JPH04314759A - Polyarylene sulfide resin composition - Google Patents

Abstract

PURPOSE:To provide a new polyarylene sulfide resin composition excellent in moldability, improved in toughness and ductility without detriment to the high rigidity and heat resistance inherent in the resin and used for parts requiring high rigidity and heat resistance and including electric and electronic components and automobile parts. CONSTITUTION:A polyarylene sulfide resin composition comprising 100 pts.wt. polyarylene sulfide resin, 0.001-5 pts.wt. acidic compound reactive with the polyarylene sulfide resin and 0.01-3 equivalents (in terms of cation equivalents), per equivalent of the acidic compound, of a compound capable of forming an ionic bond and comprising an element of the group IA, IIA, IB, IIB, IIIB or VIII of the periodic table. Another polyarylene sulfide resin composition comprising 100 pts.wt. polyarylene sulfide resin and 0.001-10 pts.wt. salt of an acidic compund reactive with the polyarylene sulfide resin.

Description

[Detailed description of the invention]

0001

[Industrial Application Field] The present invention is made by mixing a polyarylene sulfide resin with a reactive ionic compound, which has excellent moldability, and has high rigidity and heat resistance, which are the characteristics of the resin. The present invention relates to a novel polyarylene sulfide resin composition that has improved toughness and ductility without impairing properties.

[0002] The resin composition according to the present invention is used particularly in parts requiring high rigidity and heat resistance, including electrical/electronic parts and automobile parts.

0003

[Prior Art] Polyarylene sulfide resins, represented by polyphenylene sulfide resins, have high rigidity and excellent heat resistance.In particular, molding materials reinforced with reinforcing agents such as glass fibers are used for automobile parts and electronics. It is being used in the field of related parts, especially in areas that require heat resistance, and demand as a useful engineering plastic is increasing.

[0004] However, unreinforced polyarylene sulfide resin is unsuitable as a molding material because its mechanical properties, typified by bending displacement at break and tensile elongation at break, are insufficient. Furthermore, even when reinforced with glass fiber or the like, the polyarylene sulfide resin itself is brittle, which limits its application to many uses despite its excellent performance.

[0005]

Problems to be Solved by the Invention Conventionally, compositions with various resin materials have been disclosed for the purpose of imparting toughness and ductility to polyarylene sulfide resins. For example, a method of blending polyphenylene ether resin (JP-A-50-15
6561), method of blending polyarylate resin (JP-A-53-57255), method of blending polyamide resin (JP-A-53-69255), method of blending polyethylene terephthalate resin (JP-A-57-168945)
, a method of blending an olefin copolymer consisting of an α-olefin and a glycidyl ester of an α,β-unsaturated acid (Japanese Unexamined Patent Publication No. 58-154757), a method of blending a polyetheramide thermoplastic elastomer (Japanese Unexamined Patent Publication No. 154757), 58-277
46), method of blending polyamide-based or polyester-based thermoplastic elastomer (JP-A-59-11305
5), a method of blending an ethylene-propylene-nonconjugated diene copolymer rubber (Japanese Patent Application Laid-Open No. 148268/1983), and the like.

Although these methods are effective in imparting toughness and ductility to polyarylene sulfide resins, they have the essential problem that the rigidity of the resins is impaired to some extent. On the other hand, in an attempt to impart toughness and ductility to polyarylene sulfide resin without impairing its rigidity, a method of blending various functional group-containing alkoxysilanes (Japanese Unexamined Patent Application Publication No. 63-2011)
51430), which is somewhat effective in improving the tensile elongation at break of the same resin with a low degree of polymerization;
It remains fragile.

In addition, since this method involves increasing the molecular weight by utilizing the reactivity of the terminal groups of polyarylene sulfide resin, when applied to the same resin with a high degree of polymerization, the melt viscosity increases significantly and the toughness and ductility decrease. Even if this was applied, there remained a problem in moldability.

[0008]

[Means for Solving the Problems] In view of the problems of the prior art as described above, the present inventors have developed a polyarylene sulfide resin that maintains its rigidity, imparts toughness and ductility, and has excellent moldability. As a result of intensive studies aimed at obtaining a polyarylene sulfide resin, it was discovered that the above object could be achieved by mixing a reactive ionic compound with a polyarylene sulfide resin, and the present invention was achieved.

