JPH04302495A - Integrated circuit for high frequency - Google Patents

Abstract

PURPOSE:To preserve stable properties without creating parasitic capacitance even at high frequency. CONSTITUTION:An integrated circuit for high frequency which is equipped with a board 11 having a circuit within and a plurality of leads 12 being made at the lower end of this board 11, and in which the sectional shape of each lead 12 is an L shape and there is no space between the bottom of the board 11 and the mother board and the lead 12 of the board 11 is connected directly to the conductor on the topside of the mother board, and which has stable properties without creating parasitic capacitance even at high frequency.

Description

[Detailed description of the invention]

0001

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to high frequency integrated circuits, and more particularly to high frequency integrated circuits such as SIP type ICs with improved lead shapes.

0002

[Prior Art] FIG. 4 shows a conventional SIP (Single
In Line Package) type hybrid I
Indicates C. This IC consists of a substrate 1 with a circuit formed inside.
It is composed of a plurality of leads 2 projecting downward from the lower end of the substrate 1.

[0003] An IC having such a configuration is normally mounted on a motherboard 3 as shown in FIG. This motherboard 3
A conductor 4 is formed on the surface, and furthermore, through holes 5 and lands 6 are formed. When the above IC is mounted on the motherboard 3, the leads 2 of the IC are inserted into the through holes 5 and fixed with solder 7, as shown in FIG.

0004

However, conventional hybrid ICs are usually mounted on the motherboard 3 with a distance (L) between the conductor 4 of the motherboard 3 and the end surface of the substrate. Therefore, the gap becomes a parasitic capacitance, making it difficult to use the above IC at high frequencies. In addition, parasitic capacitance is generated by inserting the IC leads 2 into the through holes 5 of the motherboard 3 and fixing them with solder 7.

Furthermore, since the shapes of the transmission lines such as the solder pads and leads of ICs and the solder pads of motherboards are different, it is difficult to use them at high frequencies due to their characteristics.

The present invention has been made in view of the above circumstances, and by making the lead shape L-shaped in cross section so that it can be directly connected to the conductor on the main surface of the motherboard without any gaps,
It is an object of the present invention to provide a high frequency integrated circuit that can maintain stable characteristics without generating parasitic capacitance even at high frequencies and is easy to use due to its characteristics even at high frequencies.

[0007]

[Means for Solving the Problems] The first invention of the present application is a high-frequency integrated circuit that is mounted while standing up against the surface of a motherboard on the conductor formation side, which includes a substrate on which a circuit is formed inside, and a substrate on which a circuit is formed inside. a plurality of leads formed at a lower end portion, each lead having an L-shaped cross section, and with no gap between the bottom surface of the board and the top surface of the motherboard;
The high frequency integrated circuit is characterized in that a lead portion extending in a direction perpendicular to the main surface of the substrate is connected to a conductor on the upper surface of the motherboard.

[0008] The second invention of the present application is a high-frequency integrated circuit that is mounted while lying on the surface of a motherboard on the conductor formation side. each lead is bent toward the side wall surface of the board so that its cross section is L-shaped, and there is no gap between the bottom surface of the board and the top surface of the motherboard. The high frequency integrated circuit is characterized in that a tip portion of the motherboard is connected to a conductor on the upper surface of the motherboard.

[0009]

[Operation] In the present invention, by making the lead shape L-shaped in cross section so that it can be connected to the conductor of the motherboard without any gap between the top surface of the motherboard and the board, Furthermore, since there is no need to provide through holes as in the conventional case, stable characteristics can be maintained at high frequencies without the generation of parasitic capacitance as in the conventional case (see FIG. 2). Furthermore, a surface mount type can be realized by making the main surface of the board face the main surface of the motherboard as shown in FIG. 3, and by bending the leads toward the side wall surface of the board and connecting them to the conductor as shown in the figure.

0010

[Embodiment] FIG. 1 shows a SIP type I diagram showing an embodiment of the present invention.
FIG. Reference numeral 11 in the figure is a board with a circuit formed therein. A plurality of leads 12 are formed at the lower end of this substrate 11 . The cross-sectional shape of each lead 12 is all L-shaped, and the lead portion along the direction perpendicular to the main surface of the substrate is bent with a slight distance from the bottom surface of the substrate. The distance from the bottom of this board to the lead bending part (L
) is approximately equal to the thickness of a conductor formed on the surface of the motherboard, which will be described later.

