substances 0.000 description 3
- 239000012948 isocyanate Substances 0.000 description 3
- 239000004850 liquid epoxy resins (LERs) Substances 0.000 description 3
- VYKXQOYUCMREIS-UHFFFAOYSA-N methylhexahydrophthalic anhydride Chemical compound C1CCCC2C(=O)OC(=O)C21C VYKXQOYUCMREIS-UHFFFAOYSA-N 0.000 description 3
- 239000002245 particle Substances 0.000 description 3
- 150000007519 polyprotic acids Polymers 0.000 description 3
- 239000002994 raw material Substances 0.000 description 3
- UFDHBDMSHIXOKF-UHFFFAOYSA-N tetrahydrophthalic acid Natural products OC(=O)C1=C(C(O)=O)CCCC1 UFDHBDMSHIXOKF-UHFFFAOYSA-N 0.000 description 3
- LTVUCOSIZFEASK-MPXCPUAZSA-N (3ar,4s,7r,7as)-3a-methyl-3a,4,7,7a-tetrahydro-4,7-methano-2-benzofuran-1,3-dione Chemical compound C([C@H]1C=C2)[C@H]2[C@H]2[C@]1(C)C(=O)OC2=O LTVUCOSIZFEASK-MPXCPUAZSA-N 0.000 description 2
- MYRTYDVEIRVNKP-UHFFFAOYSA-N 1,2-Divinylbenzene Chemical compound C=CC1=CC=CC=C1C=C MYRTYDVEIRVNKP-UHFFFAOYSA-N 0.000 description 2
- IVSZLXZYQVIEFR-UHFFFAOYSA-N 1,3-Dimethylbenzene Natural products CC1=CC=CC(C)=C1 IVSZLXZYQVIEFR-UHFFFAOYSA-N 0.000 description 2
- WZCQRUWWHSTZEM-UHFFFAOYSA-N 1,3-phenylenediamine Chemical compound NC1=CC=CC(N)=C1 WZCQRUWWHSTZEM-UHFFFAOYSA-N 0.000 description 2
- AZQWKYJCGOJGHM-UHFFFAOYSA-N 1,4-benzoquinone Chemical compound O=C1C=CC(=O)C=C1 AZQWKYJCGOJGHM-UHFFFAOYSA-N 0.000 description 2
- FBHPRUXJQNWTEW-UHFFFAOYSA-N 1-benzyl-2-methylimidazole Chemical compound CC1=NC=CN1CC1=CC=CC=C1 FBHPRUXJQNWTEW-UHFFFAOYSA-N 0.000 description 2
- 239000012956 1-hydroxycyclohexylphenyl-ketone Substances 0.000 description 2
- VILCJCGEZXAXTO-UHFFFAOYSA-N 2,2,2-tetramine Chemical compound NCCNCCNCCN VILCJCGEZXAXTO-UHFFFAOYSA-N 0.000 description 2
- SMZOUWXMTYCWNB-UHFFFAOYSA-N 2-(2-methoxy-5-methylphenyl)ethanamine Chemical compound COC1=CC=C(C)C=C1CCN SMZOUWXMTYCWNB-UHFFFAOYSA-N 0.000 description 2
- NIXOWILDQLNWCW-UHFFFAOYSA-N 2-Propenoic acid Natural products OC(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 2
- YTWBFUCJVWKCCK-UHFFFAOYSA-N 2-heptadecyl-1h-imidazole Chemical compound CCCCCCCCCCCCCCCCCC1=NC=CN1 YTWBFUCJVWKCCK-UHFFFAOYSA-N 0.000 description 2
- ZCUJYXPAKHMBAZ-UHFFFAOYSA-N 2-phenyl-1h-imidazole Chemical compound C1=CNC(C=2C=CC=CC=2)=N1 ZCUJYXPAKHMBAZ-UHFFFAOYSA-N 0.000 description 2
- LLEASVZEQBICSN-UHFFFAOYSA-N 2-undecyl-1h-imidazole Chemical compound CCCCCCCCCCCC1=NC=CN1 LLEASVZEQBICSN-UHFFFAOYSA-N 0.000 description 2
- VEORPZCZECFIRK-UHFFFAOYSA-N 3,3',5,5'-tetrabromobisphenol A Chemical compound C=1C(Br)=C(O)C(Br)=CC=1C(C)(C)C1=CC(Br)=C(O)C(Br)=C1 VEORPZCZECFIRK-UHFFFAOYSA-N 0.000 description 2
- UIDDPPKZYZTEGS-UHFFFAOYSA-N 3-(2-ethyl-4-methylimidazol-1-yl)propanenitrile Chemical compound CCC1=NC(C)=CN1CCC#N UIDDPPKZYZTEGS-UHFFFAOYSA-N 0.000 description 2
- RNLHGQLZWXBQNY-UHFFFAOYSA-N 3-(aminomethyl)-3,5,5-trimethylcyclohexan-1-amine Chemical compound CC1(C)CC(N)CC(C)(CN)C1 RNLHGQLZWXBQNY-UHFFFAOYSA-N 0.000 description 2
- IGSBHTZEJMPDSZ-UHFFFAOYSA-N 4-[(4-amino-3-methylcyclohexyl)methyl]-2-methylcyclohexan-1-amine Chemical compound C1CC(N)C(C)CC1CC1CC(C)C(N)CC1 IGSBHTZEJMPDSZ-UHFFFAOYSA-N 0.000 description 2
- XLSZMDLNRCVEIJ-UHFFFAOYSA-N 4-methylimidazole Chemical compound CC1=CNC=N1 XLSZMDLNRCVEIJ-UHFFFAOYSA-N 0.000 description 2
- ULKLGIFJWFIQFF-UHFFFAOYSA-N 5K8XI641G3 Chemical compound CCC1=NC=C(C)N1 ULKLGIFJWFIQFF-UHFFFAOYSA-N 0.000 description 2
- MWSKJDNQKGCKPA-UHFFFAOYSA-N 6-methyl-3a,4,5,7a-tetrahydro-2-benzofuran-1,3-dione Chemical compound C1CC(C)=CC2C(=O)OC(=O)C12 MWSKJDNQKGCKPA-UHFFFAOYSA-N 0.000 description 2
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 2
- 239000004925 Acrylic resin Substances 0.000 description 2
- 229920000178 Acrylic resin Polymers 0.000 description 2
- 239000004342 Benzoyl peroxide Substances 0.000 description 2
- OMPJBNCRMGITSC-UHFFFAOYSA-N Benzoylperoxide Chemical compound C=1C=CC=CC=1C(=O)OOC(=O)C1=CC=CC=C1 OMPJBNCRMGITSC-UHFFFAOYSA-N 0.000 description 2
- VTYYLEPIZMXCLO-UHFFFAOYSA-L Calcium carbonate Chemical compound [Ca+2].[O-]C([O-])=O VTYYLEPIZMXCLO-UHFFFAOYSA-L 0.000 description 2
- MQJKPEGWNLWLTK-UHFFFAOYSA-N Dapsone Chemical compound C1=CC(N)=CC=C1S(=O)(=O)C1=CC=C(N)C=C1 MQJKPEGWNLWLTK-UHFFFAOYSA-N 0.000 description 2
- RPNUMPOLZDHAAY-UHFFFAOYSA-N Diethylenetriamine Chemical compound NCCNCCN RPNUMPOLZDHAAY-UHFFFAOYSA-N 0.000 description 2
- PIICEJLVQHRZGT-UHFFFAOYSA-N Ethylenediamine Chemical compound NCCN PIICEJLVQHRZGT-UHFFFAOYSA-N 0.000 description 2
- 239000005057 Hexamethylene diisocyanate Substances 0.000 description 2
- QIGBRXMKCJKVMJ-UHFFFAOYSA-N Hydroquinone Chemical compound OC1=CC=C(O)C=C1 QIGBRXMKCJKVMJ-UHFFFAOYSA-N 0.000 description 2
- CERQOIWHTDAKMF-UHFFFAOYSA-N Methacrylic acid Chemical compound CC(=C)C(O)=O CERQOIWHTDAKMF-UHFFFAOYSA-N 0.000 description 2
- CTQNGGLPUBDAKN-UHFFFAOYSA-N O-Xylene Chemical compound CC1=CC=CC=C1C CTQNGGLPUBDAKN-UHFFFAOYSA-N 0.000 description 2
- KFSLWBXXFJQRDL-UHFFFAOYSA-N Peracetic acid Chemical compound CC(=O)OO KFSLWBXXFJQRDL-UHFFFAOYSA-N 0.000 description 2
- 239000004698 Polyethylene Substances 0.000 description 2
- 239000002202 Polyethylene glycol Substances 0.000 description 2
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 2
- 150000007513 acids Chemical class 0.000 description 2
- WNLRTRBMVRJNCN-UHFFFAOYSA-N adipic acid Chemical compound OC(=O)CCCCC(O)=O WNLRTRBMVRJNCN-UHFFFAOYSA-N 0.000 description 2
- IMUDHTPIFIBORV-UHFFFAOYSA-N aminoethylpiperazine Chemical compound NCCN1CCNCC1 IMUDHTPIFIBORV-UHFFFAOYSA-N 0.000 description 2
- ADCOVFLJGNWWNZ-UHFFFAOYSA-N antimony trioxide Chemical compound O=[Sb]O[Sb]=O ADCOVFLJGNWWNZ-UHFFFAOYSA-N 0.000 description 2
- 150000004982 aromatic amines Chemical class 0.000 description 2
- ISAOCJYIOMOJEB-UHFFFAOYSA-N benzoin Chemical compound C=1C=CC=CC=1C(O)C(=O)C1=CC=CC=C1 ISAOCJYIOMOJEB-UHFFFAOYSA-N 0.000 description 2
- 235000019400 benzoyl peroxide Nutrition 0.000 description 2
- MQDJYUACMFCOFT-UHFFFAOYSA-N bis[2-(1-hydroxycyclohexyl)phenyl]methanone Chemical compound C=1C=CC=C(C(=O)C=2C(=CC=CC=2)C2(O)CCCCC2)C=1C1(O)CCCCC1 MQDJYUACMFCOFT-UHFFFAOYSA-N 0.000 description 2
- PXKLMJQFEQBVLD-UHFFFAOYSA-N bisphenol F Chemical compound C1=CC(O)=CC=C1CC1=CC=C(O)C=C1 PXKLMJQFEQBVLD-UHFFFAOYSA-N 0.000 description 2
- 238000009835 boiling Methods 0.000 description 2
- WERYXYBDKMZEQL-UHFFFAOYSA-N butane-1,4-diol Chemical compound OCCCCO WERYXYBDKMZEQL-UHFFFAOYSA-N 0.000 description 2
- OSGAYBCDTDRGGQ-UHFFFAOYSA-L calcium sulfate Chemical compound [Ca+2].[O-]S([O-])(=O)=O OSGAYBCDTDRGGQ-UHFFFAOYSA-L 0.000 description 2
- 230000000052 comparative effect Effects 0.000 description 2
- 230000007423 decrease Effects 0.000 description 2
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- ZZTCPWRAHWXWCH-UHFFFAOYSA-N diphenylmethanediamine Chemical compound C=1C=CC=CC=1C(N)(N)C1=CC=CC=C1 ZZTCPWRAHWXWCH-UHFFFAOYSA-N 0.000 description 2
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- 239000000945 filler Substances 0.000 description 2
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- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 2
- RRAMGCGOFNQTLD-UHFFFAOYSA-N hexamethylene diisocyanate Chemical compound O=C=NCCCCCCN=C=O RRAMGCGOFNQTLD-UHFFFAOYSA-N 0.000 description 2
- 239000011261 inert gas Substances 0.000 description 2
- 239000003112 inhibitor Substances 0.000 description 2
- 239000003999 initiator Substances 0.000 description 2
- 150000002576 ketones Chemical class 0.000 description 2
- QOHMWDJIBGVPIF-UHFFFAOYSA-N n',n'-diethylpropane-1,3-diamine Chemical compound CCN(CC)CCCN QOHMWDJIBGVPIF-UHFFFAOYSA-N 0.000 description 2
- 229910052757 nitrogen Inorganic materials 0.000 description 2
- 239000004745 nonwoven fabric Substances 0.000 description 2
- 150000003003 phosphines Chemical class 0.000 description 2
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- 150000003077 polyols Chemical class 0.000 description 2
- 229920001451 polypropylene glycol Polymers 0.000 description 2
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- 239000007787 solid Substances 0.000 description 2
