JPH04314121A - Touch panel - Google Patents

Touch panel

Info

Publication number
JPH04314121A
JPH04314121A JP3106705A JP10670591A JPH04314121A JP H04314121 A JPH04314121 A JP H04314121A JP 3106705 A JP3106705 A JP 3106705A JP 10670591 A JP10670591 A JP 10670591A JP H04314121 A JPH04314121 A JP H04314121A
Authority
JP
Japan
Prior art keywords
electrode
polymer film
conductive adhesive
adhesive layer
output circuit
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP3106705A
Other languages
Japanese (ja)
Inventor
Soichi Matsuzaki
松崎 壮一
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Lincstech Circuit Co Ltd
Original Assignee
Hitachi AIC Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi AIC Inc filed Critical Hitachi AIC Inc
Priority to JP3106705A priority Critical patent/JPH04314121A/en
Publication of JPH04314121A publication Critical patent/JPH04314121A/en
Pending legal-status Critical Current

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Abstract

PURPOSE:To prevent imperfect connection between an electrode and an output circuit and a defect that the output circuit is peeled off from a polymer film. CONSTITUTION:A first electrode 5 such as ITO is installed on the polymer film 2, and a first output circuit 6 to be c1onnected to this first electrode 5 and a second output circuit 7 insulated from the first electrode 5 are installed by applying Ag paste, etc., and these are made into a first insulated base board 1. Then, a conductive adhesive layer 14 is laminated at the part of the polymer film 2 at the surface of the second output circuit 7 and its periphery, and in addition, it comes into contact with a second electrode 11 so as to connect both electrically, and a touch panel 10 is formed. Since the conductive adhesive layer is laminated not only at the surface of the second output circuitk but up to the part of the polymer film at its periphery, the defect that the conductive adhesive layer is peedled off from the second output circuit and the imperfect connection is caused, or the second output circuit is peeled off from the polymer film can be prevented even if stress is applied to the conductive adhesive layer since the internal pressure is increased.

Description

【発明の詳細な説明】[Detailed description of the invention]

【0001】0001

【産業上の利用分野】本発明はタッチパネルに関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a touch panel.

【0002】0002

【従来の技術】従来、タッチパネルは、CRTディスプ
レイや液晶ディスプレイ等の表示体の表面に設置し、情
報入力装置や座標指示装置として利用されている。
2. Description of the Related Art Conventionally, a touch panel has been installed on the surface of a display such as a CRT display or a liquid crystal display and used as an information input device or a coordinate indicating device.

【0003】このタッチパネルは、例えば図3に示す通
り、ガラス板やアクリル板等に電極を形成した絶縁基板
20と、フレキシブルな高分子フィルムに電極を形成し
た絶縁基板21とを積層した構造になっている。そして
電極を外部回路に接続するために、Agペースト等から
なる取り出し回路を設けこれを電極に接続する。しかし
、前者のガラス板等に取り出し回路を設けると外部回路
に接続するのにコストがかかるため、通常、この前者の
絶縁基板20に形成した電極22用の取り出し回路23
も、後者の高分子フィルムからなる絶縁基板21の方に
設けている。そして、電極22の表面と取り出し回路2
3の表面とにのみ導電性接着剤24を積層して互いに電
気的に接続している。
For example, as shown in FIG. 3, this touch panel has a structure in which an insulating substrate 20 in which electrodes are formed on a glass plate, an acrylic plate, etc., and an insulating substrate 21 in which electrodes are formed in a flexible polymer film are laminated. ing. In order to connect the electrode to an external circuit, a lead-out circuit made of Ag paste or the like is provided and connected to the electrode. However, if a lead-out circuit is provided on the glass plate or the like in the former case, it will be costly to connect it to an external circuit, so usually, the lead-out circuit 23 for the electrode 22 formed on the insulating substrate 20 in the former case is
They are also provided on the latter insulating substrate 21 made of a polymer film. Then, the surface of the electrode 22 and the extraction circuit 2
A conductive adhesive 24 is laminated only on the surfaces of 3 and 3 to electrically connect them to each other.

