JPH04323339A - Iridium wire and sheet - Google Patents
Iridium wire and sheetInfo
- Publication number
- JPH04323339A JPH04323339A JP11537291A JP11537291A JPH04323339A JP H04323339 A JPH04323339 A JP H04323339A JP 11537291 A JP11537291 A JP 11537291A JP 11537291 A JP11537291 A JP 11537291A JP H04323339 A JPH04323339 A JP H04323339A
- Authority
- JP
- Japan
- Prior art keywords
- iridium
- zirconium
- sheet
- wire
- hafnium
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- GKOZUEZYRPOHIO-UHFFFAOYSA-N iridium atom Chemical compound [Ir] GKOZUEZYRPOHIO-UHFFFAOYSA-N 0.000 title claims abstract description 19
- 229910052741 iridium Inorganic materials 0.000 claims abstract description 11
- QCWXUUIWCKQGHC-UHFFFAOYSA-N Zirconium Chemical compound [Zr] QCWXUUIWCKQGHC-UHFFFAOYSA-N 0.000 claims abstract description 10
- 229910052726 zirconium Inorganic materials 0.000 claims abstract description 10
- 229910052735 hafnium Inorganic materials 0.000 claims abstract description 9
- VBJZVLUMGGDVMO-UHFFFAOYSA-N hafnium atom Chemical compound [Hf] VBJZVLUMGGDVMO-UHFFFAOYSA-N 0.000 claims abstract description 9
- 229910052727 yttrium Inorganic materials 0.000 claims abstract description 9
- VWQVUPCCIRVNHF-UHFFFAOYSA-N yttrium atom Chemical compound [Y] VWQVUPCCIRVNHF-UHFFFAOYSA-N 0.000 claims abstract description 9
- 239000000463 material Substances 0.000 claims description 20
- 229910052751 metal Inorganic materials 0.000 claims description 4
- 239000002184 metal Substances 0.000 claims description 4
- 238000005260 corrosion Methods 0.000 abstract description 5
- 230000007797 corrosion Effects 0.000 abstract description 5
- 230000001590 oxidative effect Effects 0.000 abstract description 4
- 239000000126 substance Substances 0.000 abstract description 2
- 238000005336 cracking Methods 0.000 abstract 1
- 230000003746 surface roughness Effects 0.000 description 5
- 238000000034 method Methods 0.000 description 4
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 2
- 238000004663 powder metallurgy Methods 0.000 description 2
- PWHULOQIROXLJO-UHFFFAOYSA-N Manganese Chemical compound [Mn] PWHULOQIROXLJO-UHFFFAOYSA-N 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000007772 electrode material Substances 0.000 description 1
- 230000003628 erosive effect Effects 0.000 description 1
- 238000005098 hot rolling Methods 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 229910052748 manganese Inorganic materials 0.000 description 1
- 239000011572 manganese Substances 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 229910052697 platinum Inorganic materials 0.000 description 1
- 238000001953 recrystallisation Methods 0.000 description 1
- 229910052703 rhodium Inorganic materials 0.000 description 1
- 239000010948 rhodium Substances 0.000 description 1
- MHOVAHRLVXNVSD-UHFFFAOYSA-N rhodium atom Chemical compound [Rh] MHOVAHRLVXNVSD-UHFFFAOYSA-N 0.000 description 1
- 238000005491 wire drawing Methods 0.000 description 1
Landscapes
- Non-Insulated Conductors (AREA)
Abstract
Description
【0001】0001
【産業上の利用分野】本発明は、化学的、熱酸化的もし
くは電気的な侵食を伴う雰囲気で使用されるイリジウム
線および薄板材料に関するものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to iridium wire and sheet materials used in chemical, thermal oxidative or electrically aggressive atmospheres.
