JPH04327909A - Thermoplastic resin chip and compound chip - Google Patents
Thermoplastic resin chip and compound chipInfo
- Publication number
- JPH04327909A JPH04327909A JP12280791A JP12280791A JPH04327909A JP H04327909 A JPH04327909 A JP H04327909A JP 12280791 A JP12280791 A JP 12280791A JP 12280791 A JP12280791 A JP 12280791A JP H04327909 A JPH04327909 A JP H04327909A
- Authority
- JP
- Japan
- Prior art keywords
- chip
- thermoplastic resin
- resin
- chips
- blended
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 150000001875 compounds Chemical class 0.000 title claims abstract description 18
- 229920005992 thermoplastic resin Polymers 0.000 title claims abstract description 17
- 239000000654 additive Substances 0.000 claims abstract description 21
- 239000000203 mixture Substances 0.000 claims abstract description 17
- 238000002156 mixing Methods 0.000 claims description 11
- 229920005989 resin Polymers 0.000 abstract description 36
- 239000011347 resin Substances 0.000 abstract description 36
- -1 polyethylene Polymers 0.000 abstract description 33
- 239000003921 oil Substances 0.000 abstract description 11
- 239000004743 Polypropylene Substances 0.000 abstract description 9
- 229920001155 polypropylene Polymers 0.000 abstract description 9
- 239000004698 Polyethylene Substances 0.000 abstract description 6
- 229920000573 polyethylene Polymers 0.000 abstract description 6
- 239000003795 chemical substances by application Substances 0.000 abstract description 5
- 238000004519 manufacturing process Methods 0.000 abstract description 5
- 239000004611 light stabiliser Substances 0.000 abstract description 4
- 239000006096 absorbing agent Substances 0.000 abstract description 3
- 229910052751 metal Inorganic materials 0.000 abstract description 3
- 239000002184 metal Substances 0.000 abstract description 3
- 239000004952 Polyamide Substances 0.000 abstract description 2
- 229920000122 acrylonitrile butadiene styrene Polymers 0.000 abstract description 2
- 230000000996 additive effect Effects 0.000 abstract description 2
- 229920002647 polyamide Polymers 0.000 abstract description 2
- 229920002545 silicone oil Polymers 0.000 abstract description 2
- 239000003112 inhibitor Substances 0.000 abstract 1
- 230000003647 oxidation Effects 0.000 abstract 1
- 238000007254 oxidation reaction Methods 0.000 abstract 1
- 239000012188 paraffin wax Substances 0.000 abstract 1
- 238000005259 measurement Methods 0.000 description 14
- 239000000945 filler Substances 0.000 description 12
- 239000008188 pellet Substances 0.000 description 12
- 239000000126 substance Substances 0.000 description 12
- 238000002441 X-ray diffraction Methods 0.000 description 9
- 238000001746 injection moulding Methods 0.000 description 8
- 230000000052 comparative effect Effects 0.000 description 7
- 239000006185 dispersion Substances 0.000 description 7
- 239000004594 Masterbatch (MB) Substances 0.000 description 6
- 238000000034 method Methods 0.000 description 6
- 238000000465 moulding Methods 0.000 description 6
- 239000000049 pigment Substances 0.000 description 6
- 238000013329 compounding Methods 0.000 description 5
- 238000010586 diagram Methods 0.000 description 5
- 235000014113 dietary fatty acids Nutrition 0.000 description 5
- 150000002148 esters Chemical class 0.000 description 5
- 239000000194 fatty acid Substances 0.000 description 5
- 229930195729 fatty acid Natural products 0.000 description 5
- 150000004665 fatty acids Chemical class 0.000 description 5
- QZCLKYGREBVARF-UHFFFAOYSA-N Acetyl tributyl citrate Chemical compound CCCCOC(=O)CC(C(=O)OCCCC)(OC(C)=O)CC(=O)OCCCC QZCLKYGREBVARF-UHFFFAOYSA-N 0.000 description 4
- VTYYLEPIZMXCLO-UHFFFAOYSA-L Calcium carbonate Chemical compound [Ca+2].[O-]C([O-])=O VTYYLEPIZMXCLO-UHFFFAOYSA-L 0.000 description 4
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 4
- 238000005453 pelletization Methods 0.000 description 4
- GVJHHUAWPYXKBD-UHFFFAOYSA-N (±)-α-Tocopherol Chemical compound OC1=C(C)C(C)=C2OC(CCCC(C)CCCC(C)CCCC(C)C)(C)CCC2=C1C GVJHHUAWPYXKBD-UHFFFAOYSA-N 0.000 description 3
- JKIJEFPNVSHHEI-UHFFFAOYSA-N Phenol, 2,4-bis(1,1-dimethylethyl)-, phosphite (3:1) Chemical compound CC(C)(C)C1=CC(C(C)(C)C)=CC=C1OP(OC=1C(=CC(=CC=1)C(C)(C)C)C(C)(C)C)OC1=CC=C(C(C)(C)C)C=C1C(C)(C)C JKIJEFPNVSHHEI-UHFFFAOYSA-N 0.000 description 3
- 239000004793 Polystyrene Substances 0.000 description 3
- 239000003963 antioxidant agent Substances 0.000 description 3
- 235000006708 antioxidants Nutrition 0.000 description 3
- 239000002216 antistatic agent Substances 0.000 description 3
- SAOKZLXYCUGLFA-UHFFFAOYSA-N bis(2-ethylhexyl) adipate Chemical compound CCCCC(CC)COC(=O)CCCCC(=O)OCC(CC)CCCC SAOKZLXYCUGLFA-UHFFFAOYSA-N 0.000 description 3
- BJQHLKABXJIVAM-UHFFFAOYSA-N bis(2-ethylhexyl) phthalate Chemical compound CCCCC(CC)COC(=O)C1=CC=CC=C1C(=O)OCC(CC)CCCC BJQHLKABXJIVAM-UHFFFAOYSA-N 0.000 description 3
- 239000008395 clarifying agent Substances 0.000 description 3
- 229920001577 copolymer Polymers 0.000 description 3
- 239000002270 dispersing agent Substances 0.000 description 3
- 238000001125 extrusion Methods 0.000 description 3
- 239000000314 lubricant Substances 0.000 description 3
- 239000006078 metal deactivator Substances 0.000 description 3
- 239000002667 nucleating agent Substances 0.000 description 3
- 150000001451 organic peroxides Chemical class 0.000 description 3
- 229920001083 polybutene Polymers 0.000 description 3
- 229920002223 polystyrene Polymers 0.000 description 3
- 150000003839 salts Chemical class 0.000 description 3
- 239000000454 talc Substances 0.000 description 3
- 229910052623 talc Inorganic materials 0.000 description 3
- 239000001993 wax Substances 0.000 description 3
- VBICKXHEKHSIBG-UHFFFAOYSA-N 1-monostearoylglycerol Chemical compound CCCCCCCCCCCCCCCCCC(=O)OCC(O)CO VBICKXHEKHSIBG-UHFFFAOYSA-N 0.000 description 2
- FBPFZTCFMRRESA-FSIIMWSLSA-N D-Glucitol Natural products OC[C@H](O)[C@H](O)[C@@H](O)[C@H](O)CO FBPFZTCFMRRESA-FSIIMWSLSA-N 0.000 description 2
- MQIUGAXCHLFZKX-UHFFFAOYSA-N Di-n-octyl phthalate Natural products CCCCCCCCOC(=O)C1=CC=CC=C1C(=O)OCCCCCCCC MQIUGAXCHLFZKX-UHFFFAOYSA-N 0.000 description 2
- ZVFDTKUVRCTHQE-UHFFFAOYSA-N Diisodecyl phthalate Chemical compound CC(C)CCCCCCCOC(=O)C1=CC=CC=C1C(=O)OCCCCCCCC(C)C ZVFDTKUVRCTHQE-UHFFFAOYSA-N 0.000 description 2
- OAKJQQAXSVQMHS-UHFFFAOYSA-N Hydrazine Chemical compound NN OAKJQQAXSVQMHS-UHFFFAOYSA-N 0.000 description 2
- OWYWGLHRNBIFJP-UHFFFAOYSA-N Ipazine Chemical compound CCN(CC)C1=NC(Cl)=NC(NC(C)C)=N1 OWYWGLHRNBIFJP-UHFFFAOYSA-N 0.000 description 2
- UQSXHKLRYXJYBZ-UHFFFAOYSA-N Iron oxide Chemical compound [Fe]=O UQSXHKLRYXJYBZ-UHFFFAOYSA-N 0.000 description 2
- CSNNHWWHGAXBCP-UHFFFAOYSA-L Magnesium sulfate Chemical compound [Mg+2].[O-][S+2]([O-])([O-])[O-] CSNNHWWHGAXBCP-UHFFFAOYSA-L 0.000 description 2
- 229920011250 Polypropylene Block Copolymer Polymers 0.000 description 2
- XBDQKXXYIPTUBI-UHFFFAOYSA-M Propionate Chemical compound CCC([O-])=O XBDQKXXYIPTUBI-UHFFFAOYSA-M 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 2
- XLOMVQKBTHCTTD-UHFFFAOYSA-N Zinc monoxide Chemical compound [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 description 2
- 239000002253 acid Substances 0.000 description 2
- 150000001412 amines Chemical class 0.000 description 2
- 238000004458 analytical method Methods 0.000 description 2
- ADCOVFLJGNWWNZ-UHFFFAOYSA-N antimony trioxide Chemical compound O=[Sb]O[Sb]=O ADCOVFLJGNWWNZ-UHFFFAOYSA-N 0.000 description 2
- 229910000019 calcium carbonate Inorganic materials 0.000 description 2
- FIASKJZPIYCESA-UHFFFAOYSA-L calcium;octacosanoate Chemical compound [Ca+2].CCCCCCCCCCCCCCCCCCCCCCCCCCCC([O-])=O.CCCCCCCCCCCCCCCCCCCCCCCCCCCC([O-])=O FIASKJZPIYCESA-UHFFFAOYSA-L 0.000 description 2
- VJHINFRRDQUWOJ-UHFFFAOYSA-N dioctyl sebacate Chemical compound CCCCC(CC)COC(=O)CCCCCCCCC(=O)OCC(CC)CCCC VJHINFRRDQUWOJ-UHFFFAOYSA-N 0.000 description 2
- DMBHHRLKUKUOEG-UHFFFAOYSA-N diphenylamine Chemical compound C=1C=CC=CC=1NC1=CC=CC=C1 DMBHHRLKUKUOEG-UHFFFAOYSA-N 0.000 description 2
- UKMSUNONTOPOIO-UHFFFAOYSA-N docosanoic acid Chemical compound CCCCCCCCCCCCCCCCCCCCCC(O)=O UKMSUNONTOPOIO-UHFFFAOYSA-N 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000003063 flame retardant Substances 0.000 description 2
