JPH04314890A - Liquid and method for surface treatment - Google Patents
Liquid and method for surface treatmentInfo
- Publication number
- JPH04314890A JPH04314890A JP10822291A JP10822291A JPH04314890A JP H04314890 A JPH04314890 A JP H04314890A JP 10822291 A JP10822291 A JP 10822291A JP 10822291 A JP10822291 A JP 10822291A JP H04314890 A JPH04314890 A JP H04314890A
- Authority
- JP
- Japan
- Prior art keywords
- surface treatment
- tin
- copper
- treatment liquid
- iron
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000007788 liquid Substances 0.000 title claims abstract description 25
- 238000004381 surface treatment Methods 0.000 title claims description 47
- 238000000034 method Methods 0.000 title claims description 15
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims abstract description 18
- 238000007747 plating Methods 0.000 claims abstract description 17
- -1 dimethyl phthalate) Chemical class 0.000 claims abstract description 15
- 229910001128 Sn alloy Inorganic materials 0.000 claims abstract description 14
- 239000007769 metal material Substances 0.000 claims abstract description 13
- PEDCQBHIVMGVHV-UHFFFAOYSA-N Glycerine Chemical compound OCC(O)CO PEDCQBHIVMGVHV-UHFFFAOYSA-N 0.000 claims abstract description 12
- 235000019271 petrolatum Nutrition 0.000 claims abstract description 9
- 239000004264 Petrolatum Substances 0.000 claims abstract description 8
- 229940066842 petrolatum Drugs 0.000 claims abstract description 8
- 235000011187 glycerol Nutrition 0.000 claims abstract description 6
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 claims description 18
- 229910052718 tin Inorganic materials 0.000 claims description 16
- 239000000463 material Substances 0.000 claims description 12
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 11
- 229910052802 copper Inorganic materials 0.000 claims description 11
- 239000010949 copper Substances 0.000 claims description 11
- 229910052742 iron Inorganic materials 0.000 claims description 9
- JNYAEWCLZODPBN-JGWLITMVSA-N (2r,3r,4s)-2-[(1r)-1,2-dihydroxyethyl]oxolane-3,4-diol Chemical class OC[C@@H](O)[C@H]1OC[C@H](O)[C@H]1O JNYAEWCLZODPBN-JGWLITMVSA-N 0.000 claims description 7
- 229910017464 nitrogen compound Inorganic materials 0.000 claims description 6
- 150000001412 amines Chemical class 0.000 claims description 4
- 238000003825 pressing Methods 0.000 claims description 4
- 239000003960 organic solvent Substances 0.000 claims description 3
- 239000002530 phenolic antioxidant Substances 0.000 claims description 2
- AQSJGOWTSHOLKH-UHFFFAOYSA-N phosphite(3-) Chemical class [O-]P([O-])[O-] AQSJGOWTSHOLKH-UHFFFAOYSA-N 0.000 claims 1
- 125000005498 phthalate group Chemical class 0.000 claims 1
- 230000007797 corrosion Effects 0.000 abstract description 12
- 238000005260 corrosion Methods 0.000 abstract description 12
- 239000002904 solvent Substances 0.000 abstract description 9
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 abstract description 6
- NIQCNGHVCWTJSM-UHFFFAOYSA-N Dimethyl phthalate Chemical compound COC(=O)C1=CC=CC=C1C(=O)OC NIQCNGHVCWTJSM-UHFFFAOYSA-N 0.000 abstract description 4
- 150000002148 esters Chemical class 0.000 abstract description 4
- RZRNAYUHWVFMIP-KTKRTIGZSA-N 1-oleoylglycerol Chemical compound CCCCCCCC\C=C/CCCCCCCC(=O)OCC(O)CO RZRNAYUHWVFMIP-KTKRTIGZSA-N 0.000 abstract description 2
- XSTXAVWGXDQKEL-UHFFFAOYSA-N Trichloroethylene Chemical group ClC=C(Cl)Cl XSTXAVWGXDQKEL-UHFFFAOYSA-N 0.000 abstract description 2
- FBSAITBEAPNWJG-UHFFFAOYSA-N dimethyl phthalate Natural products CC(=O)OC1=CC=CC=C1OC(C)=O FBSAITBEAPNWJG-UHFFFAOYSA-N 0.000 abstract description 2
- 229960001826 dimethylphthalate Drugs 0.000 abstract description 2
- UBOXGVDOUJQMTN-UHFFFAOYSA-N trichloroethylene Natural products ClCC(Cl)Cl UBOXGVDOUJQMTN-UHFFFAOYSA-N 0.000 abstract description 2
- YJTKZCDBKVTVBY-UHFFFAOYSA-N 1,3-Diphenylbenzene Chemical group C1=CC=CC=C1C1=CC=CC(C=2C=CC=CC=2)=C1 YJTKZCDBKVTVBY-UHFFFAOYSA-N 0.000 abstract 1
- UPWGQKDVAURUGE-UHFFFAOYSA-N glycerine monooleate Natural products CCCCCCCCC=CCCCCCCCC(=O)OC(CO)CO UPWGQKDVAURUGE-UHFFFAOYSA-N 0.000 abstract 1
- 230000001050 lubricating effect Effects 0.000 abstract 1
- 238000005476 soldering Methods 0.000 abstract 1
- 239000001257 hydrogen Substances 0.000 description 17
- 229910052739 hydrogen Inorganic materials 0.000 description 17
- 239000000126 substance Substances 0.000 description 10
- 150000002431 hydrogen Chemical group 0.000 description 8
- 238000012360 testing method Methods 0.000 description 8
- 229910000679 solder Inorganic materials 0.000 description 7
- SIKJAQJRHWYJAI-UHFFFAOYSA-N Indole Chemical compound C1=CC=C2NC=CC2=C1 SIKJAQJRHWYJAI-UHFFFAOYSA-N 0.000 description 6
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 6
- 230000000694 effects Effects 0.000 description 5
- 125000004435 hydrogen atom Chemical group [H]* 0.000 description 5
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 5
- 150000003839 salts Chemical class 0.000 description 5
- 239000007921 spray Substances 0.000 description 5
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 4
- HYZJCKYKOHLVJF-UHFFFAOYSA-N 1H-benzimidazole Chemical compound C1=CC=C2NC=NC2=C1 HYZJCKYKOHLVJF-UHFFFAOYSA-N 0.000 description 3
- BAXOFTOLAUCFNW-UHFFFAOYSA-N 1H-indazole Chemical compound C1=CC=C2C=NNC2=C1 BAXOFTOLAUCFNW-UHFFFAOYSA-N 0.000 description 3
- 241001163841 Albugo ipomoeae-panduratae Species 0.000 description 3
- DGAQECJNVWCQMB-PUAWFVPOSA-M Ilexoside XXIX Chemical compound C[C@@H]1CC[C@@]2(CC[C@@]3(C(=CC[C@H]4[C@]3(CC[C@@H]5[C@@]4(CC[C@@H](C5(C)C)OS(=O)(=O)[O-])C)C)[C@@H]2[C@]1(C)O)C)C(=O)O[C@H]6[C@@H]([C@H]([C@@H]([C@H](O6)CO)O)O)O.[Na+] DGAQECJNVWCQMB-PUAWFVPOSA-M 0.000 description 3
