JPH0430956A - Ultrasonic vibrational polishing device - Google Patents

Ultrasonic vibrational polishing device

Info

Publication number
JPH0430956A
JPH0430956A JP13601890A JP13601890A JPH0430956A JP H0430956 A JPH0430956 A JP H0430956A JP 13601890 A JP13601890 A JP 13601890A JP 13601890 A JP13601890 A JP 13601890A JP H0430956 A JPH0430956 A JP H0430956A
Authority
JP
Japan
Prior art keywords
vibration
polishing
amplifying
tip
mean
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP13601890A
Other languages
Japanese (ja)
Inventor
Hiroshi Koseki
小関 博
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nippon Electric Industry Co Ltd
Original Assignee
Nippon Electric Industry Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Electric Industry Co Ltd filed Critical Nippon Electric Industry Co Ltd
Priority to JP13601890A priority Critical patent/JPH0430956A/en
Publication of JPH0430956A publication Critical patent/JPH0430956A/en
Pending legal-status Critical Current

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  • Grinding And Polishing Of Tertiary Curved Surfaces And Surfaces With Complex Shapes (AREA)

Abstract

PURPOSE:To enable the polishing of the inner peripheral face in a small diameter simply and highly accurately, by generating ultrasonic vibration in the circumferential direction by an exciting means and making a polishing means provided at the tip of a bar body subjected to a high frequency vibration in the circumferential direction after amplifying the vibration by an amplifier. CONSTITUTION:The title device is equipped with an exciting mean 2 which generates untrasonic vibration in the circumferential direction by electifying the alternating current in the specific frequency, an amplifying body 3 which amplifies the ultrasonic vibration transmitted from the exciting means 2, having the shape that one end is fixed to the exciting means 2 and the other end is tapered toward the tip side as well, flange 1 which fixes the vibration node of this amplifying body 3 and also stores the exciting mean 2 at the internal part and a polishing mean 5 provided at the part of the vibration flat of the bar body fixed to the tip of the amplifying body 3. Namely the polishing mean 5 is vibrated with the ultrasonic vibration being transmitted to the polishing mean 5 of the bar body tip after its amplifying by the amplifying body 3. Consequently polishing can be performed easily and with high accuracy at even the specially back part, etc., of the hole inner peripheral face.

Description

【発明の詳細な説明】 〔産業上の利用分野〕 この発明は、超音波振動によって被研磨部材の研磨を行
う超音波振動研磨装置に関するものである。
DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to an ultrasonic vibration polishing apparatus that polishes a member to be polished using ultrasonic vibration.

〔従来の技術〕[Conventional technology]

種々の形状を有する被加工物に対し、所定の切削・研磨
を行うことができろ装置や工具等が各41F開発され使
用されている。
41F devices, tools, etc. that can perform predetermined cutting and polishing on workpieces having various shapes have been developed and used.

例えば、小径で奥の深い穴の内面を加工させるた約の手
段として、第5図に示すような超音波振動研磨装置が知
られている。即ち、この超音波振動研磨装置は、圧電素
子等を用い超音波振動を発生ずる起振手段100と、こ
の起振手段+00による超音波振動が伝達されて長平方
向に振動する棒体101と、この棒体101の先端部に
固着した砥石等の研磨体102とを備えており、基端部
側の把持体103を手で把持し、研磨体102を振動さ
せながら被加工物の内面を研磨させるようになっている
For example, an ultrasonic vibration polishing device as shown in FIG. 5 is known as a means for machining the inner surface of a small-diameter, deep hole. That is, this ultrasonic vibration polishing apparatus includes a vibration excitation means 100 that generates ultrasonic vibration using a piezoelectric element or the like, a rod 101 that vibrates in the longitudinal direction by transmitting the ultrasonic vibration generated by the vibration excitation means +00. A polishing body 102 such as a grindstone is fixed to the tip of this rod 101, and the grip body 103 on the base end side is held by hand, and the inner surface of the workpiece is polished while vibrating the polishing body 102. It is designed to let you do so.

