JPH04328893A - Manufacture of electric circuit molded piece - Google Patents
Manufacture of electric circuit molded pieceInfo
- Publication number
- JPH04328893A JPH04328893A JP12492491A JP12492491A JPH04328893A JP H04328893 A JPH04328893 A JP H04328893A JP 12492491 A JP12492491 A JP 12492491A JP 12492491 A JP12492491 A JP 12492491A JP H04328893 A JPH04328893 A JP H04328893A
- Authority
- JP
- Japan
- Prior art keywords
- electric circuit
- gate
- molded
- synthetic resin
- molded piece
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000004519 manufacturing process Methods 0.000 title claims description 9
- 229920003002 synthetic resin Polymers 0.000 claims abstract description 14
- 239000000057 synthetic resin Substances 0.000 claims abstract description 14
- 239000011342 resin composition Substances 0.000 claims abstract description 13
- 238000000034 method Methods 0.000 claims abstract description 11
- 238000000465 moulding Methods 0.000 claims abstract description 10
- 229920005989 resin Polymers 0.000 claims description 3
- 239000011347 resin Substances 0.000 claims description 3
- 238000002347 injection Methods 0.000 claims description 2
- 239000007924 injection Substances 0.000 claims description 2
- 239000002184 metal Substances 0.000 abstract description 11
- 239000011231 conductive filler Substances 0.000 abstract description 10
- 230000002159 abnormal effect Effects 0.000 abstract description 6
- 230000020169 heat generation Effects 0.000 description 4
- 229920005990 polystyrene resin Polymers 0.000 description 3
- 229920005992 thermoplastic resin Polymers 0.000 description 3
- 239000000835 fiber Substances 0.000 description 2
- 238000002844 melting Methods 0.000 description 2
- 229920000914 Metallic fiber Polymers 0.000 description 1
- 239000004677 Nylon Substances 0.000 description 1
- 239000004721 Polyphenylene oxide Substances 0.000 description 1
- 239000006229 carbon black Substances 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 230000000052 comparative effect Effects 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000010790 dilution Methods 0.000 description 1
- 239000012895 dilution Substances 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000001747 exhibiting effect Effects 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 229920001778 nylon Polymers 0.000 description 1
- 239000008188 pellet Substances 0.000 description 1
- 229920006380 polyphenylene oxide Polymers 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
Abstract
Description
【0001】0001
【産業上の利用分野】本発明は、導電性の優れた電気回
路成形品の製造方法に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method of manufacturing an electrical circuit molded product having excellent conductivity.
【0002】0002
【従来の技術】従来、電気回路を形成した成形品は、生
産性や構造面から、合成樹脂成形体の例えば凹部に導電
性樹脂組成物を二重成形して電気回路と絶縁基体とを一
体化する方法が有効であり、実用化されている。[Prior Art] Conventionally, from the viewpoint of productivity and structure, molded products on which electric circuits are formed are made by double-molding a conductive resin composition, for example, in the recesses of synthetic resin moldings, to integrate the electric circuit and the insulating substrate. This method is effective and has been put into practical use.
【0003】すなわち、従来の電気回路成形品は、図5
に示したように、合成樹脂成形体20の凹部に、導電性
樹脂組成物を用いて電気回路21を二重成形する場合、
普通は電気回路21上にそのゲート22を設けてその電
気回路21を成形し、電気回路の両端にインサート成形
した金属端子23,23′によって通電している。That is, the conventional electric circuit molded product is as shown in FIG.
As shown in FIG.
Usually, the electric circuit 21 is molded with the gate 22 provided on the electric circuit 21, and current is supplied through metal terminals 23, 23' insert-molded at both ends of the electric circuit.
【0004】しかしながら、上記したような従来の電気
回路成形品では、導電性樹脂組成物中の導電性繊維や金
属粉末、カーボンブラック等の導電性フイラーがその配
向によってゲート22付近で希薄になる傾向がある。そ
のため、電気回路21に電流を流した場合、導電性フイ
ラーの希薄部分ではその他の部分に比べて導電性が悪く
なる欠点がある。その導電性の悪い部分では電気抵抗に
より発熱量が大きくなり回路の断線や成形品の変形を引
きおこしやすいという欠点があった。However, in the conventional electric circuit molded product as described above, the conductive filler such as conductive fibers, metal powder, and carbon black in the conductive resin composition tends to become diluted near the gate 22 due to its orientation. There is. Therefore, when a current is passed through the electric circuit 21, there is a drawback that the thin portion of the conductive filler has poor conductivity compared to other portions. The disadvantage is that the portions with poor conductivity generate a large amount of heat due to electrical resistance, which tends to cause circuit breakage and deformation of the molded product.
