JPH0432299A - Cooler for electronic apparatus - Google Patents

Abstract

PURPOSE:To cool the apparatus efficiently and miniaturize the cooler by providing the storage case of an electronic component with a hollow heat absorbing tube, which pierces this vertically, so as to increase the surface area for heat radiation, in the cooler for a totally enclosed self cooling box type electronic apparatus. CONSTITUTION:In the rough constitution of a power converter, a box-type case 11 of total enclosure structure, which stores electronic components 4 requiring waterproof properties such as a semiconductor element 2 for power conversion, a control circuit part (printed board) 3, etc., a heat radiating fin for the semiconductor element 2, and a case 6 easy in ventilation, which stores electronic components generating a large amount of heat excluding the electronic components 4, are formed integrally. The case is provided with many hollow heat absorbing tubes 12, which pierce this vertically. The air inside the hollow heat absorbing tubes 12 absorbs the heat from the inside air of the case 11 wherein the temperature has risen and rises in temperature, whereby it becomes a rising air flow, so it is replaced with the outside air whose temperature is low, whereby heat replacement can be performed successively.

Description

DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a cooling device that skillfully increases the heat dissipation surface area of a completely enclosed box-shaped electronic device to efficiently cool the device.

[Conventional technology]

A conventional example of a cooling device for electronic equipment will be explained based on FIGS. 3 and 4. These figures show a schematic configuration of a power conversion device, in which a power conversion semiconductor element 2, a control circuit section (printed circuit board) 3, and other electronic components 4 that require waterproofness are housed in a box-shaped case 1 with a completely enclosed structure. A radiation fin 5 made of a material having a high heat transfer coefficient is attached to the back surface of the negative side plate to radiate the heat generated by the semiconductor element 2. The radiation fin 5 is surrounded by a box 6 formed by a cylindrical extension of the case extending to the back side of the negative side plate and an end plate attached to the end surface of the cylindrical extension. This box body 6 has a large number of ventilation holes 6a arranged in at least the ceiling plate and the bottom plate so that inside air and outside air can be easily ventilated. It is designed to store parts. The temperature of the inside air of the case 1 rises due to part of the heat generated by the electronic component 4, and this inside air is cooled to below the allowable temperature limit of the electronic component 4 by radiating heat from the outer surface of the case 1.

[Problem to be solved by the invention]

In the above structure, the case 1 becomes large in order to secure a heat dissipation surface area, which makes it difficult to handle electronic equipment installed in the underfloor ring of a vehicle.As a countermeasure, attempts were made to downsize the case by installing a blower fan for cooling. This has the drawback that maintenance work for the fan requires a lot of effort.

In order to eliminate the above-mentioned drawbacks, the present invention provides a cooling device for a completely enclosed self-cooling box type electronic device that can be downsized by skillfully increasing the heat dissipation surface area and efficiently cooling the device. With the goal.

[Means to solve the problem]

In order to achieve the above-mentioned object, the present invention provides a storage case 11 for electronic components 4 with a hollow heat absorption tube 12 that vertically passes through the storage case 11 to increase the heat radiation surface area.

[Effect]

In case 1, the temperature of the air inside the hollow heat absorption tube 12 has increased.
The temperature of the case 11 increases through heat exchange with the inside air of the case 11, and this creates an upward air flow, so that the inside air of the case 11 can be cooled by successive heat exchanges.

〔Example〕

FIG. 1 and FIG. 2 show an embodiment of this invention.
Components designated by the same reference numerals as in FIGS. 3 and 4 are the same parts. These figures show the schematic configuration of the power conversion device, including a power conversion semiconductor element 2, a control circuit section (printed board) 3
A box-shaped case 11 with a completely closed structure that stores electronic components 4 that require waterproofness, such as a heat dissipating fin 5 of a semiconductor element 2, and an easily ventilated box that stores electrical components (not shown) that generate a large amount of heat other than the electronic components 4. The body 6 is integrally formed. The case 11 is provided with a large number of hollow heat-absorbing tubes 12 passing through the case 11 in the vertical direction.

According to the embodiment described above, the air inside the hollow heat absorption tube 12 exchanges heat with the inside air of the case 11 whose temperature has increased, and the temperature rises, resulting in an upward air flow, so that the air in the hollow heat absorption tube 12 replaces the outside air with a low temperature and is replaced with the inside air of the case 11. Heat exchange can be performed with Therefore, the inside air of the case 11 can radiate heat from the outer surface of the case 11 and exchange heat with the air inside the heat absorption tube 12, thereby being efficiently cooled. The heat absorption tube 12 may have a circular inner circumference cross section, but the heat absorption effect can be increased by providing a large number of axial protrusions on the inner circumference by drawing radially as shown in the figure to increase the surface area of the inner circumference. can.

In the embodiment described above, a case has been described in which a power conversion device is provided with a box-shaped case 11 having a completely closed structure and a box body 6 that is easily ventilated, but the present invention is not limited thereto.

〔Effect of the invention〕

According to the present invention, in a completely enclosed self-cooling type box type electronic equipment cooling device, a hollow heat absorption pipe is provided in the storage case for electronic components and vertically penetrates the case to skillfully increase the heat dissipation surface area. The effect is that it can be efficiently cooled and downsized.

[Brief explanation of drawings]

FIG. 1 is a longitudinal cross-sectional view of an embodiment of the present invention, FIG. 2 is a cross-sectional view of FIG. 1, FIG. 3 is a vertical cross-sectional view of a conventional example, and FIG.
FIG. 4...Electronic component, 11...Case, 12...Heat absorption tube. Figure 1 Figure 2

Claims (1)

[Claims] 1) A cooling device for electronic equipment characterized by increasing the heat dissipation area by providing a completely closed box-shaped electronic component storage case with a hollow heat absorption tube that vertically passes through the case.