JPH04323622A - Display device - Google Patents

Abstract

PURPOSE:To assure the sufficient adhesive area of a film substrate and a substrate for display and the strength of adhesion therebetween while diminishing the uneffective display region of the display device. CONSTITUTION:A flat planar substrate la having a connecting terminal 3 constituting a flat plate type display panel is provided. A film substrate 2 having a conductor pattern 4, the front end of which is thermally compression bonded via an anisotropic conductive film 5 or directly of a heat seal connector 7 subjected to the direct thermocompression bonding is provided on the surface of the substrate 1a disposed with the above-mentioned connecting terminal 3 and the surface of the other substrate 1b making a pair with the substrate 1a perpendicular to the surface.

Description

[Detailed description of the invention]

0001

[Industrial Application Field] The present invention relates to a display device in which electrodes on a circuit board are connected to connection terminals provided on a flat board via a conductor pattern on a film board or a heat seal connector. It is related to.

0002

2. Description of the Related Art FIG. 9 is a schematic sectional view showing a conventional display device disclosed in, for example, Japanese Unexamined Patent Publication No. 2-29628.
In the figure, 1 is a liquid crystal display panel, 1a and 1b are glass substrates as two flat substrates constituting the liquid crystal display panel 1, 2 is a film substrate that supplies drive signals to the liquid crystal display panel 1, and 3 is a glass substrate. A connecting terminal on the substrate 1a, 4 a conductive pattern on the film substrate 2, and 5 an anisotropic conductive film for electrically connecting the connecting terminal 3 on the glass substrate 1a and the conductive pattern 4 on the film substrate 2. It is.

FIG. 10 is a perspective view showing a conventional display element disclosed in Japanese Utility Model Application Publication No. 2-126177.
1 is a liquid crystal display panel, 1a and 1b are two glass substrates forming the liquid crystal display panel 1, 6 is a printed circuit board that generates a driving signal for the liquid crystal display panel 1, and 7 is a printed circuit board 6 and a liquid crystal display panel 1. It is a heat seal connector that connects. Further, FIGS. 11 and 12 are cross-sectional views showing the structures of the anisotropic conductive film 5 and the heat seal connector 7, respectively, in which 11 is a binder, 12 is a conductive particle, and 1
3 is a base film, 14 is a conductor layer disposed on the base film 13, and 15 is an adhesive layer.

Next, the procedure for connecting the connection terminal 3 and the conductor pattern 4 using the anisotropic conductive film 5 will be explained. First, an anisotropic conductive film 5 is sandwiched between a glass substrate 1a and a film substrate 2 to be connected to form a sandwich structure as shown in FIG. At this time, the connection terminals 3 on the glass substrate 1a and the conductor patterns 4 on the film substrate 2 are arranged so as to overlap. In this state, pressure is applied from the film substrate 2 side,
11 between the connection terminal 3 and the conductor pattern 4 when heated.
The binder 11 as shown in FIG. 1 is extruded, and the remaining conductive particles 12 come into contact with the connecting terminal 3 and the conductive pattern 4, thereby establishing an electrical connection between them. By maintaining this state by the adhesive action of the binder 11,
Electrical continuity is maintained.

On the other hand, in the case of a heat seal connector 7 as shown in FIG. 10, the base film 1 shown in FIG.
The conductor layer 14 on the glass substrate 1 is attached to the glass substrate 1 through the adhesive layer 15.
It is superimposed on the connection terminal 3 on a or 1b, and pressurized and heated from the base film 13 side. As a result, the adhesive layer 15 between the conductor layer 14 and the connection terminal 3 is pushed out, and the conductor layer 14 and the connection terminal 3 come into contact with each other. In this state, adhesive layer 1
5, the base film 13 and the glass substrate 1a or 1b
Electrical continuity is maintained by firmly adhering the

[0006]

[Problems to be Solved by the Invention] Since the conventional display device is constructed as described above, the anisotropic conductive film 5 or the heat-seal connector 7 is basically made of an adhesive using the binder 11 or the adhesive layer 15. Therefore, in order to maintain a reliable connection state, a certain amount of bonding area is required, for example, 2.0 mm for the anisotropic conductive film 5, and heat sealing. The connector 7 requires a bonding width of at least 1.5 mm. Therefore, the width of the portion of the glass substrate 1a of the liquid crystal display panel 1 where the connection terminals are arranged needs to be approximately 2.0 mm to 3.0 mm. When used as a device, there were problems such as the portion outside the effective display area (referred to as a frame portion) becoming large.