- 125000000217 alkyl group Chemical group 0.000 description 3
- QRUDEWIWKLJBPS-UHFFFAOYSA-N benzotriazole Chemical compound C1=CC=C2N[N][N]C2=C1 QRUDEWIWKLJBPS-UHFFFAOYSA-N 0.000 description 3
- 239000012964 benzotriazole Substances 0.000 description 3
- KUNSUQLRTQLHQQ-UHFFFAOYSA-N copper tin Chemical compound [Cu].[Sn] KUNSUQLRTQLHQQ-UHFFFAOYSA-N 0.000 description 3
- JQCXWCOOWVGKMT-UHFFFAOYSA-N diheptyl phthalate Chemical compound CCCCCCCOC(=O)C1=CC=CC=C1C(=O)OCCCCCCC JQCXWCOOWVGKMT-UHFFFAOYSA-N 0.000 description 3
- PZOUSPYUWWUPPK-UHFFFAOYSA-N indole Natural products CC1=CC=CC2=C1C=CN2 PZOUSPYUWWUPPK-UHFFFAOYSA-N 0.000 description 3
- RKJUIXBNRJVNHR-UHFFFAOYSA-N indolenine Natural products C1=CC=C2CC=NC2=C1 RKJUIXBNRJVNHR-UHFFFAOYSA-N 0.000 description 3
- 229910052759 nickel Inorganic materials 0.000 description 3
- 150000008301 phosphite esters Chemical class 0.000 description 3
- XNGIFLGASWRNHJ-UHFFFAOYSA-N phthalic acid Chemical class OC(=O)C1=CC=CC=C1C(O)=O XNGIFLGASWRNHJ-UHFFFAOYSA-N 0.000 description 3
- 229910052708 sodium Inorganic materials 0.000 description 3
- 239000011734 sodium Substances 0.000 description 3
- UOCLXMDMGBRAIB-UHFFFAOYSA-N 1,1,1-trichloroethane Chemical compound CC(Cl)(Cl)Cl UOCLXMDMGBRAIB-UHFFFAOYSA-N 0.000 description 2
- KGRVJHAUYBGFFP-UHFFFAOYSA-N 2,2'-Methylenebis(4-methyl-6-tert-butylphenol) Chemical compound CC(C)(C)C1=CC(C)=CC(CC=2C(=C(C=C(C)C=2)C(C)(C)C)O)=C1O KGRVJHAUYBGFFP-UHFFFAOYSA-N 0.000 description 2
- BVUXDWXKPROUDO-UHFFFAOYSA-N 2,6-di-tert-butyl-4-ethylphenol Chemical compound CCC1=CC(C(C)(C)C)=C(O)C(C(C)(C)C)=C1 BVUXDWXKPROUDO-UHFFFAOYSA-N 0.000 description 2
- LVAGMBHLXLZJKZ-UHFFFAOYSA-N 2-o-decyl 1-o-octyl benzene-1,2-dicarboxylate Chemical compound CCCCCCCCCCOC(=O)C1=CC=CC=C1C(=O)OCCCCCCCC LVAGMBHLXLZJKZ-UHFFFAOYSA-N 0.000 description 2
- GPNYZBKIGXGYNU-UHFFFAOYSA-N 2-tert-butyl-6-[(3-tert-butyl-5-ethyl-2-hydroxyphenyl)methyl]-4-ethylphenol Chemical compound CC(C)(C)C1=CC(CC)=CC(CC=2C(=C(C=C(CC)C=2)C(C)(C)C)O)=C1O GPNYZBKIGXGYNU-UHFFFAOYSA-N 0.000 description 2
- MDWVSAYEQPLWMX-UHFFFAOYSA-N 4,4'-Methylenebis(2,6-di-tert-butylphenol) Chemical compound CC(C)(C)C1=C(O)C(C(C)(C)C)=CC(CC=2C=C(C(O)=C(C=2)C(C)(C)C)C(C)(C)C)=C1 MDWVSAYEQPLWMX-UHFFFAOYSA-N 0.000 description 2
- CMGDVUCDZOBDNL-UHFFFAOYSA-N 4-methyl-2h-benzotriazole Chemical compound CC1=CC=CC2=NNN=C12 CMGDVUCDZOBDNL-UHFFFAOYSA-N 0.000 description 2
- 229910000906 Bronze Inorganic materials 0.000 description 2
- MQIUGAXCHLFZKX-UHFFFAOYSA-N Di-n-octyl phthalate Chemical compound CCCCCCCCOC(=O)C1=CC=CC=C1C(=O)OCCCCCCCC MQIUGAXCHLFZKX-UHFFFAOYSA-N 0.000 description 2
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 2
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 2
- 239000004147 Sorbitan trioleate Substances 0.000 description 2
- PRXRUNOAOLTIEF-ADSICKODSA-N Sorbitan trioleate Chemical compound CCCCCCCC\C=C/CCCCCCCC(=O)OC[C@@H](OC(=O)CCCCCCC\C=C/CCCCCCCC)[C@H]1OC[C@H](O)[C@H]1OC(=O)CCCCCCC\C=C/CCCCCCCC PRXRUNOAOLTIEF-ADSICKODSA-N 0.000 description 2
- 239000002253 acid Substances 0.000 description 2
- 230000002411 adverse Effects 0.000 description 2
- 239000003963 antioxidant agent Substances 0.000 description 2
- 230000003078 antioxidant effect Effects 0.000 description 2
- 239000002585 base Substances 0.000 description 2
- 239000002199 base oil Substances 0.000 description 2
- 239000010974 bronze Substances 0.000 description 2
- 238000004140 cleaning Methods 0.000 description 2
- 150000001875 compounds Chemical class 0.000 description 2
- 230000007547 defect Effects 0.000 description 2
- 230000006866 deterioration Effects 0.000 description 2
- DOIRQSBPFJWKBE-UHFFFAOYSA-N dibutyl phthalate Chemical compound CCCCOC(=O)C1=CC=CC=C1C(=O)OCCCC DOIRQSBPFJWKBE-UHFFFAOYSA-N 0.000 description 2
- FLKPEMZONWLCSK-UHFFFAOYSA-N diethyl phthalate Chemical compound CCOC(=O)C1=CC=CC=C1C(=O)OCC FLKPEMZONWLCSK-UHFFFAOYSA-N 0.000 description 2
- JEIPFZHSYJVQDO-UHFFFAOYSA-N iron(III) oxide Inorganic materials O=[Fe]O[Fe]=O JEIPFZHSYJVQDO-UHFFFAOYSA-N 0.000 description 2
- 238000005259 measurement Methods 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- 239000003208 petroleum Substances 0.000 description 2
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 description 2
- 238000012545 processing Methods 0.000 description 2
- 235000019337 sorbitan trioleate Nutrition 0.000 description 2
- 229960000391 sorbitan trioleate Drugs 0.000 description 2
- 125000000547 substituted alkyl group Chemical group 0.000 description 2
- 238000011282 treatment Methods 0.000 description 2
- HVLLSGMXQDNUAL-UHFFFAOYSA-N triphenyl phosphite Chemical compound C=1C=CC=CC=1OP(OC=1C=CC=CC=1)OC1=CC=CC=C1 HVLLSGMXQDNUAL-UHFFFAOYSA-N 0.000 description 2
- CUNWUEBNSZSNRX-RKGWDQTMSA-N (2r,3r,4r,5s)-hexane-1,2,3,4,5,6-hexol;(z)-octadec-9-enoic acid Chemical compound OC[C@H](O)[C@@H](O)[C@H](O)[C@H](O)CO.OC[C@H](O)[C@@H](O)[C@H](O)[C@H](O)CO.CCCCCCCC\C=C/CCCCCCCC(O)=O.CCCCCCCC\C=C/CCCCCCCC(O)=O.CCCCCCCC\C=C/CCCCCCCC(O)=O CUNWUEBNSZSNRX-RKGWDQTMSA-N 0.000 description 1
- ZORQXIQZAOLNGE-UHFFFAOYSA-N 1,1-difluorocyclohexane Chemical compound FC1(F)CCCCC1 ZORQXIQZAOLNGE-UHFFFAOYSA-N 0.000 description 1
- JYEUMXHLPRZUAT-UHFFFAOYSA-N 1,2,3-triazine Chemical compound C1=CN=NN=C1 JYEUMXHLPRZUAT-UHFFFAOYSA-N 0.000 description 1
- HCITUYXHCZGFEO-UHFFFAOYSA-N 1,3,5-triazine-2,4,6-triamine Chemical compound NC1=NC(N)=NC(N)=N1.N=C1NC(=N)NC(=N)N1 HCITUYXHCZGFEO-UHFFFAOYSA-N 0.000 description 1