- 229910052736 halogen Inorganic materials 0.000 description 2
- 125000001841 imino group Chemical group [H]N=* 0.000 description 2
- 238000002347 injection Methods 0.000 description 2
- 239000007924 injection Substances 0.000 description 2
- 239000011256 inorganic filler Substances 0.000 description 2
- 229910003475 inorganic filler Inorganic materials 0.000 description 2
- 229940057995 liquid paraffin Drugs 0.000 description 2
- 229910052759 nickel Inorganic materials 0.000 description 2
- XKIVKIIBCJIWNU-UHFFFAOYSA-N o-[3-pentadecanethioyloxy-2,2-bis(pentadecanethioyloxymethyl)propyl] pentadecanethioate Chemical compound CCCCCCCCCCCCCCC(=S)OCC(COC(=S)CCCCCCCCCCCCCC)(COC(=S)CCCCCCCCCCCCCC)COC(=S)CCCCCCCCCCCCCC XKIVKIIBCJIWNU-UHFFFAOYSA-N 0.000 description 2
- GLDOVTGHNKAZLK-UHFFFAOYSA-N octadecan-1-ol Chemical compound CCCCCCCCCCCCCCCCCCO GLDOVTGHNKAZLK-UHFFFAOYSA-N 0.000 description 2
- DXGLGDHPHMLXJC-UHFFFAOYSA-N oxybenzone Chemical compound OC1=CC(OC)=CC=C1C(=O)C1=CC=CC=C1 DXGLGDHPHMLXJC-UHFFFAOYSA-N 0.000 description 2
- 229910052698 phosphorus Inorganic materials 0.000 description 2
- 239000011574 phosphorus Substances 0.000 description 2
- 229920000642 polymer Polymers 0.000 description 2
- 239000000843 powder Substances 0.000 description 2
- 239000000600 sorbitol Substances 0.000 description 2
- 239000003381 stabilizer Substances 0.000 description 2
- 125000000999 tert-butyl group Chemical group [H]C([H])([H])C(*)(C([H])([H])[H])C([H])([H])[H] 0.000 description 2
- OGIDPMRJRNCKJF-UHFFFAOYSA-N titanium oxide Inorganic materials [Ti]=O OGIDPMRJRNCKJF-UHFFFAOYSA-N 0.000 description 2
- JNXDCMUUZNIWPQ-UHFFFAOYSA-N trioctyl benzene-1,2,4-tricarboxylate Chemical compound CCCCCCCCOC(=O)C1=CC=C(C(=O)OCCCCCCCC)C(C(=O)OCCCCCCCC)=C1 JNXDCMUUZNIWPQ-UHFFFAOYSA-N 0.000 description 2
- HZVFRKSYUGFFEJ-YVECIDJPSA-N (2r,3r,4s,5r)-7-phenylhept-6-ene-1,2,3,4,5,6-hexol Chemical compound OC[C@@H](O)[C@@H](O)[C@H](O)[C@@H](O)C(O)=CC1=CC=CC=C1 HZVFRKSYUGFFEJ-YVECIDJPSA-N 0.000 description 1
- CHJJYTIOLUWORE-UHFFFAOYSA-N (3,5-ditert-butyl-4-hydroxyphenyl)methyl dihydrogen phosphate Chemical compound CC(C)(C)C1=CC(COP(O)(O)=O)=CC(C(C)(C)C)=C1O CHJJYTIOLUWORE-UHFFFAOYSA-N 0.000 description 1
- ABFCPWCUXLLRSC-UHFFFAOYSA-N 1,1-bis(2,4-ditert-butylphenyl)-2,2-bis(hydroxymethyl)propane-1,3-diol Chemical compound C(C)(C)(C)C1=C(C=CC(=C1)C(C)(C)C)C(O)(C(CO)(CO)CO)C1=C(C=C(C=C1)C(C)(C)C)C(C)(C)C ABFCPWCUXLLRSC-UHFFFAOYSA-N 0.000 description 1
- LXIZRZRTWSDLKK-UHFFFAOYSA-N 1,3-dibromo-5-[2-[3,5-dibromo-4-(2,3-dibromopropoxy)phenyl]propan-2-yl]-2-(2,3-dibromopropoxy)benzene Chemical compound C=1C(Br)=C(OCC(Br)CBr)C(Br)=CC=1C(C)(C)C1=CC(Br)=C(OCC(Br)CBr)C(Br)=C1 LXIZRZRTWSDLKK-UHFFFAOYSA-N 0.000 description 1
- LDVVTQMJQSCDMK-UHFFFAOYSA-N 1,3-dihydroxypropan-2-yl formate Chemical compound OCC(CO)OC=O LDVVTQMJQSCDMK-UHFFFAOYSA-N 0.000 description 1
- OSNILPMOSNGHLC-UHFFFAOYSA-N 1-[4-methoxy-3-(piperidin-1-ylmethyl)phenyl]ethanone Chemical compound COC1=CC=C(C(C)=O)C=C1CN1CCCCC1 OSNILPMOSNGHLC-UHFFFAOYSA-N 0.000 description 1
- BKUSIKGSPSFQAC-RRKCRQDMSA-N 2'-deoxyinosine-5'-diphosphate Chemical compound O1[C@H](CO[P@@](O)(=O)OP(O)(O)=O)[C@@H](O)C[C@@H]1N1C(NC=NC2=O)=C2N=C1 BKUSIKGSPSFQAC-RRKCRQDMSA-N 0.000 description 1
- RNFJDJUURJAICM-UHFFFAOYSA-N 2,2,4,4,6,6-hexaphenoxy-1,3,5-triaza-2$l^{5},4$l^{5},6$l^{5}-triphosphacyclohexa-1,3,5-triene Chemical compound N=1P(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP=1(OC=1C=CC=CC=1)OC1=CC=CC=C1 RNFJDJUURJAICM-UHFFFAOYSA-N 0.000 description 1
- DXCHWXWXYPEZKM-UHFFFAOYSA-N 2,4-ditert-butyl-6-[1-(3,5-ditert-butyl-2-hydroxyphenyl)ethyl]phenol Chemical compound C=1C(C(C)(C)C)=CC(C(C)(C)C)=C(O)C=1C(C)C1=CC(C(C)(C)C)=CC(C(C)(C)C)=C1O DXCHWXWXYPEZKM-UHFFFAOYSA-N 0.000 description 1
- ODBCKCWTWALFKM-UHFFFAOYSA-N 2,5-bis(tert-butylperoxy)-2,5-dimethylhex-3-yne Chemical compound CC(C)(C)OOC(C)(C)C#CC(C)(C)OOC(C)(C)C ODBCKCWTWALFKM-UHFFFAOYSA-N 0.000 description 1
- DMWVYCCGCQPJEA-UHFFFAOYSA-N 2,5-bis(tert-butylperoxy)-2,5-dimethylhexane Chemical compound CC(C)(C)OOC(C)(C)CCC(C)(C)OOC(C)(C)C DMWVYCCGCQPJEA-UHFFFAOYSA-N 0.000 description 1
- XMNIXWIUMCBBBL-UHFFFAOYSA-N 2-(2-phenylpropan-2-ylperoxy)propan-2-ylbenzene Chemical compound C=1C=CC=CC=1C(C)(C)OOC(C)(C)C1=CC=CC=C1 XMNIXWIUMCBBBL-UHFFFAOYSA-N 0.000 description 1
- FWLHAQYOFMQTHQ-UHFFFAOYSA-N 2-N-[8-[[8-(4-aminoanilino)-10-phenylphenazin-10-ium-2-yl]amino]-10-phenylphenazin-10-ium-2-yl]-8-N,10-diphenylphenazin-10-ium-2,8-diamine hydroxy-oxido-dioxochromium Chemical compound O[Cr]([O-])(=O)=O.O[Cr]([O-])(=O)=O.O[Cr]([O-])(=O)=O.Nc1ccc(Nc2ccc3nc4ccc(Nc5ccc6nc7ccc(Nc8ccc9nc%10ccc(Nc%11ccccc%11)cc%10[n+](-c%10ccccc%10)c9c8)cc7[n+](-c7ccccc7)c6c5)cc4[n+](-c4ccccc4)c3c2)cc1 FWLHAQYOFMQTHQ-UHFFFAOYSA-N 0.000 description 1
- QSRJVOOOWGXUDY-UHFFFAOYSA-N 2-[2-[2-[3-(3-tert-butyl-4-hydroxy-5-methylphenyl)propanoyloxy]ethoxy]ethoxy]ethyl 3-(3-tert-butyl-4-hydroxy-5-methylphenyl)propanoate Chemical compound CC(C)(C)C1=C(O)C(C)=CC(CCC(=O)OCCOCCOCCOC(=O)CCC=2C=C(C(O)=C(C)C=2)C(C)(C)C)=C1 QSRJVOOOWGXUDY-UHFFFAOYSA-N 0.000 description 1
- NCLHYVDSVOPBJY-UHFFFAOYSA-N 2-[2-tert-butyl-6-[(3-tert-butyl-2-hydroxy-5-methylphenyl)methyl]-4-methylphenyl]prop-2-enoic acid Chemical compound CC(C)(C)C1=CC(C)=CC(CC=2C(=C(C=C(C)C=2)C(C)(C)C)C(=C)C(O)=O)=C1O NCLHYVDSVOPBJY-UHFFFAOYSA-N 0.000 description 1
- 125000001731 2-cyanoethyl group Chemical group [H]C([H])(*)C([H])([H])C#N 0.000 description 1
- 239000004808 2-ethylhexylester Substances 0.000 description 1
- MZZYGYNZAOVRTG-UHFFFAOYSA-N 2-hydroxy-n-(1h-1,2,4-triazol-5-yl)benzamide Chemical compound OC1=CC=CC=C1C(=O)NC1=NC=NN1 MZZYGYNZAOVRTG-UHFFFAOYSA-N 0.000 description 1
- ALKCLFLTXBBMMP-UHFFFAOYSA-N 3,7-dimethylocta-1,6-dien-3-yl hexanoate Chemical compound CCCCCC(=O)OC(C)(C=C)CCC=C(C)C ALKCLFLTXBBMMP-UHFFFAOYSA-N 0.000 description 1
- PZRWFKGUFWPFID-UHFFFAOYSA-N 3,9-dioctadecoxy-2,4,8,10-tetraoxa-3,9-diphosphaspiro[5.5]undecane Chemical compound C1OP(OCCCCCCCCCCCCCCCCCC)OCC21COP(OCCCCCCCCCCCCCCCCCC)OC2 PZRWFKGUFWPFID-UHFFFAOYSA-N 0.000 description 1
- VPWNQTHUCYMVMZ-UHFFFAOYSA-N 4,4'-sulfonyldiphenol Chemical class C1=CC(O)=CC=C1S(=O)(=O)C1=CC=C(O)C=C1 VPWNQTHUCYMVMZ-UHFFFAOYSA-N 0.000 description 1
- ISAVYTVYFVQUDY-UHFFFAOYSA-N 4-tert-Octylphenol Chemical compound CC(C)(C)CC(C)(C)C1=CC=C(O)C=C1 ISAVYTVYFVQUDY-UHFFFAOYSA-N 0.000 description 1
- 229920000178 Acrylic resin Polymers 0.000 description 1
- 239000004925 Acrylic resin Substances 0.000 description 1
- 239000004114 Ammonium polyphosphate Substances 0.000 description 1
- 235000021357 Behenic acid Nutrition 0.000 description 1
- 239000004342 Benzoyl peroxide Substances 0.000 description 1
- OMPJBNCRMGITSC-UHFFFAOYSA-N Benzoylperoxide Chemical compound C=1C=CC=CC=1C(=O)OOC(=O)C1=CC=CC=C1 OMPJBNCRMGITSC-UHFFFAOYSA-N 0.000 description 1
- 229930185605 Bisphenol Natural products 0.000 description 1
- LSNNMFCWUKXFEE-UHFFFAOYSA-M Bisulfite Chemical compound OS([O-])=O LSNNMFCWUKXFEE-UHFFFAOYSA-M 0.000 description 1
- CPELXLSAUQHCOX-UHFFFAOYSA-M Bromide Chemical compound [Br-] CPELXLSAUQHCOX-UHFFFAOYSA-M 0.000 description 1
- 239000011627 DL-alpha-tocopherol Substances 0.000 description 1
- 235000001815 DL-alpha-tocopherol Nutrition 0.000 description 1
- GHKOFFNLGXMVNJ-UHFFFAOYSA-N Didodecyl thiobispropanoate Chemical compound CCCCCCCCCCCCOC(=O)CCSCCC(=O)OCCCCCCCCCCCC GHKOFFNLGXMVNJ-UHFFFAOYSA-N 0.000 description 1
- 239000003508 Dilauryl thiodipropionate Substances 0.000 description 1
- 239000002656 Distearyl thiodipropionate Substances 0.000 description 1
- VGGSQFUCUMXWEO-UHFFFAOYSA-N Ethene Chemical compound C=C VGGSQFUCUMXWEO-UHFFFAOYSA-N 0.000 description 1
- 239000005977 Ethylene Substances 0.000 description 1
- YIVJZNGAASQVEM-UHFFFAOYSA-N Lauroyl peroxide Chemical compound CCCCCCCCCCCC(=O)OOC(=O)CCCCCCCCCCC YIVJZNGAASQVEM-UHFFFAOYSA-N 0.000 description 1
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 1
- 229920003171 Poly (ethylene oxide) Polymers 0.000 description 1
- 229930182556 Polyacetal Natural products 0.000 description 1
- NRCMAYZCPIVABH-UHFFFAOYSA-N Quinacridone Chemical compound N1C2=CC=CC=C2C(=O)C2=C1C=C1C(=O)C3=CC=CC=C3NC1=C2 NRCMAYZCPIVABH-UHFFFAOYSA-N 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 235000021355 Stearic acid Nutrition 0.000 description 1
