JPH04309478A - Laser beam machine - Google Patents

Laser beam machine

Info

Publication number
JPH04309478A
JPH04309478A JP3076053A JP7605391A JPH04309478A JP H04309478 A JPH04309478 A JP H04309478A JP 3076053 A JP3076053 A JP 3076053A JP 7605391 A JP7605391 A JP 7605391A JP H04309478 A JPH04309478 A JP H04309478A
Authority
JP
Japan
Prior art keywords
laser
reflected light
output
laser beam
processing apparatus
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP3076053A
Other languages
Japanese (ja)
Inventor
Koichi Masuda
浩一 増田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp filed Critical Toshiba Corp
Priority to JP3076053A priority Critical patent/JPH04309478A/en
Publication of JPH04309478A publication Critical patent/JPH04309478A/en
Pending legal-status Critical Current

Links

Landscapes

  • Laser Beam Processing (AREA)

Abstract

PURPOSE:To protect the laser oscillating means, etc., by executing the stop control of laser oscillation, based on a detection value of a reflected light from an object to be worked at the time of working by the laser beam machine. CONSTITUTION:The laser beam machine is provided with a reflected light detecting means for detecting a reflected light from an object to be worked, generated at the time of working by a laser light, and a stop control means for controlling a stop of laser oscillation, based on a detection value from the reflected light detecting means in accordance with an operating state of a laser oscillating means. In such a way, even in the case of working a material whose reflectance is high such as aluminum, copper, etc., and even in the case the reflected light from the object to be worked returns to the laser oscillating means, an interlock is operated effectively, and the laser oscillating means, etc., can be protected.

Description

【発明の詳細な説明】[Detailed description of the invention]

[発明の目的] [Purpose of the invention]

【0001】0001

【産業上の利用分野】本発明は、レーザ光によりアルミ
や銅等の比較的反射率の高い材料を加工するレーザ加工
装置に関する。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a laser processing apparatus for processing materials with relatively high reflectivity, such as aluminum and copper, using laser light.

【0002】0002

【従来の技術】図3に従来から用いられているレーザ加
工装置の1例を示す。
2. Description of the Related Art FIG. 3 shows an example of a conventionally used laser processing apparatus.

【0003】レーザ発振器1から放出されたレーザビー
ム2は途中1枚以上のベンダーミラー3によって集光レ
ンズ4に導かれ、酸素などのアシストガスとともに被加
工物5に照射され、切断等のレーザ加工が行なわれる。
A laser beam 2 emitted from a laser oscillator 1 is guided to a condensing lens 4 by one or more bender mirrors 3 along the way, and is irradiated onto a workpiece 5 together with an assist gas such as oxygen to perform laser processing such as cutting. will be carried out.

【0004】しかし、アルミや銅などの反射率の高い材
料を切断する際、切断開始時や切断条件不具合による加
工不良を生じた場合には、レーザビーム2は、被加工物
5の上で全反射に近い状態となり、そのレーザビーム2
がベンダーミラー3を通じレーザ発振器1に戻ってくる
現象が生じる。これらの反射光6は例えばレーザ発振器
1の出力ミラー周囲のOリング(図示せず)や、気密保
持部品(図示せず)などを焼傷することもあり、また反
射光6が集光レンズ4により逆に集光され、途中のベン
ダーミラー3やレーザ発振器1の出力ミラー(図示せず
)にダメージを及ぼすことがあった。
However, when cutting materials with high reflectivity such as aluminum or copper, if a processing defect occurs at the start of cutting or due to a defect in the cutting conditions, the laser beam 2 is completely focused on the workpiece 5. The state is close to reflection, and the laser beam 2
A phenomenon occurs in which the laser beam returns to the laser oscillator 1 through the bender mirror 3. These reflected lights 6 may burn, for example, an O-ring (not shown) around the output mirror of the laser oscillator 1 or airtight parts (not shown), and the reflected lights 6 may burn the condenser lens 4. This may cause damage to the bender mirror 3 or the output mirror (not shown) of the laser oscillator 1, which is located on the way.

【0005】このため、従来のレーザ加工装置では、反
射光6がレーザ発振器1に戻ってきた場合には、図4に
示すように反射光6によってレーザ出力が増加すること
をレーザ出力モニターによって検知し、レーザ出力モニ
ター7の出力が図5に示すような一定値Peになったこ
とをレーザ出力比較器8を用いて比較し、電源制御盤9
に信号を発し、レーザ発振を停止させることが行われて
きた。
Therefore, in the conventional laser processing apparatus, when the reflected light 6 returns to the laser oscillator 1, the laser output monitor detects that the laser output increases due to the reflected light 6, as shown in FIG. Then, the laser output comparator 8 is used to compare whether the output of the laser output monitor 7 has reached a constant value Pe as shown in FIG.
It has been attempted to emit a signal to stop laser oscillation.