That is, the gist of the present invention is that (a) polyarylene sulfide resin: 100 parts by weight, (b) acidic compound having reactivity with polyarylene sulfide resin: 0.001 to 5 parts by weight, and (c) 1A of the periodic table
Ionic bonding compound having an element belonging to any of Group 2A, Group 1B, Group 2B, Group 3B and Group 8: the above (b
) 0.01 to 0.01 as the cation equivalent to the acid equivalent of the component
A polyarylene sulfide resin composition consisting of 3 equivalents,
and (a) polyarylene sulfide resin: 100 parts by weight, (b) a salt of an acidic compound having reactivity with the polyarylene sulfide resin: 0.001 to 10 parts by weight. .

The present invention will be explained in detail below. The polyarylene sulfide resin in the composition of the present invention is a polymer consisting of repeating units represented by the following structural formula.

[0011]

[Chemical formula 1]

(R represents an alkyl group having 1 to 5 carbon atoms or a hydrogen atom, and n represents an integer of 0 to 4.) Among these, preferred polymers include:

[0013]

[Case 2]

Examples include polymers consisting of repeating units represented by the following: polyphenylene sulfide (hereinafter sometimes abbreviated as PPS). PPS is generally made of a polymer with a relatively small molecular weight obtained by a manufacturing method typified by Japanese Patent Publication No. 45-3368, and
There are essentially linear and relatively high molecular weight polymers obtained by the production method typified by No. 2240. It is also possible to increase the degree of polymerization and use it by adding a crosslinking agent such as PP and heating, and in the present invention, PP obtained by any method can be used.
Although it is possible to use S, in terms of the toughness of PPS itself, an essentially linear polymer obtained by the production method typified by the above-mentioned Japanese Patent Publication No. 52-12240 may be more preferably used. .

[0015] In addition, less than 30 mol% of the repeating units in PPS can be composed of repeating units having the following structural formula.

[0016]

[Chemical formula 3]

[0017] The melt viscosity of PPS used in the present invention is:
There is no particular restriction as long as it is possible to obtain a molded product, but under the conditions of a temperature of 310°C and a shear rate of 103 sec-1, the toughness of PPS itself is 100 poise or more, but the moldability is 100 poise or more. ,000 poise or less is more preferably used. Furthermore, from the viewpoint of fully exhibiting the effects of the present invention, 2000 poise or more, 10,000 poise
Poise or less is optimal.

The PPS used in the present invention may also contain antioxidants, heat stabilizers, lubricants, etc. to the extent that the effects of the present invention are not impaired.
Conventional additives such as crystal nucleating agents, ultraviolet inhibitors, and coloring agents can be added, and in addition, for the purpose of controlling the degree of crosslinking of PPS, conventional peroxides and JP-A-59-131650 can be added.
Crosslinking accelerators such as thiophosphinic acid metal salts described in JP-A-58-204045 and JP-A-58
Crosslinking inhibitors such as dialkyl acid dicarboxylate and aminotriazole described in JP-A-204046 and the like can also be blended.

The acidic compound having reactivity with the polyarylene sulfide resin used as component (b) of the present invention refers to (a) a carboxyl group (including cases where it is present in the form of an acid anhydride group) in the same molecule. ) and/or a sulfonic acid group and (b) a chemical structure that is reactive with the polyarylene sulfide resin under the melting conditions of the resin.

Reactivity with the polyarylene sulfide resin can be confirmed by indirect evidence, such as an increase in the melt viscosity of the resin due to the mixing of multiple compounds with specific chemical structures, or an increase in non-Newtonian properties in the molten state. It is possible. These phenomena are considered to be caused by the increase in molecular weight due to the reaction between a specific chemical structure and the polyarylene sulfide resin.

Therefore, in the present invention, the chemical structure (b) that is reactive with the polyarylene sulfide resin means that by mixing a compound having a plurality of these into the same resin, the melt viscosity and/or melt state of the resin changes. includes chemical structures that increase the non-Newtonian nature of Specific examples of such chemical structures include carbon-carbon double bonds, carbon-carbon triple bonds, epoxy groups, acid anhydride groups, nitro groups, and alkoxysilyl groups.