【0005】[0005]
【発明が解決しようとする課題】本発明は、上記の欠点
を解消するためになされたもので、導電性に優れ、異状
発熱、それにより生ずる電気回路の断線や成形品の変形
のない、しかも生産性のよい電気回路成形品の製造方法
を提供することを目的としている。SUMMARY OF THE INVENTION The present invention has been made to solve the above-mentioned drawbacks, and has excellent conductivity, and is free from abnormal heat generation, resulting in disconnection of electrical circuits, and deformation of molded products. The purpose of this invention is to provide a highly productive method for manufacturing electrical circuit molded products.
【0006】[0006]
【課題を解決するための手段】本発明者らは、上記の目
的を達成しようと導電性フイラーの配向状態と導電性の
関係に着目して鋭意研究を重ねた結果、適切なゲート位
置を工夫すれば、導電性フイラーの希薄部分のない、導
電性に優れた電気回路成形品が得られることを見いだし
、本発明を完成したものである。[Means for Solving the Problems] In order to achieve the above object, the present inventors have conducted extensive research focusing on the relationship between the orientation state of the conductive filler and the conductivity, and have devised an appropriate gate position. It was discovered that by doing so, it was possible to obtain an electrical circuit molded product with excellent conductivity without a thin portion of the conductive filler, and thus completed the present invention.
【0007】すなわち、本発明は、合成樹脂成形体に導
電性樹脂組成物を二重成形して電気回路を形成する電気
回路成形品の製造方法において、上記導電性樹脂組成物
を成形するゲートの注入箇所を電気回路の外にかつ有効
な間隔を隔てて成形することを特徴とする電気回路成形
品の製造方法である。That is, the present invention provides a method for manufacturing an electric circuit molded article in which an electric circuit is formed by double-molding a conductive resin composition on a synthetic resin molded article, in which a gate for molding the conductive resin composition is formed. This is a method for manufacturing an electric circuit molded product, characterized in that the injection site is molded outside the electric circuit and at an effective interval.
【0008】本発明に用いる導電性樹脂組成物としては
、金属性繊維と低融点金属からなる導電性フイラーの表
面に熱可塑性樹脂を被覆形成し、ペレット状に切断して
なるものを使用するのが好ましい。この組成物を使用す
ることによって、成形品とした場合に金属繊維と金属繊
維とが低融点金属によって融着結合されて優れた導電性
を示し、特に経時変化においても導電性の低下を少なく
することができるのである。The conductive resin composition used in the present invention is prepared by coating the surface of a conductive filler made of metallic fibers and a low-melting point metal with a thermoplastic resin, and cutting it into pellets. is preferred. By using this composition, when made into a molded product, the metal fibers are fused and bonded by a low melting point metal, exhibiting excellent electrical conductivity, and reducing the decrease in electrical conductivity, especially when changing over time. It is possible.
【0009】合成樹脂成形品中の導電性フイラーの配向
状態を確認するために以下の実験を行った。すなわち、
導電性樹脂組成物エミクリアEC−2300H(東芝ケ
ミカル社製、商品名)を用い、図1に示したような 1
50× 3× 4mmの導電性成形品をその長手方向中
央にゲート1を置いて成形し、ゲート1を中心にして成
形品を左右 7ブロックずつ均等にブロック分けし(1
ブロック10mm)、各々を切り離して、図示のとお
りのブロック番号を付した。この各ブロック番号のもの
について体積抵抗率(Ω・cm)を測定したところ、図
2に示したようにゲート部に近いブロック番号のものほ
ど、体積抵抗率が大きいという結果が得られた。The following experiment was conducted to confirm the orientation of the conductive filler in the synthetic resin molded article. That is,
1 as shown in FIG.
A 50 x 3 x 4 mm conductive molded product was molded with gate 1 placed in the center in the longitudinal direction, and the molded product was equally divided into 7 blocks on each side with gate 1 at the center (1
Each block (10 mm) was separated and numbered as shown in the figure. When the volume resistivity (Ω·cm) of each block number was measured, it was found that, as shown in FIG. 2, the closer the block number to the gate portion, the higher the volume resistivity.
【0010】すなわち、導電性フイラーは、ゲート部で
は希薄となり、導電性が悪化することが判った。従って
、この導電性樹脂組成物を用いて電気回路を有する合成
樹脂成形品を得る場合には、電気回路上ではなく電気回
路の外にゲート部を設けることが重要である。もちろん
、電気回路にはそれぞれ所望の抵抗値とその許容範囲が
あるのであるから、電気回路とゲート位置との間隔はそ
れぞれに応じて決定すればよい。[0010] That is, it has been found that the conductive filler becomes thinner in the gate portion, and the conductivity deteriorates. Therefore, when obtaining a synthetic resin molded article having an electric circuit using this conductive resin composition, it is important to provide a gate portion outside the electric circuit rather than on the electric circuit. Of course, each electric circuit has a desired resistance value and its tolerance range, so the distance between the electric circuit and the gate position may be determined depending on each electric circuit.