【0006】[0006]

【発明が解決しようとする課題】しかし、パルス運転、
特に高ピークパルス運転時などのように平均レーザ出力
がパルスのON,OFF比により連続運転時(CW運転
時)より小さくなるが、レーザ発振器1などの部品を損
傷するには十分に高いピーク出力を持つ場合には、図5
に示すような一定出力値によってレーザ発振器1を停止
させる方法では、パルスON,OFF比により平均レー
ザ出力が小さくなり、出力上限値Pe以下となってしま
うため、効果的にレーザ発振器1を保護することが不可
能であった。
[Problem to be solved by the invention] However, pulse operation,
Especially during high peak pulse operation, the average laser output is smaller than during continuous operation (CW operation) depending on the pulse ON/OFF ratio, but the peak output is high enough to damage parts such as the laser oscillator 1. Figure 5
In the method of stopping the laser oscillator 1 at a constant output value as shown in FIG. That was impossible.

【0007】そこで、本発明は上記問題点を鑑みて、レ
ーザ発振手順の運転状態を考慮し、被加工物からの反射
光を基にレーザ発振の停止制御ができるレーザ加工装置
を提供することを目的とする。 [発明の構成]
SUMMARY OF THE INVENTION In view of the above-mentioned problems, an object of the present invention is to provide a laser processing apparatus that can control the stop of laser oscillation based on the reflected light from the workpiece, taking into consideration the operating state of the laser oscillation procedure. purpose. [Structure of the invention]

【0008】[0008]

【課題を解決するための手段】上記目的を達成するため
に、本発明においては、レーザ媒質を励起することによ
りレーザ光を射出するレーザ発振手段と、このレーザ発
振手段の運転状態を設定する設定手段と、前記レーザ発
振手段により射出させるレーザ光を反射させ被加工物に
導く導光手段と、前記レーザ光を集光する集光手段を有
するレーザ加工装置において、前記レーザ光による加工
時に発生する前記被加工物からの反射光を検出する反射
光検出手段と、前記設定手段により設定され稼動してい
る前記レーザ発振手段の運転状態に応じて、前記反射光
検出手段からの検出値を基にレーザ発振の停止を制御す
る停止制御手段とを備えたレーザ加工装置を提供する。
[Means for Solving the Problems] In order to achieve the above object, the present invention provides a laser oscillation means for emitting laser light by exciting a laser medium, and a setting for setting the operating state of the laser oscillation means. In the laser processing apparatus, the laser processing apparatus includes a means for reflecting the laser light emitted by the laser oscillation means and guiding it to the workpiece, and a condensing means for condensing the laser light. Based on the detected value from the reflected light detection means according to the operating state of the reflected light detection means for detecting the reflected light from the workpiece and the laser oscillation means set and operated by the setting means. A laser processing apparatus is provided that includes a stop control means for controlling the stop of laser oscillation.

【0009】[0009]

【作用】このように構成された本発明のレーザ加工装置
においては、レーザ発振手段の運転状態に応じてレーザ
発振の停止を決定する基準値を最適化することにより、
被加工物からの反射光による装置の損傷を防止すること
ができる。
[Operation] In the laser processing apparatus of the present invention configured as described above, by optimizing the reference value for determining the stop of laser oscillation according to the operating state of the laser oscillation means,
Damage to the device due to reflected light from the workpiece can be prevented.

【0010】0010

【実施例】以下、本発明の一実施例を図面を用いて説明
する。図1は本実施例によるレーザ加工装置の構成例を
ブロック的に示すものであり、図4と同一部分には同一
符号を付して、その説明を省略する。
DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of the present invention will be described below with reference to the drawings. FIG. 1 shows in block form an example of the configuration of a laser processing apparatus according to this embodiment, and the same parts as those in FIG.

【0011】図1に示すように、本実施例のレーザ加工
装置は、反射光6がレーザ発振器1に戻ってきた場合に
は反射光6によってレーザ出力が増幅することを出力モ
ニター7によって検知し、電源制御盤9からパルスON
時間t1 とパルスOFF時間t2 と上述した出力上
限値Peの値を用い、出力演算器10により演算を行い
パルスON,OFF比に見合った割合で低く設定される
出力上限値Pe´と、前記出力モニター7の出力値P0
 を出力比較器8を用いて比較し、P0 ≧Pe´とな
った場合に電源,制御盤9に信号を発し、レーザ発振を
停止させる。
As shown in FIG. 1, the laser processing apparatus of this embodiment uses an output monitor 7 to detect that when the reflected light 6 returns to the laser oscillator 1, the laser output is amplified by the reflected light 6. , turn on the pulse from the power control panel 9
Using the time t1, the pulse OFF time t2, and the above-mentioned output upper limit Pe, the output calculator 10 calculates the output upper limit Pe', which is set low at a rate commensurate with the pulse ON/OFF ratio, and the output Monitor 7 output value P0
are compared using an output comparator 8, and if P0≧Pe', a signal is sent to the power supply and control panel 9 to stop laser oscillation.