- 238000001694 spray drying Methods 0.000 description 2
- 238000003860 storage Methods 0.000 description 2
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- FAGUFWYHJQFNRV-UHFFFAOYSA-N tetraethylenepentamine Chemical compound NCCNCCNCCNCCN FAGUFWYHJQFNRV-UHFFFAOYSA-N 0.000 description 2
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- RIOQSEWOXXDEQQ-UHFFFAOYSA-N triphenylphosphine Chemical compound C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1 RIOQSEWOXXDEQQ-UHFFFAOYSA-N 0.000 description 2
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 description 2
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- 239000008096 xylene Substances 0.000 description 2
- QEQBMZQFDDDTPN-UHFFFAOYSA-N (2-methylpropan-2-yl)oxy benzenecarboperoxoate Chemical compound CC(C)(C)OOOC(=O)C1=CC=CC=C1 QEQBMZQFDDDTPN-UHFFFAOYSA-N 0.000 description 1
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- XBTRYWRVOBZSGM-UHFFFAOYSA-N (4-methylphenyl)methanediamine Chemical group CC1=CC=C(C(N)N)C=C1 XBTRYWRVOBZSGM-UHFFFAOYSA-N 0.000 description 1
- DPZSNGJNFHWQDC-ARJAWSKDSA-N (z)-2,3-diaminobut-2-enedinitrile Chemical compound N#CC(/N)=C(/N)C#N DPZSNGJNFHWQDC-ARJAWSKDSA-N 0.000 description 1
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- NALFRYPTRXKZPN-UHFFFAOYSA-N 1,1-bis(tert-butylperoxy)-3,3,5-trimethylcyclohexane Chemical compound CC1CC(C)(C)CC(OOC(C)(C)C)(OOC(C)(C)C)C1 NALFRYPTRXKZPN-UHFFFAOYSA-N 0.000 description 1
- CTSQZGJZQUVGBQ-UHFFFAOYSA-N 1,2,4,5-tetrachloro-3,6-dimethylbenzene Chemical group CC1=C(Cl)C(Cl)=C(C)C(Cl)=C1Cl CTSQZGJZQUVGBQ-UHFFFAOYSA-N 0.000 description 1
- FKTHNVSLHLHISI-UHFFFAOYSA-N 1,2-bis(isocyanatomethyl)benzene Chemical compound O=C=NCC1=CC=CC=C1CN=C=O FKTHNVSLHLHISI-UHFFFAOYSA-N 0.000 description 1
- MSAHTMIQULFMRG-UHFFFAOYSA-N 1,2-diphenyl-2-propan-2-yloxyethanone Chemical compound C=1C=CC=CC=1C(OC(C)C)C(=O)C1=CC=CC=C1 MSAHTMIQULFMRG-UHFFFAOYSA-N 0.000 description 1
- 150000005208 1,4-dihydroxybenzenes Chemical class 0.000 description 1
- OVBFMUAFNIIQAL-UHFFFAOYSA-N 1,4-diisocyanatobutane Chemical compound O=C=NCCCCN=C=O OVBFMUAFNIIQAL-UHFFFAOYSA-N 0.000 description 1
- UICXTANXZJJIBC-UHFFFAOYSA-N 1-(1-hydroperoxycyclohexyl)peroxycyclohexan-1-ol Chemical compound C1CCCCC1(O)OOC1(OO)CCCCC1 UICXTANXZJJIBC-UHFFFAOYSA-N 0.000 description 1
- AYRQYSRFOWTRGV-UHFFFAOYSA-N 1-isocyanato-2-propan-2-ylidenecyclohexane Chemical compound C(C)(C)=C1C(CCCC1)N=C=O AYRQYSRFOWTRGV-UHFFFAOYSA-N 0.000 description 1
- HECLRDQVFMWTQS-RGOKHQFPSA-N 1755-01-7 Chemical compound C1[C@H]2[C@@H]3CC=C[C@@H]3[C@@H]1C=C2 HECLRDQVFMWTQS-RGOKHQFPSA-N 0.000 description 1
- LCHAFMWSFCONOO-UHFFFAOYSA-N 2,4-dimethylthioxanthen-9-one Chemical compound C1=CC=C2C(=O)C3=CC(C)=CC(C)=C3SC2=C1 LCHAFMWSFCONOO-UHFFFAOYSA-N 0.000 description 1
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- 229920006337 unsaturated polyester resin Polymers 0.000 description 1
- 229920001567 vinyl ester resin Polymers 0.000 description 1
- 230000037303 wrinkles Effects 0.000 description 1
- GFQYVLUOOAAOGM-UHFFFAOYSA-N zirconium(iv) silicate Chemical compound [Zr+4].[O-][Si]([O-])([O-])[O-] GFQYVLUOOAAOGM-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
- H05K1/0366—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement reinforced, e.g. by fibres, fabrics
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/022—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates
Landscapes
- Laminated Bodies (AREA)
Abstract
Description
【0001】0001
【産業上の利用分野】本発明は、消費エネルギーが効率
的で、かつ予備硬化が均一に行える、積層板の製造方法
に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for manufacturing a laminate, which consumes energy efficiently and can uniformly pre-cure.
【0002】0002
【従来の技術】酸無水物硬化型液状エポキシ樹脂と重合
性不飽和基を有する樹脂とからなる樹脂組成物を繊維質
基材に含浸させ、加熱による予備硬化を行ない、次いで
加熱加圧成形することにより積層板を製造する方法(特
開昭59−49240 号公報)等が知られている。[Prior Art] A fibrous base material is impregnated with a resin composition consisting of an acid anhydride-curable liquid epoxy resin and a resin having a polymerizable unsaturated group, precured by heating, and then heated and pressure molded. A method of manufacturing a laminate by using the above method (Japanese Patent Laid-Open No. 59-49240) is known.
【0003】0003
【発明が解決しようとする課題】しかしながら、上記方
法では樹脂組成物を繊維質基材に含浸させた後、銅箔や
フィルムでその積層体の上下両面を被覆し、次いで加熱
により実質的には無圧下で加熱により予備硬化をするた
め、積層体の全体に亘って均一に片寄り無く、かつ必要
充分にそれを予備硬化することができるが、銅箔に微細
なしわが発生するという問題及び予備硬化に要するエネ
ルギーが多くなるという問題がある。However, in the above method, after impregnating a fibrous base material with a resin composition, the upper and lower surfaces of the laminate are covered with copper foil or a film, and then heated to substantially impregnate the fibrous base material. Since pre-curing is performed by heating under no pressure, it is possible to pre-cure the entire laminate uniformly and sufficiently without any deviation, but there is a problem that fine wrinkles occur in the copper foil and the pre-curing process is difficult. There is a problem that more energy is required for curing.
【0004】一方、活性エネルギー線による予備硬化方
法では、熱による予備硬化に比べれば、エネルギー量を
少なくすることができ、かつ積層体の全体に亘って均一
に片寄り無く、かつ必要充分にそれを予備硬化すること
ができるが、活性エネルギー線を上下から照射できる装
置が必要である。On the other hand, in the pre-curing method using active energy rays, the amount of energy can be reduced compared to pre-curing using heat, and the laminate can be uniformly distributed over the entire laminate without any deviation, and can be cured to the necessary extent. can be precured, but a device that can irradiate active energy rays from above and below is required.
【0005】[0005]
【課題を解決しようとする手段】本発明者らは、この様
な状況に鑑みて鋭意研究した結果、エネルギ−線硬化性
成分を含有するエポキシ系樹脂組成物を含浸した繊維質
基材の片面を金属箔で覆い、その金属箔の反対面から活
性エネルギー線を照射すると、活性エネルギー線を片面
からのみ照射する装置で充分であり、しかも照射エネル
ギー量をより減らしてもに積層体の全体に亘って均一に
片寄り無く、かつ必要充分にそれを予備硬化することが
できることを見い出し本発明を完成するに至った。[Means for Solving the Problem] As a result of intensive research in view of the above situation, the present inventors have devised the following method: one side of a fibrous base material impregnated with an epoxy resin composition containing an energy beam curable component. Covering the laminate with metal foil and irradiating active energy rays from the opposite side of the metal foil will suffice with a device that irradiates active energy rays from only one side, and even if the amount of irradiation energy is further reduced, it will not affect the entire laminate. The present inventors have discovered that it is possible to precure uniformly and to the necessary extent without any deviation over the entire area, and have completed the present invention.
【0006】即ち本発明は、活性エネルギ−線硬化性成
分を含有するエポキシ系樹脂組成物を含浸した活性エネ
ルギー線透過性含浸繊維質基材またはこれを複数枚積層
してなる活性エネルギー線透過性含浸繊維質積層体の片
面を金属箔(1)で覆い、次いで金属箔(1)の反対側
から該基材または積層体に活性エネルギー線を照射して
予備硬化させ、次いで加熱加圧硬化させることを特徴と
する金属箔張積層板の製造方法及び活性エネルギ−線硬
化性成分を含有するエポキシ系樹脂組成物を含浸した活
性エネルギー線透過性含浸繊維質基材またはこれを複数
枚積層してなる活性エネルギー線透過性含浸繊維質積層
体の片面を金属箔(1)で覆い、次いで金属箔(1)の
反対側から該基材または積層体に活性エネルギー線を照
射することを特徴とする含浸繊維質積層体の予備硬化方
法を提供するものである。That is, the present invention provides an active energy ray transparent impregnated fibrous base material impregnated with an epoxy resin composition containing an active energy ray curable component, or an active energy ray transparent impregnated fibrous base material formed by laminating a plurality of sheets thereof. One side of the impregnated fibrous laminate is covered with metal foil (1), then the base material or laminate is irradiated with active energy rays from the opposite side of the metal foil (1) to precure, and then cured by heating and pressure. A method for producing a metal foil-clad laminate, and an active energy ray-transparent impregnated fibrous base material impregnated with an epoxy resin composition containing an active energy ray-curable component, or a plurality of sheets thereof laminated. One side of the active energy ray-transparent impregnated fibrous laminate is covered with a metal foil (1), and then the base material or the laminate is irradiated with active energy rays from the opposite side of the metal foil (1). A method for pre-curing an impregnated fibrous laminate is provided.