【0004】0004

【発明が解決しようとする課題】しかし、タッチパネル
は、高温雰囲気中に晒すと内部の圧力が上昇してふくれ
、また、高湿の雰囲気中に晒すと高分子フィルムがたる
んでふくらんだりする。そのために、導電性接着剤層の
箇所にストレスがかかり、電極と取り出し回路とが接続
不良となり易い欠点がある。
[Problems to be Solved by the Invention] However, when a touch panel is exposed to a high-temperature atmosphere, the internal pressure increases and the touch panel swells, and when exposed to a high-humidity atmosphere, the polymer film sag and swell. Therefore, stress is applied to the portion of the conductive adhesive layer, resulting in a disadvantage that poor connection between the electrode and the extraction circuit is likely to occur.

【0005】また、取り出し回路を形成するのに用いる
Agペースト等は、高分子フィルムとの密着性が比較的
小さく、そのため、導電性接着剤層にストレスがかかる
と、取り出し回路が高分子フィルムから剥離する欠点も
ある。
[0005] Furthermore, the Ag paste used to form the lead-out circuit has relatively low adhesion to the polymer film, and therefore, if stress is applied to the conductive adhesive layer, the lead-out circuit will separate from the polymer film. It also has the disadvantage of peeling.

【0006】本発明の目的は、以上の欠点を改良し、電
極と取り出し回路との接続不良や取り出し回路が高分子
フィルムから剥離する不良を防止できるタッチパネルを
提供するものである。
SUMMARY OF THE INVENTION An object of the present invention is to improve the above-mentioned drawbacks and to provide a touch panel that can prevent poor connection between electrodes and take-out circuits and failures such as peeling of the take-out circuits from the polymer film.

【0007】[0007]

【課題を解決するための手段】本発明は、上記の目的を
達成するために、高分子フィルムに第1電極を設けると
ともにこの第1電極に接続する第1取り出し回路と前記
第1電極に対して絶縁した第2取り出し回路とを設けて
第1絶縁基板とし、この第1絶縁基板を第2電極を設け
た第2絶縁基板に積層し、前記第2取り出し回路をこの
第2電極に導電性接着剤層を介して接続したタッチパネ
ルにおいて、第2取り出し回路周辺の高分子フィルムの
部分にまで積層した導電性接着剤層を設けることを特徴
とするタッチパネルを提供するものである。
[Means for Solving the Problems] In order to achieve the above object, the present invention provides a first electrode on a polymer film, a first extraction circuit connected to the first electrode, and a first electrode connected to the first electrode. A second insulating substrate is provided with a second insulating circuit insulated with a second electrode, and the first insulating substrate is laminated on a second insulating substrate provided with a second electrode, and the second insulating circuit is insulated with the second electrode. The present invention provides a touch panel connected via an adhesive layer, characterized in that a conductive adhesive layer is provided that is laminated up to a portion of the polymer film around the second take-out circuit.

【0008】[0008]

【作用】導電性接着剤層を第2取り出し回路だけに積層
して第2電極と接続するだけでなく、第2取り出し回路
周辺の高分子フィルムの部分にまで積層しているため、
この箇所で高分子フィルムを第2絶縁基板により強固に
接着できる。従って、内圧が上昇したり高分子フィルム
にたるみ等を生じ導電性接着剤層にストレスがかかって
も、第2取り出し回路と第2電極とが接続不良となった
りあるいは第2取り出し回路が高分子フィルムから剥離
したりするのを防止できる。
[Function] The conductive adhesive layer is not only laminated only on the second take-out circuit and connected to the second electrode, but also on the part of the polymer film around the second take-out circuit.
At this location, the polymer film can be firmly bonded to the second insulating substrate. Therefore, even if the internal pressure increases or the polymer film becomes sagging and stress is applied to the conductive adhesive layer, there may be a poor connection between the second take-out circuit and the second electrode, or if the second take-out circuit is made of polymer film. It can prevent it from peeling off from the film.

【0009】[0009]

