JPH0430723U - - Google Patents
Info
- Publication number
- JPH0430723U JPH0430723U JP7069190U JP7069190U JPH0430723U JP H0430723 U JPH0430723 U JP H0430723U JP 7069190 U JP7069190 U JP 7069190U JP 7069190 U JP7069190 U JP 7069190U JP H0430723 U JPH0430723 U JP H0430723U
- Authority
- JP
- Japan
- Prior art keywords
- ground plate
- electrode
- insulating
- fitted
- center conductor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004020 conductor Substances 0.000 claims description 3
- 229920001296 polysiloxane Polymers 0.000 claims description 3
- 239000000853 adhesive Substances 0.000 claims description 2
- 229910052573 porcelain Inorganic materials 0.000 claims description 2
- 239000011347 resin Substances 0.000 claims description 2
- 229920005989 resin Polymers 0.000 claims description 2
- 239000002966 varnish Substances 0.000 claims description 2
- 239000003990 capacitor Substances 0.000 claims 2
- 230000001070 adhesive effect Effects 0.000 claims 1
- 239000003989 dielectric material Substances 0.000 claims 1
- 230000002093 peripheral effect Effects 0.000 claims 1
- 239000003985 ceramic capacitor Substances 0.000 description 2
- 238000009413 insulation Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
Landscapes
- Ceramic Capacitors (AREA)
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
Description
第１図及び第２図は本考案の実施例に係るもの
で、第１図は高圧貫通型磁器コンデンサの組立要
領を示す斜視図、第２図はその正面断面図、第３
図及び第４図は従来例に係るもので、第３図は高
圧貫通型磁器コンデンサの組立要領を示す斜視図
、第４図はその正面断面図である。
１……貫通孔、２……表電極、３……裏電極、
４……磁器誘電体、５……接地板、５１……窓、
６……電極金具、７……タブ、８……中心導体、
９……シリコーンチユーブ、１０……絶縁ケース
、１０１……外ケース、１０２……内ケース、１
１……絶縁カバー、１２，１３……絶縁樹脂モー
ルド、１４，１５……凹凸部、２１……非接着性
ワニス層。
1 and 2 are related to an embodiment of the present invention, in which FIG. 1 is a perspective view showing how to assemble a high-voltage feed-through ceramic capacitor, FIG. 2 is a front sectional view thereof, and FIG.
4 and 4 relate to a conventional example, FIG. 3 is a perspective view showing the assembly procedure of a high-voltage feedthrough ceramic capacitor, and FIG. 4 is a front sectional view thereof. 1...Through hole, 2...Top electrode, 3...Back electrode,
4...Porcelain dielectric, 5...Grounding plate, 5 1 ...Window,
6... Electrode fitting, 7... Tab, 8... Center conductor,
9...Silicone tube, 10...Insulation case, 10 1 ...Outer case, 10 2 ...Inner case, 1
DESCRIPTION OF SYMBOLS 1... Insulating cover, 12, 13... Insulating resin mold, 14, 15... Uneven portion, 21... Non-adhesive varnish layer.
Claims (1)
に、シリコーンチユーブを挿入被着したタブ付中
心導体を挿通し、前記表電極を電極金具を介して
前記中心導体上方部に導通せしめると共に、前記
裏電極を接地板に導通せしめ、該接地板の外周側
に絶縁ケースを、内周側に絶縁カバーをそれぞれ
挿入嵌合し、これら各部材を絶縁樹脂モールドで
一体固化形成した高電圧コンデンサにおいて、前
記絶縁ケース内周面にシリコーン等の非接着性ワ
ニス層を形成したことを特徴とする高電圧コンデ
ンサ。 Inserting a tabbed center conductor with a silicone tube inserted into a through hole of a porcelain dielectric material having a front electrode and a back electrode, making the front electrode electrically conductive to the upper part of the center conductor via an electrode fitting, and In a high voltage capacitor in which the back electrode is electrically connected to a ground plate, an insulating case is inserted and fitted to the outer circumferential side of the ground plate, and an insulating cover is inserted and fitted to the inner circumferential side of the ground plate, and these parts are integrally solidified with an insulating resin mold. A high voltage capacitor, characterized in that a non-adhesive varnish layer such as silicone is formed on the inner peripheral surface of the insulating case.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7069190U JPH0430723U (en) | 1990-07-04 | 1990-07-04 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7069190U JPH0430723U (en) | 1990-07-04 | 1990-07-04 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0430723U true JPH0430723U (en) | 1992-03-12 |
Family
ID=31607064
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP7069190U Pending JPH0430723U (en) | 1990-07-04 | 1990-07-04 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0430723U (en) |
-
1990
- 1990-07-04 JP JP7069190U patent/JPH0430723U/ja active Pending
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