【0011】次に図面を参照して本発明を説明する。Next, the present invention will be explained with reference to the drawings.
【0012】図3のように合成樹脂を用いて、後に電気
回路を形成する凹部3と電気回路の外のゲート位置に対
応する凹部3aを有する合成樹脂成形体2を成形する。
ここで用いる合成樹脂としては、ポリスチレン樹脂、A
BS樹脂、ポリフェニレンオキサイド樹脂、ナイロン等
の熱可塑性樹脂が多くの場合用いられるが、特に熱可塑
性樹脂に限定されるものでもない。As shown in FIG. 3, a synthetic resin molded body 2 having a recess 3 in which an electric circuit will later be formed and a recess 3a corresponding to a gate position outside the electric circuit is molded using a synthetic resin. The synthetic resins used here include polystyrene resin, A
Thermoplastic resins such as BS resin, polyphenylene oxide resin, and nylon are often used, but they are not particularly limited to thermoplastic resins.
【0013】次に、図4に示すように、図3の合成樹脂
成形体2の凹部3に導電性樹脂組成物を用いて電気回路
4を二次成形をするが、電気回路の外の凹部3aに向け
てゲート1が設けられるので、ゲート1から電気回路4
まで電気回路としては実質関わりのない盲腸部分4a
が付属する。この成形の際に、金属端子5,5′を電気
回路4の両端に配置してインサート成形して電気回路成
形品6を製造することができる。ゲート1の位置は、電
気回路4上でなければいづれでもよく、特に限定される
ものではない。Next, as shown in FIG. 4, an electrical circuit 4 is second-molded using a conductive resin composition in the recess 3 of the synthetic resin molded body 2 shown in FIG. Since the gate 1 is provided facing 3a, the electric circuit 4 is connected from the gate 1
The cecal part 4a is virtually unrelated to the electrical circuit.
is included. During this molding, the electric circuit molded product 6 can be manufactured by placing the metal terminals 5, 5' at both ends of the electric circuit 4 and performing insert molding. The position of the gate 1 may be anywhere as long as it is not on the electric circuit 4, and is not particularly limited.
【0014】[0014]
【作用】本発明の電気回路成形品の製造方法によって優
れた導電性を有する電気回路成形品を製造することがで
きる。すなわち、ゲート部分が、電気回路と外れて、か
つ離れているため、ゲート部分における導電性フイラー
の希薄の影響を電気回路が直接受けることがなくなる。
従って、不均一な電気抵抗による異常発熱もなく、その
後の断線や成形品の変形もなくなる。[Function] By the method of manufacturing an electric circuit molded article of the present invention, an electric circuit molded article having excellent conductivity can be manufactured. That is, since the gate portion is separated from and separated from the electric circuit, the electric circuit is not directly affected by the dilution of the conductive filler in the gate portion. Therefore, there is no abnormal heat generation due to non-uniform electrical resistance, and there is no subsequent disconnection or deformation of the molded product.
【0015】[0015]
【実施例】次に本発明を実施例によって説明する。EXAMPLES Next, the present invention will be explained by examples.
【0016】実施例
凹状の電気回路形成部を有するポリスチレン樹脂成形品
をつくり、次いで導電性樹脂組成物エミクリヤ(東芝ケ
ミカル社製、商品名)を用いて凹状の電気回路形成部の
外にゲートを設けて電気回路を形成する。また電気回路
を形成すると同時に 2本の金属端子を電気回路の両端
に配置してインサート成形して図4に示した電気回路成
形品を製造した。得られた電気回路成形品の金属端子間
に 5Aの電流を加えて電気回路の温度を測定したが雰
囲気温度(25℃)と同じで異常発熱は全く見られなか
った。EXAMPLE A polystyrene resin molded product having a concave electric circuit forming part was made, and then a gate was formed outside the concave electric circuit forming part using the conductive resin composition Emiclear (manufactured by Toshiba Chemical Co., Ltd., trade name). to form an electrical circuit. Further, at the same time as forming the electric circuit, two metal terminals were placed at both ends of the electric circuit and insert molding was performed to produce the electric circuit molded product shown in FIG. 4. The temperature of the electrical circuit was measured by applying a current of 5 A between the metal terminals of the obtained electrical circuit molded product, and it was the same as the ambient temperature (25° C.), and no abnormal heat generation was observed.