- 229910000831 Steel Inorganic materials 0.000 description 1
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 1
- KRADHMIOFJQKEZ-UHFFFAOYSA-N Tri-2-ethylhexyl trimellitate Chemical compound CCCCC(CC)COC(=O)C1=CC=C(C(=O)OCC(CC)CCCC)C(C(=O)OCC(CC)CCCC)=C1 KRADHMIOFJQKEZ-UHFFFAOYSA-N 0.000 description 1
- 229930003427 Vitamin E Natural products 0.000 description 1
- CGRTZESQZZGAAU-UHFFFAOYSA-N [2-[3-[1-[3-(3-tert-butyl-4-hydroxy-5-methylphenyl)propanoyloxy]-2-methylpropan-2-yl]-2,4,8,10-tetraoxaspiro[5.5]undecan-9-yl]-2-methylpropyl] 3-(3-tert-butyl-4-hydroxy-5-methylphenyl)propanoate Chemical compound CC(C)(C)C1=C(O)C(C)=CC(CCC(=O)OCC(C)(C)C2OCC3(CO2)COC(OC3)C(C)(C)COC(=O)CCC=2C=C(C(O)=C(C)C=2)C(C)(C)C)=C1 CGRTZESQZZGAAU-UHFFFAOYSA-N 0.000 description 1
- BGYHLZZASRKEJE-UHFFFAOYSA-N [3-[3-(3,5-ditert-butyl-4-hydroxyphenyl)propanoyloxy]-2,2-bis[3-(3,5-ditert-butyl-4-hydroxyphenyl)propanoyloxymethyl]propyl] 3-(3,5-ditert-butyl-4-hydroxyphenyl)propanoate Chemical compound CC(C)(C)C1=C(O)C(C(C)(C)C)=CC(CCC(=O)OCC(COC(=O)CCC=2C=C(C(O)=C(C=2)C(C)(C)C)C(C)(C)C)(COC(=O)CCC=2C=C(C(O)=C(C=2)C(C)(C)C)C(C)(C)C)COC(=O)CCC=2C=C(C(O)=C(C=2)C(C)(C)C)C(C)(C)C)=C1 BGYHLZZASRKEJE-UHFFFAOYSA-N 0.000 description 1
- 150000008360 acrylonitriles Chemical class 0.000 description 1
- 150000001298 alcohols Chemical class 0.000 description 1
- 125000001931 aliphatic group Chemical group 0.000 description 1
- 150000003973 alkyl amines Chemical class 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- WNROFYMDJYEPJX-UHFFFAOYSA-K aluminium hydroxide Chemical compound [OH-].[OH-].[OH-].[Al+3] WNROFYMDJYEPJX-UHFFFAOYSA-K 0.000 description 1
- CEGOLXSVJUTHNZ-UHFFFAOYSA-K aluminium tristearate Chemical compound [Al+3].CCCCCCCCCCCCCCCCCC([O-])=O.CCCCCCCCCCCCCCCCCC([O-])=O.CCCCCCCCCCCCCCCCCC([O-])=O CEGOLXSVJUTHNZ-UHFFFAOYSA-K 0.000 description 1
- 229940063655 aluminum stearate Drugs 0.000 description 1
- 235000019826 ammonium polyphosphate Nutrition 0.000 description 1
- 229920001276 ammonium polyphosphate Polymers 0.000 description 1
- 125000000129 anionic group Chemical group 0.000 description 1
- PYKYMHQGRFAEBM-UHFFFAOYSA-N anthraquinone Natural products CCC(=O)c1c(O)c2C(=O)C3C(C=CC=C3O)C(=O)c2cc1CC(=O)OC PYKYMHQGRFAEBM-UHFFFAOYSA-N 0.000 description 1
- 150000004056 anthraquinones Chemical class 0.000 description 1
- IRERQBUNZFJFGC-UHFFFAOYSA-L azure blue Chemical compound [Na+].[Na+].[Na+].[Na+].[Na+].[Na+].[Na+].[Na+].[Al+3].[Al+3].[Al+3].[Al+3].[Al+3].[Al+3].[S-]S[S-].[O-][Si]([O-])([O-])[O-].[O-][Si]([O-])([O-])[O-].[O-][Si]([O-])([O-])[O-].[O-][Si]([O-])([O-])[O-].[O-][Si]([O-])([O-])[O-].[O-][Si]([O-])([O-])[O-] IRERQBUNZFJFGC-UHFFFAOYSA-L 0.000 description 1
- 229940116226 behenic acid Drugs 0.000 description 1
- RWCCWEUUXYIKHB-UHFFFAOYSA-N benzophenone Chemical compound C=1C=CC=CC=1C(=O)C1=CC=CC=C1 RWCCWEUUXYIKHB-UHFFFAOYSA-N 0.000 description 1
- 239000012965 benzophenone Substances 0.000 description 1
- QRUDEWIWKLJBPS-UHFFFAOYSA-N benzotriazole Chemical compound C1=CC=C2N[N][N]C2=C1 QRUDEWIWKLJBPS-UHFFFAOYSA-N 0.000 description 1
- 239000012964 benzotriazole Substances 0.000 description 1
- 235000019400 benzoyl peroxide Nutrition 0.000 description 1
- XITRBUPOXXBIJN-UHFFFAOYSA-N bis(2,2,6,6-tetramethylpiperidin-4-yl) decanedioate Chemical compound C1C(C)(C)NC(C)(C)CC1OC(=O)CCCCCCCCC(=O)OC1CC(C)(C)NC(C)(C)C1 XITRBUPOXXBIJN-UHFFFAOYSA-N 0.000 description 1
- RRDGKBOYQLLJSW-UHFFFAOYSA-N bis(2-ethylhexyl) 7-oxabicyclo[4.1.0]heptane-3,4-dicarboxylate Chemical compound C1C(C(=O)OCC(CC)CCCC)C(C(=O)OCC(CC)CCCC)CC2OC21 RRDGKBOYQLLJSW-UHFFFAOYSA-N 0.000 description 1
- QUCSUPGVEFBICW-UHFFFAOYSA-N bis(8-methylnonyl) 7-oxabicyclo[4.1.0]heptane-3,4-dicarboxylate Chemical compound C1C(C(=O)OCCCCCCCC(C)C)C(C(=O)OCCCCCCCC(C)C)CC2OC21 QUCSUPGVEFBICW-UHFFFAOYSA-N 0.000 description 1
- OWMVSZAMULFTJU-UHFFFAOYSA-N bis-tris Chemical compound OCCN(CCO)C(CO)(CO)CO OWMVSZAMULFTJU-UHFFFAOYSA-N 0.000 description 1
- 229920001400 block copolymer Polymers 0.000 description 1
- OCWYEMOEOGEQAN-UHFFFAOYSA-N bumetrizole Chemical compound CC(C)(C)C1=CC(C)=CC(N2N=C3C=C(Cl)C=CC3=N2)=C1O OCWYEMOEOGEQAN-UHFFFAOYSA-N 0.000 description 1
- LNQMUHQVKMATKD-UHFFFAOYSA-N butan-1-amine;nickel Chemical compound [Ni].CCCCN LNQMUHQVKMATKD-UHFFFAOYSA-N 0.000 description 1
- 239000001506 calcium phosphate Substances 0.000 description 1
- 229910000389 calcium phosphate Inorganic materials 0.000 description 1
- 235000011010 calcium phosphates Nutrition 0.000 description 1
- CJZGTCYPCWQAJB-UHFFFAOYSA-L calcium stearate Chemical compound [Ca+2].CCCCCCCCCCCCCCCCCC([O-])=O.CCCCCCCCCCCCCCCCCC([O-])=O CJZGTCYPCWQAJB-UHFFFAOYSA-L 0.000 description 1
- 239000008116 calcium stearate Substances 0.000 description 1
- 235000013539 calcium stearate Nutrition 0.000 description 1
- 239000006229 carbon black Substances 0.000 description 1
- 125000002091 cationic group Chemical group 0.000 description 1
- 239000004927 clay Substances 0.000 description 1
- 229910052570 clay Inorganic materials 0.000 description 1
- 239000003086 colorant Substances 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- XCJYREBRNVKWGJ-UHFFFAOYSA-N copper(II) phthalocyanine Chemical compound [Cu+2].C12=CC=CC=C2C(N=C2[N-]C(C3=CC=CC=C32)=N2)=NC1=NC([C]1C=CC=CC1=1)=NC=1N=C1[C]3C=CC=CC3=C2[N-]1 XCJYREBRNVKWGJ-UHFFFAOYSA-N 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- WHHGLZMJPXIBIX-UHFFFAOYSA-N decabromodiphenyl ether Chemical compound BrC1=C(Br)C(Br)=C(Br)C(Br)=C1OC1=C(Br)C(Br)=C(Br)C(Br)=C1Br WHHGLZMJPXIBIX-UHFFFAOYSA-N 0.000 description 1
- XJOBOFWTZOKMOH-UHFFFAOYSA-N decanoyl decaneperoxoate Chemical compound CCCCCCCCCC(=O)OOC(=O)CCCCCCCCC XJOBOFWTZOKMOH-UHFFFAOYSA-N 0.000 description 1
- XAEWZDYWZHIUCT-UHFFFAOYSA-N desipramine hydrochloride Chemical compound [H+].[Cl-].C1CC2=CC=CC=C2N(CCCNC)C2=CC=CC=C21 XAEWZDYWZHIUCT-UHFFFAOYSA-N 0.000 description 1
- LSXWFXONGKSEMY-UHFFFAOYSA-N di-tert-butyl peroxide Chemical compound CC(C)(C)OOC(C)(C)C LSXWFXONGKSEMY-UHFFFAOYSA-N 0.000 description 1
- 239000012933 diacyl peroxide Substances 0.000 description 1
- 229940087101 dibenzylidene sorbitol Drugs 0.000 description 1
- ZJIPHXXDPROMEF-UHFFFAOYSA-N dihydroxyphosphanyl dihydrogen phosphite Chemical compound OP(O)OP(O)O ZJIPHXXDPROMEF-UHFFFAOYSA-N 0.000 description 1
- 235000019304 dilauryl thiodipropionate Nutrition 0.000 description 1
- JFHGLVIOIANSIN-UHFFFAOYSA-N dimethyl butanedioate;1-(2-hydroxyethyl)-2,2,6,6-tetramethylpiperidin-4-ol Chemical compound COC(=O)CCC(=O)OC.CC1(C)CC(O)CC(C)(C)N1CCO JFHGLVIOIANSIN-UHFFFAOYSA-N 0.000 description 1
- NJLLQSBAHIKGKF-UHFFFAOYSA-N dipotassium dioxido(oxo)titanium Chemical compound [K+].[K+].[O-][Ti]([O-])=O NJLLQSBAHIKGKF-UHFFFAOYSA-N 0.000 description 1
- PWWSSIYVTQUJQQ-UHFFFAOYSA-N distearyl thiodipropionate Chemical compound CCCCCCCCCCCCCCCCCCOC(=O)CCSCCC(=O)OCCCCCCCCCCCCCCCCCC PWWSSIYVTQUJQQ-UHFFFAOYSA-N 0.000 description 1
- 235000019305 distearyl thiodipropionate Nutrition 0.000 description 1
- LJZKUDYOSCNJPU-UHFFFAOYSA-N dotetracontanediamide Chemical compound NC(=O)CCCCCCCCCCCCCCCCCCCCCCCCCCCCCCCCCCCCCCCCC(N)=O LJZKUDYOSCNJPU-UHFFFAOYSA-N 0.000 description 1
- MCPKSFINULVDNX-UHFFFAOYSA-N drometrizole Chemical compound CC1=CC=C(O)C(N2N=C3C=CC=CC3=N2)=C1 MCPKSFINULVDNX-UHFFFAOYSA-N 0.000 description 1
- UAUDZVJPLUQNMU-KTKRTIGZSA-N erucamide Chemical compound CCCCCCCC\C=C/CCCCCCCCCCCC(N)=O UAUDZVJPLUQNMU-KTKRTIGZSA-N 0.000 description 1
- SWSBIGKFUOXRNJ-CVBJKYQLSA-N ethene;(z)-octadec-9-enamide Chemical compound C=C.CCCCCCCC\C=C/CCCCCCCC(N)=O.CCCCCCCC\C=C/CCCCCCCC(N)=O SWSBIGKFUOXRNJ-CVBJKYQLSA-N 0.000 description 1
- ZJOLCKGSXLIVAA-UHFFFAOYSA-N ethene;octadecanamide Chemical compound C=C.CCCCCCCCCCCCCCCCCC(N)=O.CCCCCCCCCCCCCCCCCC(N)=O ZJOLCKGSXLIVAA-UHFFFAOYSA-N 0.000 description 1
- VXNZUUAINFGPBY-UHFFFAOYSA-N ethyl ethylene Natural products CCC=C VXNZUUAINFGPBY-UHFFFAOYSA-N 0.000 description 1
- 239000012847 fine chemical Substances 0.000 description 1
- 238000009472 formulation Methods 0.000 description 1
- 230000004927 fusion Effects 0.000 description 1
- WIGCFUFOHFEKBI-UHFFFAOYSA-N gamma-tocopherol Natural products CC(C)CCCC(C)CCCC(C)CCCC1CCC2C(C)C(O)C(C)C(C)C2O1 WIGCFUFOHFEKBI-UHFFFAOYSA-N 0.000 description 1
- 230000005484 gravity Effects 0.000 description 1