Therefore, specific examples of acidic compounds having reactivity with the polyarylene sulfide resin used as component (b) of the present invention include acrylic acid, butenoic acid, crotonic acid, vinylacetic acid, methacrylic acid, pentenoic acid, Angelic acid, tibric acid, 2-pentenoic acid, 3-pentenoic acid, α-ethyl acrylic acid, β-methyl crotonic acid,
4-pentenoic acid, 2-hexenoic acid, 2-methyl-2-pentenoic acid, 3-methyl-2-pentenoic acid, α-ethylcrotonic acid, 2,2-dimethyl-3-butenoic acid, 2-heptenoic acid, 2-octenoic acid, 4-decenoic acid, 9-undecenoic acid, 10-undecenoic acid, 4-dodecenoic acid, 5-dodecenoic acid, 4-tetradecenoic acid, 9-tetradecenoic acid, 9
-hexadecenoic acid, 2-octadecenoic acid, 9-octadecenoic acid, icosenoic acid, docosenoic acid, erucic acid, tetracosenoic acid, mycolipenic acid, 2,4-pentadienoic acid,
2,4-hexadienoic acid, diallylacetic acid, geranic acid, 2,4-decadienoic acid, 2,4-dodecadienoic acid, 9
・12-hexadecadienoic acid, 9,12-octadecadienoic acid, hexadecatrienoic acid, linoleic acid, linolenic acid, octadecatrienoic acid, icosadienoic acid, icosatrienoic acid, icosatetraenoic acid, ricinoleic acid,
Eleostearic acid, oleic acid, icosapentaenoic acid, erucic acid, docosadienoic acid, docosatrienoic acid,
Unsaturated carboxylic acids such as docosatetraenoic acid, docosapentaenoic acid, tetracosenoic acid, hexacosenoic acid, hexacodienoic acid, octacosenoic acid, traacontenoic acid, vinylbenzoic acid, propargylbenzoic acid, and their carbon-carbon unsaturated bonds Epoxidized carboxylic acids containing epoxy groups, 4-glycidyloxybenzoic acid, maleic anhydride, maleic acid, fumaric acid, itaconic anhydride,
α,β-unsaturated dicarboxylic acids and their anhydrides such as itaconic acid, methylnadic anhydride, dichloromaleic anhydride, methylnadic acid, dichloromaleic acid, dichlorofumaric acid, etc., soybean oil, tung oil, castor oil, linseed oil , natural oils and fats such as hempseed oil, cottonseed oil, sesame oil, rapeseed oil, peanut oil, camellia oil, olive oil, coconut oil, and sardine oil, epoxidized natural oils and fats such as epoxidized soybean oil, vinyl sulfonic acid,
Vinyl methanesulfonic acid, isopropenylsulfonic acid,
Vinylethanesulfonic acid, isopropenylmethanesulfonic acid, o-styrenesulfonic acid, m-styrenesulfonic acid, p-styrenesulfonic acid, propargylbenzenesulfonic acid, isopropenylbenzenesulfonic acid, 2-acrylamido-2-methyl-propanesulfone acid, 3-
Unsaturated sulfonic acids such as sulfopropyl acrylate and 3-sulfopropyl methacrylate, and their carbon-
Sulfonic acid containing an epoxy group whose carbon unsaturated bond is epoxidized, 4-glycidyloxybenzenesulfonic acid,
Trimellitic anhydride, pyromellitic anhydride, 1, 2, 3
-Cyclohexanetricarboxylic anhydride, 1,2,4-
Cyclohexanetricarboxylic anhydride, 1, 2, 4, 5
-cyclohexanetetracarboxylic dianhydride, 1, 4,
Anhydrides of polyhydric carboxylic acids such as 5,8-naphthalenetetracarboxylic dianhydride, o-nitrobenzoic acid, m-nitrobenzoic acid, p-nitrobenzoic acid, 3-nitrophthalic acid,
Mononitrocarboxylic acids and their anhydrides such as 4-nitrophthalic acid, 3-nitrophthalic anhydride, 4-nitrophthalic anhydride, nitroacetic acid, 2-nitropropionic acid, and 3-nitropropionic acid, o-nitrobenzenesulfonic acid, m-
Mononitrosulfonic acids such as nitrobenzenesulfonic acid, p-nitrobenzenesulfonic acid, and nitromethanesulfonic acid, γ-carboxypropyltrimethoxysilane, γ-
Examples include alkoxysilanes containing a carboxyl group such as carboxypropyltriethoxysilane.

