JPH04317352A - Formation of wafer for calibration of inspecting apparatus for surface contamination of wafer - Google Patents
Formation of wafer for calibration of inspecting apparatus for surface contamination of waferInfo
- Publication number
- JPH04317352A JPH04317352A JP8489291A JP8489291A JPH04317352A JP H04317352 A JPH04317352 A JP H04317352A JP 8489291 A JP8489291 A JP 8489291A JP 8489291 A JP8489291 A JP 8489291A JP H04317352 A JPH04317352 A JP H04317352A
- Authority
- JP
- Japan
- Prior art keywords
- wafer
- standard
- particle solution
- calibration
- particles
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000011109 contamination Methods 0.000 title abstract 3
- 230000015572 biosynthetic process Effects 0.000 title 1
- 239000002245 particle Substances 0.000 claims abstract description 38
- 238000007689 inspection Methods 0.000 claims abstract description 11
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 claims abstract description 7
- 238000000034 method Methods 0.000 claims abstract description 5
- 230000005856 abnormality Effects 0.000 abstract description 3
- 239000000243 solution Substances 0.000 abstract 5
- 230000002159 abnormal effect Effects 0.000 abstract 1
- 239000012895 dilution Substances 0.000 abstract 1
- 238000010790 dilution Methods 0.000 abstract 1
- 239000007788 liquid Substances 0.000 abstract 1
- 238000007796 conventional method Methods 0.000 description 1
- 238000007865 diluting Methods 0.000 description 1
- 239000003085 diluting agent Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
Abstract
Description
【0001】0001
【産業上の利用分野】本発明はウェーハ表面異物検査装
置の校正用ウェーハの作成方法に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for preparing a wafer for calibration of a wafer surface foreign matter inspection apparatus.
【0002】0002
【従来の技術】従来のウェーハ表面異物検査装置の校正
用ウェーハは、標準粒子と、アルコールと、噴霧器とウ
ェーハを用いて作成されている。以下その作成方法につ
いて説明する。2. Description of the Related Art A calibration wafer for a conventional wafer surface foreign matter inspection apparatus is prepared using standard particles, alcohol, an atomizer, and a wafer. The method for creating it will be explained below.
【0003】図2に示すように、支持台4に立て掛けた
ウェーハ3上に、標準粒子をアルコールで10〜30万
倍に希釈した標準粒子溶液2を噴霧器5を用いて吹き付
け、ウェーハ3に標準粒子を付着させる。標準粒子とし
ては、粒径として0.1μm〜10μmのものが用いら
れる。As shown in FIG. 2, a standard particle solution 2 in which standard particles are diluted 100,000 to 300,000 times with alcohol is sprayed onto the wafer 3 placed on a support stand 4 using a sprayer 5. Attach particles. As standard particles, those having a particle size of 0.1 μm to 10 μm are used.
【0004】0004
【発明が解決しようとする課題】上述した従来のウェー
ハ表面異物検査装置の校正用ウェーハの作成方法では、
噴霧器で標準粒子を付着させている為、ウェーハ全面に
標準粒子が付着してしまい、ウェーハ表面異物検査装置
で一枚の校正用ウェーハを定期的に測定する場合、異物
カウント数の増加が認められても、増加の原因がウェー
ハ表面異物検査装置の異常によるものなのか、校正用ウ
ェーハが汚れた為に標準粒子以外の異物が付着した為な
のかを判断するのが困難であった。[Problems to be Solved by the Invention] In the above-described conventional method for preparing a wafer for calibration of a wafer surface foreign matter inspection device,
Since the standard particles are attached using a sprayer, the standard particles are attached to the entire surface of the wafer, and when a single calibration wafer is periodically measured with a wafer surface foreign particle inspection device, an increase in the number of foreign particles is observed. However, it was difficult to determine whether the increase was due to an abnormality in the wafer surface foreign matter inspection device, or whether it was due to foreign matter other than standard particles adhering to the calibration wafer because it was dirty.
【0005】また、付着させる標準粒子数を調節するの
が困難であり、更に、1枚当り100個以下程度の少数
の標準粒子を付着させることが困難であるという問題点
があった。Another problem is that it is difficult to control the number of standard particles to be deposited, and furthermore, it is difficult to deposit a small number of standard particles, about 100 or less per sheet.
【0006】[0006]
【課題を解決するための手段】本発明のウェーハ表面異
物検査装置の校正用ウェーハの作成方法は、標準粒子溶
液をピペットでウェーハ上に滴下するものである。[Means for Solving the Problems] A method for preparing a calibration wafer for a wafer surface foreign matter inspection apparatus according to the present invention is to drop a standard particle solution onto the wafer using a pipette.