- 150000002367 halogens Chemical class 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- NZYMWGXNIUZYRC-UHFFFAOYSA-N hexadecyl 3,5-ditert-butyl-4-hydroxybenzoate Chemical compound CCCCCCCCCCCCCCCCOC(=O)C1=CC(C(C)(C)C)=C(O)C(C(C)(C)C)=C1 NZYMWGXNIUZYRC-UHFFFAOYSA-N 0.000 description 1
- 239000004615 ingredient Substances 0.000 description 1
- 239000012796 inorganic flame retardant Substances 0.000 description 1
- 238000004898 kneading Methods 0.000 description 1
- MOUPNEIJQCETIW-UHFFFAOYSA-N lead chromate Chemical compound [Pb+2].[O-][Cr]([O-])(=O)=O MOUPNEIJQCETIW-UHFFFAOYSA-N 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 229910052943 magnesium sulfate Inorganic materials 0.000 description 1
- 235000019341 magnesium sulphate Nutrition 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000000691 measurement method Methods 0.000 description 1
- GTIBACHAUHDNPH-WHYMJUELSA-N n,n'-bis[(z)-benzylideneamino]oxamide Chemical compound C=1C=CC=CC=1\C=N/NC(=O)C(=O)N\N=C/C1=CC=CC=C1 GTIBACHAUHDNPH-WHYMJUELSA-N 0.000 description 1
- FTQWRYSLUYAIRQ-UHFFFAOYSA-N n-[(octadecanoylamino)methyl]octadecanamide Chemical compound CCCCCCCCCCCCCCCCCC(=O)NCNC(=O)CCCCCCCCCCCCCCCCC FTQWRYSLUYAIRQ-UHFFFAOYSA-N 0.000 description 1
- GOQYKNQRPGWPLP-UHFFFAOYSA-N n-heptadecyl alcohol Natural products CCCCCCCCCCCCCCCCCO GOQYKNQRPGWPLP-UHFFFAOYSA-N 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- QUAMTGJKVDWJEQ-UHFFFAOYSA-N octabenzone Chemical compound OC1=CC(OCCCCCCCC)=CC=C1C(=O)C1=CC=CC=C1 QUAMTGJKVDWJEQ-UHFFFAOYSA-N 0.000 description 1
- LYRFLYHAGKPMFH-UHFFFAOYSA-N octadecanamide Chemical compound CCCCCCCCCCCCCCCCCC(N)=O LYRFLYHAGKPMFH-UHFFFAOYSA-N 0.000 description 1
- QIQXTHQIDYTFRH-UHFFFAOYSA-N octadecanoic acid Chemical compound CCCCCCCCCCCCCCCCCC(O)=O QIQXTHQIDYTFRH-UHFFFAOYSA-N 0.000 description 1
- OQCDKBAXFALNLD-UHFFFAOYSA-N octadecanoic acid Natural products CCCCCCCC(C)CCCCCCCCC(O)=O OQCDKBAXFALNLD-UHFFFAOYSA-N 0.000 description 1
- SSDSCDGVMJFTEQ-UHFFFAOYSA-N octadecyl 3-(3,5-ditert-butyl-4-hydroxyphenyl)propanoate Chemical compound CCCCCCCCCCCCCCCCCCOC(=O)CCC1=CC(C(C)(C)C)=C(O)C(C(C)(C)C)=C1 SSDSCDGVMJFTEQ-UHFFFAOYSA-N 0.000 description 1
- FATBGEAMYMYZAF-KTKRTIGZSA-N oleamide Chemical compound CCCCCCCC\C=C/CCCCCCCC(N)=O FATBGEAMYMYZAF-KTKRTIGZSA-N 0.000 description 1
- 150000002912 oxalic acid derivatives Chemical class 0.000 description 1
- NFHFRUOZVGFOOS-UHFFFAOYSA-N palladium;triphenylphosphane Chemical compound [Pd].C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1.C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1.C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1.C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1 NFHFRUOZVGFOOS-UHFFFAOYSA-N 0.000 description 1
- 150000002989 phenols Chemical class 0.000 description 1
- AQSJGOWTSHOLKH-UHFFFAOYSA-N phosphite(3-) Chemical class [O-]P([O-])[O-] AQSJGOWTSHOLKH-UHFFFAOYSA-N 0.000 description 1
- XNGIFLGASWRNHJ-UHFFFAOYSA-L phthalate(2-) Chemical compound [O-]C(=O)C1=CC=CC=C1C([O-])=O XNGIFLGASWRNHJ-UHFFFAOYSA-L 0.000 description 1
- XNGIFLGASWRNHJ-UHFFFAOYSA-N phthalic acid Chemical class OC(=O)C1=CC=CC=C1C(O)=O XNGIFLGASWRNHJ-UHFFFAOYSA-N 0.000 description 1
- IEQIEDJGQAUEQZ-UHFFFAOYSA-N phthalocyanine Chemical compound N1C(N=C2C3=CC=CC=C3C(N=C3C4=CC=CC=C4C(=N4)N3)=N2)=C(C=CC=C2)C2=C1N=C1C2=CC=CC=C2C4=N1 IEQIEDJGQAUEQZ-UHFFFAOYSA-N 0.000 description 1
- 239000004014 plasticizer Substances 0.000 description 1
- 229920000767 polyaniline Polymers 0.000 description 1
- 229920001748 polybutylene Polymers 0.000 description 1
- 239000004417 polycarbonate Substances 0.000 description 1
- 229920000515 polycarbonate Polymers 0.000 description 1
- 229920000139 polyethylene terephthalate Polymers 0.000 description 1
- 239000005020 polyethylene terephthalate Substances 0.000 description 1
- 229920000306 polymethylpentene Polymers 0.000 description 1
- 239000011116 polymethylpentene Substances 0.000 description 1
- 229920006324 polyoxymethylene Polymers 0.000 description 1
- 229920005630 polypropylene random copolymer Polymers 0.000 description 1
- 229920001296 polysiloxane Polymers 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 125000001501 propionyl group Chemical group O=C([*])C([H])([H])C([H])([H])[H] 0.000 description 1
- QQONPFPTGQHPMA-UHFFFAOYSA-N propylene Natural products CC=C QQONPFPTGQHPMA-UHFFFAOYSA-N 0.000 description 1
- 125000004805 propylene group Chemical group [H]C([H])([H])C([H])([*:1])C([H])([H])[*:2] 0.000 description 1
- 150000003242 quaternary ammonium salts Chemical class 0.000 description 1
- 229960001860 salicylate Drugs 0.000 description 1
- 150000003873 salicylate salts Chemical class 0.000 description 1
- 229940058287 salicylic acid derivative anticestodals Drugs 0.000 description 1
- 150000003872 salicylic acid derivatives Chemical class 0.000 description 1
- 238000005204 segregation Methods 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- WXMKPNITSTVMEF-UHFFFAOYSA-M sodium benzoate Chemical compound [Na+].[O-]C(=O)C1=CC=CC=C1 WXMKPNITSTVMEF-UHFFFAOYSA-M 0.000 description 1
- 235000010234 sodium benzoate Nutrition 0.000 description 1
- 239000004299 sodium benzoate Substances 0.000 description 1
- SNAQARSCIHDMGI-UHFFFAOYSA-M sodium;bis(4-tert-butylphenyl) phosphate Chemical compound [Na+].C1=CC(C(C)(C)C)=CC=C1OP([O-])(=O)OC1=CC=C(C(C)(C)C)C=C1 SNAQARSCIHDMGI-UHFFFAOYSA-M 0.000 description 1
- 239000008117 stearic acid Substances 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
- 150000005846 sugar alcohols Polymers 0.000 description 1
- SWAXTRYEYUTSAP-UHFFFAOYSA-N tert-butyl ethaneperoxoate Chemical compound CC(=O)OOC(C)(C)C SWAXTRYEYUTSAP-UHFFFAOYSA-N 0.000 description 1
- LVEOKSIILWWVEO-UHFFFAOYSA-N tetradecyl 3-(3-oxo-3-tetradecoxypropyl)sulfanylpropanoate Chemical compound CCCCCCCCCCCCCCOC(=O)CCSCCC(=O)OCCCCCCCCCCCCCC LVEOKSIILWWVEO-UHFFFAOYSA-N 0.000 description 1
- 229920001169 thermoplastic Polymers 0.000 description 1
- 239000004416 thermosoftening plastic Substances 0.000 description 1
- 150000007970 thio esters Chemical class 0.000 description 1
- 239000010936 titanium Substances 0.000 description 1
- 229910052719 titanium Inorganic materials 0.000 description 1
- 229960000984 tocofersolan Drugs 0.000 description 1
- AOBORMOPSGHCAX-DGHZZKTQSA-N tocofersolan Chemical compound OCCOC(=O)CCC(=O)OC1=C(C)C(C)=C2O[C@](CCC[C@H](C)CCC[C@H](C)CCCC(C)C)(C)CCC2=C1C AOBORMOPSGHCAX-DGHZZKTQSA-N 0.000 description 1
- QORWJWZARLRLPR-UHFFFAOYSA-H tricalcium bis(phosphate) Chemical compound [Ca+2].[Ca+2].[Ca+2].[O-]P([O-])([O-])=O.[O-]P([O-])([O-])=O QORWJWZARLRLPR-UHFFFAOYSA-H 0.000 description 1
- ARCGXLSVLAOJQL-UHFFFAOYSA-N trimellitic acid Chemical class OC(=O)C1=CC=C(C(O)=O)C(C(O)=O)=C1 ARCGXLSVLAOJQL-UHFFFAOYSA-N 0.000 description 1
- FJFYFBRNDHRTHL-UHFFFAOYSA-N tris(8-methylnonyl) benzene-1,2,4-tricarboxylate Chemical compound CC(C)CCCCCCCOC(=O)C1=CC=C(C(=O)OCCCCCCCC(C)C)C(C(=O)OCCCCCCCC(C)C)=C1 FJFYFBRNDHRTHL-UHFFFAOYSA-N 0.000 description 1
- 235000013799 ultramarine blue Nutrition 0.000 description 1
- 239000006097 ultraviolet radiation absorber Substances 0.000 description 1
- 229940046009 vitamin E Drugs 0.000 description 1
- 239000011709 vitamin E Substances 0.000 description 1
- 235000019165 vitamin E Nutrition 0.000 description 1
- 239000011787 zinc oxide Substances 0.000 description 1
- XOOUIPVCVHRTMJ-UHFFFAOYSA-L zinc stearate Chemical compound [Zn+2].CCCCCCCCCCCCCCCCCC([O-])=O.CCCCCCCCCCCCCCCCCC([O-])=O XOOUIPVCVHRTMJ-UHFFFAOYSA-L 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29B—PREPARATION OR PRETREATMENT OF THE MATERIAL TO BE SHAPED; MAKING GRANULES OR PREFORMS; RECOVERY OF PLASTICS OR OTHER CONSTITUENTS OF WASTE MATERIAL CONTAINING PLASTICS
- B29B9/00—Making granules
- B29B9/12—Making granules characterised by structure or composition
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Processing And Handling Of Plastics And Other Materials For Molding In General (AREA)
Abstract
Description
【0001】0001
【産業上の利用分野】本発明は、特定した形状を有する
熱可塑性樹脂チップに関し、該チップに種々の添加剤、
充填剤などが良好に配合されたコンパウンドチップを提
供するものである。[Field of Industrial Application] The present invention relates to a thermoplastic resin chip having a specified shape, and the present invention relates to a thermoplastic resin chip having a specified shape.
