JPH04315776A - Method of connection superconducting wire - Google Patents
Method of connection superconducting wireInfo
- Publication number
- JPH04315776A JPH04315776A JP10812391A JP10812391A JPH04315776A JP H04315776 A JPH04315776 A JP H04315776A JP 10812391 A JP10812391 A JP 10812391A JP 10812391 A JP10812391 A JP 10812391A JP H04315776 A JPH04315776 A JP H04315776A
- Authority
- JP
- Japan
- Prior art keywords
- superconducting
- joining
- superconducting wire
- wires
- superconducting wires
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
- 238000000034 method Methods 0.000 title claims abstract description 41
- 239000000463 material Substances 0.000 claims abstract description 25
- 230000000087 stabilizing effect Effects 0.000 claims abstract description 23
- 229910052751 metal Inorganic materials 0.000 claims abstract description 18
- 239000002184 metal Substances 0.000 claims abstract description 18
- 229910000679 solder Inorganic materials 0.000 claims abstract description 10
- 238000002844 melting Methods 0.000 claims abstract description 6
- 150000002739 metals Chemical class 0.000 claims abstract description 6
- 239000002253 acid Substances 0.000 claims abstract description 5
- 238000007747 plating Methods 0.000 claims description 24
- 239000000243 solution Substances 0.000 claims description 18
- 239000012670 alkaline solution Substances 0.000 claims description 5
- 238000007772 electroless plating Methods 0.000 claims description 4
- 239000003381 stabilizer Substances 0.000 claims 1
- 239000007788 liquid Substances 0.000 abstract description 10
- 229910020012 Nb—Ti Inorganic materials 0.000 abstract description 5
- 230000008018 melting Effects 0.000 abstract description 2
- 230000003247 decreasing effect Effects 0.000 abstract 1
- 238000010586 diagram Methods 0.000 description 5
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 5
- 229910052737 gold Inorganic materials 0.000 description 5
- 239000010931 gold Substances 0.000 description 5
- SWQJXJOGLNCZEY-NJFSPNSNSA-N helium-6 atom Chemical compound [6He] SWQJXJOGLNCZEY-NJFSPNSNSA-N 0.000 description 5
- 230000000052 comparative effect Effects 0.000 description 4
- 238000007796 conventional method Methods 0.000 description 4
- 230000000694 effects Effects 0.000 description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 3
- 229910052802 copper Inorganic materials 0.000 description 3
- 239000010949 copper Substances 0.000 description 3
- 238000001514 detection method Methods 0.000 description 2
- 230000008020 evaporation Effects 0.000 description 2
- 238000001704 evaporation Methods 0.000 description 2
- 230000005284 excitation Effects 0.000 description 2
- 239000001307 helium Substances 0.000 description 2
- 229910052734 helium Inorganic materials 0.000 description 2
- SWQJXJOGLNCZEY-UHFFFAOYSA-N helium atom Chemical compound [He] SWQJXJOGLNCZEY-UHFFFAOYSA-N 0.000 description 2
- 230000002085 persistent effect Effects 0.000 description 2
- GRYLNZFGIOXLOG-UHFFFAOYSA-N Nitric acid Chemical compound O[N+]([O-])=O GRYLNZFGIOXLOG-UHFFFAOYSA-N 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 230000000996 additive effect Effects 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 230000003197 catalytic effect Effects 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 238000009713 electroplating Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000002708 enhancing effect Effects 0.000 description 1
- 239000007789 gas Substances 0.000 description 1
- 238000007654 immersion Methods 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 229910017604 nitric acid Inorganic materials 0.000 description 1
- 230000001235 sensitizing effect Effects 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
- 238000004804 winding Methods 0.000 description 1
Landscapes
- Manufacturing Of Electrical Connectors (AREA)
- Connections Effected By Soldering, Adhesion, Or Permanent Deformation (AREA)
- Superconductors And Manufacturing Methods Therefor (AREA)
Abstract
Description
【０００１】0001
【産業上の利用分野】本発明は、複数の超電導線材の端
部を接合する方法に関するものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for joining the ends of a plurality of superconducting wires.