Among these, preferred are (a) the above carboxyl group and/or sulfonic acid group and (b) a carbon-carbon double bond, a carbon-carbon triple bond, a nitro group or an epoxy group in the same molecule. It is a compound having simultaneously acrylic acid, crotonic acid, methacrylic acid, itaconic acid, maleic acid, fumaric acid, p-styrenesulfonic acid, 2-acrylamido-2-methyl-1
-Propanesulfonic acid, 3-sulfopropyl acrylate, 3-sulfopropyl methacrylate, m-nitrobenzoic acid, m-nitrobenzenesulfonic acid, 4-glycidyloxybenzoic acid, and 4-glycidyloxybenzenesulfonic acid are preferably used.

Groups 1A, 2A, 1B, 2B, 3B and 8 of the periodic table used as component (c) of the present invention
An ion-binding compound having an element belonging to any of the above groups refers to a compound containing these elements as a releasable cation, that is, a hydroxide, oxide, carbonate,
It means bicarbonate, carboxylate, halide, sulfide, hydrogen sulfide, nitrate, phosphate, aryloxide salt, alcoholate, hydride, borohydride salt, alkylate.

Preferably, the elements constituting component (c) of the present invention include Group 1A, Group 2A, Group 1B, and Group 2B of the periodic table.
and aluminum, particularly preferably elements of groups 1A and 2A of the periodic table, or zinc. Specific examples of component (c) include lithium hydroxide, sodium hydroxide, potassium hydroxide, magnesium hydroxide, calcium hydroxide, barium hydroxide, zinc hydroxide, aluminum hydroxide, nickel hydroxide, and hydroxide. Hydroxides such as iron, cobalt hydroxide, copper hydroxide, oxides such as lithium oxide, sodium oxide, potassium oxide, magnesium oxide, barium oxide, zinc oxide, lithium carbonate, sodium carbonate, potassium carbonate, magnesium carbonate, Carbonates such as zinc carbonate and iron carbonate, hydrogen carbonates such as lithium hydrogen carbonate, sodium hydrogen carbonate, and potassium hydrogen carbonate, lithium formate, sodium formate, potassium formate, magnesium formate, calcium formate, barium formate, zinc formate, lithium acetate , sodium acetate, potassium acetate, magnesium acetate, calcium acetate, barium acetate, zinc acetate, nickel acetate, cobalt acetate, iron acetate, aluminum acetate, lithium benzoate, sodium benzoate, potassium benzoate, etc. carboxylate, chloride Lithium, sodium chloride, potassium chloride, magnesium chloride, calcium chloride,
Halides such as barium chloride, lithium bromide, sodium bromide, potassium bromide, lithium iodide, sodium iodide, potassium iodide, etc., sulfides such as lithium sulfide, sodium sulfide, potassium sulfide, magnesium sulfide, calcium sulfide, etc. , hydrogen sulfide salts such as lithium hydrogen sulfide, sodium hydrogen sulfide, potassium hydrogen sulfide, nitrates such as lithium nitrate, sodium nitrate, potassium nitrate, zinc nitrate, lithium phosphate, sodium phosphate, potassium phosphate, magnesium phosphate, calcium phosphate, etc. Phosphates, aryl oxide salts such as lithium phenolate, sodium phenolate, potassium phenolate, lithium naphthlate, sodium naphthlate, potassium naphthlate, lithium methylate, sodium methylate, potassium methylate, magnesium methylate, Alcoholates such as sodium ethylate, t-butyloxypotassium, hydrides such as lithium hydride, sodium hydride, potassium hydride, magnesium hydride, calcium hydride, borohydride salts such as sodium borohydride, n
Examples include alkylated products such as -butyl lithium, dimethyl cuprate, and Grignard reagent.