【0002】0002
【従来の技術とその問題点】イリジウム材料は高い融点
と耐蝕性を有するイリジウム金属自身の特性を生かし、
ドットプリンタのピン先や放電を伴う電極材料等、耐蝕
性が必要な部位に用いられてきた。これらの材料は直径
1mm以下の線材もしくは厚み1mm以下の薄板材をカ
ットした形状で用いられるが、従来の純イリジウムを熱
間で引抜き加工する方法では線材長手方向に対し垂直方
向に多数の細かいクラックが表面に発生し、線材破断を
生じたり、使用中に侵食が発生する原因となっていた。
また、薄板材でも同様の問題が発生し、熱間圧延中に板
材表面にクラックを生じていた。これらのクラックは径
の太い棒状材料や厚い板材料では無視できるものであっ
たが、特に引張力をかけながらの細い線材や薄い板材の
熱間加工では重要な問題となっており、その主となる要
因はイリジウムが熱間加工中に酸化揮発して、材料表面
が荒れることがきっかけとなって起こるものと考えられ
る。このような問題を避ける方法としては粉末冶金法や
圧延材を薄く切り出す方法があるが、粉末冶金法では密
度を98%以上に高めることが困難で、使用中に著しい
消耗をもたらすものであった。また、圧延材を薄く切り
出す方法では切断の手間がかかるとともに切断時の地金
ロスの発生が多く経済性に欠け実用的な方法ではなかっ
た。[Prior art and its problems] Iridium material takes advantage of the characteristics of iridium metal itself, which has a high melting point and corrosion resistance.
It has been used in areas that require corrosion resistance, such as the pin tips of dot printers and electrode materials that involve electrical discharge. These materials are used in the form of cut wires with a diameter of 1 mm or less or thin plates with a thickness of 1 mm or less, but the conventional method of hot drawing pure iridium produces many small cracks in the direction perpendicular to the longitudinal direction of the wire. was generated on the surface, causing the wire to break and corrosion to occur during use. A similar problem also occurred with thin plate materials, with cracks occurring on the surface of the plate materials during hot rolling. These cracks can be ignored in rod-shaped materials with large diameters and thick plate materials, but they have become an important problem especially when hot working thin wire rods and thin plate materials while applying tensile force. The reason for this is thought to be that iridium oxidizes and volatilizes during hot working, causing the material surface to become rough. Methods to avoid such problems include powder metallurgy and cutting rolled material into thin pieces, but powder metallurgy makes it difficult to increase the density to over 98%, resulting in significant wear and tear during use. . In addition, the method of cutting a rolled material into thin pieces takes time and effort to cut, and there is a lot of metal loss during cutting, making it uneconomical and not a practical method.
【0003】0003
【発明の目的】本発明は、上記事情に鑑みなされたもの
で、高密度で安価な材料を提供できる線材引抜き法やロ
ールによる薄板加工に於いて、加工中の材料破断を防ぎ
、使用中の侵食を防止するため、材料表面にクラックの
ない材料を提供することを目的とする。[Object of the Invention] The present invention has been made in view of the above circumstances, and is used to prevent material breakage during processing and to prevent material breakage during processing in the wire drawing method and roll-based thin plate processing that can provide high-density and inexpensive materials. The purpose is to provide a material without cracks on the material surface to prevent erosion.
【0004】0004
【課題を解決するための手段】本発明は、イリジウムに
ジルコニウム、ハフニウム、イットリウムより選ばれた
少なくとも1種の金属を20〜5000ppm含有する
ことを特徴とするイリジウム線および薄板材料である。[Means for Solving the Problems] The present invention is an iridium wire and thin plate material characterized by containing 20 to 5000 ppm of at least one metal selected from zirconium, hafnium, and yttrium in iridium.
