JPH0432548U - - Google Patents

Info

Publication number
JPH0432548U
JPH0432548U JP1990073349U JP7334990U JPH0432548U JP H0432548 U JPH0432548 U JP H0432548U JP 1990073349 U JP1990073349 U JP 1990073349U JP 7334990 U JP7334990 U JP 7334990U JP H0432548 U JPH0432548 U JP H0432548U
Authority
JP
Japan
Prior art keywords
lens
optical axis
header
optical semiconductor
projection
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1990073349U
Other languages
English (en)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1990073349U priority Critical patent/JPH0432548U/ja
Publication of JPH0432548U publication Critical patent/JPH0432548U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/42—Wire connectors; Manufacturing methods related thereto
    • H01L24/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L24/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)

Description

【図面の簡単な説明】
第１図は本考案の第１の実施例ヘツダの外観図
、第２図は本考案の実施例の組立工程図、第３図
は従来例の透視図、第４図はキヤンシール工程図
、第５図はレンズキヤン実装図、第６図は本考案
の第２の実施例の構造図、第７図は本考案の第３
の実施例の構造図、第８図は取り付け部への実装
方法示す図である。 ２，１４，１５……突起部、５……光軸、１０
……ヘツダ、１１……レンズキヤン。

Claims (1)

  1. 【実用新案登録請求の範囲】 (1) レンズ付きキヤン構造の光半導体素子にお
    いて、ヘツダに光軸合わせ用の突起部を設けたこ
    とを特徴とする光半導体素子。 (2) レンズ付きキヤン構造の光半導体素子にお
    いて、キヤンの内側に光軸合わせ用の突起部を設
    けたことを特徴とする光半導体素子。 (3) レンズ付きキヤン構造の光半導体素子にお
    いて、キヤンの外側と、キヤンの内側かヘツダの
    外側のいずれか一方とに光軸用の突起部を設けた
    ことを特徴とする光半導体素子。
JP1990073349U 1990-07-12 1990-07-12 Pending JPH0432548U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1990073349U JPH0432548U (ja) 1990-07-12 1990-07-12

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1990073349U JPH0432548U (ja) 1990-07-12 1990-07-12

Publications (1)

Publication Number Publication Date
JPH0432548U true JPH0432548U (ja) 1992-03-17

Family

ID=31612094

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1990073349U Pending JPH0432548U (ja) 1990-07-12 1990-07-12

Country Status (1)

Country Link
JP (1) JPH0432548U (ja)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005158874A (ja) * 2003-11-21 2005-06-16 Toshiba Corp 光受信装置及びその製造方法

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005158874A (ja) * 2003-11-21 2005-06-16 Toshiba Corp 光受信装置及びその製造方法

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