【0007】[0007]
【実施例】次に本発明について図面を参照して説明する
。図1は本発明の一実施例を説明するためのウェーハ及
びピペットの斜視図である。DESCRIPTION OF THE PREFERRED EMBODIMENTS Next, the present invention will be explained with reference to the drawings. FIG. 1 is a perspective view of a wafer and a pipette for explaining one embodiment of the present invention.
【0008】まずビーカー等を用い標準粒子をアルコー
ルで約10〜30万倍に希釈した標準粒子溶液2を作り
、この標準粒子溶液2をピレット1に充填し、ウェーハ
3に滴下する。滴下された標準粒子溶液2はウェーハ3
上に円状に広がる。希釈液であるアルコールは数秒程度
で蒸発するため、標準粒子は標準粒子溶液2を滴下した
部分に円状に分布して付着する。First, a standard particle solution 2 is prepared by diluting standard particles approximately 100,000 to 300,000 times with alcohol using a beaker or the like, and this standard particle solution 2 is filled into a pillet 1 and dripped onto a wafer 3. The dropped standard particle solution 2 is placed on the wafer 3.
Spread out in a circle on top. Since alcohol, which is a diluent, evaporates in about a few seconds, the standard particles are distributed in a circular pattern and adhere to the area where the standard particle solution 2 is dropped.
【0009】標準粒子溶液2の滴下量により、付着させ
る標準粒子数を調節することができるため、100個以
下の標準粒子の付着も容易である。Since the number of standard particles to be deposited can be adjusted by adjusting the amount of the standard particle solution 2 dropped, it is possible to easily deposit 100 or less standard particles.
【0010】0010
【発明の効果】以上説明したように本発明は、ピペット
によりウェーハの一部に標準粒子を付着させるため、ウ
ェーハ表面異物検査装置で校正用ウェーハを定期的に測
定する時に、異物カウント数の増加が認められても、付
着している異物の分布により、校正用ウェーハが汚れた
のか、ウェーハ表面異物検査装置の異常かどうかが容易
に判断できるという効果を有する。また、標準粒子溶液
をピペットで滴下するので、100個以下程度の小数の
標準粒子を容易に付着させることができるという効果も
ある。[Effects of the Invention] As explained above, the present invention allows standard particles to be attached to a part of a wafer using a pipette, so that when a calibration wafer is periodically measured with a wafer surface foreign matter inspection device, the number of foreign matter counts increases. Even if foreign matter is detected, it is possible to easily determine whether the calibration wafer is contaminated or whether there is an abnormality in the wafer surface foreign matter inspection device based on the distribution of attached foreign matter. Furthermore, since the standard particle solution is dropped with a pipette, there is also the effect that a small number of standard particles, about 100 or less, can be easily attached.
【図1】本発明の一実施例を説明するためのピペットと
ウェーハの斜視図。FIG. 1 is a perspective view of a pipette and a wafer for explaining one embodiment of the present invention.
【図2】従来の校正用ウェーハの作成方法を説明するた
めのウェーハと噴霧器の斜視図。FIG. 2 is a perspective view of a wafer and a sprayer for explaining a conventional calibration wafer manufacturing method.
1 ピペット 2 標準粒子溶液 3 ウェーハ 4 支持台 5 噴霧器 1 Pipette 2 Standard particle solution 3 Wafer 4 Support stand 5 Sprayer
Claims (1)
ピペットを用いてウェーハ上に滴下することを特徴とす
るウェーハ表面異物検査装置の校正用ウェーハの作成方
法。1. A method for preparing a wafer for calibration of a wafer surface foreign matter inspection device, which comprises dropping a standard particle solution diluted with alcohol onto the wafer using a pipette.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP8489291A JPH04317352A (en) | 1991-04-17 | 1991-04-17 | Formation of wafer for calibration of inspecting apparatus for surface contamination of wafer |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP8489291A JPH04317352A (en) | 1991-04-17 | 1991-04-17 | Formation of wafer for calibration of inspecting apparatus for surface contamination of wafer |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH04317352A true JPH04317352A (en) | 1992-11-09 |
Family
ID=13843401
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP8489291A Pending JPH04317352A (en) | 1991-04-17 | 1991-04-17 | Formation of wafer for calibration of inspecting apparatus for surface contamination of wafer |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH04317352A (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US11209107B2 (en) | 2017-07-28 | 2021-12-28 | ASC Engineered Solutions, LLC | Pre-assembled coupling assembly with cap |
-
1991
- 1991-04-17 JP JP8489291A patent/JPH04317352A/en active Pending
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US11209107B2 (en) | 2017-07-28 | 2021-12-28 | ASC Engineered Solutions, LLC | Pre-assembled coupling assembly with cap |
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