〔解決しようとする課題〕[Problem to be solved]

ところで、このような構成の超音波振動研磨装置にあっ
ては、棒体の長手方向に沿って研磨体を振動させ穴内面
等に対しその中心線方向に研磨させているので、例えば
角穴でなく丸穴の場合、その内周面全体を研磨するのは
面倒である。つまり、これは、毎回特定中心角度に相当
する部分を何回かに分けて研磨する等の作業が必要よな
るからである。また、このように穴の中心線方向への研
磨を行う構成のものは、角穴の内面のような平面に対し
ては比較的精度の良い研磨が行えるが、丸穴の内周面の
精密研摩等には、極めて不適当である。
By the way, in the ultrasonic vibration polishing device having such a configuration, the polishing body is vibrated along the longitudinal direction of the rod to polish the inner surface of the hole, etc. in the direction of its center line. In the case of a round hole, it is troublesome to polish the entire inner peripheral surface of the hole. In other words, this is because it is necessary to perform operations such as polishing the portion corresponding to a specific central angle several times each time. In addition, with a configuration that polishes in the direction of the center line of the hole, it is possible to polish a flat surface with relatively high precision, such as the inner surface of a square hole, but it is difficult to polish the inner surface of a round hole with high precision. It is extremely unsuitable for polishing, etc.

そこで、この発明は、上記した従来の欠点に鑑み、丸穴
内周面の研磨、特に小径で奥の深い内周面の精密研磨加
工に好適な超音波振動研磨装置を提供することを目的と
するものである。
SUMMARY OF THE INVENTION In view of the above-mentioned conventional drawbacks, it is an object of the present invention to provide an ultrasonic vibration polishing device suitable for polishing the inner peripheral surface of a round hole, particularly precision polishing of a small diameter and deep inner peripheral surface. It is something.

〔課題を解決するための手段〕[Means to solve the problem]

即ち、この発明は、超音波振動によって被研磨部材の研
磨を行う超音波振動研磨装置であって、所定周波数の交
番電流を通電することにより、円周方向に超音波振動を
おこず起振手段と、一端が起振手段に固着されていると
共に、他端が先端側に向けて窄まる形状を有し、前記起
振手段からの超音波振動を増幅する増幅体と、この増幅
体の振動節部分を固着すると共に、内方に前記起振手段
を収容したフランジと、前記増幅体の先端部に固着した
棒体の振動腹の部位に設けた研磨手段とを備えたもので
ある。
That is, the present invention is an ultrasonic vibration polishing apparatus that polishes a member to be polished by ultrasonic vibration, and which generates ultrasonic vibration in the circumferential direction by applying an alternating current of a predetermined frequency. an amplifier whose one end is fixed to the vibration excitation means and whose other end is tapered toward the distal end, and which amplifies the ultrasonic vibrations from the vibration excitation means; It is provided with a flange to which the node portion is fixed and which houses the vibration excitation means inside, and a polishing means provided at the vibration antinode of the rod fixed to the tip of the amplifier.

〔作用〕[Effect]

この発明の超音波振動研磨装置は、起振手段によって円
周方向に超音波振動を発生させ、この超音波振動を増幅
体で増幅させたのち棒体先端部の研磨手段に伝達させて
その研磨手段を振動させ、これによって穴内周面の特に
奥部等でも簡単に、かつ高精度に研磨加工を行うことが
できる。
The ultrasonic vibration polishing device of the present invention generates ultrasonic vibrations in the circumferential direction by a vibrator, amplifies the ultrasonic vibrations by an amplifier, and then transmits the ultrasonic vibrations to the polishing means at the tip of the rod for polishing. By vibrating the means, it is possible to easily and accurately polish the inner circumferential surface of the hole, especially in the deep part.

しかも、この発明の超音波振動研磨装置は、研磨手段が
丁度棒体の振動腹に対応する最大変位(振幅)部分に設
けられており、効率的に研磨加工を行うことができる。
Furthermore, in the ultrasonic vibration polishing apparatus of the present invention, the polishing means is provided at the maximum displacement (amplitude) portion exactly corresponding to the vibration antinode of the rod, so that polishing can be performed efficiently.

〔実施例〕〔Example〕

以下この発明の一実施例について添付図面を参照しなが
ら説明する。
An embodiment of the present invention will be described below with reference to the accompanying drawings.

第1図はこの発明に係る超音波振動研磨装置を示すもの
であり、この超音波振動研磨装置は、フランジlと、起
振手段2と、増幅体3と、棒体4と、研磨手段5とから
構成されている。
FIG. 1 shows an ultrasonic vibration polishing apparatus according to the present invention. It is composed of.

フランジ1は、−刃側端面が開口した円筒状のものから
構成されており、操作時に作業者が把持するための把持
部を構成している。
The flange 1 has a cylindrical shape with an open end face on the -blade side, and constitutes a grip portion for an operator to grip during operation.