The present invention was made to solve the above-mentioned problems, and it is possible to suppress the area outside the effective display area to a sufficiently small size compared to the conventional one, and also to reduce the distance between the film substrate and the display substrate sufficiently. The object of the present invention is to obtain a display device that can ensure a sufficient adhesive area and adhesive strength.

[0008]

[Means for Solving the Problems] A display device according to the present invention includes a flat board having connection terminals constituting a flat display panel, and includes a surface of the board on which the connection terminals are disposed, and a surface of the board on which the connection terminals are disposed and A film substrate or a heat-seal connector directly thermocompressed is provided on a surface perpendicular to the above surface of another substrate that is paired with the substrate, the tip of which has a conductor pattern thermocompression bonded via an anisotropic conductive film. It is something that

[0009]

[Operation] The film substrate and the heat-seal connector of the present invention can be applied to the surface of the substrate on which the connection terminal is arranged and the other substrate paired with this substrate, respectively, through an anisotropic conductive film or directly. By adhering to a surface perpendicular to the above surface by applying pressure and heating, it is possible to secure a sufficiently large effective display area while keeping the adhesion area small.

0010

DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of the present invention will be described below with reference to the drawings. In FIG. 1, 1 is a liquid crystal display panel, 1a, 1b
2 are glass substrates as two flat substrates constituting the liquid crystal display panel 1, 2 is a film substrate that supplies drive signals to the liquid crystal display panel 1, 3 is a connection terminal on the glass substrate 1a, and 4 is the film substrate 2. The upper conductor pattern 5 is an anisotropic conductive film for electrically connecting the connection terminal 3 on the glass substrate 1a and the conductor pattern 4 on the film substrate 2. Further, the film substrate 2 having the conductor pattern 4 has its tip bent at a substantially right angle, and is attached to a part of the connection terminal 3 on the glass substrate 1a and the periphery of the glass substrate 1b via the anisotropic conductive film 5. It is glued.

Next, a procedure for assembling the flat panel display device will be explained. First, among the connection terminals 3 on the glass substrate 1a constituting the flat display panel 1 and the conductor pattern 4 on the film substrate 2 that supplies drive signals for the liquid crystal display panel 1, those located at the tip of the film substrate 2 Align so that they overlap. Next, the anisotropic conductive film 5 is placed between the glass substrate 1a and the film substrate 2, pressurized and heated, and the tip of the film substrate 2 is
Bend the glass substrate 1b along a plane perpendicular to the surface on which the connection terminals 3 are disposed, and
There is also an anisotropic conductive film 5 between the surface perpendicular to the surface on which the
Pressure and heat are applied by intervening.

As a result, the film substrate 2 is fixed to the glass substrates 1a and 1b, and the electrical connection between the connection terminals 3 and the conductive patterns 4 is maintained. Usually, flat display panel 1
Since the glass substrate 1b used for this is about 1 mm thick, the above method allows for an adhesive width of about 1 mm in addition to the area where the connecting terminals 3 are arranged.
Even if the adhesive width at the portion where the connection terminal 3 is provided is small, reliable connection can be made.

In the above embodiment, the film substrate 2 is bonded via the anisotropic conductive film 5 to the surface of the glass substrate 1b perpendicular to the surface on which the connection terminals 3 are arranged. As shown in FIG. 2, the bonding area can be further increased by bonding the film substrate 2 to the surfaces of both the glass substrates 1a and 1b that are perpendicular to the surface on which the connection terminals 3 are disposed. .

Furthermore, in the embodiment shown in FIG.
The plate thicknesses of a and 1b were the same, but as shown in Figure 3,
The thickness of the glass substrate 1b may be made thicker than the thickness of the glass substrate 1a, and in this case, the bonding area can be further increased.