【0017】比較例
凹状の電気回路形成部を有するポリスチレン樹脂成形品
をつくり、次いで導電性樹脂組成物エミクリヤ(東芝ケ
ミカル社製、商品名)を用いて、図5に示したように電
気回路上にゲートを設けて電気回路を形成すると同時に
、 2本の金属端子を電気回路の両端に配置してインサ
ート成形し、電気回路成形品を製造した。この成形品を
用いて実施例と同様にして電気回路の温度を測定したと
ころ雰囲気温度(25℃)より31℃昇温して56℃ま
で発熱していた。Comparative Example A polystyrene resin molded product having a concave electrical circuit forming part was made, and then a conductive resin composition Emi-Clya (manufactured by Toshiba Chemical Co., Ltd., trade name) was used to form an electrical circuit on the electrical circuit as shown in FIG. At the same time, two metal terminals were placed at both ends of the electric circuit and insert molding was performed to produce an electric circuit molded product. When the temperature of the electric circuit was measured using this molded article in the same manner as in the example, it was found to generate heat to 56°C, an increase of 31°C from the ambient temperature (25°C).
【0018】[0018]
【発明の効果】以上の説明から明らかなように、本発明
の電気回路成形品の製造方法によれば、導電性に優れ、
大電流による異常発熱やその後の断線や成形品の変形等
がなく、かつ生産性のよい電気回路成形品が得られる。[Effects of the Invention] As is clear from the above explanation, according to the method for manufacturing an electric circuit molded product of the present invention, it has excellent conductivity,
An electrical circuit molded product with good productivity can be obtained without abnormal heat generation due to large current, subsequent disconnection, or deformation of the molded product.
【図1】導電性フイラーの分布状態を測定するためのテ
ストピース成形品の平面図である。FIG. 1 is a plan view of a test piece molded product for measuring the distribution state of a conductive filler.
【図2】図1の成形品における各ブロックの体積抵抗率
を示す曲線図である。2 is a curve diagram showing the volume resistivity of each block in the molded product of FIG. 1. FIG.
【図3】本発明方法に用いられる合成樹脂成形体の1例
を示す斜視図である。FIG. 3 is a perspective view showing an example of a synthetic resin molded article used in the method of the present invention.
【図4】本発明方法によって得られる電気回路成形品の
1例を示す斜視図である。FIG. 4 is a perspective view showing an example of an electric circuit molded product obtained by the method of the present invention.
【図5】従来の電気回路成形品を示す斜視図である。FIG. 5 is a perspective view showing a conventional electric circuit molded product.
1,22 ゲート 2,20 合成樹脂成形体 3 凹部 4,21 電気回路 5,5′,23,23′ 金属端子 6 電気回路成形品 1,22 Gate 2,20 Synthetic resin molded body 3 Recessed part 4,21 Electric circuit 5, 5', 23, 23' Metal terminal 6 Electric circuit molded products
Claims (1)
二重成形して電気回路を形成する電気回路成形品の製造
方法において、上記導電性樹脂組成物を成形するゲート
の注入箇所を電気回路の外にかつ有効な間隔を隔てて成
形することを特徴とする電気回路成形品の製造方法。Claim 1. A method for manufacturing an electric circuit molded article, in which an electric circuit is formed by double-molding a conductive resin composition on a synthetic resin molded article, in which an electrically conductive resin is applied to the injection point of a gate where the conductive resin composition is molded. A method for manufacturing an electric circuit molded product, characterized in that the molded product is molded outside the circuit at an effective interval.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP12492491A JPH04328893A (en) | 1991-04-26 | 1991-04-26 | Manufacture of electric circuit molded piece |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP12492491A JPH04328893A (en) | 1991-04-26 | 1991-04-26 | Manufacture of electric circuit molded piece |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH04328893A true JPH04328893A (en) | 1992-11-17 |
Family
ID=14897522
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP12492491A Pending JPH04328893A (en) | 1991-04-26 | 1991-04-26 | Manufacture of electric circuit molded piece |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH04328893A (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2015095562A (en) * | 2013-11-12 | 2015-05-18 | 日本メクトロン株式会社 | Filling method of conductive paste, and manufacturing method of multilayer printed wiring board |
JPWO2016021618A1 (en) * | 2014-08-05 | 2017-06-01 | 株式会社江東彫刻 | Wiring circuit component manufacturing method, mold for manufacturing wiring circuit component, resin wiring circuit component |
-
1991
- 1991-04-26 JP JP12492491A patent/JPH04328893A/en active Pending
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2015095562A (en) * | 2013-11-12 | 2015-05-18 | 日本メクトロン株式会社 | Filling method of conductive paste, and manufacturing method of multilayer printed wiring board |
JPWO2016021618A1 (en) * | 2014-08-05 | 2017-06-01 | 株式会社江東彫刻 | Wiring circuit component manufacturing method, mold for manufacturing wiring circuit component, resin wiring circuit component |
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