Among these, preferably 1 of the periodic table
Hydroxide, oxide, carbonate or carboxylate of an element belonging to Group A, Group 2A, Group 1B, Group 2B, Group 3B or Group 8, specifically potassium hydroxide, water Hydroxides such as magnesium oxide, aluminum hydroxide, zinc hydroxide, oxides such as potassium oxide, magnesium oxide, calcium oxide, barium oxide, zinc oxide, carbonates such as potassium carbonate, magnesium carbonate, zinc carbonate, or Basic compounds represented by acetate salts such as , sodium acetate, potassium acetate, barium acetate, and zinc acetate are preferably used, and among them, potassium hydroxide, magnesium hydroxide, magnesium oxide, barium oxide, zinc oxide, potassium carbonate, Magnesium carbonate, zinc carbonate, zinc acetate, potassium acetate and the like are particularly preferably used. Among these,
Particularly preferred are hydroxides, oxides or acetates.

The salt of an acidic compound that is reactive with the polyarylene sulfide resin used as the component (d) of the present invention is the salt of an acidic compound that is reactive with the polyarylene sulfide resin used as the component (b) of the present invention, as described above. Refers to a salt of a reactive acidic compound. Possible cations constituting the salt include Groups 1A and 2 of the periodic table.
Cations containing elements of Group A, Group 6A, Group 7A, Group 8, Group 1B, Group 2B, Group 3B, Group 4B, Group 5B (preferably,
Groups 1A, 2A, 1B, 2B, 3B of the periodic table,
or those containing Group 8 elements), ammonia, amines, nitrogen-containing heterocyclic aromatic compounds, onium ions of phosphine, and the like. Specifically, Li+, Na+,
K + , Be2+, Mg2+, Ca2+, Sr2+,
Ba2+, Cr2+, Cr3+, Mn2+, Mn3+,
Fe2+, Fe3+, Co2+, Co3+, Ni2+,
Ni3+, Cu+, Cu2+, Ag+, Zn2+,
Al3+, Sn2+, Sn4+, Pb2+, Pb4+,
Inorganic cations such as Sb3+, SbO +, NH4 +
, CH3NH3+ , (CH3)2NH2 +, (C
H3)3NH+ , (CH3)4N + , (C2H5
)3NH + , (C2H5)4N+ , (n-C4H
9) 3NH + , (n-C4H9)4N+ , (CH
3) 3(C6H5-CH2)H + , ammonium ions such as pyrrolidinium ions and piperidinium ions, onium of nitrogen-containing heterocyclic aromatic compounds such as pyridinium ions, collidinium ions, quinolinium ions, and pyrimidinium ions ion, (CH3)4P +
, (n-C3H7)4P+ , (n-C4H9)4P+
Examples include phosphonium ions such as Among these, Na+, K+, Mg2+, Ca2+, Ba2
Inorganic cations such as + and Zn2+ are preferably used from the viewpoint of thermal stability and non-toxicity.

Preferably, component (d) of the present invention contains (in the same molecule) in view of the relationship with component (b).
a) carboxyl group and/or sulfonic acid group, and (b)
It is a salt of a compound having at the same time a carbon-carbon double bond, a carbon-carbon triple bond, or a nitro group. Particularly preferred salts include sodium p-styrenesulfonate, potassium 3-sulfopropyl acrylate, potassium 3-sulfopropyl methacrylate, sodium m-nitrobenzenesulfonate, sodium 4-glycidyloxybenzenesulfonate, tetra-glycidyloxybenzenesulfonate, Butylphosphonium salt, 2-acrylamide-2
-sodium methylpropanesulfonate, zinc 2-acrylamido-2-methylpropanesulfonate, and the like.

In the resin composition of the present invention, the above (a)
) For 100 parts by weight of polyarylene sulfide resin,
(b) 0.001 to 5 parts by weight, preferably 0.001 to 5 parts by weight, of an acidic compound that is reactive with the polyarylene sulfide resin.
05 to 3 parts by weight, more preferably 0.1 to 1.5 parts by weight, (c) Group 1A, Group 2A, Group 1B, Group 2B of the periodic table,
The ion-binding compound having an element belonging to either Group 3B or Group 8 is used in an amount of 0.01 to 3 equivalents, preferably 0.05 to 3 equivalents as a cation equivalent to the acid equivalent of the component (b).
Use 2.5 equivalents, more preferably 0.1 to 2 equivalents. and the (a) polyarylene sulfide resin 100
(d) 0.001 to 10 parts by weight, preferably 0.05 to 6 parts by weight, more preferably 0.1 to 3 parts by weight, based on the weight part It is necessary to use some parts.