- SZGFVDMKVRMJKE-UHFFFAOYSA-N 1-(benzimidazol-1-yl)ethanone Chemical compound C1=CC=C2N(C(=O)C)C=NC2=C1 SZGFVDMKVRMJKE-UHFFFAOYSA-N 0.000 description 1
- ODFXXBQMLWHOAH-UHFFFAOYSA-N 1-indazol-1-ylethanone Chemical compound C1=CC=C2N(C(=O)C)N=CC2=C1 ODFXXBQMLWHOAH-UHFFFAOYSA-N 0.000 description 1
- HXQHRUJXQJEGER-UHFFFAOYSA-N 1-methylbenzotriazole Chemical compound C1=CC=C2N(C)N=NC2=C1 HXQHRUJXQJEGER-UHFFFAOYSA-N 0.000 description 1
- BLRHMMGNCXNXJL-UHFFFAOYSA-N 1-methylindole Chemical compound C1=CC=C2N(C)C=CC2=C1 BLRHMMGNCXNXJL-UHFFFAOYSA-N 0.000 description 1
- VOXHHUSCWMAPPY-UHFFFAOYSA-N 2-benzylindazole Chemical compound C1=C2C=CC=CC2=NN1CC1=CC=CC=C1 VOXHHUSCWMAPPY-UHFFFAOYSA-N 0.000 description 1
- OAZHXZJUWHKFMP-UHFFFAOYSA-N 2-methylindazole Chemical compound C1=CC=CC2=NN(C)C=C21 OAZHXZJUWHKFMP-UHFFFAOYSA-N 0.000 description 1
- JNRLEMMIVRBKJE-UHFFFAOYSA-N 4,4'-Methylenebis(N,N-dimethylaniline) Chemical compound C1=CC(N(C)C)=CC=C1CC1=CC=C(N(C)C)C=C1 JNRLEMMIVRBKJE-UHFFFAOYSA-N 0.000 description 1
- XZIIFPSPUDAGJM-UHFFFAOYSA-N 6-chloro-2-n,2-n-diethylpyrimidine-2,4-diamine Chemical compound CCN(CC)C1=NC(N)=CC(Cl)=N1 XZIIFPSPUDAGJM-UHFFFAOYSA-N 0.000 description 1
- 229910001369 Brass Inorganic materials 0.000 description 1
- 239000004255 Butylated hydroxyanisole Substances 0.000 description 1
- NLZUEZXRPGMBCV-UHFFFAOYSA-N Butylhydroxytoluene Chemical compound CC1=CC(C(C)(C)C)=C(O)C(C(C)(C)C)=C1 NLZUEZXRPGMBCV-UHFFFAOYSA-N 0.000 description 1
- 229910000881 Cu alloy Inorganic materials 0.000 description 1
- ZVFDTKUVRCTHQE-UHFFFAOYSA-N Diisodecyl phthalate Chemical compound CC(C)CCCCCCCOC(=O)C1=CC=CC=C1C(=O)OCCCCCCCC(C)C ZVFDTKUVRCTHQE-UHFFFAOYSA-N 0.000 description 1
- 229920000877 Melamine resin Polymers 0.000 description 1
- 229910000990 Ni alloy Inorganic materials 0.000 description 1
- CTQNGGLPUBDAKN-UHFFFAOYSA-N O-Xylene Chemical compound CC1=CC=CC=C1C CTQNGGLPUBDAKN-UHFFFAOYSA-N 0.000 description 1
- QAPVYZRWKDXNDK-UHFFFAOYSA-N P,P-Dioctyldiphenylamine Chemical compound C1=CC(CCCCCCCC)=CC=C1NC1=CC=C(CCCCCCCC)C=C1 QAPVYZRWKDXNDK-UHFFFAOYSA-N 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- IYFATESGLOUGBX-YVNJGZBMSA-N Sorbitan monopalmitate Chemical compound CCCCCCCCCCCCCCCC(=O)OC[C@@H](O)[C@H]1OC[C@H](O)[C@H]1O IYFATESGLOUGBX-YVNJGZBMSA-N 0.000 description 1
- HVUMOYIDDBPOLL-XWVZOOPGSA-N Sorbitan monostearate Chemical compound CCCCCCCCCCCCCCCCCC(=O)OC[C@@H](O)[C@H]1OC[C@H](O)[C@H]1O HVUMOYIDDBPOLL-XWVZOOPGSA-N 0.000 description 1
- 229910000831 Steel Inorganic materials 0.000 description 1
- GSBLJNMZWBPOPI-UHFFFAOYSA-N [2-(9,9-diphenylnonyl)phenyl] dihydrogen phosphite Chemical compound OP(O)OC1=CC=CC=C1CCCCCCCCC(C=1C=CC=CC=1)C1=CC=CC=C1 GSBLJNMZWBPOPI-UHFFFAOYSA-N 0.000 description 1
- 230000032683 aging Effects 0.000 description 1
- 229910052783 alkali metal Inorganic materials 0.000 description 1
- 150000001340 alkali metals Chemical class 0.000 description 1
- 125000003277 amino group Chemical group 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- IYVBKVVOHXVKRD-UHFFFAOYSA-N benzimidazol-1-yl(phenyl)methanone Chemical compound C1=NC2=CC=CC=C2N1C(=O)C1=CC=CC=C1 IYVBKVVOHXVKRD-UHFFFAOYSA-N 0.000 description 1
- 239000010951 brass Substances 0.000 description 1
- 229940043253 butylated hydroxyanisole Drugs 0.000 description 1
- CZBZUDVBLSSABA-UHFFFAOYSA-N butylated hydroxyanisole Chemical compound COC1=CC=C(O)C(C(C)(C)C)=C1.COC1=CC=C(O)C=C1C(C)(C)C CZBZUDVBLSSABA-UHFFFAOYSA-N 0.000 description 1
- 235000019282 butylated hydroxyanisole Nutrition 0.000 description 1
- 238000005119 centrifugation Methods 0.000 description 1
- 239000013522 chelant Substances 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- IUYOGGFTLHZHEG-UHFFFAOYSA-N copper titanium Chemical compound [Ti].[Cu] IUYOGGFTLHZHEG-UHFFFAOYSA-N 0.000 description 1
- 238000002788 crimping Methods 0.000 description 1
- 238000005238 degreasing Methods 0.000 description 1
- SPBMDAHKYSRJFO-UHFFFAOYSA-N didodecyl hydrogen phosphite Chemical compound CCCCCCCCCCCCOP(O)OCCCCCCCCCCCC SPBMDAHKYSRJFO-UHFFFAOYSA-N 0.000 description 1
- 125000004177 diethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 description 1
- HBGGXOJOCNVPFY-UHFFFAOYSA-N diisononyl phthalate Chemical compound CC(C)CCCCCCOC(=O)C1=CC=CC=C1C(=O)OCCCCCCC(C)C HBGGXOJOCNVPFY-UHFFFAOYSA-N 0.000 description 1
- 125000000118 dimethyl group Chemical group [H]C([H])([H])* 0.000 description 1
- 238000009713 electroplating Methods 0.000 description 1
- 230000002708 enhancing effect Effects 0.000 description 1
- NBVXSUQYWXRMNV-UHFFFAOYSA-N fluoromethane Chemical compound FC NBVXSUQYWXRMNV-UHFFFAOYSA-N 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 229910052736 halogen Inorganic materials 0.000 description 1
- 150000002367 halogens Chemical class 0.000 description 1
- 230000001771 impaired effect Effects 0.000 description 1
- UTWGRMYWDUMKNY-UHFFFAOYSA-N indole-1-carboxylic acid Chemical compound C1=CC=C2N(C(=O)O)C=CC2=C1 UTWGRMYWDUMKNY-UHFFFAOYSA-N 0.000 description 1
- 238000003780 insertion Methods 0.000 description 1
- 230000037431 insertion Effects 0.000 description 1
- ZFSLODLOARCGLH-UHFFFAOYSA-N isocyanuric acid Chemical compound OC1=NC(O)=NC(O)=N1 ZFSLODLOARCGLH-UHFFFAOYSA-N 0.000 description 1
- 238000005461 lubrication Methods 0.000 description 1
- 238000003754 machining Methods 0.000 description 1
- JDSHMPZPIAZGSV-UHFFFAOYSA-N melamine Chemical compound NC1=NC(N)=NC(N)=N1 JDSHMPZPIAZGSV-UHFFFAOYSA-N 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 125000000896 monocarboxylic acid group Chemical group 0.000 description 1
