JPH0430760U - - Google Patents
Info
- Publication number
- JPH0430760U JPH0430760U JP7109590U JP7109590U JPH0430760U JP H0430760 U JPH0430760 U JP H0430760U JP 7109590 U JP7109590 U JP 7109590U JP 7109590 U JP7109590 U JP 7109590U JP H0430760 U JPH0430760 U JP H0430760U
- Authority
- JP
- Japan
- Prior art keywords
- pad
- chip
- chip component
- mounting surface
- wiring board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000005476 soldering Methods 0.000 claims 3
- 229910000679 solder Inorganic materials 0.000 claims 2
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7109590U JPH0430760U (pt-PT) | 1990-07-05 | 1990-07-05 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7109590U JPH0430760U (pt-PT) | 1990-07-05 | 1990-07-05 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0430760U true JPH0430760U (pt-PT) | 1992-03-12 |
Family
ID=31607824
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP7109590U Pending JPH0430760U (pt-PT) | 1990-07-05 | 1990-07-05 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0430760U (pt-PT) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2003031937A (ja) * | 2001-07-18 | 2003-01-31 | Sony Corp | 表面実装部品の半田付け用ランド構造 |
-
1990
- 1990-07-05 JP JP7109590U patent/JPH0430760U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2003031937A (ja) * | 2001-07-18 | 2003-01-31 | Sony Corp | 表面実装部品の半田付け用ランド構造 |