【0007】まず最初に、活性エネルギ−線硬化性成分
を含有するエポキシ系樹脂組成物について説明する。本
発明にかかる活性エネルギ−線硬化性成分としては、例
えばポリエ−テルアクリレ−ト、ポリエステルアクリレ
−ト、ポリウレタンアクリレ−ト、エポキシビニルエス
テルなどのアクリル系樹脂、不飽和ポリエステル樹脂、
スピラン樹脂およびジアリルフタレ−ト樹脂などが用い
られるが、金属箔との密着性という点でアクリル系樹脂
が好ましく、中でもエポキシビニルエステル樹脂が特に
好ましい。First, an epoxy resin composition containing an active energy beam-curable component will be explained. Examples of the active energy beam-curable component according to the present invention include acrylic resins such as polyether acrylate, polyester acrylate, polyurethane acrylate, and epoxy vinyl ester, unsaturated polyester resins,
Spirane resin, diallyl phthalate resin, etc. are used, but acrylic resins are preferred from the viewpoint of adhesion to metal foil, and epoxy vinyl ester resins are particularly preferred.
【0008】更に、上記エポキシビニルエステル樹脂と
しては、通常エポキシ樹脂中のエポキシ基のエステル化
率が20%より大きい樹脂、好ましくは30%以上の樹
脂を用いる。エポキシビニルエステル樹脂はどの様な製
造方法で製造されたものであってもよいが、例えばエポ
キシ樹脂と不飽和一塩基酸とを、必要に応じてエステル
化触媒の存在下でエステル化反応させて得られる樹脂が
挙げられる。Furthermore, as the epoxy vinyl ester resin, a resin in which the esterification rate of the epoxy groups in the epoxy resin is usually greater than 20%, preferably 30% or more is used. Epoxy vinyl ester resin may be produced by any method, but for example, it may be produced by esterifying an epoxy resin and an unsaturated monobasic acid in the presence of an esterification catalyst if necessary. Examples include the resins obtained.
【0009】上記エポキシ樹脂として代表的なものを挙
げれば、エピクロルヒドリン又はβ−メチルエピクロル
ヒドリンとビスフェノールA、臭素化ビスフェノールA
、ビスフェノールF又はビスフェノールSとから得られ
るエポキシ樹脂;フェノール又はアルキルフェノール・
ノボラック樹脂のポリグリシジルエーテル類;エチレン
グリコール、プロピレングリコール、ポリエチレングリ
コール、ポリプロピレングリコール、ネオペンチルグリ
コール、グリセリン、トリメチロールエタン、トリメチ
ロールプロパン又はビスフェノールAのエチレンオキサ
イドもしくはプロピレンオキサイドの付加物の如き多価
アルコールのポリグリシジルエーテル類;アジピン酸、
フタル酸、テトラヒドロフタル酸、ヘキサヒドロフタル
酸又はダイマー酸の如きポリカルボン酸のポリグリシジ
ルエステル類;シクロヘキセン又はその誘導体を過酢酸
などでエポキシ化させることにより得られるシクロヘキ
セン系のエポキシ化合物類( 3,4−エポキシ−6−
メチル−シクロヘキシル− 3,4−エポキシ−6−メ
チル−シクロヘキサンカルボキシレート、 3,4−エ
ポキシシクロヘキシルメチル− 3,4−シクロヘキサ
ンカルボキシレート、1−エポキシエチル− 3,4−
エポキシシクロヘキサンなど);シクロペンタジエンも
しくはジシクロペンタジエン又はそれらの誘導体を過酢
酸などでエポキシ化させることにより得られるシクロペ
ンタジエン系のエポキシ化合物類(シクロペンタジエン
オキサイド、ジシクロペンタジエンオキサイド、2,3
−エポキシシクロペンチルエーテルなど);リモネン
ジオキサイド;あるいはヒドロキシ安息香酸のグリシジ
ルエーテルエステルなどがあり、単独あるいは二種以上
を混合して用いられる。Typical examples of the above epoxy resin include epichlorohydrin or β-methylepichlorohydrin, bisphenol A, and brominated bisphenol A.
, bisphenol F or bisphenol S; phenol or alkylphenol.
Polyglycidyl ethers of novolac resins; polyhydric alcohols such as ethylene glycol, propylene glycol, polyethylene glycol, polypropylene glycol, neopentyl glycol, glycerin, trimethylolethane, trimethylolpropane, or adducts of bisphenol A with ethylene oxide or propylene oxide. polyglycidyl ethers; adipic acid,
Polyglycidyl esters of polycarboxylic acids such as phthalic acid, tetrahydrophthalic acid, hexahydrophthalic acid or dimer acid; cyclohexene-based epoxy compounds obtained by epoxidizing cyclohexene or its derivatives with peracetic acid etc. (3, 4-Epoxy-6-
Methyl-cyclohexyl-3,4-epoxy-6-methyl-cyclohexanecarboxylate, 3,4-epoxycyclohexylmethyl-3,4-cyclohexanecarboxylate, 1-epoxyethyl-3,4-
cyclopentadiene-based epoxy compounds (cyclopentadiene oxide, dicyclopentadiene oxide, 2,3
-epoxycyclopentyl ether, etc.); limonene dioxide; and glycidyl ether ester of hydroxybenzoic acid, which can be used alone or in combination of two or more.
【0010】上記不飽和一塩基酸として代表的なものは
、例えばアクリル酸、メタクリル酸、桂皮酸、クロトン
酸、モノメチルマレート、モノプロピルマレート、モノ
ブチルマレート、ソルビン酸又はモノ(2−エチルヘキ
シル)マレートなどがあるが、これらは単独でも二種以
上混合しても用いられる。Typical unsaturated monobasic acids include acrylic acid, methacrylic acid, cinnamic acid, crotonic acid, monomethyl maleate, monopropyl maleate, monobutyl maleate, sorbic acid, and mono(2- ethylhexyl) malate, etc., and these may be used alone or in combination of two or more.
【0011】また、エポキシビニルエステル樹脂を製造
する際に必要に応じて用いるエステル化触媒としては、
通常公知のものが用いられるが、なかでも、ホスフィン
誘導体、4級ホスホニウム塩等のリン系化合物が好まし
く、なかでもトリフェニルホスフィン、トリ−n−ブチ
ルホスフィン等の様なホスフィン誘導体が特に好ましい
。これらのエステル化触媒は触媒量添加されればよく、
たとえば、原料であるエポキシ樹脂と不飽和一塩基酸に
対して、100〜10,000ppm 程度添加して用
いればよい。[0011] Furthermore, as an esterification catalyst to be used as necessary when producing an epoxy vinyl ester resin,
Generally known compounds are used, but phosphorus compounds such as phosphine derivatives and quaternary phosphonium salts are preferred, and phosphine derivatives such as triphenylphosphine and tri-n-butylphosphine are particularly preferred. These esterification catalysts may be added in catalytic amounts;
For example, about 100 to 10,000 ppm may be added to the epoxy resin and unsaturated monobasic acid as raw materials.
【0012】エポキシビニルエステル樹脂を得るには、
反応中のゲル化を防止する目的や生成物の保存安定性あ
るいは硬化性の調整の目的でそれぞれ重合禁止剤を使用
することが推奨される。[0012] To obtain the epoxy vinyl ester resin,
It is recommended to use a polymerization inhibitor for the purpose of preventing gelation during the reaction and adjusting the storage stability or curability of the product.
【0013】かかる重合禁止剤として代表的なものを挙
げれば、ハイドロキノン、p−t−ブチルカテコール、
モノ−t−ブチルハイドロキノンの如きハイドロキノン
類;ハイドロキノンモノメチルエーテル、ジ−t−p−
クレゾールの如きフェノール類;p−ベンゾキノン、ナ
フトキノン、p−トルキノンの如きキノン類;又はナフ
テン酸銅の如き銅塩などがある。Representative examples of such polymerization inhibitors include hydroquinone, pt-butylcatechol,
Hydroquinones such as mono-t-butylhydroquinone; hydroquinone monomethyl ether, di-t-p-
Examples include phenols such as cresol; quinones such as p-benzoquinone, naphthoquinone, and p-torquinone; and copper salts such as copper naphthenate.
【0014】これらエポキシビニルエステル樹脂は、ケ
トン類、エステル類等の溶剤に溶解して用いても良いし
、エポキシ樹脂等の他の原料と同時に溶解させて用いて
も良いが、重合性ビニルモノマーのみを用いることが好
ましい。この場合の重合性ビニルモノマーとしては、例
えばスチレン、ビニルトルエン、t−ブチルスチレン、
クロルスチレンもしくはジビニルベンゼンの如きスチレ
ン及びその誘導体;エチル(メタ)アクリレート、プロ
ピル(メタ)アクリレート、イソプロピル(メタ)アク
リレート、n−ブチル(メタ)アクリレート、イソブチ
ル(メタ)アクリレート、2−エチルヘキシル(メタ)
アクリレート、ラウリル(メタ)アクリレート、2−ヒ
ドロキシエチル(メタ)アクリレートもしくは2−ヒド
ロキシプロピル(メタ)アクリレートの如き(メタ)ア
クリル酸の低沸点エステルモノマー類;又はトリメチロ
ールプロパントリ(メタ)アクリレート、ジエチレング
リコールジ(メタ)アクリレート、1,4 −ブタンジ
オールジ(メタ)アクリレートもしくは 1,6−ヘキ
サンジオールジ(メタ)アクリレートの如き多価アルコ
ールの(メタ)アクリレート類などが挙げられ、なかで
も粘度が低い点でスチレン、ビニルトルエン、(メタ)
アクリル酸の低沸点エステルモノマー類が好ましい。These epoxy vinyl ester resins may be used by being dissolved in a solvent such as ketones or esters, or may be used by being dissolved together with other raw materials such as epoxy resin, but polymerizable vinyl monomers may be used. It is preferable to use only Examples of the polymerizable vinyl monomer in this case include styrene, vinyltoluene, t-butylstyrene,
Styrene and its derivatives such as chlorstyrene or divinylbenzene; ethyl (meth)acrylate, propyl (meth)acrylate, isopropyl (meth)acrylate, n-butyl (meth)acrylate, isobutyl (meth)acrylate, 2-ethylhexyl (meth)acrylate
low boiling ester monomers of (meth)acrylic acid such as acrylate, lauryl (meth)acrylate, 2-hydroxyethyl (meth)acrylate or 2-hydroxypropyl (meth)acrylate; or trimethylolpropane tri(meth)acrylate, diethylene glycol Examples include (meth)acrylates of polyhydric alcohols such as di(meth)acrylate, 1,4-butanediol di(meth)acrylate, or 1,6-hexanediol di(meth)acrylate, among which viscosity is low. Styrene, vinyltoluene, (meth)
Low boiling ester monomers of acrylic acid are preferred.