起振手段2は、高精度の研磨加工を行わせると共に、作
業時に作業者等周囲の者が騒音で煩わされることがない
ようにするため、超音波と同等の領域の振動数(n)で
起振するものであり、この実施例では電磁気力により超
音波振動を行うようになっている。即ち、この実施例の
起振手段2は、第2図に示すように、略円筒形状を有す
るフェライト等の磁性体に銅線等を巻装して形成したコ
イルから構成されており、このコイルに超音波域と同等
の周波数f  (−n)の高周波交番電流を流すように
ブニっている。
The vibration excitation means 2 generates vibrations at a frequency (n) in the same range as ultrasonic waves in order to perform high-precision polishing and to prevent surrounding people such as workers from being bothered by noise during work. In this embodiment, ultrasonic vibration is generated by electromagnetic force. That is, as shown in FIG. 2, the vibration generating means 2 of this embodiment is composed of a coil formed by winding copper wire or the like around a magnetic material such as ferrite having a substantially cylindrical shape. A high-frequency alternating current with a frequency f (-n) equivalent to the ultrasonic range is applied to the current.

増幅体3は、起振手段2で発生した高周波振動(n)を
増幅させて棒体4の先端部に伝達させるものであり、先
端面に向けて窄まった形状を有しており、基端面が起振
手段2に固着されている。
The amplifier 3 amplifies the high-frequency vibration (n) generated by the vibration excitation means 2 and transmits it to the tip of the rod 4, and has a shape that narrows toward the tip surface, and The end face is fixed to the vibration excitation means 2.

また、この増幅体3は、振動節部分Δでフランジ1に固
着されており、この増幅体3を介してフランジ1内方に
起振手段2が収納されるようになっている。
Further, this amplifying body 3 is fixed to the flange 1 at the vibration node portion Δ, and the vibration generating means 2 is housed inside the flange 1 via this amplifying body 3.

棒体4は、所定長さ寸法を有する振動を伝達しやすい材
質のもので形成されており、より詳細には先端部分Bが
振動腹となるように増幅体3の振動節Aから所定長βの
寸法に形成されている。即ち、この実施例の棒体4は、
第3図に示すようにA−Bまでの長さ!が1/4波長(
λ)に相当するものであり、その長さβは、次式によっ
て決定される。
The rod 4 is made of a material that easily transmits vibrations and has a predetermined length. More specifically, the rod 4 has a predetermined length β from the vibration node A of the amplifier 3 so that the tip portion B becomes the vibration antinode. It is formed to the dimensions of. That is, the rod 4 of this embodiment is
As shown in Figure 3, the length from A to B! is 1/4 wavelength (
λ), and its length β is determined by the following equation.

f=v/(4n) 「但し、■は超音波の移動速度 ] −nは起振手段2の振動数」 研磨手段5は、研磨性の大きな砥石等のような材料のも
のを用いて、第4図に示すように被加工物6の穴7内周
面7aに対して高精度の研磨加工を行うことができるよ
うに一面側に所定曲率の曲面5aを形成した略円柱状の
ものが使用されておリ、棒体4先端部の振動腹の部位B
に固着されている。
f=v/(4n) "However, ■ is the moving speed of the ultrasonic wave] -n is the frequency of vibration of the vibration excitation means 2" The polishing means 5 is made of a material such as a grindstone with high abrasiveness, As shown in FIG. 4, a substantially cylindrical piece with a curved surface 5a of a predetermined curvature formed on one side is used to perform high-precision polishing on the inner circumferential surface 7a of the hole 7 of the workpiece 6. When used, vibration antinode part B of the tip of rod 4
is fixed to.

〔効果〕〔effect〕

以上説明してきたように、この発明に係る超音波振動研
磨装置によれば、起振手段によって円周方向に超音波振
動を発生させ、この振動を増幅体で増幅させたのち棒体
先端部に設けた研磨手段を円周方向に高周波振動させる
ようになっているので、特に小径内奥部の内周面の研磨
加工が簡単に、かつ高精度に行える等の効果が得られる
As explained above, according to the ultrasonic vibration polishing apparatus according to the present invention, ultrasonic vibration is generated in the circumferential direction by the vibration excitation means, and after this vibration is amplified by the amplifier, the vibration is applied to the tip of the rod. Since the provided polishing means is vibrated at high frequency in the circumferential direction, effects such as polishing of the inner circumferential surface at the innermost part of the small diameter can be easily performed with high precision.

しかも、この発明に係る超音波振動研磨装置によれば、
研磨手段が棒状先端部の最大変位(振幅)部分に設けら
れており、極狛て効率的に研磨加工を行うことができる
Moreover, according to the ultrasonic vibration polishing device according to the present invention,
The polishing means is provided at the maximum displacement (amplitude) portion of the rod-shaped tip, so that polishing can be performed extremely efficiently.