If the amount of component (b) is less than the above range, the effect of imparting toughness and ductility will be insufficient, and if it is more than the above range, the polyarylene sulfide resin will deteriorate significantly, including coloring and foaming. When the amount of component (c) is more than the above range,
In particular, the ductility decreases rapidly, which is not preferable in either case.

The amount of (c) needs to be determined according to the acid equivalent of component (b) as described above, and this fact indicates that both components (b) and (c) are salts in the composition. It is presumed that the effects of the present invention, imparting toughness and ductility, are achieved by the ionic bonding force causing some effect on the polyarylene sulfide molecular chain, such as crosslinking or crystal shape change.

On the other hand, if the amount of component (d) is less than the above range, the effect of imparting toughness and ductility will be insufficient, and if it is more than the above range, the ductility will drop particularly markedly, and discoloration and foaming may occur, which is not preferable. There is no particular restriction on the method for preparing the resin composition of the present invention, and any method can be selected and used from among the methods conventionally used for mixing resins or mixing resins and fillers. .

For example, the components in powder or pellet form are mixed uniformly using a Henschel mixer, super mixer, ribbon blender, etc., and then mixed using a twin screw extruder, single screw extruder, roll, Banbury mixer, Prabender blastograph, etc. Usually 280 ~ with a melt kneader such as
The resin composition of the present invention is obtained by melt-kneading at a temperature in the range of 350°C.

It is preferable that the components constituting the present invention be dry blended all at once and then melt-mixed.
), (b), and (c), in the case of a composition consisting of (a)
, (c) components are melt-mixed in advance, and then the (b) components are melt-mixed in advance.
It is also possible to melt mix the components. However, if the (a) and (b) components are first melted and mixed in the absence of the (c) component, the (a) component may deteriorate, which is not preferable.

In the present invention, inorganic fillers may be included in the compositions of the present invention in an amount up to about 65% by weight of the total composition, preferably in the range of about 30 to about 60% by weight of the total composition. Inorganic fillers useful in the present invention can be selected from materials such as glass materials, calcium carbonate, calcium sulfate, talc, mica, and the like. Preferably, glass substances are used. Although the glass material can be selected from any commercially available product commonly used as a filler and reinforcing agent, such as glass fibers or glass beads, the preferred material for the present invention is glass fiber.

Various other additives may be used in the polyarylene sulfide resin composition of the present invention in small amounts up to about 5% by weight of the total composition. These additives include materials such as flow enhancers (processability) agents, silanes and pigments. Solid ethylene copolymers (see U.S. Pat. No. 4,134,874) as compatible processing agents.
, saturated fatty acid salts such as zinc stearate and N,N
-Alkylenebis(alkanamide), 10 to carbon atoms
30 glycerides and phosphated glycerides of saturated fatty acids, mono- and di-alkanolamides derived from saturated fatty acids, and esters derived from saturated long-chain aliphatic acids and long-chain saturated aliphatic alcohols. It can also be added.

[0037]

EXAMPLES The present invention will be explained in more detail below with reference to Examples, but the present invention is not limited by these Examples unless it deviates from the gist thereof. In this example, the mixing of each component and the evaluation of physical properties were performed by the following method. Mixing method: All Examples and Comparative Examples were mixed using a TEM-35B twin screw extruder manufactured by Toshiba Machine Co., Ltd.
Barrel temperature setting 300℃, screw rotation speed 150rpm
The strands obtained were cooled with water and then made into chips.

Evaluation: Using an IS-45P injection molding machine manufactured by Toshiba Machinery Co., Ltd., the tension of the ASTM standard (ASTM -638)
, and bending (ASTMD-790) test pieces for each test were formed.