Furthermore, in the embodiment shown in FIG. 2, the glass substrates 1a and 1b had the same thickness, but as shown in FIG. By increasing the thickness, the bonding area can be increased.

FIG. 5 is a sectional view showing an embodiment in which the heat seal connector 7 is used. Here, the tip of the heat seal connector 7 is connected to the connection terminal 3 on the glass substrate 1a.
On the other hand, the connection is made on a vertical plane along the plane of the connection terminal, and the desired bonding width can be obtained as in FIG.

In such a flat panel display panel, the connection terminals 3 on the glass substrate 1a and the conductor layer 14 on the base film 13 of the heat seal connector 7 as shown in FIG. 12 are positioned so that they overlap. At the same time, the heat seal connector 7 is bent along a plane perpendicular to the surface on which the connection terminals 3 of the glass substrate 1b are arranged, and the connection terminals 3 of the glass substrate 1b are arranged. The heat seal connector 7 is also pressurized and heated against a surface perpendicular to the surface. As a result, the heat seal connector 7
are fixed to the glass substrates 1a and 1b, and the electrical connection between the connection terminal 3 and the conductor layer 14 is maintained.

In the embodiment shown in FIG. 5, the heat seal connector 7 is bonded to the surface of the glass substrate 1b that is perpendicular to the surface on which the connection terminals 3 are disposed, but as shown in FIG. The bonding area can be further increased by bonding the heat seal connector 3 to the surfaces of both the glass substrates 1a and 1b that are perpendicular to the surfaces on which the connection terminals 3 are disposed.

Furthermore, in the embodiment shown in FIG.
Although the case where the plate thicknesses of a and 1b are the same is shown, the glass substrate 1b
As shown in FIG. 7, the thickness of the glass substrate 1a may be made thicker than that of the glass substrate 1a, and in this case, the bonding area can be increased.

Furthermore, although the example shown in FIG. 6 shows the case where the glass substrates 1a and 1b have the same thickness, as shown in FIG. By increasing the thickness, the bonding area can be increased.

[0021]

As described above, according to the present invention, a flat display panel is provided with a flat substrate having connection terminals, and the surface of the substrate on which the connection terminals are arranged and the surface of the substrate On the surface perpendicular to the above surface of the other board forming the pair,
In the case of an anisotropic conductive film or a heat seal connector, the tip part has a film substrate with a conductor pattern thermocompressed through an anisotropic conductive film or a heat seal connector directly thermocompressed. The adhesive width required for this can be made much smaller than before, the desired adhesive reliability can be obtained, and as a result, the effective display area can be enlarged by the reduced width.

[Brief explanation of drawings]

FIG. 1 is a sectional view showing a display device according to an embodiment of the present invention.

FIG. 2 is a sectional view showing a display device according to another embodiment of the invention.

FIG. 3 is a sectional view showing a display device according to still another embodiment of the present invention.

FIG. 4 is a sectional view showing a display device according to another embodiment of the present invention.

FIG. 5 is a sectional view showing a display device according to another embodiment of the invention.

FIG. 6 is a sectional view showing a display device according to yet another embodiment of the invention.

FIG. 7 is a sectional view showing a display device according to another embodiment of the invention.

FIG. 8 is a sectional view showing a display device according to yet another embodiment of the invention.

FIG. 9 is a sectional view showing a conventional display device.

FIG. 10 is a perspective view showing another conventional example of a display device.

FIG. 11 is a cross-sectional view showing an anisotropic conductive film.

FIG. 12 is a sectional view showing a heat seal connector.

[Explanation of symbols]

1a Substrate (glass substrate) 1b Substrate (glass substrate) 2 Film substrate 3 Connection terminal 4 Conductor pattern 5 Anisotropic conductive film 7 Heat seal connector

Claims (1)

[Claims] 1. A flat board having connection terminals constituting a flat display panel, a surface of the board on which the connection terminals are provided, and a surface of another board that is paired with the board at right angles to the surface. 1. A display device comprising a film substrate having a conductor pattern whose tip end is thermocompression bonded via an anisotropic conductive film or a heat seal connector directly thermocompression bonded to a top surface thereof.