The purpose is to provide a compound chip in which fillers and the like are well mixed.
【0002】0002
【従来の技術】熱可塑性樹脂は、一般にペレットの形状
で押出成形、射出成形などに供され、目的物に仕上げら
れて広い分野に有効に用いられている。また、このよう
な樹脂ペレットと種々の添加剤、充填剤、顔料などとの
配合は、一般的にはマスターバッチによる方法、あるい
は直接添加のドライブレンドによる方法などでブレンド
した後に、射出成形や押出し成形が行われている。ある
いは、押出し機による均一分散配合のペレタイズ後に射
出成形や押出し成形を行う場合もある。2. Description of the Related Art Thermoplastic resins are generally subjected to extrusion molding, injection molding, etc. in the form of pellets, and are finished into desired objects and used effectively in a wide range of fields. In addition, such resin pellets and various additives, fillers, pigments, etc. are generally blended using a masterbatch method or a direct addition dry blend method, and then injection molding or extrusion is performed. Molding is taking place. Alternatively, injection molding or extrusion molding may be performed after pelletizing a uniformly dispersed mixture using an extruder.
【0003】0003
【発明が解決しようとする問題点】しかしながら、上記
した樹脂ペレットと種々の添加剤、充填剤、顔料などと
の配合において、マスターバッチによる方法は、マスタ
ーペレット量が少量添加の場合に分散不良、多量添加の
場合分散が不均一となる問題が生じる。即ち、マスター
バッチの製造における問題として、添加剤、充填剤など
の配合は、押出し機によりペレタイズしているため、少
量添加の場合に均一分散の効果があるが、多量添加の場
合には分散不良、ペレタイズ不良などを生じる。[Problems to be Solved by the Invention] However, when blending the above-mentioned resin pellets with various additives, fillers, pigments, etc., the masterbatch method causes poor dispersion and problems when a small amount of master pellets is added. If a large amount is added, a problem arises in that the dispersion becomes non-uniform. In other words, a problem in the production of masterbatches is that additives, fillers, etc. are pelletized using an extruder, so when a small amount is added, uniform dispersion is effective, but when a large amount is added, poor dispersion occurs. , resulting in poor pelletization.
【0004】また、直接添加のドライブレンドによる方
法は、少量添加の場合に樹脂ペレットの周囲に均一に付
着するが、多量添加の場合に添加剤、充填剤、などが樹
脂ペレットの周囲に付着する以外に、二次凝集物を形成
し分散不良を生じる。また、ブレンド機器の周囲にも付
着するため、添加量の変動を生じる問題がある。[0004] In addition, in the dry blending method of direct addition, when a small amount is added, the additives, fillers, etc. adhere uniformly around the resin pellet, but when a large amount is added, the additives, fillers, etc. adhere to the periphery of the resin pellet. In addition, secondary agglomerates are formed, resulting in poor dispersion. Furthermore, since it adheres to the surroundings of the blending equipment, there is a problem of fluctuations in the amount added.
【0005】[0005]
【問題点を解決するための手段】本発明者らは、上記し
た樹脂ペレットと種々の添加剤、充填剤などとの配合に
おける問題点を解決するために、鋭意研究した。その結
果、樹脂ペレットの形状を改良することにより、本発明
を完成した。[Means for Solving the Problems] The present inventors have conducted extensive research in order to solve the problems in blending the above-mentioned resin pellets with various additives, fillers, etc. As a result, the present invention was completed by improving the shape of the resin pellets.
【0006】即ち、本発明によれば、外径1〜5mmお
よび長さ1〜10mmであり、(イ)内径0.5〜4.
5mmの管状体または(ロ)深さ0.5〜9mmの凹状
部を有する熱可塑性樹脂チップが提供される。That is, according to the present invention, the outer diameter is 1 to 5 mm, the length is 1 to 10 mm, and (a) the inner diameter is 0.5 to 4 mm.
A thermoplastic resin chip having a tubular body of 5 mm or (b) a concave portion of 0.5 to 9 mm in depth is provided.
【0007】また、本発明によれば、上記の特定した熱
可塑性樹脂チップ100重量部に対して、ブレンドオイ
ル0.1〜10重量部および他の添加剤0.001〜2
00重量部を配合してなるコンパウンドチップが提供さ
れる。According to the present invention, 0.1 to 10 parts by weight of blend oil and 0.001 to 2 parts by weight of other additives are added to 100 parts by weight of the above specified thermoplastic resin chips.
A compound chip containing 0.00 parts by weight is provided.
【0008】本発明の熱可塑性樹脂チップは、特定した
寸法の外径、長さおよび内径または深さを有すれば、そ
の管状体または凹状部の形状は特に制限されない。本発
明の代表的な熱可塑性樹脂チップの形態を図1〜図10
に例示する。図1は、それぞれ所定の外径d1 、内径
d2 および長さLを有する管状体(パイプ状)のチッ
プである。図2は、外径d1 、長さLおよび両側に内
径d2 で長さ(深さ)L1 ,L2 の凹状部を有す
るチップである。図3は、外径d1 、長さLおよび片
側に内径d2 で長さ(深さ)L1 、の凹状部を有す
るチップである。図4は、外径d1 、長さLおよび外
表面に深さd3で一般に0.5〜4.5mmの開口幅を
有する楔形(V字形)の凹状部をヨコ溝状に有するチッ
プである。図5は、同じく外径d1 、長さLおよび外
表面に開口幅(径)Wで内径d2 、で深さd3 の楔
形状(V字形)である凹状部をタテ溝状に2個所有する
チップである。そのほか、外径d1 および長さLの外
表面に径d2 で深さd3 である凹状部を部分的に1
ケ以上を設けてもよい。また、これら凹状部の形状とし
ては、そのほかU字形状なども好ましい。なお、チップ
の外面及び内面の形状は円又は多角形の同一又は異なる
組合せでも良い。The shape of the tubular body or concave portion of the thermoplastic resin chip of the present invention is not particularly limited as long as it has a specified outer diameter, length, inner diameter, or depth. Figures 1 to 10 show the morphology of typical thermoplastic resin chips of the present invention.
For example: FIG. 1 shows a tip that is a tubular body (pipe-shaped) having a predetermined outer diameter d1, inner diameter d2, and length L, respectively. FIG. 2 shows a chip having an outer diameter d1, a length L, and a concave portion having an inner diameter d2 and lengths (depths) L1 and L2 on both sides. FIG. 3 shows a chip having an outer diameter d1, a length L, and a concave portion having an inner diameter d2 and a length (depth) L1 on one side. FIG. 4 shows a chip having an outer diameter d1, a length L, and a wedge-shaped (V-shaped) concave portion on the outer surface having a depth d3 and an opening width of generally 0.5 to 4.5 mm in the form of a horizontal groove. FIG. 5 shows two wedge-shaped (V-shaped) recesses in a vertical groove shape with an outer diameter d1, a length L, and an opening width (diameter) W on the outer surface, an inner diameter d2, and a depth d3. It's a chip. In addition, a concave portion with a diameter d2 and a depth d3 is partially formed on the outer surface with an outer diameter d1 and a length L.
It is also possible to provide more than one. Further, as the shape of these concave portions, a U-shape or the like is also preferable. Note that the outer and inner surfaces of the chip may have the same or different combinations of circles or polygons.
【0009】このような本発明の熱可塑性チップは、従
来公知の成形方法を用いて得ることができる。例えば管
状体または外表面に溝状の凹状部を有する樹脂チップは
、所定の内径および外径、あるいは深さに設定された金
型を用いて押出成形した後、所定の長さに切断する方法
により容易に得ることができる。また、上記の管状体を
一定間隔で部分的に加熱溶着して内管部を接合した後、
該接合部の片側または中央部を所定の長さに切断する方
法により両側または片側に凹状部を有するチップを得る
ことができる。そのほか外表面に所定の凹状部を有する
チップは、所定の外径を有する管状体を押出成形した直
後、軟化状態で所定の凹状部に対応した凸状部を有する
金型により成形する方法により得ることができる。[0009] Such a thermoplastic chip of the present invention can be obtained using a conventionally known molding method. For example, a tubular body or a resin chip having a groove-like concave portion on the outer surface is extruded using a mold set to a predetermined inner diameter and outer diameter or depth, and then cut to a predetermined length. can be easily obtained. In addition, after the above tubular body is partially heated and welded at regular intervals to join the inner tube part,
A chip having concave portions on both sides or one side can be obtained by cutting one side or the center of the joint into a predetermined length. In addition, a chip having a predetermined concave portion on the outer surface can be obtained by extruding a tubular body having a predetermined outer diameter, and then immediately molding it in a softened state using a mold having a convex portion corresponding to the predetermined concave portion. be able to.
【0010】本発明に用いる熱可塑性樹脂としては、特
に制限されず、例えばポリスチレン、アクリル樹脂、A
S樹脂、ABS樹脂、ポリプロピレン、ポリエチレン、
ポリアミド、ポリエチレンテレフタレート、ポリメチル
ペンテン、ポリブテン、ポリカーボネート、ポリアセタ
ール等、また例えばエチレン/プロピレン共重合体、プ
ロピレン/ブテン−1共重合体等それらの共重合体、さ
らには例えばポリプロピレンとポリエチレン、ポリプロ
ピレンとポリブテン−1、ポリプロピレンとポリスチレ
ンなどの上記した混合物が用いられる。なお、このよう
な熱可塑性樹脂には、樹脂に安定剤など必要不可欠な添
加成分、あるいはチップの成形可能な範囲で基本的な添
加剤などを予め配合して、所定のチップを成形してもよ
い。The thermoplastic resin used in the present invention is not particularly limited, and includes, for example, polystyrene, acrylic resin, A
S resin, ABS resin, polypropylene, polyethylene,
Polyamide, polyethylene terephthalate, polymethylpentene, polybutene, polycarbonate, polyacetal, etc., and copolymers thereof, such as ethylene/propylene copolymer, propylene/butene-1 copolymer, and further, for example, polypropylene and polyethylene, polypropylene and polybutene. -1, the above-mentioned mixture of polypropylene and polystyrene is used. In addition, with such thermoplastic resins, it is possible to mold the desired chip by pre-blending essential additives such as stabilizers with the resin, or basic additives within the range that can be molded into the chip. good.
【0011】本発明に用いるブレンドオイルとしては、
熱可塑性樹脂のチップに配合する種々の添加剤、充填剤
などを均一に分散させるものであれば特に制限されず、
例えばジメチルシロキサン、メチルフェニルシロキサン
等のシリコンオイル類;流動パラフィン類;例えばフタ
ル酸ジオクチル、フタル酸ジイソデシル等のフタル酸エ
ステル類;例えばアジピン酸ジ−2−エチルヘキシル、
アジピン酸ジイソデシル、セバチン酸ジ−2−エチルヘ
キシルル等の脂肪族二塩基酸エステル類;例えばトリメ
リット酸トリオクチル、トリメリット酸トリイソデシル
等のトリメリット酸エステル類;例えばクエン酸アセチ
ルトリブチル、クエン酸アセチルトリ−2−エチルヘキ
シル等のオキシ酸エステル類;例えばエポキシヘキサヒ
ドロフタル酸−2−エチルヘキシル、エポキシヘキサヒ
ドロフタル酸ジイソデシル等のエポキシヘキサヒドロフ
タル酸エステル類が挙げられる。[0011] The blended oil used in the present invention is as follows:
There are no particular restrictions as long as the various additives, fillers, etc. blended into the thermoplastic resin chips can be uniformly dispersed.
For example, silicone oils such as dimethylsiloxane and methylphenylsiloxane; liquid paraffins; phthalate esters such as dioctyl phthalate and diisodecyl phthalate; for example, di-2-ethylhexyl adipate,
Aliphatic dibasic acid esters such as diisodecyl adipate and di-2-ethylhexyl sebatate; trimellitic acid esters such as trioctyl trimellitate and triisodecyl trimellitate; such as acetyltributyl citrate and acetyl tributyl citrate; Oxyacid esters such as -2-ethylhexyl; for example, epoxyhexahydrophthalate esters such as -2-ethylhexyl epoxyhexahydrophthalate and diisodecyl epoxyhexahydrophthalate.