- GPJPBLLWYCLERP-UHFFFAOYSA-N n-(benzotriazol-1-ylmethyl)-n-octyloctan-1-amine Chemical compound C1=CC=C2N(CN(CCCCCCCC)CCCCCCCC)N=NC2=C1 GPJPBLLWYCLERP-UHFFFAOYSA-N 0.000 description 1
- 239000003921 oil Substances 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 239000012188 paraffin wax Substances 0.000 description 1
- 239000012169 petroleum derived wax Substances 0.000 description 1
- 235000019381 petroleum wax Nutrition 0.000 description 1
- OJMIONKXNSYLSR-UHFFFAOYSA-N phosphorous acid Chemical compound OP(O)O OJMIONKXNSYLSR-UHFFFAOYSA-N 0.000 description 1
- 229910052698 phosphorus Inorganic materials 0.000 description 1
- XNGIFLGASWRNHJ-UHFFFAOYSA-L phthalate(2-) Chemical compound [O-]C(=O)C1=CC=CC=C1C([O-])=O XNGIFLGASWRNHJ-UHFFFAOYSA-L 0.000 description 1
- 238000005554 pickling Methods 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 230000002265 prevention Effects 0.000 description 1
- 230000003449 preventive effect Effects 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- 229910052703 rhodium Inorganic materials 0.000 description 1
- 239000010948 rhodium Substances 0.000 description 1
- MHOVAHRLVXNVSD-UHFFFAOYSA-N rhodium atom Chemical compound [Rh] MHOVAHRLVXNVSD-UHFFFAOYSA-N 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 229940035044 sorbitan monolaurate Drugs 0.000 description 1
- 235000011069 sorbitan monooleate Nutrition 0.000 description 1
- 239000001593 sorbitan monooleate Substances 0.000 description 1
- 229940035049 sorbitan monooleate Drugs 0.000 description 1
- 235000011071 sorbitan monopalmitate Nutrition 0.000 description 1
- 239000001570 sorbitan monopalmitate Substances 0.000 description 1
- 229940031953 sorbitan monopalmitate Drugs 0.000 description 1
- 235000011076 sorbitan monostearate Nutrition 0.000 description 1
- 239000001587 sorbitan monostearate Substances 0.000 description 1
- 229940035048 sorbitan monostearate Drugs 0.000 description 1
- 229960005078 sorbitan sesquioleate Drugs 0.000 description 1
- 241000894007 species Species 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
- 238000003860 storage Methods 0.000 description 1
- 239000011135 tin Substances 0.000 description 1
- 150000003918 triazines Chemical class 0.000 description 1
- IVIIAEVMQHEPAY-UHFFFAOYSA-N tridodecyl phosphite Chemical compound CCCCCCCCCCCCOP(OCCCCCCCCCCCC)OCCCCCCCCCCCC IVIIAEVMQHEPAY-UHFFFAOYSA-N 0.000 description 1
- 238000005292 vacuum distillation Methods 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
- 239000001993 wax Substances 0.000 description 1
- 238000004804 winding Methods 0.000 description 1
- 239000008096 xylene Substances 0.000 description 1
Abstract
Description
【0001】0001
【産業上の利用分野】本発明は、錫及び錫合金めっき材
の表面処理液、表面処理方法及び表面処理されたコネク
タ接触子に関する。特には潤滑、防錆、はんだ付け性及
び電気的接続性が長期間に安定して優れる表面処理液及
び表面処理されたコネクタ接触子に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a surface treatment solution for tin and tin alloy plated materials, a surface treatment method, and a surface treated connector contact. In particular, the present invention relates to surface treatment liquids and surface-treated connector contacts that exhibit excellent lubrication, rust prevention, solderability, and electrical connectivity over a long period of time.
【0002】0002
【従来の技術】電子機器用接続部品としてコネクタは最
も代表的なものであり多種多様のコネクタが実用化され
ている。電気製品の小型化、高級化に伴い、その電気回
路は益々精密になり、コネクタも小型化されてきている
。コネクタのコンタクトの表面処理には、金、銀、ロジ
ウム、ニッケル、錫、はんだなどのめっきが代表的なも
のとして挙げられる。特に錫およびはんだめっきは、低
価格であり、また、柔らかい金属であるが、酸化被膜は
硬く剥がれ易いため、挿抜により新しい金属表面が得ら
れるため民生機器を中心に使用されている。2. Description of the Related Art Connectors are the most typical connecting parts for electronic equipment, and a wide variety of connectors have been put into practical use. BACKGROUND OF THE INVENTION As electrical products become smaller and more sophisticated, their electrical circuits become more precise and connectors become smaller. Typical surface treatments for connector contacts include plating with gold, silver, rhodium, nickel, tin, solder, and the like. In particular, tin and solder plating are inexpensive and are soft metals, but the oxide film is hard and easily peels off, so a new metal surface can be obtained by insertion and removal, so they are mainly used in consumer electronics.
【0003】0003
【発明が解決しようとする課題】しかし、錫あるいはは
んだめっきした材料のはんだ付け性は、経時劣化を起こ
すことが知られているが、従来はこの経時劣化を抑える
方法がなかった。また、耐食性が低く、悪環境下では、
白錆等が発生し、外観及びその他の特性に悪影響があっ
た。また、スリット、プレス等の加工工程でロール等と
擦れた際、粉が発生したり、傷が付いたりしていた。ま
た、巻き取り後のコイルの運搬や保管時の振動や圧着に
より、傷付いたり、材料が凝着することがあった。更に
、プレス後のプレス品同士が擦れることにより、傷つい
たり、フレッティングコロージョンが起こっていた。[Problems to be Solved by the Invention] However, it is known that the solderability of tin or solder-plated materials deteriorates over time, but there has hitherto been no method for suppressing this deterioration over time. In addition, it has low corrosion resistance and cannot be used in harsh environments.
White rust, etc. occurred, and the appearance and other characteristics were adversely affected. In addition, when it rubs against rolls and the like during processing steps such as slitting and pressing, powder is generated and scratches occur. In addition, vibrations and crimping during transportation and storage of the coil after winding may cause damage or material may adhere to the coil. Furthermore, the pressed products rubbed against each other after pressing, resulting in damage and fretting corrosion.
【0004】本発明は、このような問題点を解決する表
面処理液及びそれを用いる表面処理方法を提供すること
を目的とし、あわせてそれにより処理されたコネクタを
提供することを目的とするものである。[0004] The present invention aims to provide a surface treatment liquid and a surface treatment method using the same that solves these problems, and also to provide a connector treated with the same. It is.