【実施例】以下、本発明を実施例に基づいて説明する。 図1は第1絶縁基板1の平面図を示す。2はポリエステ
ル等のフレキシブルな高分子フィルムであり、長方形状
で長辺と短辺に各々突起状の第1テール部3及び第2テ
ール部4を形成している。5は、この高分子フィルム2
に設けたITO等からなる第1電極であり、高分子フィ
ルム2の短辺に長辺を合わせた長方形状に形成し、複数
条、互いに並列に配置している。6は第1テール部3か
ら第1電極5までAgペースト等を印刷して設けた第1
取り出し回路である。7は、第2テール部4を通り第1
電極5の近傍まで設けた第2取り出し回路である。この
第2取り出し回路7の第1電極5に近い方の端は、巾が
広くなっていて、第2電極ヘッド部8を形成している。
EXAMPLES The present invention will be explained below based on examples. FIG. 1 shows a plan view of the first insulating substrate 1. As shown in FIG. Reference numeral 2 denotes a flexible polymer film such as polyester, which has a rectangular shape and has protruding first and second tail parts 3 and 4 on its long and short sides, respectively. 5 is this polymer film 2
The first electrode is made of ITO or the like and is formed in a rectangular shape with the long side aligned with the short side of the polymer film 2, and a plurality of strips are arranged in parallel with each other. 6 is a first electrode provided by printing Ag paste or the like from the first tail portion 3 to the first electrode 5.
This is the extraction circuit. 7 passes through the second tail portion 4 and the first
This is a second extraction circuit provided up to the vicinity of the electrode 5. The end of the second extraction circuit 7 closer to the first electrode 5 has a wider width and forms a second electrode head portion 8 .

【0010】図2は第1絶縁基板1を、第2絶縁基板9
に積層したタッチパネル10を示す。第2絶縁基板9は
、ガラス板やアクリル板等に第2電極11を複数条設け
、適当な間隔でドット状のスペーサ12を設けたもので
ある。第2電極11は、長方形状で、第1絶縁基板1に
設けた第1電極5と直角に交差する方向に設けている。 13は、両面テープ等からなるスペーサであり、第1絶
縁基板1と第2絶縁基板9との端の間に配置している。 14は、異方導電性接着剤層であり、第2電極11と第
2取り出し回路7との間に積層していて、特に、第2取
り出し回路7の周辺の高分子フィルム2表面にまで積層
して設けている。
FIG. 2 shows a first insulating substrate 1 and a second insulating substrate 9.
The touch panel 10 is shown laminated on the top of the screen. The second insulating substrate 9 is a glass plate, an acrylic plate, etc., on which a plurality of second electrodes 11 are provided, and dot-shaped spacers 12 are provided at appropriate intervals. The second electrode 11 has a rectangular shape and is provided in a direction perpendicular to the first electrode 5 provided on the first insulating substrate 1 . Reference numeral 13 denotes a spacer made of double-sided tape or the like, and is arranged between the ends of the first insulating substrate 1 and the second insulating substrate 9. Reference numeral 14 denotes an anisotropic conductive adhesive layer, which is laminated between the second electrode 11 and the second take-out circuit 7, and in particular, is laminated to the surface of the polymer film 2 around the second take-out circuit 7. It is set up as follows.

【0011】次に、上記実施例の製造方法について述べ
る。先ず、高分子フィルム2にITO等をスパッタリン
グしたり真空蒸着して透明導電膜を積層し、エッチング
して第1電極5を形成する。次に、第1取り出し回路6
及び第2取り出し回路7をAgペースト等を印刷して形
成する。各回路6及び7を形成後、高分子フィルム2を
所定の形状に切断する。
Next, the manufacturing method of the above embodiment will be described. First, a transparent conductive film is laminated on the polymer film 2 by sputtering or vacuum deposition of ITO or the like, and the first electrode 5 is formed by etching. Next, the first extraction circuit 6
And the second extraction circuit 7 is formed by printing Ag paste or the like. After forming each circuit 6 and 7, the polymer film 2 is cut into a predetermined shape.

【0012】また、予じめ所定の形状に形成したガラス
板等にITO等をスパッタリング等して透明導電膜を積
層し、エッチングして第2電極11を形成する。第2電
極11を形成後、ドット状のスペーサ12を印刷して形
成する。
[0012] Further, a transparent conductive film is laminated by sputtering ITO or the like on a glass plate or the like that has been previously formed into a predetermined shape, and then etched to form the second electrode 11. After forming the second electrode 11, dot-shaped spacers 12 are printed and formed.

【0013】さらに、第2取り出し回路7の第2電極ヘ
ッド部8及びその周辺に異方導電性接着剤層14を積層
して仮接着するとともに、第1絶縁基板1と第2絶縁基
板9との端を両面テープ等を介して互いに張り付ける。 そしてこのタッチパネル10の第1絶縁基板1側から熱
ヘッド13を押し付け異方導電性接着剤層14を熱プレ
スする。
Further, an anisotropic conductive adhesive layer 14 is laminated and temporarily bonded to the second electrode head portion 8 of the second extraction circuit 7 and its surroundings, and the first insulating substrate 1 and the second insulating substrate 9 are bonded together. Attach the ends to each other using double-sided tape, etc. Then, the thermal head 13 is pressed from the first insulating substrate 1 side of the touch panel 10 to hot press the anisotropically conductive adhesive layer 14 .