【０００２】0002
【従来の技術】超電導線材は優れた通電能力により高磁
場を得る為の電磁石や大電流送電用の線材として不可欠
なものとなっている。ところで、近年、それら超電導応
用技術が進展するにつれて、従来の使用方法では問題と
ならなかった技術が超電導装置の運用上極めて大きな問
題となる場合が増加しつつある。例えば図５に示すよう
に極低温中に超電導コイル１００どうしの接合部１０１
が必要となる場合、または、送電線を分流及び接合する
場合、従来より、安定化材が付与された線材端部どうし
をあわせて半田接合する方法が知られている。2. Description of the Related Art Superconducting wires have become indispensable as electromagnets for obtaining high magnetic fields and as wires for transmitting large currents due to their excellent current carrying ability. Incidentally, in recent years, as these superconducting application technologies have progressed, techniques that did not pose problems in conventional usage methods are increasingly becoming extremely problematic in the operation of superconducting devices. For example, as shown in FIG. 5, a joint 101 between superconducting coils 100 is
When this is required, or when dividing and joining power transmission lines, a method is conventionally known in which the ends of the wires to which a stabilizing material has been applied are joined together by soldering.
【０００３】0003
【発明が解決しようとする課題】しかし、従来の超電導
線材の接合方法においては、超電導線材の接合部に厚い
常電導の層が介在するから、電気抵抗が大きくなるとい
う問題がある。本発明の課題は、超電導線材の接合部の
電気抵抗を減少することができる超電導線材の接合方法
を提供することにある。However, in the conventional method of joining superconducting wires, there is a problem in that the electrical resistance increases because a thick normal conductive layer is interposed at the joint of the superconducting wires. An object of the present invention is to provide a method for joining superconducting wires that can reduce the electrical resistance of the joints of superconducting wires.
【０００４】0004
【課題を解決するための手段】本発明によれば、安定化
材を付与された複数のＮｂ−Ｔｉ系の超電導線材の端部
を接合する接合方法において、前記複数の超電導線材の
端部を酸液またはアルカリ液に浸漬して安定化材のみを
溶解して除去し、次にこれらの安定化材を除去した超電
導線材の端部に極低温状態で低抵抗を示すと共に異種金
属との濡れ性に優れた金属を鍍金後、前記超電導線材の
端部を半田または低融点金属で接合することを特徴とす
る超電導線材の接合方法が得られる。また、本発明によ
れば、前記超電導線材の接合方法において、前記安定化
材を除去した超電導線材の端部を無電解鍍金液に浸漬し
て前記超電導線材の端部に鍍金することを特徴とする超
電導線材の接合方法が得られる。また、本発明によれば
、前記超電導線材の接合方法において、前記安定化材を
除去した超電導線材の端部を鍍金液に浸漬すると共にこ
の鍍金液に陽極板を浸漬した状態で、前記超電導線材と
陽極板との間に電流を流して前記超電導線材の端部に鍍
金することを特徴とする超電導線材の接合方法が得られ
る。[Means for Solving the Problems] According to the present invention, in a joining method for joining the ends of a plurality of Nb-Ti superconducting wires provided with a stabilizing material, the ends of the plurality of superconducting wires are joined together. Only the stabilizing materials are dissolved and removed by immersion in an acid or alkaline solution, and then the ends of the superconducting wire from which these stabilizing materials have been removed exhibit low resistance at extremely low temperatures and wettability with dissimilar metals. A method for joining superconducting wires is obtained, which comprises plating the superconducting wires with a metal having excellent properties and then joining the ends of the superconducting wires with solder or a low-melting point metal. Further, according to the present invention, the superconducting wire joining method is characterized in that the end of the superconducting wire from which the stabilizing material has been removed is immersed in an electroless plating solution to plate the end of the superconducting wire. A method for joining superconducting wires is obtained. Further, according to the present invention, in the method for joining the superconducting wire, the end portion of the superconducting wire from which the stabilizing material has been removed is immersed in a plating solution, and the anode plate is immersed in the plating solution. There is obtained a method for joining superconducting wires, characterized in that the ends of the superconducting wires are plated by passing a current between the anode plate and the anode plate.