【0005】[0005]
【課題を解決するための手段】かかる状況に鑑み、本発
明者等は鋭意研究を行なった結果、以下に示す表面処理
液、方法及び表面処理されたコネクタを発明するに至っ
た。すなわち、本発明は、
(1)銅系または鉄系金属材料に錫または錫合金をめっ
きした材料を処理する表面処理液であって、(A)ペト
ロラタム0.1〜5wt%及び(B)フタル酸エステル
、亜りん酸エステル、グリセリンモノエステル及びソル
ビタンエステルからなる群より選択された1種または2
種以上0.01〜5wt%を必須成分とする有機溶剤溶
液よりなることを特徴とする表面処理液。
(2)キレート形成性環状窒素化合物の1種もしくは2
種以上0.05〜5wt%をさらに含有することを特徴
とする前記(1)記載の表面処理液。
(3)アミン系またはフェノール系酸化防止剤の1種も
しくは2種以上0.001〜1wt%を、さらに含有す
ることを特徴とする前記(1)または(2)記載の表面
処理液。
(4)銅系または鉄系金属材料に錫または錫合金をめっ
き後、前記(1)、(2)または(3)記載の表面処理
液で処理することを特徴とする表面処理方法。
(5)錫または錫合金をめっきした銅系または鉄系金属
材料をプレス加工後、前記(1)、(2)または(3)
記載の表面処理液で処理することを特徴とする表面処理
方法。
(6)銅系または鉄系金属材料に錫または錫合金をめっ
きした材料からなり、前記(1)、(2)または(3)
記載の表面処理液で表面処理したことを特徴とするコネ
クタである。[Means for Solving the Problems] In view of the above circumstances, the inventors of the present invention have conducted extensive research and as a result have come up with the following surface treatment liquid, method, and surface treated connector. That is, the present invention provides (1) a surface treatment liquid for treating a copper-based or iron-based metal material plated with tin or a tin alloy, which contains (A) 0.1 to 5 wt% petrolatum and (B) phthalate. One or two selected from the group consisting of acid esters, phosphite esters, glycerin monoesters, and sorbitan esters
1. A surface treatment solution comprising an organic solvent solution containing 0.01 to 5 wt% of the essential components. (2) One or two chelate-forming cyclic nitrogen compounds
The surface treatment liquid according to (1) above, further comprising 0.05 to 5 wt% of at least one species. (3) The surface treatment liquid according to (1) or (2) above, further comprising 0.001 to 1 wt% of one or more amine-based or phenolic antioxidants. (4) A surface treatment method comprising plating a copper-based or iron-based metal material with tin or a tin alloy, and then treating it with the surface treatment solution described in (1), (2), or (3) above. (5) After pressing the copper-based or iron-based metal material plated with tin or tin alloy, the above (1), (2) or (3) is applied.
A surface treatment method comprising treating with the surface treatment liquid described above. (6) Made of copper-based or iron-based metal material plated with tin or tin alloy, as described in (1), (2) or (3) above.
A connector characterized in that the surface is treated with the surface treatment liquid described above.
【0006】本発明の表面処理液の必須成分であるペト
ロラタムは石油から得られるゼリー状半固体の蝋であり
、真空蒸留残渣から溶剤脱蝋、遠心分離等により得られ
る軟膏状の石油ワックスである。パラフィンワックスに
比べ正パラフィンが多く、また5員環ナフテンも含まれ
融点が低い。ペトロラタムは鉄鋼における防錆剤の成分
の一つとしても知られているものであるが、本発明にお
いては基油としての機能を有する。すなわちそれ自身、
錫または錫合金めっき表面に被膜を形成し、大気中の水
分、酸素および各種の腐食媒とめっき表面が接触するの
を防いでいる。Petrolatum, which is an essential component of the surface treatment solution of the present invention, is a jelly-like semisolid wax obtained from petroleum, and is an ointment-like petroleum wax obtained from the vacuum distillation residue by solvent dewaxing, centrifugation, etc. . Compared to paraffin wax, it contains more normal paraffins, also contains 5-membered naphthenes, and has a lower melting point. Petrolatum is also known as one of the components of a rust preventive agent for steel, but in the present invention it functions as a base oil. That is, itself
A film is formed on the tin or tin alloy plating surface to prevent the plating surface from coming into contact with atmospheric moisture, oxygen, and various corrosive media.
【0007】本発明において、この基油の選択は、他の
成分と相俟って相剰的に耐食性、耐久性を向上させるう
えで重要な成分である。そして、その濃度は0.1wt
%より小さいと、耐食性、耐久性が小さくなり、所望の
効果を得ることができない。一方5wt%より大きいと
接触抵抗が上昇し接点用の表面処理として価値がなくな
り、また、塗布ムラ等が生じて好ましくない。In the present invention, the selection of this base oil is an important component for improving corrosion resistance and durability in combination with other components. And its concentration is 0.1wt
If it is less than %, corrosion resistance and durability will be reduced, making it impossible to obtain the desired effect. On the other hand, if it is more than 5 wt%, the contact resistance will increase and it will be useless as a surface treatment for contacts, and uneven coating will occur, which is not preferable.
【0008】本発明の表面処理液のもう一つの必須成分
は、フタル酸エステル、亜りん酸エステル、グリセリン
モノエステル及びソルビタンエステルであり、これらは
1種又は2種以上混合して添加され、耐食性向上に寄与
する。添加量は0.01〜5wt%である。0.01w
t%未満では耐食性向上効果が得られず、5wt%を越
えると、接触抵抗への悪影響が認められる。Another essential component of the surface treatment liquid of the present invention is phthalate ester, phosphite ester, glycerin monoester, and sorbitan ester, which are added singly or in a mixture of two or more to improve corrosion resistance. Contribute to improvement. The amount added is 0.01 to 5 wt%. 0.01w
If it is less than t%, the effect of improving corrosion resistance cannot be obtained, and if it exceeds 5wt%, an adverse effect on contact resistance is observed.
【0009】本発明の表面処理液に使用するフタル酸エ
ステルとしては、例えば、フタル酸ジメチル、フタル酸
ジエチル、フタル酸ジブチル、フタル酸ジヘプチル、フ
タル酸ジ−n−オクチル、フタル酸ジ−2−エチルヘキ
シル、フタル酸ジイソノニル、フタル酸オクチルデシル
、フタル酸ジイソデシル等を挙げることができる。Phthalate esters used in the surface treatment solution of the present invention include, for example, dimethyl phthalate, diethyl phthalate, dibutyl phthalate, diheptyl phthalate, di-n-octyl phthalate, and di-2-phthalate. Examples include ethylhexyl, diisononyl phthalate, octyldecyl phthalate, and diisodecyl phthalate.
【0010】又、亜リン酸エステルとしては、例えば、
トリフェニルホスファイト、トリクレジルホスファイト
、ジフェニルノニルフェニルホスファイト、トリラウリ
ルホスファイト、ジラウリルハイドロゼンホスファイト
等を挙げることができる。又、グリセリンモノエステル
としては、例えは、グリセリンモノオレイン酸エステル
を好ましく用いることができる。[0010] Examples of phosphite esters include, for example:
Examples include triphenyl phosphite, tricresyl phosphite, diphenylnonylphenyl phosphite, trilauryl phosphite, dilauryl hydrogen phosphite, and the like. Further, as the glycerin monoester, for example, glycerin monooleate can be preferably used.
【0011】又、ソルビタンエステルとしては、例えば
、ソルビタンモノ・ラウレート、ソルビタンモノ・ステ
アレート、ソルビタンモノ・パルミテート、ソルビタン
・モノ・オレエート、ソルビタンセスキ・オレエート、
ソルビタントリ・オレエート等を挙げることができる。Further, as the sorbitan ester, for example, sorbitan mono laurate, sorbitan mono stearate, sorbitan mono palmitate, sorbitan mono oleate, sorbitan sesqui oleate,
Examples include sorbitan tri-oleate.
【0012】本発明の表面処理液には必要に応じてキレ
ート形成性環状窒素化合物;アミン系又はフェノール系
酸化防止剤を添加することができる。キレート形成性環
状窒素化合物は、銅、ニッケル等に配位して安定なキレ
ートを形成する化合物で、特にベンゼン環を有する環状
窒素化合物、あるいはトリアジン系化合物が好ましい。
具体例を挙げれば、ベンゼン環を有する環状窒素化合物
としては、たとえば、ベンゾトリアゾール系として下記
一般式1[0012] A chelate-forming cyclic nitrogen compound; an amine-based or phenol-based antioxidant may be added to the surface treatment liquid of the present invention, if necessary. The chelate-forming cyclic nitrogen compound is a compound that forms a stable chelate by coordinating with copper, nickel, etc., and is particularly preferably a cyclic nitrogen compound having a benzene ring or a triazine-based compound. To give a specific example, as a cyclic nitrogen compound having a benzene ring, for example, as a benzotriazole type, the following general formula 1 is used.