【0015】本発明で用いる活性エネルギ−線としては
、紫外線、ガンマ線、電子線などが用いられるが、装置
の操作性、安全性、価格などの点から、紫外線が好まし
い。上記活性エネルギー線硬化性成分として、電子線硬
化性成分を選択した時は光開始剤の併用は特に必要ない
が、紫外線硬化性成分を選択した場合には、光開始剤を
併用することが好ましい。The active energy rays used in the present invention include ultraviolet rays, gamma rays, and electron beams, but ultraviolet rays are preferred from the viewpoints of operability, safety, cost, etc. of the apparatus. When an electron beam curable component is selected as the active energy ray curable component, it is not particularly necessary to use a photoinitiator in combination, but when an ultraviolet ray curable component is selected, it is preferable to use a photoinitiator in combination. .
【0016】活性エネルギー線硬化性成分を硬化させる
際に必要に応じて用いられる光重合開始剤としては、例
えばベンジル、ベンゾイン、ベンゾインメチルエ−テル
、ベンゾインエチルエ−テル、ベンゾインイソプロピル
エ−テル、1−ヒドロキシシクロヘキシルフェニルケト
ン等のベンゾインエ−テル系化合物、ベンゾフェノン、
4−クロルベンゾフェノン、オルソベンゾイル安息香酸
メチル、3,3´−ジメチル−4−メトキシベンゾフェ
ノン、4−ベンゾイル−4´−メチルジフェニルスルフ
ィドジベンジル等のベンゾフェノン系化合物、ベンジル
ジメチルケタ−ル、ベンジルジエチルケタ−ル等のケタ
−ル系化合物、2,2´−ジエトキシアセトフェノン、
2,2´−ジブトキシアセトフェノン、2−ヒドロキシ
−2−メチルプロピオフェノン、p−t−ブチルトリク
ロロアセトフェノン p−t−ブチルトリクロロアセ
トフェノン等のアセトフェノン系化合物、チオキサント
ン2−クロルチオキサントン、2−メチルチオキサント
ン、2,4−ジメチルチオキサントン、2−エチルアン
トラキノン、2−プロピルアントラキノン等のチオキサ
ントン系化合物等が挙げられる。Examples of the photopolymerization initiator used as necessary when curing the active energy ray-curable component include benzyl, benzoin, benzoin methyl ether, benzoin ethyl ether, benzoin isopropyl ether, Benzoin ether compounds such as 1-hydroxycyclohexylphenyl ketone, benzophenone,
Benzophenone compounds such as 4-chlorobenzophenone, methyl orthobenzoylbenzoate, 3,3'-dimethyl-4-methoxybenzophenone, 4-benzoyl-4'-methyldiphenylsulfide dibenzyl, benzyl dimethyl ketal, benzyl diethyl ketal ketal compounds such as -al, 2,2'-diethoxyacetophenone,
2,2'-dibutoxyacetophenone, 2-hydroxy-2-methylpropiophenone, pt-butyltrichloroacetophenone Acetophenone compounds such as pt-butyltrichloroacetophenone, thioxanthone 2-chlorothioxanthone, 2-methylthioxanthone , 2,4-dimethylthioxanthone, 2-ethylanthraquinone, 2-propylanthraquinone, and other thioxanthone compounds.
【0017】光重合開始剤に必要に応じて併用される熱
重合開始剤としては、例えばシクロヘキサノンパーオキ
サイド、3,3,5 −トリメチルシクロヘキサノンパ
ーオキサイド、メチロネキサノンパーオキサイド、 1
,1−ビス(t−ブチルパーオキシ)−3,3,5 −
トリメチルシクロヘキサン、クメンハイドロパーオキサ
イド、ジクミルパーオキサイド、ラウロイルパーオキサ
イド、3,5,5 −トリメチルヘキサノイルパーオキ
サイド、ベンゾイルパーオキサイド、ジ−ミリスチルパ
ーオキシジカーボネート、t−ブチルパーオキシ(2−
エチルヘキサノエート)、t−ブチルパーオキシ−3,
5,5 −トリメチルヘキサノエート、t−ブチルパー
オキシベンゾエート、クミルパーオキシオクトエートな
どの有機過酸化物が挙げられる。Examples of the thermal polymerization initiator used in combination with the photopolymerization initiator if necessary include cyclohexanone peroxide, 3,3,5-trimethylcyclohexanone peroxide, methylonexanone peroxide, 1
,1-bis(t-butylperoxy)-3,3,5-
Trimethylcyclohexane, cumene hydroperoxide, dicumyl peroxide, lauroyl peroxide, 3,5,5-trimethylhexanoyl peroxide, benzoyl peroxide, di-myristyl peroxydicarbonate, t-butyl peroxide (2-
ethylhexanoate), t-butylperoxy-3,
Examples include organic peroxides such as 5,5-trimethylhexanoate, t-butylperoxybenzoate, and cumylperoxyoctoate.
【0018】本発明では、上記活性エネルギ−線硬化性
成分と熱硬化性エポキシ樹脂組成物とを混合してエポキ
シ系樹脂組成物を調製する。次に熱硬化性エポキシ樹脂
組成物成分について説明する。In the present invention, an epoxy resin composition is prepared by mixing the active energy beam-curable component and a thermosetting epoxy resin composition. Next, the components of the thermosetting epoxy resin composition will be explained.
【0019】本発明で用いる組成物を調製する際に用い
ることのできるエポキシ樹脂としては、例えば上記のエ
ポキシビニルエステル樹脂の製造に用いることができる
エポキシ樹脂がそのまま使用できる。その際のエポキシ
樹脂としては、常温液状のもの、例えば平均エポキシ当
量が100〜400の液状エポキシ樹脂が好ましい。As the epoxy resin that can be used in preparing the composition used in the present invention, for example, the epoxy resin that can be used for producing the above-mentioned epoxy vinyl ester resin can be used as is. The epoxy resin used in this case is preferably one that is liquid at room temperature, for example, a liquid epoxy resin having an average epoxy equivalent of 100 to 400.
【0020】また、本発明に係るエポキシ系樹脂組成物
中のエポキシ樹脂を硬化させるための硬化剤としては、
例えば芳香族ポリアミンおよびその塩、多塩基酸無水物
、三フッ化ホウ素−アミン錯体、ジシアンジアミド、二
塩基酸ヒドラジド、ジアミノマレオニトリル、メラミン
、イミド等が挙げられるが、なかでも常温液状の多塩基
酸無水物が好ましい。 多塩基酸無水物として代表的な
ものを挙げれば、無水フタル酸、ヘキサヒドロ無水フタ
ル酸、テトラヒドロ無水フタル酸、メチルヘキサヒドロ
無水フタル酸、メチルテトラヒドロ無水フタル酸、無水
ナジック酸、無水メチルナジック酸、無水トリメリット
酸、無水ピロメリット酸、無水マレイン酸、無水コハク
酸、無水イタコン酸、無水シトラコン酸、ドデセニル無
水コハク酸、無水クロレンディック酸、無水ベンゾフェ
ノンテトラカルボン酸、無水シクロペンタテトラカルボ
ン酸、5−(2,5 −ジオキソテトラヒドロフリル)
−3−メチル−3−シクロヘキセン−1,2 −ジカル
ボン酸、エチレングリコールビストリメリテート無水物
又はグリセリントリメリテート無水物などがあり、これ
らは単独あるいは二種以上混合して用いる。なかでも好
ましいものとしては、液状の例えばメチルヘキサヒドロ
無水フタル酸、メチルテトラヒドロ無水フタル酸、無水
メチルナジック酸等が挙げられる。また、5−(2,5
−ジオキソテトラヒドロフリル)−3−メチル−3−
シクロヘキセン−1,2 −ジカルボン酸等の固形の酸
無水物を液状の酸無水物で溶解したものも好ましく用い
られる。[0020] Further, as a curing agent for curing the epoxy resin in the epoxy resin composition according to the present invention,
Examples include aromatic polyamines and their salts, polybasic acid anhydrides, boron trifluoride-amine complexes, dicyandiamide, dibasic acid hydrazides, diaminomaleonitrile, melamine, imides, etc. Among them, polybasic acids that are liquid at room temperature Anhydrides are preferred. Typical polybasic acid anhydrides include phthalic anhydride, hexahydrophthalic anhydride, tetrahydrophthalic anhydride, methylhexahydrophthalic anhydride, methyltetrahydrophthalic anhydride, nadic anhydride, methylnadic anhydride, Trimellitic anhydride, pyromellitic anhydride, maleic anhydride, succinic anhydride, itaconic anhydride, citraconic anhydride, dodecenylsuccinic anhydride, chlorendic anhydride, benzophenonetetracarboxylic anhydride, cyclopentatetracarboxylic anhydride, 5-(2,5-dioxotetrahydrofuryl)
Examples include -3-methyl-3-cyclohexene-1,2-dicarboxylic acid, ethylene glycol bistrimelitate anhydride, and glycerin trimellitate anhydride, and these may be used alone or in combination of two or more. Among these, preferred are liquid forms such as methylhexahydrophthalic anhydride, methyltetrahydrophthalic anhydride, and methylnadic anhydride. Also, 5-(2,5
-dioxotetrahydrofuryl)-3-methyl-3-
A solution obtained by dissolving a solid acid anhydride such as cyclohexene-1,2-dicarboxylic acid with a liquid acid anhydride is also preferably used.
【0021】エポキシ樹脂系組成物の硬化時に必要に応
じて用いられる硬化促進剤としては、例えばエチレンジ
アミン、ジエチレントリアミン、トリエチレンテトラミ
ン、テトラエチレンペンタミン、ジプロピレンジアミン
、ジエチルアミノプロピルアミン等の脂肪族アミン、メ
ンセンジアミン、イソフォロンジアミン、ビス(4−ア
ミノ−3−メチルシクロヘキシル)メタン、N−アミノ
エチルピペラジン等の脂環式アミン、メタキシレンジア
ミン、テトラクロロ−p−キシレンジアミン等の芳香環
を含む脂肪族アミン、メタフェニレンジアミン、ジアミ
ノジフェニルメタン、ジアミノジフェニルスルフォン、
ビスアミノメチルジフェニルメタン等の芳香族アミン、
2−メチルイミダゾール、2−エチル−4−メチルイミ
ダゾール、2−ウンデシルイミダゾール、2−ヘプタデ
シルイミダゾール、2−フェニルイミダゾール、1−ベ
ンジル−2−メチルイミダゾール、1−シアノエチル−
2−メチルイミダゾール、1−シアノエチル−2−エチ
ル−4−メチルイミダゾール等のイミダゾール化合物、
更には潜在性硬化促進剤等を挙げることができるが、本
発明のエポキシ樹脂組成物の貯蔵安定性を低下させない
点で潜在性硬化促進剤を用いることが特に望ましい。[0021] Examples of the curing accelerator used as necessary during curing of the epoxy resin composition include aliphatic amines such as ethylenediamine, diethylenetriamine, triethylenetetramine, tetraethylenepentamine, dipropylene diamine, and diethylaminopropylamine; Contains aromatic rings such as menthene diamine, isophorone diamine, bis(4-amino-3-methylcyclohexyl)methane, alicyclic amines such as N-aminoethylpiperazine, metaxylene diamine, tetrachloro-p-xylene diamine, etc. Aliphatic amine, metaphenylenediamine, diaminodiphenylmethane, diaminodiphenylsulfone,
Aromatic amines such as bisaminomethyldiphenylmethane,
2-Methylimidazole, 2-ethyl-4-methylimidazole, 2-undecylimidazole, 2-heptadecyl imidazole, 2-phenylimidazole, 1-benzyl-2-methylimidazole, 1-cyanoethyl-
imidazole compounds such as 2-methylimidazole and 1-cyanoethyl-2-ethyl-4-methylimidazole;
Further examples include latent curing accelerators, but it is particularly desirable to use latent curing accelerators in view of not reducing the storage stability of the epoxy resin composition of the present invention.