Next, the product was annealed in a vacuum oven at 120°C for 12 hours in an absolutely dry state, and the temperature was adjusted to 23°C in a vacuum desiccator (containing silica gel), and then tested according to the ASTM standard, and the various physical properties shown below were determined. was evaluated. (i) Rigidity, toughness, and ductility were evaluated using flexural modulus (kg/cm2), bending displacement at break (mm), and tensile elongation at break (%), respectively. (ii) Molding processability was evaluated using the molding injection pressure (kg/cm2); This was done by measuring the temperature (°C). (iii) Heat resistance evaluation was performed by measuring the melting point (° C.) using DSC. The DSC measurement was carried out between 30° C. and 340° C. at a temperature increase/decrease rate of 20° C./min. Example 1 Polyphenylene sulfide resin manufactured by Toray Philips (trade name: Ryton E-0780, hereinafter abbreviated as PPS) 1
00 parts by weight, 2-acrylamido-2-methyl-propanesulfonic acid (trade name: TBAS-Q: Nitto Chemical Co., Ltd.)
(hereinafter abbreviated as TBAS) 0.25 parts by weight, 0.25 parts by weight of zinc oxide.
0625 parts by weight were mixed and evaluated under the above conditions. Example 2 PPS 100 parts by weight, TBAS 2 parts by weight, zinc oxide 0.
5 parts by weight were mixed and evaluated under the above conditions. Example 3 100 parts by weight of PPS, 2 parts by weight of fumaric acid, and 2.6 parts by weight of potassium carbonate were mixed and evaluated under the above conditions. Example 4 100 parts by weight of PPS and 1 part by weight of sodium p-styrene sulfonate (Spinomer NaSS, manufactured by Tosoh Corporation) were mixed and evaluated under the above conditions. Comparative Example 1 The case of PPS alone was evaluated in the same manner as Examples 1 to 4. Comparative Example 2 100 parts by weight of PPS and 0.5 parts by weight of TBAS were mixed and evaluated under the above conditions. Comparative Example 3 100 parts by weight of PPS and 0.5 parts by weight of zinc oxide were mixed and evaluated under the above conditions.

The above evaluation results are shown in Tables 1 and 2. Example 5 100 parts by weight of PPS, 1 part by weight of TBAS, and 0.97 parts by weight of barium hydroxide (octahydrate) were mixed and evaluated under the above conditions. Example 6 100 parts by weight of PPS and 1 part by weight of sodium m-nitrobenzenesulfonate were mixed and evaluated under the above conditions. Comparative Example 4 In Comparative Example 1, the PPS was 310°C and the shear rate was 1.
A sample having a melt viscosity of 1500 poise at 0.03 sec-1 was used and evaluated in the same manner. Example 7 100 parts by weight of PPS and 1 part by weight of 4-glycidyloxybenzenesulfonic acid tetrabutylphosphonium salt were mixed and evaluated under the above conditions. Example 8 In Example 6, PPS was 310°C and shear rate 1.
A sample having a melt viscosity of 1,500 poise at 0.03 sec-1 was used, and the other components were mixed and evaluated under the same composition and conditions.

[0041]

[Table 1]

(1) 310°C, shear rate 103/se
Viscosity at c-1: 6000 poise (2) 310°C, shear rate 103/sec-1 Viscosity at 1500 poise (3) TBAS: 2-acrylamide-2-methylpropanesulfonic acid (manufactured by Nitto Chemical Co., Ltd.) 4) NaSS: Sodium P-styrene sulfonate (
Manufactured by Tosoh Corporation)

[0043]

[Table 2]

[0044]

As can be seen from Tables 1 and 2, according to the present invention, a polyarylene sulfide resin imparted with toughness and ductility can be obtained without any loss in rigidity. Regarding the molding processability, it can be seen that both the crystallization behavior during the cooling process, as indicated by the crystallization temperature, and the melt fluidity, as indicated by the molding injection pressure, are equivalent to those of PPS alone. Furthermore, as shown by the melting point, it is understood that heat resistance is almost completely maintained. Therefore, the present invention can provide extremely useful materials in the fields of various automobile parts, mechanical parts, electrical and electronic parts, etc.

Claims (2)

[Claims] Claim: (a) polyarylene sulfide resin: 100 parts by weight, (b) acidic compound having reactivity with polyarylene sulfide resin: 0.001 to 5 parts by weight.
parts by weight, and (c) an ionic bonding compound having an element belonging to any of Group 1A, Group 2A, Group 1B, Group 2B, Group 3B, and Group 8 of the periodic table: based on the acid equivalent of the component (b). A polyarylene sulfide resin composition characterized by having a cation equivalent of 0.01 to 3 equivalents. 2. (a) Polyarylene sulfide resin: 100 parts by weight, (b) Salt of an acidic compound having reactivity with polyarylene sulfide resin: 0.001
10 parts by weight of a polyarylene sulfide resin composition.