【化1】 インダゾール系として下記一般式2[Chemical formula 1] As an indazole type, the following general formula 2
【化2】 ベンズイミダゾール系として下記一般式3[Case 2] As a benzimidazole type, the following general formula 3
【化3】 インドール系として下記一般式4[Chemical formula 3] As an indole type, the following general formula 4
【化4】
(上記各式中、R1 は水素、アルキル、置換アルキル
を表わし、R2 はアルカリ金属、水素、アルキル、置
換アルキルを表わす)等を挙げることができる。embedded image (In each of the above formulas, R1 represents hydrogen, alkyl, or substituted alkyl, and R2 represents an alkali metal, hydrogen, alkyl, or substituted alkyl).
【0013】ベンゾトリアゾール系としては、例えばベ
ンゾトリアゾール(R1 、R2 ともに水素)、1−
メチルベンゾトリアゾール(R1 が水素、R2 がメ
チル)、1−(N,N−ジオクチルアミノメチル)ベン
ゾトリアゾール(R1 が水素、R2 がN,N−ジオ
クチルアミノメチル)、トリルトリアゾール(R1 が
メチル、R2 が水素)、ソジウムトリルトリアゾール
(R1 がメチル、R2 がナトリウム)等が好ましい
。Examples of the benzotriazole type include benzotriazole (both R1 and R2 are hydrogen), 1-
Methylbenzotriazole (R1 is hydrogen, R2 is methyl), 1-(N,N-dioctylaminomethyl)benzotriazole (R1 is hydrogen, R2 is N,N-dioctylaminomethyl), tolyltriazole (R1 is methyl, R2 is hydrogen), sodium tolyltriazole (R1 is methyl and R2 is sodium), and the like are preferred.
【0014】インダゾール系としては、例えばインダゾ
ール(R1、R2ともに水素)、2−メチルインダゾー
ル(R1が水素、R2がメチル)、2−ベンジルインダ
ゾール(R1が水素、R2がC6H5CH2)、1−ア
セチルインダゾール(R1が水素、R2がCOCH3)
等が好ましい。Examples of the indazole type include indazole (R1 and R2 are both hydrogen), 2-methylindazole (R1 is hydrogen and R2 is methyl), 2-benzylindazole (R1 is hydrogen and R2 is C6H5CH2), and 1-acetylindazole. (R1 is hydrogen, R2 is COCH3)
etc. are preferred.
【0015】ベンズイミダゾール系としては、例えばベ
ンズイミダゾール(R1、R2ともに水素)、N−アセ
チルベンズイミダゾール(R1が水素、R2がCOCH
3)、N−ベンゾイルベンズイミダゾール(R1が水素
、R2がCOC6H5)等が好ましい。As the benzimidazole type, for example, benzimidazole (R1 and R2 are both hydrogen), N-acetylbenzimidazole (R1 is hydrogen, R2 is COCH
3), N-benzoylbenzimidazole (R1 is hydrogen, R2 is COC6H5), etc. are preferred.
【0016】インドール系としては、例えばインドール
(R1、R2ともに水素)、インドール−1−カルボン
酸(R1が水素、R2がCOOH)、1−メチルインド
ール(R1が水素、R2がCH3)等が好ましい。Preferred examples of the indole type include indole (R1 and R2 are both hydrogen), indole-1-carboxylic acid (R1 is hydrogen and R2 is COOH), and 1-methylindole (R1 is hydrogen and R2 is CH3). .
【0017】また、トリアジン系化合物の好ましい具体
例を挙げれば、例えば、6−置換−1,3,5−トリア
ジン−2,4−ジチオール−ナトリウム塩として下記一
般式5Preferred specific examples of triazine compounds include the following general formula 5 as 6-substituted-1,3,5-triazine-2,4-dithiol-sodium salt.
【化5】
(Rはアルキル基で置換されたアミノ基を表わし、例え
ば−N(C4H9)2、−N(C8H17)2、−N(
C12H25)2、−NHC8H16CH=CHC8H
17等が好ましい。)、シアヌル酸(2,4,6−トリ
オキシ−1,3,5−トリアジン)として下記一般式6
embedded image (R represents an amino group substituted with an alkyl group, such as -N(C4H9)2, -N(C8H17)2, -N(
C12H25)2, -NHC8H16CH=CHC8H
17 etc. is preferable. ), the following general formula 6 as cyanuric acid (2,4,6-trioxy-1,3,5-triazine)
【化6】
メラミン(2,4,6−トリアミノ−1,3,5−トリ
アジン)として下記一般式7[Chemical formula 6] Melamine (2,4,6-triamino-1,3,5-triazine) has the following general formula 7
【化7】 である。[C7] It is.
【0018】これらは1種または2種以上混合して添加
され、ペトロラタムと共に耐食性、耐久性を向上させる
。その濃度は総量で0.05〜5wt%である。0.0
5wt%より小さいと耐食性、耐久性が低く、また、5
wt%より大きいと電気的接続性に支障が生じる。[0018] These are added singly or as a mixture of two or more to improve corrosion resistance and durability together with petrolatum. Its concentration is 0.05-5 wt% in total. 0.0
If it is less than 5 wt%, corrosion resistance and durability will be low;
If it is larger than wt%, electrical connectivity will be impaired.
【0019】又、本発明の表面処理液に、必要に応じて
添加される上記のアミン系又はフェノール系酸化防止剤
としては、たとえば、P,P′−ジオクチルジフェニル
アミンとして下記一般式8[0019] The above-mentioned amine-based or phenol-based antioxidant which may be added as necessary to the surface treatment liquid of the present invention is, for example, one represented by the following general formula 8 as P,P'-dioctyldiphenylamine.
【化8】
4,4′−テトラメチルジアミノジフェニルメタンとし
て下記一般式9[Chemical formula 8] The following general formula 9 as 4,4'-tetramethyldiaminodiphenylmethane
【化9】
4,4′−メチレン−ビス−(2,6−ジ−t−ブチル
フェノール)として下記一般式10[Chemical Formula 9] The following general formula 10 as 4,4'-methylene-bis-(2,6-di-t-butylphenol)
【化10】
2,2′−メチレン−ビス−(4−メチル−6−t−ブ
チルフェノール)として下記一般式11[Chemical formula 10] 2,2'-methylene-bis-(4-methyl-6-t-butylphenol) is represented by the following general formula 11.
【化11】
2,2′−メチレン−ビス−(4−エチル−6−t−ブ
チルフェノール)として下記一般式12[Chemical formula 11] The following general formula 12 as 2,2'-methylene-bis-(4-ethyl-6-t-butylphenol)
【化12】
2,6−ジ−t−ブチル−p−クレゾールとして下記一
般式13[Chemical formula 12] The following general formula 13 as 2,6-di-t-butyl-p-cresol
【化13】 ブチル化ヒドロキシアニゾールとして下記一般式14[Chemical formula 13] As butylated hydroxyanisole, the following general formula 14
【
化14】
2,6−ジ−t−ブチル−4−エチルフェノールとして
下記一般式15[
14] The following general formula 15 is used as 2,6-di-t-butyl-4-ethylphenol.
【化15】 等を挙げることができる。[Chemical formula 15] etc. can be mentioned.