【0012】図2には出力演算器10による本実施例の
演算パターンを示したものである。図2(a)はパルス
運転時の平均レーザ出力がパルスON,OFF比を乗じ
た値になることを考慮し、出力上限値Peを用い、パル
ス運転時の出力上限値Pe´を Pe´=Pe×t1 /(t1 +t2 )と演算した
場合を示している。
FIG. 2 shows the calculation pattern of this embodiment by the output calculation unit 10. In Fig. 2(a), considering that the average laser output during pulse operation is a value multiplied by the pulse ON/OFF ratio, the output upper limit Pe is used, and the output upper limit Pe' during pulse operation is set as Pe'= This shows the case where the calculation is Pe×t1/(t1+t2).

【0013】また、図2(b)は、平均レーザ出力が低
レベルの場合には高ピークパルスであってもレーザ発振
器に損傷を与えないことを考慮した場合の演算パターン
である。本実施例によると、レーザ発振器1を損傷する
には十分高いピーク出力を持つパルス運転の場合などの
ように平均レーザ出力がパルスON,OFF比によりC
W運転時より小さくなった場合にも、そのパルスON,
OFF比に見合った割合で出力上限値Peの値を変化さ
せるため効果的にレーザ発振器1を保護することができ
る。
Furthermore, FIG. 2(b) shows a calculation pattern taking into consideration that even a high peak pulse will not damage the laser oscillator when the average laser output is at a low level. According to this embodiment, in the case of pulse operation with a peak output high enough to damage the laser oscillator 1, the average laser output is caused by the pulse ON/OFF ratio.
Even if the pulse becomes smaller than during W operation, the pulse turns ON,
Since the value of the output upper limit Pe is changed at a rate commensurate with the OFF ratio, the laser oscillator 1 can be effectively protected.

【0014】また、本実施例ではパルスON,OFF比
により出力上限値Peを変化させる例を説明したが、反
対に出力上限値Peを一定としたままで、レーザ出力モ
ニター7の出力値をパルスON,OFF比に見合った割
合で増加させてもよい。
Further, in this embodiment, an example was explained in which the output upper limit value Pe is changed by the pulse ON/OFF ratio, but conversely, the output value of the laser output monitor 7 is changed by pulses while keeping the output upper limit value Pe constant. It may be increased at a rate commensurate with the ON/OFF ratio.

【0015】[0015]

【発明の効果】以上述べたように、本発明によれば、ア
ルミ,銅などの反射率の高い材料である被加工物の加工
を行なう場合においても、自動的にレーザ発振手段の運
転状態に応じたレーザ発振の停止制御を被加工物からの
反射光を基に行なうので、被加工物からの反射光がレー
ザ発振手段に戻った場合でも効果的にインターロックを
働かせ、レーザ発振手段等を保護することができる。
[Effects of the Invention] As described above, according to the present invention, even when processing a workpiece made of a material with high reflectance such as aluminum or copper, the operating state of the laser oscillation means is automatically adjusted. The laser oscillation stop control is performed based on the reflected light from the workpiece, so even if the reflected light from the workpiece returns to the laser oscillation means, the interlock is effectively activated and the laser oscillation means etc. can be protected.

【図面の簡単な説明】[Brief explanation of the drawing]

【図1】本発明の一実施例を示す構成ブロック図である
FIG. 1 is a configuration block diagram showing one embodiment of the present invention.

【図2】図1に示した本発明の一実施例におけるレーザ
出力上限値の変化を表した図である。
FIG. 2 is a diagram showing changes in the laser output upper limit value in the embodiment of the present invention shown in FIG. 1;

【図3】従来のレーザ加工装置を示す概要構成図である
FIG. 3 is a schematic configuration diagram showing a conventional laser processing device.

【図4】図3に示したレーザ加工装置における停止制御
を示す制御系の構成ブロック図である。
FIG. 4 is a configuration block diagram of a control system showing stop control in the laser processing apparatus shown in FIG. 3;

【図5】図3に示したレーザ加工装置におけるレーザ出
力上限値Peの変化を表した図である。
FIG. 5 is a diagram showing changes in the laser output upper limit value Pe in the laser processing apparatus shown in FIG. 3;

【符号の説明】[Explanation of symbols]

1…レーザ発振器 2…レーザビーム 3…ベンダーミラー 4…集光レンズ 5…被加工物 6…反射光 7…レーザ出力モニタ 8…レーザ出力比較器 9…電源・制御盤 10…出力演算器 1...Laser oscillator 2...Laser beam 3...Bender mirror 4...Condensing lens 5...Workpiece 6...Reflected light 7...Laser output monitor 8...Laser output comparator 9...Power supply/control panel 10...Output calculator