【図面の簡単な説明】[Brief explanation of the drawing]

第1図はこの発明に係る超音波振動研磨装置を示す構成
図、第2図はこの発明に係る起振手段等を示す要部斜視
図、第3図はこの発明に係る超音波振動研磨装置におけ
る各部の振動状態を示す説明図、第4図はこの発明に係
る超音波振動研磨装置の作用を示す概略断面図、第5図
は従来の振動研磨装置を示す平面図である。 6・・・被研磨部材、 2・・・起振手段、 3・・・増幅体、 1・・・フランジ、 4・・・棒体、 5・・・研磨手段。
FIG. 1 is a configuration diagram showing an ultrasonic vibration polishing apparatus according to the present invention, FIG. 2 is a perspective view of essential parts showing vibration excitation means, etc. according to the invention, and FIG. 3 is an ultrasonic vibration polishing apparatus according to the invention. FIG. 4 is a schematic sectional view showing the operation of the ultrasonic vibration polishing device according to the present invention, and FIG. 5 is a plan view showing the conventional vibration polishing device. 6... Member to be polished, 2... Oscillating means, 3... Amplifying body, 1... Flange, 4... Rod body, 5... Polishing means.

Claims (1)

【特許請求の範囲】 1、超音波振動によって被研磨部材の研磨を行う超音波
振動研磨装置であって、 所定周波数の交番電流を通電することにより、円周方向
に超音波振動をおこす起振手段と、一端が起振手段に固
着されていると共に、他端が先端側に向けて窄まる形状
を有し、前記起振手段からの超音波振動を増幅する増幅
体と、 この増幅体の振動節部分を固着すると共に、内方に前記
起振手段を収容したフランジと、 前記増幅体の先端部に固着した棒体の振動腹の部位に設
けた研磨手段と を備えたことを特徴とする超音波振動研磨装置。
[Scope of Claims] 1. An ultrasonic vibration polishing device that polishes a workpiece by ultrasonic vibration, comprising: an excitation device that generates ultrasonic vibrations in the circumferential direction by passing an alternating current of a predetermined frequency; an amplifying body having one end fixed to the vibrating means and the other end narrowing toward the distal end side and amplifying ultrasonic vibrations from the vibrating means; It is characterized by comprising a flange which fixes the vibration node portion and accommodates the vibration excitation means inside, and a polishing means provided at the vibration antinode of the rod fixed to the tip of the amplifier. Ultrasonic vibration polishing equipment.
JP13601890A 1990-05-25 1990-05-25 Ultrasonic vibrational polishing device Pending JPH0430956A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP13601890A JPH0430956A (en) 1990-05-25 1990-05-25 Ultrasonic vibrational polishing device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP13601890A JPH0430956A (en) 1990-05-25 1990-05-25 Ultrasonic vibrational polishing device

Publications (1)

Publication Number Publication Date
JPH0430956A true JPH0430956A (en) 1992-02-03

Family

ID=15165263

Family Applications (1)

Application Number Title Priority Date Filing Date
JP13601890A Pending JPH0430956A (en) 1990-05-25 1990-05-25 Ultrasonic vibrational polishing device

Country Status (1)

Country Link
JP (1) JPH0430956A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5456192B1 (en) * 2013-02-26 2014-03-26 三菱重工業株式会社 Turbine blade machining method, machining tool, and turbine blade
US9833741B2 (en) 2015-08-24 2017-12-05 Doosan Heavy Industries & Constructions Co., Ltd. Submerged membrane filtration system using reciprocating membrane

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5456192B1 (en) * 2013-02-26 2014-03-26 三菱重工業株式会社 Turbine blade machining method, machining tool, and turbine blade
WO2014132797A1 (en) * 2013-02-26 2014-09-04 三菱重工業株式会社 Turbine blade machining method, machining tool, and turbine blade
CN104968916A (en) * 2013-02-26 2015-10-07 三菱日立电力系统株式会社 Turbine blade machining method, machining tool, and turbine blade
US9903208B2 (en) 2013-02-26 2018-02-27 Mitsubishi Hitachi Power Systems, Ltd. Turbine blade machining method, machining tool, and turbine blade
US9833741B2 (en) 2015-08-24 2017-12-05 Doosan Heavy Industries & Constructions Co., Ltd. Submerged membrane filtration system using reciprocating membrane
US10232316B2 (en) 2015-08-24 2019-03-19 DOOSAN Heavy Industries Construction Co., LTD Submerged membrane filtration system using reciprocating membrane

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