【0012】本発明のコンパウンドチップに配合される
添加剤、充填剤としては、例えば酸化防止剤、帯電防止
剤、滑剤、分散剤、光安定剤、紫外線吸収剤、核剤、透
明化剤、無機充填剤、顔料、可塑剤、難燃剤、有機過酸
化物および金属不活性化剤等の添加剤、充填剤が必要に
応じて用いられる。Examples of additives and fillers to be incorporated into the compound chip of the present invention include antioxidants, antistatic agents, lubricants, dispersants, light stabilizers, ultraviolet absorbers, nucleating agents, clarifying agents, and inorganic Additives and fillers such as fillers, pigments, plasticizers, flame retardants, organic peroxides, and metal deactivators are used as necessary.
【0013】上記した主な添加剤について、具体的に1
)酸化防止剤としては、ヒンダードフェノール系、例え
ばオクタデシル−3−(3,5−ジ−t−ブチル−4−
ヒドロキシフェニル)プロピオネート、ペンタエリスリ
チル−テトラキス〔3−(3,5−ジ−t−ブチル−4
−ヒドロキシフェニル)プロピオネート〕、トリエチレ
ングリコール−ビス〔3−(3−t−ブチル−5−メチ
ル−4−ヒドロキシフェニル)プロピオネート〕、3,
9−ビス〔2−{3−(3−t−ブチル−4−ハイドロ
キシ−5−メチルフェニル)プロピオニルオキシ}−1
,1−ジメチルエチル〕−2,4,8,10−テトラオ
キサスピロ〔5・5〕ウンデカン等;フォスファイト系
、例えばトリス(2,4−ジ−t−ブチルフェニル)フ
ォスファイト、ジステアリルペンタエリスリトールジフ
ォスファイト、ビス−(2,4−ジ−t−ブチルフェニ
ル)ペンタエリスリトール、ジフォスファイト、テトラ
キス(2,4−ジ−t−ブチルフェニル)−4,4′−
ビフェニレンフォスファイト等;チオエステル系、例え
ばジラウリルチオジプロピオネート、ジミリスチルチオ
ジプロピオネート、ジステアリルチオジプロピオネート
、ペンタエリスリトールテトラキス(β−ラウリルチオ
プロピオネート)等;アミン系、例えばオクチル化ジフ
ェニルアミン等;ビスフェノール系、例えば2−t−ブ
チル−6−(3′−t−ブチル−5′−メチル−2′−
ヒドロキシベンジル)−4−メチルフェニルアクリレー
ト、2,2′−エチリデンビス(4,6−ジ−t−ブチ
ルフェノール)等;ビタミンE系、例えばdl−α−ト
コフェロール等。Regarding the above-mentioned main additives, specifically 1.
) Antioxidants include hindered phenols, such as octadecyl-3-(3,5-di-t-butyl-4-
hydroxyphenyl) propionate, pentaerythrityl-tetrakis [3-(3,5-di-t-butyl-4
-hydroxyphenyl)propionate], triethylene glycol-bis[3-(3-t-butyl-5-methyl-4-hydroxyphenyl)propionate], 3,
9-bis[2-{3-(3-t-butyl-4-hydroxy-5-methylphenyl)propionyloxy}-1
,1-dimethylethyl]-2,4,8,10-tetraoxaspiro[5,5]undecane, etc.; phosphites, such as tris(2,4-di-t-butylphenyl)phosphite, distearylpenta Erythritol diphosphite, bis-(2,4-di-t-butylphenyl)pentaerythritol, diphosphite, tetrakis(2,4-di-t-butylphenyl)-4,4'-
Biphenylene phosphite, etc.; thioesters, such as dilaurylthiodipropionate, dimyristylthiodipropionate, distearylthiodipropionate, pentaerythritol tetrakis (β-laurylthiopropionate), etc.; amines, such as octylation diphenylamine, etc.; bisphenols, such as 2-t-butyl-6-(3'-t-butyl-5'-methyl-2'-
hydroxybenzyl)-4-methylphenylacrylate, 2,2'-ethylidenebis(4,6-di-t-butylphenol), etc.; vitamin E type, such as dl-α-tocopherol.
【0014】2)紫外線吸収剤としては、ベンゾフェノ
ン系、例えば2−ヒドロキシ−4−オクトキシベンゾフ
ェノン、2−ヒドロキシ−4−メトキシベンゾフェノン
、2−ヒドロキシ−4−メトキシベンゾフェノンサルフ
ォニックアシッド等;ベンゾトリアゾール系、例えば2
−(2′−ヒドロキシ−5′−メチルフェニル)ベンゾ
トリアゾール、2−(2′−ヒドロキシ−3′−t−ブ
チル−5′−メチルフェニル)−5−クロロベンゾトリ
アゾール等;サリシレート系、例えば4−t−ブチルフ
ェニルサリシレート、2,4−ジ−t−ブチルフェニル
−3′,5′−ジ−t−ブチル−4−ヒドロキシベンゾ
エート、n−ヘキサデシル−3,5−ジ−t−ブチル−
4−ヒドロキシベンゾエート等;置換アクリロニトリル
系エチル−2−シアノ−3,3′−ジフェニルアクリレ
ート等。2) As the ultraviolet absorber, benzophenone type, such as 2-hydroxy-4-octoxybenzophenone, 2-hydroxy-4-methoxybenzophenone, 2-hydroxy-4-methoxybenzophenone sulfonic acid, etc.; benzotriazole type , for example 2
-(2'-hydroxy-5'-methylphenyl)benzotriazole, 2-(2'-hydroxy-3'-t-butyl-5'-methylphenyl)-5-chlorobenzotriazole, etc.; salicylates, e.g. -t-butylphenyl salicylate, 2,4-di-t-butylphenyl-3',5'-di-t-butyl-4-hydroxybenzoate, n-hexadecyl-3,5-di-t-butyl-
4-hydroxybenzoate, etc.; substituted acrylonitrile-based ethyl-2-cyano-3,3'-diphenylacrylate, etc.
【0015】3)光安定剤としては、ヒンダードアミン
系、例えばビス(2,2,6,6−テトラメチル−4−
ピペリジル)セバケート、コハク酸ジメチル・1−(2
−ヒドロキシエチル)−4−ヒドロキシ−2,2,6,
6−テトラメチルピペリジン重縮合物、ポリ〔{6−(
1,1,3,3−テトラメチルブチル)アミノ−1,3
,5−トリアジン−2,4−ジイル}{(2,2,6,
6−テトラメチル−4−ピペリジル)イミノ}ヘキサメ
チレン{(2,2,6,6−テトラメチル−4−ピペリ
ジル)イミノ}〕等。ニッケル錯体系、例えば〔2,2
′−チオビス(4−t−オクチルフェノラート)〕n・
ブチルアミンニッケルII、ニッケルコンプレックス−
3,5−ジ−t−ブチル−4−ヒドロキシベンジルりん
酸モノエチレート等。3) As the light stabilizer, hindered amine type, for example, bis(2,2,6,6-tetramethyl-4-
piperidyl) sebacate, dimethyl succinate 1-(2
-hydroxyethyl)-4-hydroxy-2,2,6,
6-tetramethylpiperidine polycondensate, poly[{6-(
1,1,3,3-tetramethylbutyl)amino-1,3
,5-triazine-2,4-diyl}{(2,2,6,
6-tetramethyl-4-piperidyl)imino}hexamethylene {(2,2,6,6-tetramethyl-4-piperidyl)imino} and the like. Nickel complex systems, e.g. [2,2
'-Thiobis(4-t-octylphenolate)]n・
Butylamine nickel II, nickel complex
3,5-di-t-butyl-4-hydroxybenzyl phosphate monoethylate and the like.
【0016】4)金属不活性化剤としては、シュウ酸誘
導体系、例えばオキサリルビス(ベンジリデンヒドラジ
ッド)等;サリチル酸誘導体系、例えば3−(N−サリ
チロイル)アミノ−1,2,4−トリアゾール等;ヒド
ラジド誘導体系、例えばN,N′−ビス〔3−(3′,
5′−ジ−t−ブチル−4′−ヒドロキシフェニル)プ
ロピオニル〕ヒドラジン、フタル酸ビス(2−フェノキ
シプロピオニルヒドラジッド)等。4) Examples of metal deactivators include oxalic acid derivatives such as oxalyl bis(benzylidene hydrazide); salicylic acid derivatives such as 3-(N-salicyloyl)amino-1,2,4-triazole, etc. ; hydrazide derivative systems, e.g. N,N'-bis[3-(3',
5'-di-t-butyl-4'-hydroxyphenyl)propionyl]hydrazine, bis(2-phenoxypropionylhydrazide) phthalate, and the like.
【0017】5)滑剤としては、モノグリセライド系、
例えばステアリン酸グリセロール等;脂肪酸の高級アル
コール系、例えばステアリルアルコール等;脂肪酸モノ
アミド系、例えばオレイン酸アミド、エルカ酸アミド、
ステアリン酸アミド等;ビスアミド系、例えばエチレン
ビスステアリン酸アミド、ヘキサメチレンビスステアリ
ン酸アミド、エチレンビスオレイン酸アミド等。脂肪酸
系、例えばステアリン酸、ベヘニン酸等;脂肪酸の金属
塩系、例えばステアリン酸カルシウム、ステアリン酸ア
ルミニウム、ステアリン酸亜鉛等。5) As the lubricant, monoglyceride type,
For example, glycerol stearate, etc.; higher alcohols of fatty acids, such as stearyl alcohol; fatty acid monoamides, such as oleic acid amide, erucic acid amide,
Stearic acid amide, etc.; Bisamide type, such as ethylene bis stearic acid amide, hexamethylene bis stearic acid amide, ethylene bis oleic acid amide, etc. Fatty acids, such as stearic acid, behenic acid, etc.; metal salts of fatty acids, such as calcium stearate, aluminum stearate, zinc stearate, etc.
【0018】6)帯電防止剤としては、カチオン系、例
えば四級アンモニウム塩等;非イオン系、例えば脂肪酸
の多価アルコールエステル、ポリオキシエチレンアルキ
ルアミン等;アニオン系例えばアルキルフォスフェート
塩、アルキルスルフォン酸塩等。6) As antistatic agents, cationic ones such as quaternary ammonium salts, nonionic ones such as polyhydric alcohol esters of fatty acids, polyoxyethylene alkylamines, etc.; anionic ones such as alkyl phosphate salts, alkyl sulfones, etc. acid salts etc.
【0019】7)核剤としては芳香族カルボン酸の金属
塩、例えばp−t−ブチル安息香酸アルミニウム、安息
香酸ナトリウム、りん酸ビス(4−t−ブチルフェニル
)ナトリウム等。7) Nucleating agents include metal salts of aromatic carboxylic acids, such as aluminum pt-butylbenzoate, sodium benzoate, and sodium bis(4-t-butylphenyl) phosphate.
【0020】8)透明化剤としては、ベンジリデンソル
ビトール系、例えば1・3,2・4−ジベンジリデンソ
ルビトール、1・3,2・4−ジ(メチルベンジリデン
)ソルビトール、1・3,2・4−ジ(エチルベンジリ
デン)ソルビトール等。8) As a clarifying agent, benzylidene sorbitol type, for example, 1,3,2,4-dibenzylidene sorbitol, 1,3,2,4-di(methylbenzylidene) sorbitol, 1,3,2,4 -di(ethylbenzylidene)sorbitol, etc.
【0021】9)無機充填剤としては、炭酸カルシウム
、シリカ、硫酸マグネシウム、クレー、チタン酸カリ等
。9) Examples of inorganic fillers include calcium carbonate, silica, magnesium sulfate, clay, and potassium titanate.
【0022】10)難燃剤としては、ハロゲン系、例え
ば2,2−ビス−〔4−(2,3−ジブロモプロポキシ
)−3,5−ジブロモフェニル〕プロパン、デカブロモ
ジフェニルオキサイド等;リンハロゲン系、例えばエチ
レンビストリス(2−シアノエチル)フォスフォリウム
ブロミド等;リン系例えばポリりん酸アンモニウム等、
無機系、例えば三酸化アンチモン、水酸化アルミウム、
赤りん等。10) As the flame retardant, halogen type, such as 2,2-bis-[4-(2,3-dibromopropoxy)-3,5-dibromophenyl]propane, decabromodiphenyl oxide, etc.; phosphorus halogen type , such as ethylene bistris (2-cyanoethyl) phosphorium bromide; phosphorus-based materials such as ammonium polyphosphate, etc.