【０００５】[0005]
【実施例】本発明は、安定化材を付与された複数のＮｂ
−Ｔｉ系の超電導線材の端部を接合する接合方法におい
て、前記複数の超電導線材の端部を酸液またはアルカリ
液に浸漬して安定化材のみを溶解して除去し、次にこれ
らの安定化材を除去した超電導線材の端部に極低温状態
で低抵抗を示すと共に異種金属との濡れ性に優れた金属
を鍍金後、前記超電導線材の端部を半田または低融点金
属で接合することを特徴としている。また、前記本発明
の超電導線材の接合方法において、前記安定化材を除去
した超電導線材の端部を無電解鍍金液に浸漬して前記超
電導線材の端部に鍍金する。さらにまた、前記本発明の
超電導線材の接合方法において、前記安定化材を除去し
た超電導線材の端部を鍍金液に浸漬すると共にこの鍍金
液に陽極板を浸漬した状態で、前記超電導線材と陽極板
との間に電流を流して前記超電導線材の端部に鍍金して
もよい。[Example] The present invention provides a plurality of Nb
- In a joining method of joining the ends of Ti-based superconducting wires, the ends of the plurality of superconducting wires are immersed in an acid solution or alkaline solution to dissolve and remove only the stabilizing material, and then the stabilizing material is removed. After plating the ends of the superconducting wire from which the additive has been removed with a metal that exhibits low resistance at extremely low temperatures and has excellent wettability with different metals, the ends of the superconducting wire are joined with solder or a low-melting point metal. It is characterized by Furthermore, in the superconducting wire joining method of the present invention, the end portion of the superconducting wire from which the stabilizing material has been removed is immersed in an electroless plating solution to plate the end portion of the superconducting wire. Furthermore, in the superconducting wire joining method of the present invention, the end portion of the superconducting wire from which the stabilizing material has been removed is immersed in a plating solution, and the anode plate is immersed in the plating solution. The ends of the superconducting wire may be plated by passing a current between the superconducting wire and the plate.
【０００６】本発明の最大の特徴とするところは、酸液
またはアルカリ液によって、安定化材を溶解除去した状
態の異種金属との濡れ性が極めて悪い極組のＮｂ−Ｔｉ
系の超電導線材に、電気抵抗の温度係数が大きく極低温
状態で低抵抗を示すと共に異種金属との濡れ性に優れた
金属を鍍金せしめることにある。結果としてＮｂ−Ｔｉ
系の超電導線材の表面状態が改善され、超電導線材どう
しのより合わせ後に行う半田または低融点金属による接
合処理が容易に行える。また、常電導体である安定化材
を介さず低抵抗の薄膜と極めて薄い半田または低融点接
合層のみの介在であるため、通電時、接合部での損失を
大幅に低減出来る効果が得られている。The greatest feature of the present invention is that the Nb-Ti electrode assembly has extremely poor wettability with dissimilar metals after the stabilizing material has been dissolved and removed using an acid or alkaline solution.
The objective is to plate the superconducting wire of the system with a metal that has a large temperature coefficient of electrical resistance, exhibits low resistance at extremely low temperatures, and has excellent wettability with different metals. As a result, Nb-Ti
The surface condition of the superconducting wires in the system is improved, and joining treatment using solder or a low-melting point metal after the superconducting wires are twisted together can be easily performed. In addition, because only a low-resistance thin film and an extremely thin solder or low-melting-point bonding layer are interposed, without the use of a stabilizing material that is a normal conductor, it is possible to significantly reduce loss at the bonded portion when electricity is applied. ing.
【０００７】前記鍍金の方法としては、希望する材質の
鍍金が行える方法であることおよび容易かつどこの場所
でも行えることの２点から決定すべきである。これらの
観点から、電気鍍金法および無電解鍍金法が本発明を実
施する上で有効な方法である。次に、鍍金の材料として
は、前述したように極低温状態で電気抵抗が低くかつ半
田または低融点金属との濡れ性がよいことが必要である
。このような観点から金、銀、銅およびアルミニウム等
が良好な特性を示す。なお、強固な密着力を有する鍍金
を行うための前段階として超電導線材の表面に触媒性金
属を付与する等の方法は本発明の有効性を更に高める方
法として採用できる。[0007] The method of plating should be determined from the following two points: it must be a method that can plate the desired material, and it must be easy to perform at any location. From these viewpoints, electroplating and electroless plating are effective methods for implementing the present invention. Next, as described above, the material for plating must have low electrical resistance at extremely low temperatures and good wettability with solder or low melting point metal. From this point of view, gold, silver, copper, aluminum, etc. exhibit good properties. Note that a method of applying a catalytic metal to the surface of the superconducting wire as a preliminary step to plating with strong adhesion can be adopted as a method for further enhancing the effectiveness of the present invention.