【0005】ジルコニウム、ハフニウム、イットリウム
はイリジウムに比べ酸化し易く、イリジウム自身の酸化
を防ぐもので、酸化雰囲気中高温にさらされても加工中
の破断につながる表面荒れを防ぐものである。また、侵
食を伴う雰囲気中で使用する場合、例えば酸化雰囲気中
1000℃以上の高温にさらされると、イリジウムの酸
化揮発が増大するが、前記ジルコニウム、ハフニウム、
イットリウムの少なくとも1種を加えることにより、使
用中の消耗量を減少させることができるものである。Zirconium, hafnium, and yttrium are more easily oxidized than iridium, and are used to prevent iridium itself from being oxidized, thereby preventing surface roughness that could lead to breakage during processing even when exposed to high temperatures in an oxidizing atmosphere. Furthermore, when used in an corrosive atmosphere, for example, when exposed to high temperatures of 1000°C or higher in an oxidizing atmosphere, the oxidation and volatilization of iridium increases; however, the zirconium, hafnium,
By adding at least one type of yttrium, the amount of consumption during use can be reduced.
【0006】一方前記ジルコニウム、ハフニウム、イッ
トリウムの少なくとも1種を加えても、1400℃以上
の高温にさらされたり、加工率が小さい場合には再結晶
化が起こり、充分な特性が得られない。このためイリジ
ウム合金の脆性が改善される温度である800℃より再
結晶化が起こる1400℃までの範囲でトータル50%
以上の加工をすることが必要となる。また、ジルコニウ
ム、ハフニウム、イットリウムの少なくとも1種を加え
る量は5000ppmを超えると特に引抜力が大きくな
り、口付け部の破断が生じ加工が困難となるものである
。On the other hand, even if at least one of the above-mentioned zirconium, hafnium, and yttrium is added, recrystallization occurs when exposed to high temperatures of 1400° C. or higher or when the processing rate is small, and sufficient properties cannot be obtained. Therefore, a total of 50% of
The above processing is required. Furthermore, if the amount of at least one of zirconium, hafnium, and yttrium added exceeds 5000 ppm, the pulling force becomes particularly large, causing breakage of the opening portion and making processing difficult.
【0007】以下、本発明の実施例を記載するが、該実
施例は本発明を限定するものではない。[0007] Examples of the present invention will be described below, but these examples are not intended to limit the present invention.
【0008】[0008]
【実施例】99.96%の純度(他の含有元素として白
金、ロジウムが数百ppm、マンガン、鉄が数十ppm
、その他数ppm)をもつイリジウム粉末に表1のよう
に0〜8000ppmのジルコニウム、ハフニウム、イ
ットリウムを段階的に加えて溶解し、1500℃でハマ
リングを行ない、8mm角のインゴットを得た。これを
1500℃で再結晶化処理した後、800〜1300℃
の温度範囲で1回のリダクションを10〜25%とし、
断面減少率95%の熱間加工を行った後、材料断面組織
を200倍で観察し、結晶粒の大きい順にABCのラン
ク付けを行うとともに加工中の破断回数および10cm
長さ中に存在する目視で確認できるクラック数をカウン
トした。また、それぞれ長さ各5cmを1200℃大気
中に8時間さらし表面の荒れを観察し、荒れの多い順か
らABCのランク付けを行い使用中の侵食の目安とした
。なお、比較のためにイリジウム粉末のみで溶解し同様
に処理したものも含む。その結果は表1に示すものであ
った。[Example] 99.96% purity (Other contained elements include several hundred ppm of platinum and rhodium, and several tens of ppm of manganese and iron.
0 to 8,000 ppm of zirconium, hafnium, and yttrium were added stepwise as shown in Table 1 to iridium powder containing 1,000 to 1,000 ppm of zirconium, and several ppm of others) and dissolved therein, followed by hammering at 1,500° C. to obtain an 8 mm square ingot. After recrystallizing this at 1500℃,
One reduction is 10-25% in the temperature range of
After hot working with a cross-section reduction rate of 95%, the cross-sectional structure of the material was observed at 200x magnification, and the ABC ranking was performed in descending order of grain size, as well as the number of fractures during processing and the 10 cm
The number of visually visible cracks present along the length was counted. In addition, each 5 cm length was exposed to the atmosphere at 1200° C. for 8 hours to observe the surface roughness, and the surface roughness was ranked ABC in descending order of roughness, which was used as a measure of corrosion during use. For comparison, the results also include those dissolved with only iridium powder and treated in the same manner. The results are shown in Table 1.