【0014】次に、実施例と従来例とについて、湿乾サ
イクルテストを行い、それ等の変化を測定した。実施例
等の製造条件は次の通りとする。
Next, a wet/dry cycle test was conducted for the example and the conventional example, and changes therein were measured. The manufacturing conditions for Examples etc. are as follows.

【0015】実施例: 高分子フィルム 厚さ175μmのポリエステルフィルムを20×30c
m(第1テール部及び第2テール部を除く)の長方形状
に形成する。 電  極 ITOからなる厚さ400Aの透明導電膜第1取り出し
回路・第2取り出し回路 Agインクを厚さ10μmに塗布印刷する。 熱圧着処理 異方導電性接着剤として4mm巾のアニソルム(日立化
成工業株式会社製商品名)を用い、これを第2電極ヘッ
ド部とその周辺に積層する。そしてアニソルム側から4
mm×17cmの熱ヘッドを当て、アニソルムを温度1
00℃にして、4kg/cm2 圧で5秒間熱プレスし
、仮圧着する。この仮圧着後、アニソルムからセパレー
タを剥離し、高分子フィルム側から、アニソルムを温度
150℃にして20kg/cm2 で20秒間熱プレス
し、本圧着する。
Example: Polyester film 20×30cm thick polyester film 175 μm thick
m (excluding the first tail part and the second tail part) in a rectangular shape. A transparent conductive film made of ITO electrodes with a thickness of 400 A is applied and printed with Ag ink for the first and second extraction circuits to a thickness of 10 μm. A 4 mm wide Anisolm (trade name, manufactured by Hitachi Chemical Co., Ltd.) is used as an anisotropic conductive adhesive for thermocompression bonding, and is laminated on the second electrode head portion and its periphery. And from the Anisorum side 4
Apply a heat head of mm x 17 cm and heat the anisolum to temperature 1.
Temporarily press-bond by heat pressing at 00°C for 5 seconds at a pressure of 4 kg/cm2. After this temporary pressure bonding, the separator is peeled off from the Anisolm, and from the polymer film side, the Anisolm is heated to 150° C. and hot pressed at 20 kg/cm 2 for 20 seconds to perform the main bonding.

【0016】従来例:実施例において、異方導電性接着
剤として3mm巾のアニソルムを用い、これを第2電極
ヘッド部にのみ積層し、その周辺には積層しない構成と
したもの。
Conventional example: In the example, a 3 mm wide anisolm was used as the anisotropic conductive adhesive, and this was laminated only on the second electrode head portion, and was not laminated around it.

【0017】なお、湿乾サイクルテストは、タッチパネ
ルを温度65℃、湿度95%RHの雰囲気中に1時間放
置後、温度65℃で1時間乾燥する処理を100回繰り
返す。また、テストに用いた試料数は、実施例及び従来
例とも5ヶづつとする。
In the wet-dry cycle test, the touch panel is left in an atmosphere at a temperature of 65° C. and humidity of 95% RH for 1 hour, and then dried at a temperature of 65° C. for 1 hour, which is repeated 100 times. Furthermore, the number of samples used in the test was five for both the example and the conventional example.

【0018】テストの結果、従来例では第2電極ヘッド
部が高分子フィルムから浮き上がったが、実施例では変
化がなかった。
As a result of the test, in the conventional example, the second electrode head part was lifted from the polymer film, but in the example, there was no change.

【0019】また、第2電極にプルーブを接触するとと
もに、第2取り出し回路に電極を接続し、その間の電気
抵抗を測定したところ、表1の通りの結果が得られた。
Further, when a probe was brought into contact with the second electrode and the electrode was connected to the second extraction circuit, the electrical resistance therebetween was measured, and the results shown in Table 1 were obtained.

【0020】[0020]

【0021】表1から明らかな通り、実施例によれば抵
抗値は変化しないが、従来例によれば50倍上昇してい
る。
As is clear from Table 1, the resistance value does not change according to the example, but increases by 50 times according to the conventional example.