【０００８】次に実施例をもって本発明の有効性を示す
。図１は本発明の有効性を確認する目的で製作された２
つのコイル１に分割された超電導マグネットを示してい
る。コイル１の形成に使用した超電導線材２は安定化材
として銅を付与されたＮｂ−Ｔｉ系の極細多芯型の超電
導線材２である。これらのコイル１の接合方法として、
超電導線材２の安定化材を除去する目的で超電導線材２
の端部約５ｃｍの部分を硝酸液に浸漬し銅を溶解除去し
超電導線材２のみを露出させた。Next, the effectiveness of the present invention will be shown with examples. Figure 1 is 2, which was created for the purpose of confirming the effectiveness of the present invention.
A superconducting magnet divided into two coils 1 is shown. The superconducting wire 2 used to form the coil 1 is an Nb-Ti superfine multicore superconducting wire 2 to which copper is added as a stabilizing material. As a method of joining these coils 1,
Superconducting wire 2 for the purpose of removing the stabilizing material of superconducting wire 2
An approximately 5 cm end portion of the wire was immersed in a nitric acid solution to dissolve and remove the copper, exposing only the superconducting wire 2.
【０００９】次に前記安定化材を除去した超電導線材２
の端部の表面に極低温で低抵抗を示す金を鍍金する方法
として、前処理として短時間のセンシタイジング処理を
施した後、下記の表１に示す組成の液からなる金の無電
解鍍金液中に浸漬し超電導線材２に鍍金する方法を採用
した。Next, superconducting wire 2 from which the stabilizing material was removed
As a method of plating gold that exhibits low resistance at extremely low temperatures on the surface of the end of the gold plate, after a short sensitizing treatment is performed as a pretreatment, an electroless gold plate made of a liquid with the composition shown in Table 1 below is used. A method of plating the superconducting wire 2 by immersing it in a plating solution was adopted.
【００１０】0010
【表１】[Table 1]
【００１１】また、前記鍍金方法として、下記の表２に
示すようなシアンアルカリ液からなる鍍金液３と、図２
に示すこの鍍金液３を収容する鍍金槽４と、鍍金液３に
浸漬された陽極板５とからなる装置の鍍金液３に超電導
線材２の端部２ａを浸漬後、直流電源６により陰極電流
密度０．３Ｖ／ｄｍ２で通電し鍍金する方法を採用した
。Further, as the plating method, a plating solution 3 made of a cyan alkaline solution as shown in Table 2 below, and a plating solution 3 shown in FIG.
After the end portion 2a of the superconducting wire 2 is immersed in the plating solution 3 of the apparatus, which consists of a plating tank 4 containing the plating solution 3 and an anode plate 5 immersed in the plating solution 3, a cathode current is applied by a DC power supply 6. A method of plating by applying current at a density of 0.3 V/dm2 was adopted.
【００１２】0012
【表２】[Table 2]
【００１３】これらの方法により０．３μｍの膜厚を有
する金を超電導線材２の端部２ａに付着させた。次に２
本の超電導線材２どうしを５ｃｍクロスさせた後、半田
接合を行ったが、いわゆる半田ののりがよく強固な接合
ができることを確認し、実際に接合したコイル１を極低
温に冷却後、励磁テストを行ったところ、当初目標とし
た磁場の発生が可能であり、本発明による接合方法の有
効性が明らかとなった。Gold having a thickness of 0.3 μm was deposited on the end portion 2a of the superconducting wire 2 by these methods. Next 2
After making the two superconducting wires 2 cross each other by 5 cm, we performed solder joints. We confirmed that the so-called solder paste was good and a strong joint could be made. After cooling the actually joined coils 1 to an extremely low temperature, we conducted an excitation test. As a result, it was possible to generate the initially targeted magnetic field, demonstrating the effectiveness of the bonding method according to the present invention.