【0022】上記潜在性硬化促進剤としては、例えば、
■エポキシ樹脂とアミン系化合物を混合し、直ちに冷凍
して反応を停止させた冷凍型潜在性硬化促進剤、■アミ
ン系化合物をマイクロカプセル化したマイクロカプセル
型潜在性硬化促進剤、■モノキュラーシーブに化合物を
吸着させたモノキュラーシーブ型潜在性硬化促進剤、■
アミン系化合物とエポキシ基を有する化合物との付加物
をイソシアネート基を有する化合物で表面処理してなる
も潜在性硬化促進剤等が挙げられ、なかでも取扱いが容
易で作業性が高く、加熱時の硬化促進効果が適当で、物
性の低下がない点で上記■の潜在性硬化促進剤が特に好
ましい。[0022] Examples of the latent curing accelerator include:
■Frozen type latent curing accelerator made by mixing epoxy resin and amine compound and immediately freezing to stop the reaction, ■Microcapsule type latent curing accelerator made by microcapsulating amine compound, ■Monocular sieve. Monocular sieve type latent curing accelerator with compound adsorbed,■
Latent curing accelerators are made by surface-treating adducts of amine compounds and compounds with epoxy groups with compounds having isocyanate groups. The latent curing accelerator (2) above is particularly preferred since it has an appropriate curing accelerating effect and does not cause deterioration in physical properties.
【0023】上記■のアミン系化合物とエポキシ化合物
との付加物は、例えば従来公知の一般的方法で製造でき
る。アミン系化合物とエポキシ化合物との反応比は、ア
ミン系化合物の活性水素1個に対してエポキシ基の数が
1.0〜1.5個、好ましくは1.2〜1.4個となる
比率である。付加反応は無溶剤で行なってもよいが、適
当な溶剤にアミン系化合物を溶解し、エポキシ化合物を
滴下又は分割添加する方法等が通常用いられる。この際
に用いる溶剤としては、芳香族系溶剤、ケトン系溶剤が
好ましく、例えばトルエン、キシレン、メチルエチルケ
トン、メチルイソブチルケトン等が挙げられる。上記付
加反応を無溶剤系で行った場合は、得られた付加物を所
要の粒子サイズに粉砕して用いることが好ましい。また
上記付加反応を溶剤中で行った場合は、反応終了後、ス
プレードライ方式で噴霧乾燥する方法、溶剤を除去して
粉砕する方法等が採用できる。付加物の粒子径は、通常
30μm以下であり、なかでも0.1〜10μm、特に
1〜6μmであることが好ましい。付加物の粒子径が3
0μmを越えると分散性が劣る傾向がある。The above adduct of an amine compound and an epoxy compound can be produced, for example, by a conventionally known general method. The reaction ratio between the amine compound and the epoxy compound is such that the number of epoxy groups is 1.0 to 1.5, preferably 1.2 to 1.4 per active hydrogen of the amine compound. It is. Although the addition reaction may be carried out without a solvent, a method is usually used in which the amine compound is dissolved in a suitable solvent and the epoxy compound is added dropwise or in portions. The solvent used in this case is preferably an aromatic solvent or a ketone solvent, such as toluene, xylene, methyl ethyl ketone, methyl isobutyl ketone, and the like. When the above addition reaction is carried out in a solvent-free system, it is preferable to use the resulting adduct after pulverizing it to a desired particle size. Further, when the above addition reaction is carried out in a solvent, after the reaction is completed, a method of spray drying using a spray drying method, a method of removing the solvent and pulverizing, etc. can be adopted. The particle size of the adduct is usually 30 μm or less, preferably 0.1 to 10 μm, particularly 1 to 6 μm. The particle size of the adduct is 3
If it exceeds 0 μm, the dispersibility tends to be poor.
【0024】上記■の付加物を製造する際に用いること
のできるアミン系化合物としては、例えばエチレンジア
ミン、ジエチレントリアミン、トリエチレンテトラミン
、テトラエチレンペンタミン、ジプロピレンジアミン、
ジエチルアミノプロピルアミン等の脂肪族アミン、メン
センジアミン、イソフォロンジアミン、ビス(4−アミ
ノ−3−メチルシクロヘキシル)メタン、N−アミノエ
チルピペラジン等の脂環式アミン、メタキシレンジアミ
ン、テトラクロロ−p−キシレンジアミン等の芳香環を
含む脂肪族アミン、メタフェニレンジアミン、ジアミノ
ジフェニルメタン、ジアミノジフェニルスルフォン、ビ
スアミノメチルジフェニルメタン等の芳香族アミン、2
−メチルイミダゾール、2−エチル−4−メチルイミダ
ゾール、2−ウンデシルイミダゾール、2−ヘプタデシ
ルイミダゾール、2−フェニルイミダゾール、1−ベン
ジル−2−メチルイミダゾール、1−シアノエチル−2
−メチルイミダゾール、1−シアノエチル−2−エチル
−4−メチルイミダゾール等のイミダゾール化合物など
が挙げられる。[0024] Examples of amine compounds that can be used in the production of the adduct (2) above include ethylenediamine, diethylenetriamine, triethylenetetramine, tetraethylenepentamine, dipropylenediamine,
Aliphatic amines such as diethylaminopropylamine, menzendiamine, isophorone diamine, bis(4-amino-3-methylcyclohexyl)methane, alicyclic amines such as N-aminoethylpiperazine, metaxylene diamine, tetrachloro-p - Aliphatic amines containing aromatic rings such as xylene diamine, aromatic amines such as metaphenylene diamine, diaminodiphenylmethane, diaminodiphenylsulfone, bisaminomethyldiphenylmethane, 2
-Methylimidazole, 2-ethyl-4-methylimidazole, 2-undecylimidazole, 2-heptadecylimidazole, 2-phenylimidazole, 1-benzyl-2-methylimidazole, 1-cyanoethyl-2
Examples include imidazole compounds such as -methylimidazole and 1-cyanoethyl-2-ethyl-4-methylimidazole.
【0025】また、付加物を製造する際に用いることの
できるエポキシ基を有する化合物としては、エポキシ基
を1個以上有する化合物がいずれも使用でき、例えば脂
肪族グリシジルエーテル、芳香族グリシジルエーテル、
グリシジルアルキレート等のモノエポキシ化合物、前記
エポキシビニルエステル樹脂を製造する際に用いること
ができるエポキシ樹脂等が挙げられ、なかでも無溶剤液
状又は固型のエポキシ樹脂が好ましい。Further, as the compound having an epoxy group that can be used in producing the adduct, any compound having one or more epoxy groups can be used, such as aliphatic glycidyl ether, aromatic glycidyl ether,
Examples include monoepoxy compounds such as glycidyl alkylate, epoxy resins that can be used in producing the epoxy vinyl ester resin, and solvent-free liquid or solid epoxy resins are particularly preferred.
【0026】上記アミン系化合物とエポキシ化合物との
付加物をイソシアネート基を有する化合物で表面処理す
る方法は、特に限定されないが、例えば粉末状の上記付
加物を溶解しない溶剤、例えばトルエン、キシレン、ア
セトン、メチルエチルケトン等に、まず所定量のイソシ
アネート基を有する化合物を溶解させ、次いで上記粉末
状の付加物をこの中に分散させ、表面処理して、溶剤を
飛散、乾燥する方法等が挙げられる。イソシアネート基
を有する化合物の使用量は、上記付加物100重量部に
対し通常0.5〜20重量部、好ましくは1.0〜10
重量部である。The method for surface treating the adduct of the amine compound and epoxy compound with a compound having an isocyanate group is not particularly limited, but for example, a solvent that does not dissolve the adduct in powder form, such as toluene, xylene, acetone, etc. Examples include a method of first dissolving a predetermined amount of a compound having an isocyanate group in methyl ethyl ketone or the like, then dispersing the powdered adduct therein, subjecting the surface to treatment, scattering the solvent, and drying. The amount of the compound having an isocyanate group used is usually 0.5 to 20 parts by weight, preferably 1.0 to 10 parts by weight, per 100 parts by weight of the above adduct.
Parts by weight.
【0027】上記付加物の表面を処理するのに使用でき
るイソシアネート基を有する化合物としては、例えば芳
香族又は脂肪族モノイソシアネート、芳香族又は脂肪族
ポリイソシアネート、ポリオールとポリイソシアネート
の付加物であるポリイソシアネート、ポリイソシアネー
トと水との反応で得られるビューレット型ポリイソシア
ネート、環化重合型ポリイソシアネート等が挙げられ、
具体的にはフェニルイソシアネート、トリルイソシアネ
ート等のモノイソシアネート化合物、テトラメチレンジ
イソシアネート、ヘキサメチレンジイソシアネート、ト
リレンジイソシアネート、キシリレンジイソシアネート
、ジフェニルメタンジイソシアネート、イソプロピリデ
ンシクロヘキシルイソシアネート、リジンイソシアネー
ト、トリレンジイソシアネートとトリメチロールプロパ
ンの付加物、トリレンジイソシアネートとペンタエリス
リトールの付加物、トリレンジイソシアネートとポリエ
チレングリコールの付加物、トリレンジイソシアネート
とポリプロピレングリコールの付加物、ヘキサメチレン
ジイソシアネートとポリエチレンアジペートのプレポリ
マー等のポリイソシアネート化合物等が挙げられる。
なかでも芳香族又は脂肪族ポリイソシアネートおよびポ
リオールとポリイソシアネートの付加物であるポリイソ
シアネートが好ましい。Examples of compounds having isocyanate groups that can be used to treat the surface of the adduct include aromatic or aliphatic monoisocyanates, aromatic or aliphatic polyisocyanates, and polysaccharides which are adducts of polyols and polyisocyanates. Examples include isocyanate, biuret type polyisocyanate obtained by reaction of polyisocyanate and water, cyclopolymerization type polyisocyanate, etc.
Specifically, monoisocyanate compounds such as phenyl isocyanate and tolyl isocyanate, tetramethylene diisocyanate, hexamethylene diisocyanate, tolylene diisocyanate, xylylene diisocyanate, diphenylmethane diisocyanate, isopropylidenecyclohexyl isocyanate, lysine isocyanate, tolylene diisocyanate and trimethylolpropane. Polyisocyanate compounds such as adducts, adducts of tolylene diisocyanate and pentaerythritol, adducts of tolylene diisocyanate and polyethylene glycol, adducts of tolylene diisocyanate and polypropylene glycol, prepolymers of hexamethylene diisocyanate and polyethylene adipate, etc. It will be done. Among these, aromatic or aliphatic polyisocyanates and polyisocyanates which are adducts of polyols and polyisocyanates are preferred.