【0020】これらは、1種又は2種以上を0.001
〜1wt%添加することができる。これらの成分を添加
することにより、耐久性を一層向上させることができる
。
すなわち、表面処理皮膜の機能を長期に亘り安定させ、
また高温環境における皮膜の劣化を抑制する効果を有す
る。0.001wt%未満ではその効果を得ることはで
きず、1wt%を越えると接触抵抗の低下現象が認めら
れる。[0020] These include one or more types at a concentration of 0.001
~1 wt% can be added. By adding these components, durability can be further improved. In other words, the function of the surface treatment film is stabilized over a long period of time,
It also has the effect of suppressing film deterioration in high-temperature environments. If it is less than 0.001 wt%, this effect cannot be obtained, and if it exceeds 1 wt%, a decrease in contact resistance is observed.
【0021】表面処理液は上述の成分を有するが、溶媒
としては特に制限されず、公知の有機溶媒より適宜選択
することができる。例えばトルエン、キシレン等の石油
系溶媒、トリクロロエチレン、トリクロロエタン等のハ
ロゲン系溶媒、あるいはフロン系溶媒等である。The surface treatment liquid has the above-mentioned components, but the solvent is not particularly limited and can be appropriately selected from known organic solvents. Examples include petroleum-based solvents such as toluene and xylene, halogen-based solvents such as trichloroethylene and trichloroethane, and fluorocarbon-based solvents.
【0022】処理方法としては、めっき品を表面処理液
中に浸漬するか、表面処理液をスプレー、あるいは塗布
するなど、何れの方法によることもできる。しかし本発
明において、めっき品の形状が板・条、プレス部品であ
るを問わず、めっき直後すなわち連続ラインであれば、
そのラインの中で処理することが、表面処理の各種機能
を高める効果が高いことを見いだした。[0022] As a treatment method, any method may be used, such as immersing the plated product in a surface treatment liquid, or spraying or applying the surface treatment liquid. However, in the present invention, regardless of whether the shape of the plated product is a plate, strip, or pressed part, if it is immediately after plating, that is, on a continuous line,
It has been found that processing within this line is highly effective in enhancing various functions of surface treatment.
【0023】さらに、めっき品をプレス加工後に本発明
の表面処理液で表面処理する事も有効である。めっき後
表面処理した金属材料であっても、その後のプレス加工
で付着したプレス油を洗浄する工程において、表面処理
の機能の多くは喪失する、そこで再度の表面処理が有効
となる。Furthermore, it is also effective to surface-treat the plated product with the surface treatment solution of the present invention after press working. Even with metal materials that have been surface-treated after plating, many of the functions of the surface treatment are lost in the process of cleaning press oil adhering during subsequent press working, so re-surface treatment becomes effective.
【0024】その後のコネクタの加工工程においても、
最終の電子機器の組み立てまで、めっき品の洗浄工程が
あれば同様に表面処理機能は喪失するため、適宜本発明
により表面処理する事が有効である。さらには電子機器
にコネクタとして組み込まれ実使用に際しても、使用に
ともない接点性能が低下するなどの場合は、適宜表面処
理液により処理することができる。従って、本発明は本
発明表面処理液により処理されたコネクタをも包含する
ものである。[0024] In the subsequent connector machining process,
If there is a cleaning process for the plated product until the final assembly of the electronic device, the surface treatment function will be lost as well, so it is effective to perform the surface treatment according to the present invention as appropriate. Furthermore, even when incorporated into electronic equipment as a connector and used in actual use, if the contact performance deteriorates with use, it can be treated with an appropriate surface treatment liquid. Therefore, the present invention also includes connectors treated with the surface treatment liquid of the present invention.
【0025】なお、本発明における、めっき母材となる
金属材料は、銅及び、黄銅、りん青銅、チタン銅等の各
種銅合金、鉄、ステンレス鋼、高ニッケル合金等、コネ
クタの要求性能に従い適宜選択でき、何等制限されない
。下地めっきについては、銅、ニッケル等を適宜でき、
何等制限されない。錫または錫合金めっきは、酸性浴、
アルカリ性浴からの無光沢めっき、光沢めっき、リフロ
ーめっきも包含するものである。In the present invention, the metal material serving as the plating base material may be copper, various copper alloys such as brass, phosphor bronze, titanium copper, iron, stainless steel, high nickel alloy, etc., as appropriate according to the required performance of the connector. You can choose and there are no restrictions. For base plating, copper, nickel, etc. can be used as appropriate.
There are no restrictions whatsoever. Tin or tin alloy plating is done by acid bath,
It also includes matte plating, bright plating, and reflow plating from an alkaline bath.
【0026】[0026]
【実施例】以下に実施例を挙げて本発明を更に詳細に説
明する。ばね用りん青銅(C5210)の厚み0.2m
mの冷間圧延材を用い、雄及び雌の連続端子をそれぞれ
プレス成形した。これをリール・ツウ・リールの連続電
気めっきラインを通して電気めっきを施した。めっきラ
インにおいては、脱脂、酸洗後、1.5μmの厚みでリ
フロー錫、リフローはんだ及び光沢はんだの各種のめっ
きを施し、トリクロロエタンを溶媒とした各種表面処理
液に浸漬し、表面処理を施した。こうして表面処理した
雄と雌の端子をキャリアー部から切断しリード線を圧着
したものを供試材とした。これらの供試材を塩水噴霧試
験(JISZ 2731−1988)48時間に供し
、耐食性を評価した。また、塩水噴霧試験後の材料のは
んだ付け性をJIS C 0050−1985(エ
ージング無し、方法1)で試験を行ない、はんだ濡れ面
積で評価した。また、塩水噴霧試験後の材料の接触抵抗
を4端子法で測定した。また、雄と雌のコネクタを嵌合
し、バイブレーター上に固定し、1時間バイブレーター
を作動させた後、コネクタを引き抜き、その接触部の外
観で耐振動性を評価した。バイブレーターで1時間振動
後の材料の接触抵抗を測定した。接触抵抗測定は次の条
件で行なった。
荷 重:0.1N
摺動速度:0.02mm/sec
摺動距離:2mm
測定点 :200
結果を表1に示す。[Examples] The present invention will be explained in more detail with reference to Examples below. Thickness of phosphor bronze (C5210) for springs: 0.2m
Male and female continuous terminals were each press-molded using a cold-rolled material of 500 mm. This was electroplated through a reel-to-reel continuous electroplating line. In the plating line, after degreasing and pickling, various platings of reflow tin, reflow solder, and bright solder were applied to a thickness of 1.5 μm, and the surface treatment was performed by immersing it in various surface treatment solutions using trichloroethane as a solvent. . The thus surface-treated male and female terminals were cut from the carrier portion and lead wires were crimped to prepare test materials. These test materials were subjected to a salt spray test (JISZ 2731-1988) for 48 hours to evaluate their corrosion resistance. Further, the solderability of the material after the salt spray test was tested in accordance with JIS C 0050-1985 (no aging, method 1), and evaluated by the solder wetted area. In addition, the contact resistance of the material after the salt spray test was measured using a four-terminal method. Further, the male and female connectors were fitted together and fixed on a vibrator, and after operating the vibrator for 1 hour, the connector was pulled out and the vibration resistance was evaluated based on the appearance of the contact portion. The contact resistance of the material was measured after being vibrated with a vibrator for 1 hour. Contact resistance measurements were conducted under the following conditions. Load: 0.1N Sliding speed: 0.02mm/sec Sliding distance: 2mm Measurement points: 200 The results are shown in Table 1.