【００１４】次に、本発明による超電導線材２の接合部
２ａの電気抵抗の低減効果を確認する目的で、図３に示
すような装置を作製した。図３に示す装置は、液体ヘリ
ウム６と、この液体ヘリウム６を収容している槽７と、
この槽７内の液体ヘリウム６の蒸発量を検出する蒸発量
検出器８とからなる。前記槽７内の液体ヘリウム６中に
２つの超電導線材２の接合部２ｂを配置し、これらの超
電導線材２および接合部２ｂに直流電源９により、超電
導状態で電流を流した際の接合部２ｂの抵抗で発生する
発熱量を液体ヘリウム６の蒸発気体量の絶対値から試算
した。なお、比較例としては従来の常電導安定化材が付
与された状態で半田接合する方法において各種接合長さ
を変化させた試料を採用した。その結果を下記の表３に
示す。これより本発明の方法の良好な低抵抗接合効果が
確認された。Next, in order to confirm the effect of reducing the electrical resistance of the joint portion 2a of the superconducting wire 2 according to the present invention, a device as shown in FIG. 3 was manufactured. The device shown in FIG. 3 includes liquid helium 6, a tank 7 containing this liquid helium 6,
It consists of an evaporation amount detector 8 that detects the amount of evaporation of liquid helium 6 in this tank 7. The bonded portions 2b of two superconducting wires 2 are placed in liquid helium 6 in the tank 7, and the bonded portions 2b are formed when a current is passed through the superconducting wires 2 and the bonded portions 2b in a superconducting state by a DC power supply 9. The amount of heat generated by the resistance was estimated from the absolute value of the amount of evaporated gas of liquid helium 6. In addition, as a comparative example, samples were adopted in which various bonding lengths were varied in the conventional method of solder bonding with a normal conductivity stabilizing material applied. The results are shown in Table 3 below. This confirmed the good low resistance bonding effect of the method of the present invention.
【００１５】[0015]
【表３】[Table 3]
【００１６】図４には、本発明の超電導線材の接合方法
による超電導線材２の接合部２ｂおよび従来の接合方法
による超電導線材の接合部（比較例）に電流を流して磁
場減衰率を測定する装置が示されている。図４の装置は
、液体ヘリウム１０と、この液体ヘリウム１０を収容す
る槽１１と、この槽１１の内部に設けたれた検出筒１２
と、この検出筒１２の内部に配置されたホール素子１３
とからなる。円筒状の磁性体１４に超電導線材２を巻回
してなるソレノイドコイル１５の超電導線材２の２つの
接合部２ｂ，２ｂの間に永久電流スイッチ１６を接合す
ると共に直流電源１７を接続し、かつ、ソレノイドコイ
ル１５をこれの内部にホール素子１３が位置するように
配置し、この状態で、ソレノイドコイル１５の定格値で
ある４テラスまで励磁後、永久電流モードの運用を開始
しその際の磁場減衰率をホール素子１３で実測し、また
、比較例も同様にして実測したところ、表４に示すよう
な結果が得られた。この表４により、本発明の方法によ
る接合部は、従来の方法による接合部（比較例）による
ものに比較して約２桁小さい磁場減衰率を示すことが確
認できた。FIG. 4 shows the results of measuring the magnetic field attenuation rate by passing a current through the joint 2b of the superconducting wire 2 by the superconducting wire joining method of the present invention and the joint of superconducting wire 2 by the conventional joining method (comparative example). Equipment is shown. The apparatus shown in FIG. 4 includes liquid helium 10, a tank 11 containing this liquid helium 10, and a detection tube 12 provided inside this tank 11.
and the Hall element 13 arranged inside this detection cylinder 12.
It consists of. A persistent current switch 16 is connected between the two joints 2b, 2b of the superconducting wire 2 of a solenoid coil 15 formed by winding the superconducting wire 2 around a cylindrical magnetic body 14, and a DC power source 17 is connected, and The solenoid coil 15 is arranged so that the Hall element 13 is located inside it, and in this state, after excitation to the rated value of 4 terraces of the solenoid coil 15, operation in persistent current mode is started, and the magnetic field attenuation occurs at that time. The ratio was actually measured using the Hall element 13, and the comparative example was also measured in the same manner, and the results shown in Table 4 were obtained. From Table 4, it was confirmed that the joint formed by the method of the present invention exhibits a magnetic field attenuation rate that is about two orders of magnitude smaller than that of the joint formed by the conventional method (comparative example).