【0022】[0022]

【発明の効果】以上の通り、本発明によれば、導電性接
着剤層を第2取り出し回路の端だけではなくその周辺の
高分子フィルムの部分にまで積層しているために、導電
性接着剤層の部分での接続不良や、第2取り出し回路が
高分子フィルムから剥離する不良を防止できるタッチパ
ネルが得られる。
As described above, according to the present invention, since the conductive adhesive layer is laminated not only on the edge of the second lead-out circuit but also on the portion of the polymer film around it, the conductive adhesive layer A touch panel can be obtained that can prevent connection failures at the agent layer portion and failures in which the second extraction circuit peels off from the polymer film.

【図面の簡単な説明】[Brief explanation of drawings]

【図1】本発明の実施例に用いる第1絶縁基板の平面図
を示す。
FIG. 1 shows a plan view of a first insulating substrate used in an example of the present invention.

【図2】本発明の実施例の断面図を示す。FIG. 2 shows a cross-sectional view of an embodiment of the invention.

【図3】従来のタッチパネルの断面図を示す。FIG. 3 shows a cross-sectional view of a conventional touch panel.

【符号の説明】[Explanation of symbols]

1…第1絶縁基板、  2…高分子フィルム、  5…
第1電極、6…第1取り出し回路、  7…第2取り出
し回路、  8…第2電極ヘッド部、9…第2絶縁基板
、10…タッチパネル、  11…第2電極、14…異
方導電性接着剤層。
DESCRIPTION OF SYMBOLS 1...First insulating substrate, 2...Polymer film, 5...
First electrode, 6... First extraction circuit, 7... Second extraction circuit, 8... Second electrode head portion, 9... Second insulating substrate, 10... Touch panel, 11... Second electrode, 14... Anisotropic conductive adhesive agent layer.

Claims (1)

【特許請求の範囲】[Claims] 【請求項1】  高分子フィルムに第1電極を設けると
ともにこの第1電極に接続する第1取り出し回路と前記
第1電極に対して絶縁した第2取り出し回路とを設けて
第1絶縁基板とし、この第1絶縁基板を第2電極を設け
た第2絶縁基板に積層し、前記第2取り出し回路をこの
第2電極に導電性接着剤層を介して接続したタッチパネ
ルにおいて、第2取り出し回路周辺の高分子フィルムの
部分にまで積層した導電性接着剤層を設けることを特徴
とするタッチパネル。
1. A first insulating substrate including a first electrode provided on a polymer film, a first extraction circuit connected to the first electrode, and a second extraction circuit insulated from the first electrode; In a touch panel in which this first insulating substrate is laminated on a second insulating substrate provided with a second electrode, and the second take-out circuit is connected to the second electrode via a conductive adhesive layer, the area around the second take-out circuit is A touch panel characterized by providing a conductive adhesive layer laminated to a portion of a polymer film.
JP3106705A 1991-04-11 1991-04-11 Touch panel Pending JPH04314121A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP3106705A JPH04314121A (en) 1991-04-11 1991-04-11 Touch panel

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP3106705A JPH04314121A (en) 1991-04-11 1991-04-11 Touch panel

Publications (1)

Publication Number Publication Date
JPH04314121A true JPH04314121A (en) 1992-11-05

Family

ID=14440410

Family Applications (1)

Application Number Title Priority Date Filing Date
JP3106705A Pending JPH04314121A (en) 1991-04-11 1991-04-11 Touch panel

Country Status (1)

Country Link
JP (1) JPH04314121A (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008506173A (en) * 2004-07-06 2008-02-28 ユーピーエム−キンメネ コーポレイション Electric field detection sensor products
JP2012059247A (en) * 2010-09-13 2012-03-22 Samsung Electro-Mechanics Co Ltd Electrostatic capacitance touch screen and its manufacturing method
JP2012089102A (en) * 2010-10-21 2012-05-10 Samsung Electro-Mechanics Co Ltd Capacitive touch screen and method for manufacturing the same
TWI395999B (en) * 2009-09-18 2013-05-11 Innolux Corp Touch panel

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008506173A (en) * 2004-07-06 2008-02-28 ユーピーエム−キンメネ コーポレイション Electric field detection sensor products
TWI395999B (en) * 2009-09-18 2013-05-11 Innolux Corp Touch panel
JP2012059247A (en) * 2010-09-13 2012-03-22 Samsung Electro-Mechanics Co Ltd Electrostatic capacitance touch screen and its manufacturing method
JP2012089102A (en) * 2010-10-21 2012-05-10 Samsung Electro-Mechanics Co Ltd Capacitive touch screen and method for manufacturing the same

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