Claims (1)

【特許請求の範囲】[Claims] 【請求項1】  レーザ媒質を励起することによりレー
ザ光を射出するレーザ発振手段と、このレーザ発振手段
の運転状態を設定する設定手段と、前記レーザ発振手段
により射出されるレーザ光を反射させ被加工物に導く導
光手段と、前記レーザ光を集光させる集光手段を有する
レーザ加工装置において、前記レーザ光による加工時に
発生する前記被加工物からの反射光を検出する反射光検
出手段と、前記レーザ発振手段の運転状態に応じて、前
記反射光検出手段からの検出値を基にレーザ発振の停止
を制御する停止制御手段とを具備したことを特徴とする
レーザ加工装置。
1. Laser oscillation means for emitting laser light by exciting a laser medium; setting means for setting the operating state of the laser oscillation means; In a laser processing apparatus having a light guiding means for guiding the laser beam to a workpiece, and a condensing means for condensing the laser beam, a reflected light detection means for detecting reflected light from the workpiece generated during processing with the laser beam; A laser processing apparatus comprising: a stop control means for controlling the stop of laser oscillation based on a detection value from the reflected light detection means according to the operating state of the laser oscillation means.
JP3076053A 1991-04-09 1991-04-09 Laser beam machine Pending JPH04309478A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP3076053A JPH04309478A (en) 1991-04-09 1991-04-09 Laser beam machine

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP3076053A JPH04309478A (en) 1991-04-09 1991-04-09 Laser beam machine

Publications (1)

Publication Number Publication Date
JPH04309478A true JPH04309478A (en) 1992-11-02

Family

ID=13594040

Family Applications (1)

Application Number Title Priority Date Filing Date
JP3076053A Pending JPH04309478A (en) 1991-04-09 1991-04-09 Laser beam machine

Country Status (1)

Country Link
JP (1) JPH04309478A (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5986234A (en) * 1997-03-28 1999-11-16 The Regents Of The University Of California High removal rate laser-based coating removal system
JP2002066773A (en) * 2000-08-25 2002-03-05 Amada Eng Center Co Ltd Laser processing method and system
JP2003249701A (en) * 2002-02-22 2003-09-05 Sunx Ltd Laser processing apparatus
KR20210123412A (en) * 2016-10-20 2021-10-13 토소 화인켐 가부시키가이샤 Aluminum alloy containing composition, production method therefor, and trialkyl aluminum production method

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5986234A (en) * 1997-03-28 1999-11-16 The Regents Of The University Of California High removal rate laser-based coating removal system
JP2002066773A (en) * 2000-08-25 2002-03-05 Amada Eng Center Co Ltd Laser processing method and system
JP4610059B2 (en) * 2000-08-25 2011-01-12 株式会社アマダエンジニアリングセンター Laser processing method and apparatus
JP2003249701A (en) * 2002-02-22 2003-09-05 Sunx Ltd Laser processing apparatus
KR20210123412A (en) * 2016-10-20 2021-10-13 토소 화인켐 가부시키가이샤 Aluminum alloy containing composition, production method therefor, and trialkyl aluminum production method

Similar Documents

Publication Publication Date Title
EP0557719B1 (en) Apparatus for and method of controlling the output of a laser source
US5373135A (en) Process and an arrangement for treating workpiece by means of laser radiation
US5182434A (en) Laser beam machining method
JPH04501534A (en) Diode-pumped, solid-state laser-based workstation for precision processing and machining of materials
US20220410306A1 (en) Laser processing method, laser processing apparatus, and output control device of laser processing apparatus
JP2771569B2 (en) Laser processing equipment
JPH04309478A (en) Laser beam machine
JP2000357835A (en) Laser oscillator
JPH07124766A (en) Method for controlling eximer laser machining
KR200164249Y1 (en) Laser processing apparatus
JPH10249560A (en) Laser beam machining method and equipment therefor
JPH05177372A (en) Laser beam machine
JPS62104089A (en) Laser output controller
JP2002040356A (en) Method for controlling galvano and controller
JP4074485B2 (en) Laser processing method and apparatus
JP2737472B2 (en) Welding condition detector
KR100398422B1 (en) Protective window replacement-warning system of vision sensor, making use of laser output variation
JPH04127987A (en) Laser beam machine
JPH04371380A (en) Laser beam machine
JPH0710864Y2 (en) Laser output control device for laser processing machine
JP3916734B2 (en) Laser processing equipment
JPH07155971A (en) Laser beam machine
JPH05220591A (en) Electric shutter method for laser beam machine
JPH01241391A (en) Method for deciding quality of laser beam welding
JPH067980A (en) Laser beam machine