【００１７】[0017]
【表４】[Table 4]
【００１８】[0018]
【発明の効果】本発明によれば、超電導線材の接合部の
電気抵抗を減少することができる。According to the present invention, it is possible to reduce the electrical resistance of the joints of superconducting wires.
【図１】本発明の超電導線材の接合方法を説明するため
の図である。FIG. 1 is a diagram for explaining a method for joining superconducting wires according to the present invention.
【図２】本発明の超電導線材の接合方法を説明するため
の図である。FIG. 2 is a diagram for explaining the method for joining superconducting wires of the present invention.
【図３】本発明の効果を確認するための装置を示す図で
ある。FIG. 3 is a diagram showing an apparatus for confirming the effects of the present invention.
【図４】本発明の効果を確認するための装置を示す図で
ある。FIG. 4 is a diagram showing an apparatus for confirming the effects of the present invention.
【図５】従来の超電導線材の接合方法を説明するための
図である。FIG. 5 is a diagram for explaining a conventional method for joining superconducting wires.
２ 超電導線材 ２ａ 端部 ２ｂ 接合部 ３ 鍍金液 2 Superconducting wire 2a End 2b Joint part 3 Plating liquid
Claims (3)
ｉ系の超電導線材の端部を接合する接合方法において、
前記複数の超電導線材の端部を酸液またはアルカリ液に
浸漬して安定化材のみを溶解して除去し、次にこれらの
安定化材を除去した超電導線材の端部に極低温状態で低
抵抗を示すと共に異種金属との濡れ性に優れた金属を鍍
金後、前記超電導線材の端部を半田または低融点金属で
接合することを特徴とする超電導線材の接合方法。[Claim 1] A plurality of Nb-Ts provided with a stabilizing agent.
In a joining method for joining ends of i-based superconducting wire,
The ends of the plurality of superconducting wires are immersed in an acid solution or alkaline solution to dissolve and remove only the stabilizing materials, and then the ends of the superconducting wires from which these stabilizing materials have been removed are soaked in a cryogenic state. A method for joining superconducting wires, which comprises plating the ends of the superconducting wires with a metal that exhibits resistance and has excellent wettability with different metals, and then joining the ends of the superconducting wires with solder or a low-melting point metal.
法において、前記安定化材を除去した超電導線材の端部
を無電解鍍金液に浸漬して前記超電導線材の端部に鍍金
することを特徴とする超電導線材の接合方法。2. The method for joining superconducting wires according to claim 1, further comprising immersing an end portion of the superconducting wire from which the stabilizing material has been removed in an electroless plating solution to plate the end portion of the superconducting wire. Characteristic joining method for superconducting wires.
法において、前記安定化材を除去した超電導線材の端部
を鍍金液に浸漬すると共にこの鍍金液に陽極板を浸漬し
た状態で、前記超電導線材と陽極板との間に電流を流し
て前記超電導線材の端部に鍍金することを特徴とする超
電導線材の接合方法。3. The method for joining a superconducting wire according to claim 1, wherein the end portion of the superconducting wire from which the stabilizing material has been removed is immersed in a plating solution, and the anode plate is immersed in the plating solution. 1. A method for joining superconducting wires, comprising passing a current between the superconducting wire and an anode plate to plate the ends of the superconducting wire.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10812391A JPH04315776A (en) | 1991-04-15 | 1991-04-15 | Method of connection superconducting wire |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10812391A JPH04315776A (en) | 1991-04-15 | 1991-04-15 | Method of connection superconducting wire |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH04315776A true JPH04315776A (en) | 1992-11-06 |
Family
ID=14476516
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP10812391A Withdrawn JPH04315776A (en) | 1991-04-15 | 1991-04-15 | Method of connection superconducting wire |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH04315776A (en) |
-
1991
- 1991-04-15 JP JP10812391A patent/JPH04315776A/en not_active Withdrawn
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