【0028】本発明にかかる組成物には必要に応じて、
充填剤を加えることができる。この際に用いる充填剤と
しては、例えば水酸化アルミニウム、ケイ酸アルミニウ
ム、コロイダルシリカ、炭酸カルシウム、硫酸カルシウ
ム、マイカ、タルク、二酸化チタン、石英粉末、ケイ酸
ジルコニウム、ガラス粉末、アスベスト粉末、ケイ藻土
、三酸化アンチモンなどが挙げられる。[0028] The composition according to the present invention may optionally contain:
Fillers can be added. Examples of fillers used in this case include aluminum hydroxide, aluminum silicate, colloidal silica, calcium carbonate, calcium sulfate, mica, talc, titanium dioxide, quartz powder, zirconium silicate, glass powder, asbestos powder, diatomaceous earth. , antimony trioxide, etc.
【0029】本発明で用いられる組成物は、活性エネル
ギー線硬化性成分とそれを硬化させるために必要に応じ
て用いられる光開始剤と、エポキシ樹脂とその硬化剤と
必要に応じて用いられる硬化促進剤とから構成されるが
、その必須成分たる活性エネルギー線硬化性成分とエポ
キシ樹脂成分とエポキシ樹脂の硬化剤成分との合計重量
中の活性エネルギ−線硬化性成分の含有量は、通常2〜
80重量%であり、金属箔との接着力に優れる点で、3
〜50%であることが好ましい。The composition used in the present invention comprises an active energy ray-curable component, a photoinitiator used as necessary to cure the component, an epoxy resin, a curing agent thereof, and a curing agent used as necessary. The content of the active energy ray curable component in the total weight of the active energy ray curable component, the epoxy resin component, and the epoxy resin curing agent component, which are essential components, is usually 2. ~
80% by weight, and has excellent adhesive strength with metal foil.
It is preferable that it is 50%.
【0030】エポキシ系樹脂組成物を得るに際しての各
成分の配合方法および配合順序は特に限定されるもので
はないが、液状成分を混合した後、固型の成分を粉末状
で添加して、分解又は溶解させる方法が好ましい。[0030] The method and order of blending each component to obtain an epoxy resin composition are not particularly limited, but after mixing the liquid components, solid components are added in powder form and decomposed. Alternatively, a method of dissolving is preferred.
【0031】次に上記エポキシ系樹脂組成物を繊維質基
材に含浸して含浸繊維質基材を作成する。上記含浸繊維
質基材は、活性エネルギー線を透過する必要がある。本
発明で用いる上記繊維質基材は、上記本発明にかかるエ
ポキシ系樹脂組成物を含浸した後活性エネルギー線を透
過するものが好ましい。この様な繊維質基材として代表
的なものを挙げれば、ガラス繊維、炭素繊維または芳香
族ポリアミド系繊維などであり、なかでもガラス繊維が
好ましい。これらのうちガラス繊維としては、その原料
面から、E−グラス、C−グラス、A−グラスおよびS
−グラスなどが存在しているが、本発明においてはいず
れの種類のものも適用できる。これらの繊維質基材は、
その形状によりロービング、チョップドストランドマッ
ト、コンティニアスマット、クロス、不織布、ロービン
グクロス、サーフェシングマットおよびチョップドスト
ランドがあるが、上掲した如き種類や形状は、目的とす
る成形物の用途および性能により適宜選択されるもので
あって、必要によっては二以上の種類または形状からの
混合使用であってもよい。なかでもクロス、不織布が好
ましい。Next, a fibrous base material is impregnated with the above epoxy resin composition to prepare an impregnated fibrous base material. The impregnated fibrous base material needs to transmit active energy rays. The fibrous base material used in the present invention is preferably one that transmits active energy rays after being impregnated with the epoxy resin composition according to the present invention. Typical examples of such fibrous base materials include glass fibers, carbon fibers, and aromatic polyamide fibers, of which glass fibers are preferred. Among these, glass fibers include E-glass, C-glass, A-glass, and S-glass in terms of their raw materials.
- Although there are glasses, any type can be applied in the present invention. These fibrous base materials are
Depending on the shape, there are rovings, chopped strand mats, continuous mats, cloths, non-woven fabrics, roving cloths, surfacing mats, and chopped strands, but the types and shapes listed above are selected as appropriate depending on the intended use and performance of the molded product. If necessary, two or more types or shapes may be used in combination. Among them, cloth and nonwoven fabric are preferred.
【0032】本発明の予備硬化方法は、上記含浸繊維質
基材中の活性エネルギ−線硬化性成分を活性エネルギー
線照射により予備硬化するものであり、含浸繊維質基材
或いはこれを複数枚積層した積層体の片面を金属箔(1
)で覆ってから、この金属箔の反対面から活性エネルギ
ー線を照射して予備硬化する。The precuring method of the present invention is to precure the active energy ray-curable component in the impregnated fibrous base material by irradiation with active energy rays. One side of the laminate was covered with metal foil (1
) and then pre-cure by irradiating active energy rays from the opposite side of this metal foil.
【0033】この際に用いることができる金属箔(1)
としては、例えば金箔、銀箔、銅箔、アルミニウム箔等
の金属箔が挙げられる。この様に金属箔(1)の反対面
から活性エネルギー線を照射して予備硬化を行うと、活
性エネルギー線照射表面(即ち含浸繊維質基材或いはそ
の積層体の表面)のみならず、活性エネルギー線が含浸
繊維質基材或いはその積層体の内部まで透過して、金属
箔と含浸繊維質基材或いはその積層体の接着部近傍、驚
くべきことにさらに含浸繊維質基材或いはその積層体の
厚みの中心部分までも、全体をムラ無く均一に予備硬化
を行うことができる。Metal foil (1) that can be used in this case
Examples include metal foils such as gold foil, silver foil, copper foil, and aluminum foil. When preliminary curing is performed by irradiating active energy rays from the opposite side of the metal foil (1) in this way, not only the active energy ray irradiated surface (i.e. the surface of the impregnated fibrous base material or its laminate) but also the active energy The wire penetrates into the interior of the impregnated fibrous base material or the laminate thereof, near the bonding area between the metal foil and the impregnated fibrous base material or the laminate thereof, and surprisingly, further penetrates into the impregnated fibrous base material or the laminate thereof. Precuring can be performed evenly and uniformly throughout the entire thickness, even at the center of the thickness.
【0034】活性エネルギー線の照射量は、特に制限さ
れるものではなく、用いる活性エネルギー線の種類、予
備硬化のための時間により適当な条件を選択すればよい
が、紫外線の場合は、通常2000〜20000mJ/
cmのエネルギー量の照射を行えばよい。The amount of active energy ray irradiation is not particularly limited and may be selected depending on the type of active energy ray used and the time for preliminary curing, but in the case of ultraviolet rays, usually 2000 ~20000mJ/
It is sufficient to perform irradiation with an energy amount of cm.
【0035】この活性エネルギー線の照射は、金属箔(
1)の反対面の含浸繊維質基材が露出している状態で行
ってもよいし、金属箔(1)の反対面の含浸繊維質基材
を予め活性エネルギー線透過性フイルム(2)で覆って
、そのフィルム(2)上から行ってもよい。[0035] This active energy ray irradiation is applied to metal foil (
This may be carried out with the impregnated fibrous base material on the opposite side of 1) exposed, or the impregnated fibrous base material on the opposite side of the metal foil (1) may be coated with active energy ray transparent film (2) in advance. You may also cover the film (2) and perform the process from above.
【0036】活性エネルギー線透過性フィルム(2)と
しては、例えばポリエチレン、ポリプロピレン、ポリエ
ステル、ポリイミド、ポリフッ化エチレン系フィルム等
のプラスチックフィルムが挙げられる。Examples of the active energy ray transparent film (2) include plastic films such as polyethylene, polypropylene, polyester, polyimide, and polyfluoroethylene films.
【0037】エネルギー線硬化性成分のうち、活性エネ
ルギー線照射時に未硬化の部分は次の加熱工程で熱硬化
させることが可能である。予備硬化後の予備硬化繊維質
基材或いは積層体の加熱硬化方法は、特に制限されるも
のではなく、公知慣用の方法がいずれも採用できる。加
熱硬化方法は、例えば連続加熱炉内で無圧下で行なわれ
ても良いし、連続ダブルベルトプレスで、連続的に加熱
加圧成形されても良いが、積層板の表面平滑性の点から
加熱加圧成形の方が好ましい。また、予備硬化後の積層
体を裁断し、バッチワイズで加熱加圧成形されても良い
。加熱硬化は通常、130〜190℃で行なわれる。
加熱加圧成形の場合は、通常5〜40kg/cm2の圧
力下で行なわれる。[0037] Of the energy ray-curable components, the uncured portions upon irradiation with active energy rays can be thermally cured in the next heating step. The method of heating and curing the precured fibrous base material or laminate after precuring is not particularly limited, and any known and commonly used method can be employed. The heat curing method may be carried out under no pressure in a continuous heating furnace, or may be continuously heated and pressed in a continuous double belt press, but from the viewpoint of surface smoothness of the laminate, heating is Pressure molding is preferred. Alternatively, the pre-cured laminate may be cut and subjected to batchwise heating and pressure molding. Heat curing is usually performed at 130 to 190°C. In the case of hot pressure molding, it is usually carried out under a pressure of 5 to 40 kg/cm2.
【0038】本発明のエポキシ系樹脂組成物を用いて、
積層板を得る方法としては、例えば、■繊維質基材にエ
ポキシ系樹脂組成物を含浸させ、単独または所定枚数重
ね合せたものの下面を金属箔(1)で覆い搬送しながら
上面から空気中または窒素等の不活性ガス中で活性エネ
ルギー線を照射して予備硬化し、次いでその上面を活性
エネルギー線透過性でもそうでなくともよいフィルムで
被覆し、次いで加熱硬化させた後、該フィルムを剥離す
る片面金属箔張積層板の製造方法、■繊維質基材にエポ
キシ系樹脂組成物を含浸させ、単独または所定枚数重ね
合せたものの下面を金属箔(1)で覆い、上面を活性エ
ネルギー線透過性フィルム(2)で覆い、搬送しながら
上面から活性エネルギー線を照射して予備硬化し、次い
で加熱硬化させた後、上面のフィルム(2)を剥離する
片面金属箔張積層板の製造方法、■繊維質基材にエポキ
シ系樹脂組成物を含浸させ、単独または所定枚数重ね合
せたものの下面を金属箔(1)で覆い搬送しながら上面
から空気中または窒素等の不活性ガス中で活性エネルギ
ー線を照射して予備硬化し、次いでその上面を金属箔(
1)で覆い、次いで加熱硬化させる両面金属箔張積層板
の製造方法、■繊維質基材にエポキシ系樹脂組成物を含
浸させ、単独または所定枚数重ね合せたものの下面を金
属箔(1)で覆い、上面を活性エネルギー線透過性フィ
ルム(2)で覆い、搬送しながら上面から活性エネルギ
ー線を照射して予備硬化し、該フィルム(2)を剥離し
、次いでその上面を金属箔(1)で覆い、さらに加熱硬
化させる両面金属箔張積層板の製造方法、等が挙げられ
る。[0038] Using the epoxy resin composition of the present invention,
As a method for obtaining a laminate, for example, (1) a fibrous base material is impregnated with an epoxy resin composition, the lower surface of the fibrous base material alone or a predetermined number of laminated sheets is covered with metal foil (1), and the upper surface is exposed to air or air while being transported. Precure by irradiation with active energy rays in an inert gas such as nitrogen, then cover the top surface with a film that may or may not be transparent to active energy rays, then heat cure and peel off the film. Method for producing a single-sided metal foil-clad laminate, ■ Impregnating a fibrous base material with an epoxy resin composition, covering the lower surface of the single or predetermined number of laminated sheets with metal foil (1), and transmitting active energy rays to the upper surface. A method for manufacturing a single-sided metal foil-clad laminate, which comprises covering the sheet with a plastic film (2), pre-curing it by irradiating active energy rays from the top surface while transporting it, then curing it by heating, and then peeling off the top film (2); ■A fibrous base material is impregnated with an epoxy resin composition, and the bottom surface of the material is covered with metal foil (1) either alone or in a predetermined number of layers, and activated energy is applied from the top surface in the air or inert gas such as nitrogen while transporting the material. Pre-cure by irradiating the wire, then cover the top surface with metal foil (
Method for manufacturing a double-sided metal foil-clad laminate, covered with 1) and then heated and cured; Cover the upper surface with an active energy ray-transparent film (2), irradiate active energy rays from the upper surface to pre-cure while transporting, peel off the film (2), and then cover the upper surface with a metal foil (1). For example, a method for manufacturing a double-sided metal foil-clad laminate in which the metal foil is covered with a metal foil and further heat-cured is used.