Inorganic systems, such as antimony trioxide, aluminum hydroxide,
Akarin et al.
【0023】11)顔料としては例えば酸化亜鉛、酸化
チタン、酸化鉄、群青、カーボンブラック、アニリンブ
ラック、クロムエロー、チタンエロー、キナクリドンレ
ッド、アンスラキノンレッド、ベンジジンエロー、ピグ
メントスカーレット、フタロシアニングリーン、フタロ
シアニンブルー等。11) Examples of pigments include zinc oxide, titanium oxide, iron oxide, ultramarine blue, carbon black, aniline black, chrome yellow, titanium yellow, quinacridone red, anthraquinone red, benzidine yellow, pigment scarlet, phthalocyanine green, and phthalocyanine blue.
【0024】12)有機過酸化物としては、過酸化ジア
シル類、例えば、過酸化ベンゾイル、過酸化ラウロイル
、過酸化デカノイル等;過酸化アルキル類、例えば過酸
化ジクミル、過酸化ジ−t−ブチル、2,5−ジメチル
−2,5−ジ(t−ブチルパーオキシ)ヘキサン、2,
5−ジメチル−2,5−ジ(t−ブチルパーオキシ)ヘ
キシン−3等;過酸エステル類、例えば過酢酸t−ブチ
ル、過パビリン酸t−ブチル、過ラウリン酸t−ブチル
、過安息香酸t−ブチル等。12) Organic peroxides include diacyl peroxides such as benzoyl peroxide, lauroyl peroxide, decanoyl peroxide, etc.; alkyl peroxides such as dicumyl peroxide, di-t-butyl peroxide, 2,5-dimethyl-2,5-di(t-butylperoxy)hexane, 2,
5-dimethyl-2,5-di(t-butylperoxy)hexyne-3, etc.; peracid esters such as t-butyl peracetate, t-butyl perpavirate, t-butyl perlaurate, perbenzoic acid t-butyl etc.
【0025】13)分散剤としては、WAX系、例えば
モンタン酸カルシウム、モンタン酸カルシウムのエステ
ル付加物、ポリエチレンワックス、ポリプロピレンワッ
クス等である。13) Dispersants include WAX, such as calcium montanate, ester adducts of calcium montanate, polyethylene wax, polypropylene wax, and the like.
【0026】本発明のコンパウンドチップにおける配合
割合は、用途により適宜選定すればよいが、一般に熱可
塑性樹脂チップ100重量部に対して、ブレンドオイル
0.1〜10重量部及び樹脂配合剤0.001〜200
重量部の割合が、本発明の効果が極めて顕著に発揮され
るために好ましい。特に、酸化防止剤、帯電防止剤、滑
剤、分散剤、光安定剤、紫外線吸収剤、核剤、透明化剤
、および金属不活性化剤等は、0.01〜50重量部、
顔料、着色剤、有機過酸化物等は0.001〜10重量
部、無機充填剤、難燃剤、等は1.0〜200重量部が
好ましい。[0026] The blending ratio in the compound chip of the present invention may be appropriately selected depending on the application, but generally 0.1 to 10 parts by weight of blend oil and 0.001 parts by weight of the resin compounding agent are added to 100 parts by weight of the thermoplastic resin chip. ~200
The ratio of parts by weight is preferable because the effects of the present invention are extremely clearly exhibited. In particular, 0.01 to 50 parts by weight of antioxidants, antistatic agents, lubricants, dispersants, light stabilizers, ultraviolet absorbers, nucleating agents, clarifying agents, metal deactivators, etc.
Pigments, colorants, organic peroxides, and the like are preferably 0.001 to 10 parts by weight, and inorganic fillers, flame retardants, and the like are preferably 1.0 to 200 parts by weight.
【0027】本発明の樹脂コンパウンドチップは樹脂チ
ップとブレンドオイル及び所望の配合剤を例えばタンブ
ラーやヘンシェルミキサー等で混合する公知の方法によ
り得られる。即ち、ブレンドオイルを媒体として、樹脂
チップの表面に配合剤を付着させ、さらに目的の配合量
が多い場合は樹脂チップの管状部または凹部(穴)に配
合剤が堆積されるまで混合操作を行えばよい。[0027] The resin compound chips of the present invention can be obtained by a known method of mixing resin chips, blended oil, and desired ingredients using, for example, a tumbler or a Henschel mixer. That is, the compounding agent is attached to the surface of the resin chip using blended oil as a medium, and if the desired amount of compounding is large, the mixing operation is performed until the compounding agent is deposited in the tubular part or recess (hole) of the resin chip. That's fine.
【0028】[0028]
【作用および効果】上記から理解されるように、本発明
の樹脂コンパウンドチップは、管状または凹部形状を有
する樹脂チップとブレンドオイルにより、目的の配合剤
を表面付着及び管状部または凹部への堆積現象により、
樹脂チップ1ケ当り、ほぼ等量を保持させることができ
る。したがって、本発明の樹脂コンパウンドチップは、
マスターバッチまたはドライブレンドコンパウンドの分
野に好適に用いられ、さらに従来のこれらの方法では分
散不良もしくは偏析現象を生じるため困難であった多量
又は比重差の大なる物質を配合せんとする場合等に好適
に用いられる。[Operations and Effects] As understood from the above, the resin compound chip of the present invention uses a resin chip having a tubular or concave shape and a blended oil to cause the desired compounding agent to adhere to the surface and deposit on the tubular or concave portion. According to
Approximately the same amount can be held per resin chip. Therefore, the resin compound chip of the present invention is
Suitable for use in the field of masterbatches or dry blend compounds, and is also suitable for blending large quantities or substances with large differences in specific gravity, which are difficult to achieve with conventional methods due to poor dispersion or segregation phenomena. used for.
【0029】その結果、本発明によれば、添加剤が多量
の場合にも、均一に分散された樹脂コンパウンドチップ
により、良好なペレタイズが可能であるばかりでなく、
そのままマスターバッチとしても使用できるため従来の
練込みが不要(合理化)となり、さらにはそのまま直接
成形に供することもできる。また、本発明においては、
基本的な安定剤だけを練込んだ所定のチップを製造し、
該チップに注文に応じて他の添加剤をブレンド配合した
コンパウンドチップを調製することにより、目的のグレ
ードとして出荷することもできる。即ち、本発明は、グ
レードのチェンジによるオフグレードが減少し安定的運
転ができる合理化、在庫量の削減、少量多品種に即応で
きるなど工業的に極めて有用である。As a result, according to the present invention, even when a large amount of additives are used, not only is good pelletization possible due to uniformly dispersed resin compound chips, but also
Since it can be used as it is as a masterbatch, conventional kneading is not required (rationalization), and furthermore, it can be directly used for molding as it is. Furthermore, in the present invention,
Manufacture a predetermined chip with only basic stabilizers mixed in,
By preparing a compound chip by blending the chip with other additives according to the order, the chip can be shipped as a desired grade. That is, the present invention is extremely useful industrially, such as reducing off-grades due to grade changes, streamlining stable operation, reducing inventory, and being able to quickly respond to small-lot production of a wide variety of products.
【0030】[0030]
【実施例】以下実施例に基づき具体的に説明するが、本
発明は以下の実施例に特に限定されるものではない。
尚、以下の実施例および比較例において使用した測定法
と、添加剤およびポリマーを次に示した。[Examples] The present invention will be specifically explained below based on Examples, but the present invention is not particularly limited to the following Examples. The measurement methods, additives, and polymers used in the following Examples and Comparative Examples are shown below.
【0031】1)灰分測定
射出成形品を5mm角程度に裁断したもの5gを、るつ
ぼに秤量する。徐々に加熱してほとんど灰化した後、い
ったん放冷し、500℃で強熱する。放冷後その重量を
量り灰分を求めた。n=3にて分散性を評価した。1) Ash content measurement 5 g of the injection molded product cut into approximately 5 mm square pieces was weighed into a crucible. After gradually heating until almost all ash is formed, the mixture is allowed to cool and then ignited at 500°C. After cooling, the weight was measured to determine the ash content. Dispersibility was evaluated at n=3.
【0032】2)蛍光X線分析
射出成形品を使用して、蛍光X線分析にてSの検出を行
い、添加剤成分の配合量を求めた。n=3にて分散性を
評価した。2) Fluorescent X-ray Analysis Using the injection molded product, S was detected by fluorescent X-ray analysis to determine the amount of additive components. Dispersibility was evaluated at n=3.
【0032】
3)使用添加剤およびポリマー
A1:ジメチルシロキサン :SH200 東レ・
ダウコーニング・シリコンA2:メチルフェニルシロキ
サン
:SH710 東レ・ダウコーニング・シリコンB
:流動パラフィン :モレスコホワイト
P70 松村石油研究所C1:フタル酸ジオクチ
ル :サンソサイザーDOP 新日本理化
C2:フタル酸ジイソデシル:サンソサイザーDIDP
新日本理化D1:アジピン酸ジ−2−エチルヘ
キシル
:サンソサイザーDOA 新日本理
化D2:セバチン酸ジ−2−エチルヘキシル
:サンソ
サイザーDOS 新日本理化E :トリメ
リット酸トリオクチル
:サンソサイザーTOTM 新日本理化F
:クエン酸アセチルトリブチル
:シトロフレックスA−4 ファイザーG
:エポキシヘキサヒドロフタル酸ジ−2−エチルヘキシ
ル
:サンソサイザーE−PS 新日本理化H1
:タルク :クラウンタル
クP−3 松村産業H2:炭酸カルシウム
:ホワイトン P−30 東洋ファイン
ケミカルH3:酸化チタン :DA
IREN WHITE W−120
大日本インキ化
学工業I :ペンタエリスリトールテトラキス(β−
ラウリルチオプロピオネート)
:Sumilizer
TPD 住友化学工業J1:ポリプロピレン
(ホモタイプ MFR=9g/10min.):ME
140 徳山曹達J2:ポリプロピレン(ホモタイプ
MFR=23g/10min.):MJ160 徳
山曹達J3:ポリプロピレン(ブロックコポリマータイ
プ MFR=7g/10min.)
:MS640 徳山
曹達J4:ポリプロピレン(ブロックコポリマータイプ
MFR=23g/10min.)
:MS670 徳山曹
達J5:ポリプロピレン(ランダムコポリマータイプ
MFR=17g/10min.)
:ME451 徳山曹達
K1:ポリエチレン(高密度タイプ MFR=7g/1
0min.)
:スミカセンハード2623
住友化学工業K2:ポリエチレン(低密度タイプ
MFR=7g/10min.)
:スミカセ
ン L705 住友化学工業L1:ポリブ
テン−1(MFR=4g/10min.)
:ポリブテンM2481 三井石油化学N
:ポリプロピレンパウダー(ブロックコポリマータイ
プ MFR=7g/10min.) トリ
ス(2,4−ジ−t−ブチルフェニル)フォスファイト
:Irgafos168 (チバガイギー)
0.05重量部、ペンタエリスリチル−テトラキス
〔3−(3,5−ジ−t−ブチル−4−ヒドロ
キシフェニル)プロピ オネート〕:Irg
anox1010 (チバガイギー)0.05重量部、
ステア リン酸カルシウム(日本油脂)0.
05重量部を配合P :ポリスチレン
:エスチレン G20 新
日鉄化学3) Additives and polymer A1: Dimethylsiloxane: SH200 Toray Co., Ltd.
Dow Corning Silicone A2: Methylphenylsiloxane
:SH710 Toray Dow Corning Silicon B
: Liquid paraffin : Moresco White P70 Matsumura Oil Research Institute C1 : Dioctyl phthalate : Sansocizer DOP Shin Nippon Chemical C2 : Diisodecyl phthalate : Sansocizer DIDP
New Japan Chemical D1: Di-2-ethylhexyl adipate
: Sansocizer DOA New Japan Chemical D2: Di-2-ethylhexyl sebacate
: Sansocizer DOS New Japan Chemical E : Trioctyl trimellitate
: Sansocizer TOTM New Japan Chemical F
: Acetyltributyl citrate
: Citroflex A-4 Pfizer G
:Epoxyhexahydrophthalate di-2-ethylhexyl
: Sansocizer E-PS New Japan Chemical H1
: Talc : Crown Talc P-3 Matsumura Sangyo H2 : Calcium carbonate
:Whiten P-30 Toyo Fine Chemical H3:Titanium oxide:DA
IREN WHITE W-120
Dainippon Ink Chemical Industry I: Pentaerythritol tetrakis (β-
lauryl thiopropionate)
:Sumilizer
TPD Sumitomo Chemical J1: Polypropylene (homotype MFR=9g/10min.):ME
140 Tokuyama Soda J2: Polypropylene (homotype MFR=23g/10min.): MJ160 Tokuyama Soda J3: Polypropylene (block copolymer type MFR=7g/10min.)