【0009】[0009]
【表1】[Table 1]
【0010】0010
【発明の効果】以上の説明から明らかなように、イリジ
ウムにジルコニウム、ハフニウム、イットリウムの少な
くとも1種を20〜5000ppm含有する材料とする
ことで、クラックの発生を防止し、加工中の破断回数を
も防止し表面の荒れを解消することができ、従来の課題
を解決することを可能とした画期的なものといえる。Effects of the Invention As is clear from the above explanation, by using a material containing 20 to 5000 ppm of at least one of zirconium, hafnium, and yttrium in iridium, the occurrence of cracks can be prevented and the number of breaks during processing can be reduced. It can be said to be an epoch-making product that has made it possible to solve the conventional problems by preventing surface roughness and eliminating surface roughness.
Claims (1)
ム、イットリウムより選ばれた少なくとも1種の金属を
20〜5000ppm含有することを特徴とするイリジ
ウム線および薄板材料。1. An iridium wire and thin plate material containing 20 to 5000 ppm of at least one metal selected from zirconium, hafnium, and yttrium in iridium.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP11537291A JPH04323339A (en) | 1991-04-19 | 1991-04-19 | Iridium wire and sheet |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP11537291A JPH04323339A (en) | 1991-04-19 | 1991-04-19 | Iridium wire and sheet |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH04323339A true JPH04323339A (en) | 1992-11-12 |
Family
ID=14660901
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP11537291A Pending JPH04323339A (en) | 1991-04-19 | 1991-04-19 | Iridium wire and sheet |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH04323339A (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2009107289A1 (en) * | 2008-02-27 | 2009-09-03 | 田中貴金属工業株式会社 | Iridium alloy excellent in hardness, processability and stain proofness |
WO2012108338A1 (en) * | 2011-02-08 | 2012-08-16 | 田中貴金属工業株式会社 | Rhodium alloy which has excellent hardness, processability and antifouling characteristics and is suitable for wire rod for probe pins |
-
1991
- 1991-04-19 JP JP11537291A patent/JPH04323339A/en active Pending
Cited By (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2009107289A1 (en) * | 2008-02-27 | 2009-09-03 | 田中貴金属工業株式会社 | Iridium alloy excellent in hardness, processability and stain proofness |
US9063173B2 (en) | 2008-02-27 | 2015-06-23 | Tanaka Kikinzoku Kogyo K.K. | Iridium alloy excellent in hardness, workability and anti-contamination properties |
WO2012108338A1 (en) * | 2011-02-08 | 2012-08-16 | 田中貴金属工業株式会社 | Rhodium alloy which has excellent hardness, processability and antifouling characteristics and is suitable for wire rod for probe pins |
JP2012163460A (en) * | 2011-02-08 | 2012-08-30 | Tanaka Kikinzoku Kogyo Kk | Probe pin |
KR20130107360A (en) * | 2011-02-08 | 2013-10-01 | 다나카 기킨조쿠 고교 가부시키가이샤 | Rhodium alloy which has excellent hardness, processability and antifouling characteristic and is suitable for wire rod for probe pins |
CN103348254A (en) * | 2011-02-08 | 2013-10-09 | 田中贵金属工业株式会社 | Rhodium alloy which has excellent hardness, processability and antifouling characteristics and is suitable for wire rod for probe pins |
CN103348254B (en) * | 2011-02-08 | 2015-09-30 | 田中贵金属工业株式会社 | The probe be made up of rhodium alloy |
US9297833B2 (en) | 2011-02-08 | 2016-03-29 | Tanaka Kikinzoku Kogyo K.K. | Rhodium alloy having excellent hardness, processability and antifouling properties and suitable for wire rod for probe pins |
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