【表1】
注1)ただし、表中表面処理液の略号は以下の通りであ
る。
A ペトロラタム
B−1 フタル酸ジメチル
−2 フタル酸ジエチル
−3 フタル酸ジブチル
−4 フタル酸ジヘプチル
−5 フタル酸ジ−n−オクチル
−6 フタル酸ジ−2−エチルヘキシル−7 フタ
ル酸ジイソノニル
−8 フタル酸オクチルデシル
−9 フタル酸ジイソデシル
−10 トリフェニルホスファイト
−11 トリクレジルホスファイト
−12 ジフェニルノニルフェニルホスファイト−1
3 トリラウリルホスファイト
−14 ジラウリルハイドロゼンホスファイト−15
グリセリンモノオレイン酸エステル−16 ソル
ビタンモノ・ラウレート−17 ソルビタンモノ・ス
テアレート−18 ソルビタンモノ・パルミテート−
19 ソルビタンモノ・オレエート−20 ソルビ
タンセスキ・オレエート−21 ソルビタントリ・オ
レエートC−1 ベンゾトリアゾール
−2 インダゾール
−3 ベンズイミダゾール
−4 インドール
−5 1−メチルベンゾトリアゾール−6 トリル
トリアゾール
−7 ソジウムトリルトリアゾール
−8 メラミン
D−1 P,P′−ジオクチルフェニルアミン−2
4,4′−テトラメチルジアミノジフェニルメタン
−3 4,4′−メチレン−ビス−(2,6−ジ−t
−ブチルフェノール)
−4 2,2′−メチレン−ビス−(4−メチル−6
−t−ブチルフェノール)
−5 2,2′−メチレン−ビス−(4−エチル−6
−t−ブチルフェノール)
−6 2,6−ジ−t−ブチル−p−クレゾール−7
ブチル化ヒドロキシアニゾール−8 2,6−ジ
−t−ブチル−4−エチルフェノール注2)試験の判定
基準は次の通りである。
■塩水噴霧試験後の外観
○:白錆なし
×:白錆あり
■はんだ付け性(n=5)
○:はんだ濡れ面積が98%以上
×:はんだ濡れ面積が98%未満
■塩水噴霧試験後の接触抵抗、振動後の接触抵抗○:接
触抵抗最大値が20mΩ未満
×:接触抵抗最大値が20mΩ以上
■耐振動性
○:摩耗が認められない
×:摩耗が認められる[Table 1] Note 1) However, the abbreviations of the surface treatment liquids in the table are as follows. A Petrolatum B-1 Dimethyl phthalate-2 Diethyl phthalate-3 Dibutyl phthalate-4 Diheptyl phthalate-5 Di-n-octyl phthalate-6 Di-2-ethylhexyl phthalate-7 Diisononyl phthalate-8 Phthalic acid Octyldecyl-9 Diisodecyl phthalate-10 Triphenylphosphite-11 Tricresylphosphite-12 Diphenylnonylphenylphosphite-1
3 Trilauryl phosphite-14 Dilauryl hydrogen phosphite-15
Glycerin monooleate-16 Sorbitan mono-laurate-17 Sorbitan mono-stearate-18 Sorbitan mono-palmitate-
19 Sorbitan mono-oleate-20 Sorbitan sesqui-oleate-21 Sorbitan tri-oleate C-1 Benzotriazole-2 Indazole-3 Benzimidazole-4 Indole-5 1-Methylbenzotriazole-6 Tolyltriazole-7 Sodium tolyltriazole- 8 Melamine D-1 P,P'-dioctyl phenylamine-2
4,4'-tetramethyldiaminodiphenylmethane-3 4,4'-methylene-bis-(2,6-di-t
-butylphenol) -4 2,2'-methylene-bis-(4-methyl-6
-t-butylphenol) -5 2,2'-methylene-bis-(4-ethyl-6
-t-butylphenol) -6 2,6-di-t-butyl-p-cresol-7
Butylated hydroxyanisole-8 2,6-di-t-butyl-4-ethylphenol Note 2) The test criteria are as follows. ■ Appearance after salt spray test ○: No white rust ×: White rust ■ Solderability (n = 5) ○: Solder wet area is 98% or more ×: Solder wet area is less than 98% ■ After salt water spray test Contact resistance, contact resistance after vibration ○: Maximum contact resistance is less than 20 mΩ ×: Maximum contact resistance is 20 mΩ or more ■Vibration resistance ○: No wear is observed ×: Wear is observed
【0027】[0027]
【発明の効果】以上述べたように、本発明により表面処
理された錫または錫合金の接点は、処理直後のはんだ付
け性、過酷な腐食環境においても優れた耐食性及びはん
だ付け性を有する。また、フレッティングコロージョン
等、錫の凝着に起因する外観不良及びコンタクトにおけ
る接触不良の発生を抑えることができる。As described above, the tin or tin alloy contacts surface-treated according to the present invention have excellent solderability immediately after treatment, and excellent corrosion resistance and solderability even in a severe corrosive environment. Furthermore, it is possible to suppress the appearance defects such as fretting corrosion caused by adhesion of tin and the occurrence of contact defects in contacts.
【表2】[Table 2]
Claims (6)
合金をめっきした材料を処理する表面処理液であって、
(A)ペトロラタム0.1〜5wt%及び(B)フタル
酸エステル、亜りん酸エステル、グリセリンモノエステ
ル及びソルビタンエステルからなる群より選択された1
種または2種以上0.01〜5wt%を必須成分として
含有する有機溶剤溶液よりなることを特徴とする表面処
理液。[Claim 1] A surface treatment liquid for treating a copper-based or iron-based metal material plated with tin or a tin alloy, comprising:
(A) 0.1 to 5 wt% petrolatum and (B) 1 selected from the group consisting of phthalates, phosphites, glycerin monoesters, and sorbitan esters.
A surface treatment solution comprising an organic solvent solution containing 0.01 to 5 wt% of one or more species as essential components.
もしくは2種以上0.05〜5wt%をさらに含有する
ことを特徴とする請求項1記載の表面処理液。2. The surface treatment liquid according to claim 1, further comprising 0.05 to 5 wt % of one or more chelate-forming cyclic nitrogen compounds.
剤の1種もしくは2種以上0.001〜1wt%を、さ
らに含有することを特徴とする請求項1または2記載の
表面処理液。3. The surface treatment liquid according to claim 1, further comprising 0.001 to 1 wt % of one or more amine-based or phenolic antioxidants.
合金をめっき後、請求項1、2または3記載の表面処理
液で処理することを特徴とする表面処理方法。4. A surface treatment method, which comprises plating a copper-based or iron-based metal material with tin or a tin alloy, and then treating the material with the surface treatment solution according to claim 1, 2, or 3.
は鉄系金属材料をプレス加工後、請求項1、2または3
記載の表面処理液で処理することを特徴とする表面処理
方法。[Claim 5] After pressing a copper-based or iron-based metal material plated with tin or a tin alloy, claim 1, 2 or 3
A surface treatment method comprising treating with the surface treatment liquid described above.
合金をめっきした材料からなり、請求項1、2または3
記載の表面処理液で表面処理したことを特徴とするコネ
クタ。[Claim 6] The material is made of a copper-based or iron-based metal material plated with tin or a tin alloy, and claims 1, 2, or 3
A connector characterized in that the surface is treated with the surface treatment liquid described above.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP10822291A JPH04314890A (en) | 1991-04-15 | 1991-04-15 | Liquid and method for surface treatment |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP10822291A JPH04314890A (en) | 1991-04-15 | 1991-04-15 | Liquid and method for surface treatment |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH04314890A true JPH04314890A (en) | 1992-11-06 |
Family
ID=14479142
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP10822291A Pending JPH04314890A (en) | 1991-04-15 | 1991-04-15 | Liquid and method for surface treatment |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH04314890A (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2004218051A (en) * | 2003-01-17 | 2004-08-05 | Toyo Kohan Co Ltd | Plated steel sheet subjected to posttreatment |
JP2004218050A (en) * | 2003-01-17 | 2004-08-05 | Toyo Kohan Co Ltd | Posttreatment liquid for plated steel sheet, plated steel sheet subjected to posttreatment using the same, and production method therefor |
-
1991
- 1991-04-15 JP JP10822291A patent/JPH04314890A/en active Pending
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2004218051A (en) * | 2003-01-17 | 2004-08-05 | Toyo Kohan Co Ltd | Plated steel sheet subjected to posttreatment |
JP2004218050A (en) * | 2003-01-17 | 2004-08-05 | Toyo Kohan Co Ltd | Posttreatment liquid for plated steel sheet, plated steel sheet subjected to posttreatment using the same, and production method therefor |
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