[0011] As shown in FIG. 2, the SIP type IC having such a configuration is operated with the substrate 11 leaning against the surface of the motherboard 13 and with the bent portions of each lead 12 directly connected to the conductor 14 on the surface of the motherboard 13. Implemented.

According to the SIP type IC according to the above embodiment,
A lead 12 is provided at the lower end of the board 11, the lead 12 having an L-shaped cross section and a lead portion extending in a direction perpendicular to the main surface of the board being bent at a distance L from the bottom surface of the board. Therefore, when the above IC is mounted on the motherboard 13, the bent portions of the leads 12 are directly connected to the conductors 14 of the motherboard 13, and there is no gap between the bottom surface of the substrate 11 and the surface of the motherboard 13. Also,
Unlike conventional ICs, there is no need to form through holes on the motherboard. Therefore, parasitic capacitance can be reduced compared to the conventional one, and use at high frequencies becomes possible. Furthermore, the conductor 1 which is a part of the electric transmission line of the board 11
Width of lead 12 (W2) to match width of lead 4 (W1)
By determining this, it is possible to prevent deterioration in characteristics at the connection portion between the conductor 14 and the bent portion of the lead 12.

[0013] The high frequency integrated circuit according to the present invention includes:
The present invention is not limited to the embodiment described above, and may have the configuration shown in FIG. 3. This SIP type IC has a plurality of leads 21 formed at the side ends of the substrate 11 bent toward the main surface of the motherboard 13 along the side wall surface of the substrate 11 so that the cross-sectional shape is L.
It is shaped like a letter. In this case, the tips of the leads 21 are directly connected to the conductors 14 on the top surface of the motherboard 13 with the bottom surface of the board in contact with the top surface of the motherboard. According to the integrated circuit having such a configuration, a surface-mount type integrated circuit can be obtained.

[0014] In the above embodiment, a SIP type IC has been described, but the present invention is not limited to this, and the same effects as in the above embodiment can be expected in high frequency integrated circuits such as a DIP type IC.

[0015]

Effects of the Invention As detailed above, according to the present invention, parasitic capacitance occurs even at high frequencies by making the lead shape L-shaped in cross section so that it can be directly connected to the conductor on the main surface of the motherboard without any gaps. It is possible to provide a highly reliable high-frequency integrated circuit that can maintain stable characteristics without any problems, can be of a surface-mounted type, and can prevent deterioration in characteristics at the connection between the leads of the board and the conductor of the motherboard.

[Brief explanation of drawings]

FIG. 1 is a perspective view of a SIP type IC according to an embodiment of the present invention.

FIG. 2 is a schematic explanatory diagram of a state in which the SIP type IC of FIG. 1 is mounted on a motherboard.

FIG. 3 is an explanatory diagram of a SIP type IC according to another embodiment of the present invention.

FIG. 4 is a perspective view of a conventional SIP type IC.

FIG. 5 is a schematic explanatory diagram of a state in which the IC of FIG. 4 is mounted on a motherboard.

[Explanation of symbols]

11... Board, 12, 21... Lead, 13... Motherboard, 14... Conductor.

Claims (2)

[Claims] [Claim 1] A high-frequency integrated circuit that is mounted leaning against the conductor-forming side of a motherboard, which includes a substrate with a circuit formed therein and a plurality of leads formed at the bottom end of this substrate. The cross section of each lead is L-shaped, and with no gap between the bottom surface of the board and the top surface of the motherboard, a lead portion extending in a direction perpendicular to the main surface of the board is connected to a conductor on the top surface of the motherboard. A high frequency integrated circuit characterized by being connected. [Claim 2] A high-frequency integrated circuit that is mounted while lying on the conductor-forming side of a motherboard, which includes a substrate with a circuit formed therein, and a plurality of leads formed on the side edges of this substrate. , each lead is bent toward the side wall of the board so that its cross-sectional shape is L-shaped, and with no gap between the bottom surface of the board and the top surface of the motherboard, the tip of the lead is A high-frequency integrated circuit characterized by being connected to a conductor on the top surface of a motherboard.