【0039】上記■及び■に示した様に、加熱硬化後に
活性エネルギー線透過性でもそうでなくともよいフィル
ムを剥離すると、予備硬化後直ちに該フィルムを剥離す
る場合の様に予備硬化繊維質基材或いは積層体に歪みが
発生するとか、剥離される該フィルムに樹脂が多量に付
着し、予備硬化繊維質基材或いは積層体表面近傍の樹脂
が少なくなるという問題が生じないので好ましい。As shown in (1) and (2) above, when the film, which may or may not be transparent to active energy rays, is peeled off after being heated and cured, the pre-cured fibrous base is peeled off immediately after being pre-cured. This is preferable because it does not cause problems such as distortion of the material or the laminate, a large amount of resin adhering to the peeled film, and a decrease in the amount of resin near the surface of the pre-cured fibrous base material or the laminate.
【0040】上記■の製造方法のほうが、■の製造方法
に比べて、予備硬化繊維質基材或いは積層体に歪みが発
生するとか、剥離される該フィルムに樹脂が多量に付着
し、予備硬化繊維質基材或いは積層体表面近傍の樹脂が
少なくなるという問題が生じないので好ましい。Compared to the manufacturing method (2), the above manufacturing method (2) may cause distortion in the pre-cured fibrous base material or laminate, or a large amount of resin may adhere to the film to be peeled off, causing the pre-curing to be difficult. This is preferable because there is no problem that the amount of resin near the surface of the fibrous base material or the laminate decreases.
【0041】[0041]
【実施例】次に本発明を製造例、実施例および比較例を
挙げ更に具体的に説明する。尚、例中の部および%は特
に断りのない限りはすべて重量基準である。
実施例1
ビスフェノールAとエピクロルヒドリンとの反応により
得られたエポキシ当量190なるエポキシ樹脂18.2
部、テトラブロモビスフェノールAとエピクロルヒドリ
ンとの反応により得られたエポキシ当量370のエポキ
シ樹脂22.8部、メチルヘキサヒドロ無水フタル酸2
5.2部、テトラブロモビスフェノールAとエピクロル
ヒドリンとの反応により得られたエポキシ当両370な
るエポキシ樹脂のメタアクリレート(60%)とスチレ
ンモノマー(40%)とよりナルエポキシビニルエステ
ル樹脂溶液28.0部、1−ヒドロキシシクロヘキシル
フェニルケトン0.3部、ベンゾイルパーオキシド0.
56部、スチレンモノマー4.8部および2−エチル−
4−メチルイミダゾ−ル0.28部混合して液状エポキ
シ樹脂組成物(I−1)を調製した。[Examples] Next, the present invention will be explained in more detail with reference to production examples, working examples, and comparative examples. In addition, all parts and percentages in the examples are based on weight unless otherwise specified. Example 1 Epoxy resin with an epoxy equivalent of 190 obtained by reaction of bisphenol A and epichlorohydrin 18.2
1 part, 22.8 parts of an epoxy resin with an epoxy equivalent of 370 obtained by the reaction of tetrabromobisphenol A and epichlorohydrin, 2 parts of methylhexahydrophthalic anhydride
5.2 parts of epoxy resin obtained by the reaction of tetrabromobisphenol A and epichlorohydrin 370 epoxy resin methacrylate (60%) and styrene monomer (40%) to prepare a solution of epoxy vinyl ester resin 28.0% parts, 0.3 parts of 1-hydroxycyclohexylphenyl ketone, 0.3 parts of benzoyl peroxide.
56 parts, 4.8 parts of styrene monomer and 2-ethyl-
A liquid epoxy resin composition (I-1) was prepared by mixing 0.28 part of 4-methylimidazole.
【0042】次いで、直ちにこのエポキシ樹脂組成物(
I−1)を厚さ0.18mm、幅1050mmの長尺の
ガラスクロスに該エポキシ樹脂組成物の含有率が43%
になる様に含浸せしめ、これを4枚重ね合せ、下面に厚
さ35μmの銅箔を重ね合せた後、上面より空気雰囲気
下、水銀ランプ(80W/cm)で紫外線を6000m
J/cmとなるように照射しながら搬送して積層体を予
備硬化させた。[0042] Then, immediately this epoxy resin composition (
I-1) was added to a long glass cloth with a thickness of 0.18 mm and a width of 1050 mm, and the content of the epoxy resin composition was 43%.
After layering 4 of these sheets and layering a 35 μm thick copper foil on the bottom surface, the top surface was exposed to ultraviolet rays at 6000 m using a mercury lamp (80 W/cm) in an air atmosphere.
The laminate was precured by transporting it while irradiating it at a rate of J/cm.
【0043】この予備硬化積層体の一部を試料として切
りとり、それから第1層(銅箔と接触した層)と第4層
(最外層、即ち紫外線照射を行った層)を剥離して、そ
れぞれの層のガラスクロスからテトラヒドロフランで樹
脂を抽出し、液体クロマトグラフ(日本分析工業株式会
社製LC−08)で分析したところ、エポキシビニルエ
ステル樹脂の反応率はそれぞれ60%であった。A part of this pre-cured laminate was cut out as a sample, and then the first layer (the layer in contact with the copper foil) and the fourth layer (the outermost layer, that is, the layer exposed to ultraviolet rays) were peeled off. When the resin was extracted from the glass cloth layer with tetrahydrofuran and analyzed using a liquid chromatograph (LC-08 manufactured by Nippon Analytical Industry Co., Ltd.), the reaction rate of each epoxy vinyl ester resin was 60%.
【0044】次いで上記試料を採取したあとの残った予
備硬化積層体の上面に厚さ35μm銅箔を重ね合せ、1
70℃に加熱されたダブルベルトプレス機で20kg/
cm2の圧力で10分間加熱加圧成形した後、1000
mm×1000mmに裁断し、次いで170℃で50分
間後硬化して、厚さ0.8mmの両面銅張積層板を20
枚得た。Next, a 35 μm thick copper foil was superimposed on the upper surface of the pre-cured laminate that remained after the sample was collected, and
20kg/double belt press machine heated to 70℃
After heating and pressure molding for 10 minutes at a pressure of cm2, 1000
mm x 1000 mm, and then post-cured at 170°C for 50 minutes to form a double-sided copper-clad laminate with a thickness of 0.8 mm.
I got one.
【0045】得られた20枚の積層板(II−1)を用
い、以下の様にして積層板の表面平滑性、成形時の樹脂
流出量、吸水率およびハンダ耐熱性について測定したと
ころ、バラツキの少ない良好な結果が得られた。結果を
第1表に示す。
・表面平滑性:目視で積層板表面上の微細波打ち発生状
況を判定した。
・樹脂流出量(%)=(W0 −W1)/W0 ×10
0 にて算出し、平均値で示した。(ただし、W0 は
エポキシ樹脂組成物含有率43%、寸法1000mm×
1000mmの樹脂含浸基材4枚の重量、W1 は加熱
加圧成形して得た寸法1000mm×1000mmの積
層板から銅箔重量を差し引いた重量である。)
・吸水率(%):25mm×25mmに切断した積層板
の片面の銅箔をエッチングで除去した後、120℃、2
気圧の条件で4時間プレッシャークッカーテストを行い
、次式に基いて吸水率を算出し、平均値で示した。
W′−W
吸水率(%)=−−−−−×100
W(ただしWはテスト前の積層板重量、W′はテスト後
の積層板重量である。)・ハンダ耐熱性:上記プレッシ
ャークッカーテスト後の積層板の表面の水分をよく拭き
取った後、JIS C−6481に準じて測定し、以下
の基準で評価した。
○:ハンダ耐熱性不良の試料全くなし。
△:ハンダ耐熱性不良の試料1/4未満あり。
×:ハンダ耐熱性不良の試料1/4以上あり。
実施例2
実施例1の予備硬化積層体上面に貼合わせる銅箔の代わ
りに25μm 厚PETフィルムで上面を被覆し、且つ
加熱硬化後上記の25μm 厚PETフィルムを剥離し
た以外は実施例1と同様にして厚さ0.8mmの片面銅
張積層板を20枚得た。Using the obtained 20 laminates (II-1), the surface smoothness of the laminate, the amount of resin flowing out during molding, the water absorption rate, and the solder heat resistance were measured as follows. Good results were obtained with a small amount of The results are shown in Table 1.・Surface smoothness: The occurrence of fine waviness on the surface of the laminate was visually determined.・Resin flow rate (%) = (W0 - W1)/W0 ×10
It was calculated at 0 and shown as an average value. (However, W0 has an epoxy resin composition content of 43%, dimensions of 1000 mm x
The weight of four resin-impregnated substrates of 1000 mm, W1, is the weight obtained by subtracting the weight of the copper foil from a laminate with dimensions of 1000 mm x 1000 mm obtained by heat-pressure molding. ) ・Water absorption rate (%): After removing the copper foil on one side of the laminated board cut into 25 mm x 25 mm by etching, it was heated at 120°C for 2
A pressure cooker test was conducted for 4 hours under atmospheric pressure conditions, and the water absorption rate was calculated based on the following formula, and the average value was shown. W'-W Water absorption rate (%) = ------- x 100 W (W is the weight of the laminate before the test, W' is the weight of the laminate after the test.) Solder heat resistance: Pressure cooker above After thoroughly wiping off moisture on the surface of the laminate after the test, it was measured according to JIS C-6481 and evaluated using the following criteria. ○: No samples with poor solder heat resistance. △: Less than 1/4 of the samples had poor solder heat resistance. ×: More than 1/4 of the samples had poor solder heat resistance. Example 2 Same as Example 1 except that the upper surface of the pre-cured laminate of Example 1 was covered with a 25 μm thick PET film instead of the copper foil laminated on the upper surface, and the 25 μm thick PET film was peeled off after heat curing. 20 single-sided copper-clad laminates each having a thickness of 0.8 mm were obtained.