:MS640 Tokuyama Soda J4: Polypropylene (block copolymer type MFR=23g/10min.)
:MS670 Tokuyama Soda J5: Polypropylene (random copolymer type)
MFR=17g/10min. )
:ME451 Tokuyama Soda K1: Polyethylene (high density type MFR=7g/1
0 min. )
: Sumikasen Hard 2623
Sumitomo Chemical K2: Polyethylene (low density type)
MFR=7g/10min. )
: Sumikasen L705 Sumitomo Chemical L1: Polybutene-1 (MFR=4g/10min.)
: Polybutene M2481 Mitsui Petrochemical N
: Polypropylene powder (block copolymer type MFR=7g/10min.) Tris(2,4-di-t-butylphenyl)phosphite: Irgafos168 (Ciba Geigy)
0.05 parts by weight, pentaerythrityl-tetrakis
[3-(3,5-di-t-butyl-4-hydroxyphenyl)propionate]: Irg
anox1010 (Ciba Geigy) 0.05 parts by weight,
Stear calcium phosphate (NOF) 0.
05 parts by weight P: Polystyrene
:Estyrene G20 Nippon Steel Chemical
【0034】実施例1〜28
原料樹脂を30mmφ押出し機(樹脂温度 210℃
、クロスヘッドダイ)で、外径3mm×内径1.5mm
のパイプを成型後、5mm程度に切断した。得られた、
パイプ形状の樹脂チップ100重量部に対して、表1に
示す化合物を配合し、ヘンシェルミキサーで十分に混合
した。この得られた混合物を150ton射出成形機(
樹脂温度 230℃)で、50mmφ×1mmtの成
形品を作成した。この成形品を用いて前述の灰分測定お
よび蛍光X線分析を測定し、分散性の評価を行なった。
灰分測定および蛍光X線分析の測定結果を一括して表1
に示した。Examples 1 to 28 Raw resin was processed using a 30 mmφ extruder (resin temperature 210°C
, crosshead die), outer diameter 3 mm x inner diameter 1.5 mm
After molding the pipe, it was cut into pieces of about 5 mm. obtained,
The compounds shown in Table 1 were blended with 100 parts by weight of pipe-shaped resin chips and thoroughly mixed using a Henschel mixer. This obtained mixture was put into a 150 ton injection molding machine (
A molded product of 50 mmφ x 1 mmt was produced at a resin temperature of 230°C. Using this molded article, the above-mentioned ash content measurement and fluorescent X-ray analysis were performed to evaluate the dispersibility. Table 1 summarizes the measurement results of ash content measurement and fluorescent X-ray analysis.
It was shown to.
【0035】[0035]
【表1】[Table 1]
【0036】比較例1〜15
ブレンドオイルを用いないほかは、実施例と同様に行っ
た。灰分測定および蛍光X線分析の測定結果を表2に示
した。Comparative Examples 1 to 15 Comparative Examples 1 to 15 were carried out in the same manner as in the Examples except that no blended oil was used. Table 2 shows the measurement results of ash content measurement and fluorescent X-ray analysis.
【0037】[0037]
【表2】[Table 2]
【0038】比較例16〜36
樹脂ペレット100重量部に対して、表3に示す化合物
を配合し、ヘンシェルミキサーで十分に混合した。この
得られた混合物を150ton射出成形機(樹脂温度
230℃)で、50mmφ×1mmtの成形品を作成
した。この成形品を用いて前述の灰分測定および蛍光X
線分析を測定し、分散性の評価を行なった。灰分測定お
よび蛍光X線分析の測定結果を一括して表3に示した。Comparative Examples 16 to 36 The compounds shown in Table 3 were blended with 100 parts by weight of resin pellets, and thoroughly mixed using a Henschel mixer. This obtained mixture was applied to a 150 ton injection molding machine (resin temperature
230° C.), a molded product of 50 mmφ×1 mmt was created. Using this molded product, the above-mentioned ash content measurement and fluorescence
Line analysis was measured and dispersion was evaluated. The measurement results of ash content measurement and fluorescent X-ray analysis are collectively shown in Table 3.
【0039】[0039]
【表3】[Table 3]
【0040】比較例(その3)37〜40樹脂パウダー
100重量部に対して、表4に示す化合物を配合し、ヘ
ンシェルミキサーで十分に混合した。この得られた混合
物を50mmφ押出し機(樹脂温度210℃)で、ペレ
ットを作成した。次に、得られたペレットを150to
n射出成形機(樹脂温度 230℃)で、50mmφ
×1mmtの成形品を作成した。この成形品を用いて前
述の灰分測定および蛍光X線分析を測定し、分散性の評
価を行なった。灰分測定および蛍光X線分析の測定結果
を一括して表4に示した。Comparative Example (Part 3) 37-40 The compounds shown in Table 4 were blended with 100 parts by weight of resin powder and mixed thoroughly using a Henschel mixer. Pellets were made from the obtained mixture using a 50 mmφ extruder (resin temperature: 210° C.). Next, 150 to
n injection molding machine (resin temperature 230℃), 50mmφ
A molded product of x1 mmt was created. Using this molded article, the above-mentioned ash content measurement and fluorescent X-ray analysis were performed to evaluate the dispersibility. The measurement results of ash content measurement and fluorescent X-ray analysis are collectively shown in Table 4.
【0041】[0041]
【表4】[Table 4]
【0042】比較例(その4)41〜51樹脂ペレット
100重量部に対して、表5に示す化合物を配合し、ヘ
ンシェルミキサーで十分に混合した。この得られた混合
物を50mmφ押出し機(樹脂温度210℃)で、マス
ターバッチを作成した。次に、樹脂ペレット100重量
部に対して、得られたマスターバッチを表6に示す配合
でヘンシェルミキサーにて十分に混合した。この得られ
た混合物を150ton射出成形機(樹脂温度230℃
)で、50mmφ×1mmtの成形品を作成した。この
成形品を用いて前述の灰分測定および蛍光X線分析を測
定し、分散性の評価を行なった、灰分測定および蛍光X
線分析の測定結果を一括して表6に示した。また、表5
にマスターバッチ作成時のペレタイズ成形性を示した。Comparative Example (No. 4) 41-51 The compounds shown in Table 5 were blended with 100 parts by weight of the resin pellets and thoroughly mixed in a Henschel mixer. A masterbatch was prepared from the obtained mixture using a 50 mmφ extruder (resin temperature: 210° C.). Next, 100 parts by weight of the resin pellets were thoroughly mixed with the obtained masterbatch in the formulation shown in Table 6 using a Henschel mixer. This obtained mixture was molded into a 150 ton injection molding machine (resin temperature: 230°C).
), a molded product of 50 mmφ×1 mmt was created. Ash content measurement and fluorescence X-ray analysis were performed using this molded article to evaluate dispersibility.
The measurement results of the line analysis are collectively shown in Table 6. Also, Table 5
shows the pelletizing formability during masterbatch preparation.
【0043】[0043]
【表5】[Table 5]
【0044】[0044]
【表6】[Table 6]
【0045】実施例29〜38および比較例52〜59
原料樹脂を3mmφ押出機(樹脂温度 210℃、ク
ロスヘッドダイ)により表7に示す外径(d1 )およ
び内径(d2 )を有する各種サイズのパイプを押出し
て成形した後、所定の長さ(L)に切断したチップ、ま
た所定のパイプを押出した直後に一定間隔で熱融着を行
ない、溶融していない部分を切断して、所定の長さ(L
)と両側に所定の長さ(L1 ,L2)を有するチップ
を得た。Examples 29-38 and Comparative Examples 52-59
After extruding and molding the raw resin into pipes of various sizes having the outer diameter (d1) and inner diameter (d2) shown in Table 7 using a 3 mmφ extruder (resin temperature 210°C, crosshead die), ), and immediately after extruding a specified pipe, thermal fusion is performed at regular intervals, and the unfused portion is cut to form a specified length (L
) and a predetermined length (L1, L2) on both sides.
【0046】上記で得たチップそれぞれ100重量部に
対して、ブレンドオイルとして流動パラフィン2重量部
および充填剤としてタルク11重合部をヘンシェルミキ
サーにより十分に混合した。この混合物を150ton
射出成形機(樹脂温度 230℃)で50mmφ×1
mmtの成形品を作成した。この成形品を用いて前述の
灰分測定を行ない、その結果を表7に示した。To 100 parts by weight of each of the chips obtained above, 2 parts by weight of liquid paraffin as a blend oil and 11 parts of polymerized talc as a filler were thoroughly mixed using a Henschel mixer. 150 tons of this mixture
50mmφ×1 with injection molding machine (resin temperature 230℃)
A molded product of mmt was created. The above-mentioned ash content was measured using this molded article, and the results are shown in Table 7.
【0047】[0047]
【表7】[Table 7]
【図1】管状チップを示す模式図である。FIG. 1 is a schematic diagram showing a tubular tip.
【図2】両側に管状の凹部を有するチップを示す模式図
である。FIG. 2 is a schematic diagram showing a chip having tubular recesses on both sides.
【図3】片側に管状の凹部を有するチップを示す模式図
である。FIG. 3 is a schematic diagram showing a chip having a tubular recess on one side.
【図4】表面に1ケのV字状の凹部を有するチップを示
す模式図である。FIG. 4 is a schematic diagram showing a chip having one V-shaped recess on the surface.
【図5】表面に2ケのV字状の凹部を有するチップを示
す模式図である。FIG. 5 is a schematic diagram showing a chip having two V-shaped recesses on its surface.
d1 チップの外径 d2 チップの内径 d3 凹部の深さ L チップの長さ L1 凹部の長さ(深さ) L2 凹部の長さ(深さ) d1 Chip outer diameter d2 Inner diameter of tip d3 Depth of recess L Chip length L1 Length (depth) of recess L2 Length (depth) of recess
Claims (2)
mであり、(イ)内径0.5〜4.5mmの管状体、ま
たは(ロ)深さ0.5〜9mmの凹状部を有する熱可塑
性樹脂チップ。[Claim 1] Outer diameter 1 to 5 mm and length 1 to 10 m
m, and (a) a tubular body with an inner diameter of 0.5 to 4.5 mm, or (b) a thermoplastic resin chip having a concave portion with a depth of 0.5 to 9 mm.
100重量部に対して、ブレンドオイル0.1〜10重
量部および他の添加剤0.001〜200重量部を配合
してなるコンパウンドチップ。2. A compound chip obtained by blending 0.1 to 10 parts by weight of blend oil and 0.001 to 200 parts by weight of other additives to 100 parts by weight of the thermoplastic resin chip according to claim 1. .
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP12280791A JPH04327909A (en) | 1991-04-26 | 1991-04-26 | Thermoplastic resin chip and compound chip |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP12280791A JPH04327909A (en) | 1991-04-26 | 1991-04-26 | Thermoplastic resin chip and compound chip |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH04327909A true JPH04327909A (en) | 1992-11-17 |
Family
ID=14845125
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP12280791A Pending JPH04327909A (en) | 1991-04-26 | 1991-04-26 | Thermoplastic resin chip and compound chip |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH04327909A (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2005087472A1 (en) * | 2004-02-27 | 2005-09-22 | 3M Innovative Properties Company | Heat-curable molding material pellet having multilayer structure |
WO2012025293A1 (en) * | 2010-08-26 | 2012-03-01 | Robert Bosch Gmbh | Optimised pellet geometry |
-
1991
- 1991-04-26 JP JP12280791A patent/JPH04327909A/en active Pending
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2005087472A1 (en) * | 2004-02-27 | 2005-09-22 | 3M Innovative Properties Company | Heat-curable molding material pellet having multilayer structure |
WO2012025293A1 (en) * | 2010-08-26 | 2012-03-01 | Robert Bosch Gmbh | Optimised pellet geometry |
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