【0046】PETフィルムで被覆をする前の予備硬化
積層体から試料を採取して、実施例1と同様にして、予
備硬化積層体の第1層と第4層についてエポキシビニル
エステル樹脂の反応率を調べたところ、それらの反応率
はいずれも60%であった。A sample was taken from the pre-cured laminate before being coated with PET film, and the reaction rate of the epoxy vinyl ester resin was measured for the first and fourth layers of the pre-cured laminate in the same manner as in Example 1. When investigated, the reaction rates were all 60%.
【0047】残りの予備硬化積層体を用いて実施例1と
同様の条件で加熱硬化を行った。結果を第1表に示す。
実施例3
実施例1の予備硬化積層体上面に貼合わせる銅箔の代わ
りに25μm 厚PETフィルムを用い、かつ上面を活
性エネルギ−線照射前にそのPETフィルムで被覆し、
次いで予備硬化させ、且つ加熱硬化後上記の25μm
厚PETフィルムを剥離した以外は、実施例1と同様に
して厚さ0.8mmの片面銅張積層板を20枚得た。[0047] The remaining pre-cured laminate was heat-cured under the same conditions as in Example 1. The results are shown in Table 1. Example 3 A 25 μm thick PET film was used instead of the copper foil laminated on the top surface of the pre-cured laminate in Example 1, and the top surface was covered with the PET film before irradiation with active energy rays.
Next, pre-cure, and after heat curing the above 25 μm
Twenty single-sided copper-clad laminates each having a thickness of 0.8 mm were obtained in the same manner as in Example 1, except that the thick PET film was peeled off.
【0048】予備硬化終了後に予備硬化積層体からPE
Tフィルムを剥離して、それから試料を採取する以外は
、実施例1と同様にして予備硬化積層体の第1層(銅箔
と接触している層)と第4層(PETフィルムと接触し
ている層)についてエポキシビニルエステル樹脂の反応
率を調べたところ、それらの反応率はいずれも60%で
あった。残りの予備硬化積層体を用いて実施例1と同様
の条件で加熱硬化を行った。結果を第1表に示す。
実施例4
実施例1のガラスクロスに該エポキシ樹脂組成物の含有
率が43%になる様に含浸せしめ、これを6枚重ね合せ
た以外は、実施例1と同様にして厚さ1.6mmの両面
銅張積層板を20枚得た。After the completion of pre-curing, PE is removed from the pre-cured laminate.
The first layer (the layer in contact with the copper foil) and the fourth layer (the layer in contact with the PET film) of the pre-cured laminate were prepared in the same manner as in Example 1, except that the T film was peeled off and a sample was taken from it. When the reaction rates of the epoxy vinyl ester resins were investigated for the layer containing the epoxy resin, the reaction rates were all 60%. Heat curing was performed under the same conditions as in Example 1 using the remaining pre-cured laminate. The results are shown in Table 1. Example 4 A glass cloth with a thickness of 1.6 mm was prepared in the same manner as in Example 1, except that the glass cloth of Example 1 was impregnated with the epoxy resin composition to a content of 43%, and 6 sheets of this were stacked on top of each other. 20 double-sided copper-clad laminates were obtained.
【0049】この予備硬化積層体の一部を試料として切
りとり、それから第1層(銅箔と接触した層)と第6層
(最外層、即ち紫外線照射を行った層)を剥離して、そ
れぞれの層のガラスクロスからテトラヒドロフランで樹
脂を抽出し、液体クロマトグラフ(日本分析工業株式会
社製LC−08)で分析したところ、第1層のエポキシ
ビニルエステル樹脂の反応率は60%で、第6層のそれ
が62%であった。
比較例1
実施例1のエポキシ樹脂組成物(I−1)を厚さ0.1
8mm、幅1050mmの長尺のガラスクロスに該エポ
キシ樹脂組成物の含有率が43%になる様に含浸せしこ
れを4枚重ね合せ、下面に厚さ35μmの銅箔を重ね合
せた後、110℃で4分積層体を予備硬化した。A part of this pre-cured laminate was cut out as a sample, and then the first layer (the layer in contact with the copper foil) and the sixth layer (the outermost layer, that is, the layer exposed to ultraviolet rays) were peeled off. When the resin was extracted from the glass cloth in the first layer with tetrahydrofuran and analyzed using a liquid chromatograph (LC-08 manufactured by Nippon Analytical Industry Co., Ltd.), the reaction rate of the epoxy vinyl ester resin in the first layer was 60%, and the reaction rate of the epoxy vinyl ester resin in the first layer was 60%. That of the layer was 62%. Comparative Example 1 The epoxy resin composition (I-1) of Example 1 was
A long glass cloth measuring 8 mm and width 1050 mm was impregnated with the epoxy resin composition so that the content was 43%, and four sheets were stacked together, and a copper foil with a thickness of 35 μm was stacked on the bottom surface. The laminate was precured at 110° C. for 4 minutes.
【0050】この予備硬化積層体には、銅箔に微細な波
打ちがあった。次いで上記試料を採取したあとの残った
予備硬化積層体の上面に厚さ35μm銅箔を重ね合せ、
170℃に加熱されたダブルベルトプレス機で20kg
/cm2の圧力で10分間加熱加圧成形した後、100
0mm×1000mmに裁断し、次いで170℃で50
分間後硬化して、厚さ0.8mmの両面銅張積層板を2
0枚得た。[0050] This pre-cured laminate had fine undulations in the copper foil. Next, a 35 μm thick copper foil was superimposed on the upper surface of the pre-cured laminate that remained after collecting the sample,
20kg in a double belt press heated to 170℃
After heating and pressure molding at a pressure of /cm2 for 10 minutes,
Cut into 0mm x 1000mm, then heat at 170℃ for 50 minutes.
After curing for 2 minutes, the double-sided copper clad laminate with a thickness of 0.8 mm was
I got 0 pieces.
【0051】予備硬化をする前から積層体を覆っていた
積層体の銅箔の波打ちの程度は予備硬化直後よりも著し
く目立つようになった。結果を第1表に示す。The degree of waviness in the copper foil of the laminate that had covered the laminate before pre-curing became more noticeable than immediately after pre-curing. The results are shown in Table 1.
【0052】[0052]
【表1】[Table 1]
【0053】[0053]
【発明の効果】本発明では、含浸繊維質基材或いはその
積層体の片面を金属箔で覆い、その金属箔の反対面から
活性エネルギー線を照射するので、活性エネルギー線の
照射装置は片面から照射する装置とすることができ、照
射エネルギー量も少なくすることができ、かつ積層体の
全体に亘って均一に片寄り無く、かつ必要充分にそれ予
備硬化することができるという格別顕著な効果を奏する
。[Effects of the Invention] In the present invention, one side of the impregnated fibrous base material or its laminate is covered with metal foil, and active energy rays are irradiated from the opposite side of the metal foil, so the active energy ray irradiation device is used to irradiate the active energy rays from one side. It has the particularly remarkable effect of being able to be used as an irradiation device, reducing the amount of irradiation energy, and being able to pre-cure the laminate uniformly and sufficiently without any deviation over the entire laminate. play.
【0054】しかも、予備硬化を活性エネルギー線で行
っているので、金属箔に波打ち現象も起こらない。Moreover, since the preliminary curing is performed using active energy rays, no waving phenomenon occurs in the metal foil.
Claims (7)
るエポキシ系樹脂組成物を含浸した活性エネルギー線透
過性含浸繊維質基材またはこれを複数枚積層してなる活
性エネルギー線透過性含浸繊維質積層体の片面を金属箔
(1)で覆い、次いで金属箔(1)の反対側から該基材
または積層体に活性エネルギー線を照射して予備硬化さ
せ、次いで加熱硬化させることを特徴とする金属箔張積
層板の製造方法。Claim 1: An active energy ray permeable impregnated fibrous base material impregnated with an epoxy resin composition containing an active energy ray curable component, or an active energy ray permeable impregnated fibrous material obtained by laminating a plurality of sheets thereof. It is characterized by covering one side of the laminate with metal foil (1), then irradiating the base material or the laminate with active energy rays from the opposite side of the metal foil (1) to pre-cure it, and then heating and curing it. A method for manufacturing metal foil-clad laminates.
1)の反対側の基材または積層体面を活性エネルギー線
透過性フィルム(2)で覆っておく請求項1記載の製造
方法。Claim 2: At any stage before pre-curing, metal foil (
2. The manufacturing method according to claim 1, wherein the base material or the laminate surface opposite to step 1) is covered with an active energy ray-transparent film (2).
項1又は2記載の製造方法。3. The manufacturing method according to claim 1 or 2, wherein the active energy rays are ultraviolet rays.
不飽和基を有する樹脂である請求項1、2又は3記載の
製造方法。4. The method according to claim 1, wherein the active energy beam-curable component is a resin having a polymerizable unsaturated group.
−線硬化性成分と酸無水物硬化型エポキシ樹脂とからな
る樹脂組成物である請求項1、2、3又は4記載の製造
方法。5. The method according to claim 1, wherein the epoxy resin composition is a resin composition comprising an active energy beam-curable component and an acid anhydride-curable epoxy resin.
び/またはガラスペ−パ−である請求項1、2、3、4
又は5記載の製造方法。6. Claims 1, 2, 3, 4, wherein the fibrous base material is a long glass cloth and/or glass paper.
or the manufacturing method described in 5.
るエポキシ系樹脂組成物を含浸した活性エネルギー線透
過性含浸繊維質基材またはこれを複数枚積層してなる活
性エネルギー線透過性含浸繊維質積層体の片面を金属箔
(1)で覆い、次いで金属箔(1)の反対側から該基材
または積層体に活性エネルギー線を照射することを特徴
とする含浸繊維質積層体の予備硬化方法。7. An active energy ray permeable impregnated fibrous base material impregnated with an epoxy resin composition containing an active energy ray curable component, or an active energy ray permeable impregnated fibrous material obtained by laminating a plurality of sheets thereof. A method for pre-curing an impregnated fibrous laminate, which comprises covering one side of the laminate with a metal foil (1), and then irradiating the base material or the laminate with active energy rays from the opposite side of the metal foil (1). .
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP3098564A JPH04329130A (en) | 1991-04-30 | 1991-04-30 | Preparation of laminated sheet and precuring method |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP3098564A JPH04329130A (en) | 1991-04-30 | 1991-04-30 | Preparation of laminated sheet and precuring method |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH04329130A true JPH04329130A (en) | 1992-11-17 |
Family
ID=14223178
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP3098564A Pending JPH04329130A (en) | 1991-04-30 | 1991-04-30 | Preparation of laminated sheet and precuring method |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH04329130A (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2000026577A (en) * | 1998-07-14 | 2000-01-25 | Three Bond Co Ltd | Ultraviolet-curing flame retarded resin |
-
1991
- 1991-04-30 JP JP3098564A patent/JPH04329130A/en active Pending
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2000026577A (en) * | 1998-07-14 | 2000-01-25 | Three Bond Co Ltd | Ultraviolet-curing flame retarded resin |
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