JPH0429573Y2 - - Google Patents
Info
- Publication number
- JPH0429573Y2 JPH0429573Y2 JP14182686U JP14182686U JPH0429573Y2 JP H0429573 Y2 JPH0429573 Y2 JP H0429573Y2 JP 14182686 U JP14182686 U JP 14182686U JP 14182686 U JP14182686 U JP 14182686U JP H0429573 Y2 JPH0429573 Y2 JP H0429573Y2
- Authority
- JP
- Japan
- Prior art keywords
- electronic component
- lead
- connecting portion
- radiator
- extending
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000011324 bead Substances 0.000 claims description 9
- 238000005476 soldering Methods 0.000 claims description 4
- 229910052751 metal Inorganic materials 0.000 claims description 3
- 239000002184 metal Substances 0.000 claims description 3
- 230000017525 heat dissipation Effects 0.000 description 10
- 229910000679 solder Inorganic materials 0.000 description 7
- 238000005452 bending Methods 0.000 description 5
- 230000005855 radiation Effects 0.000 description 5
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 229910052710 silicon Inorganic materials 0.000 description 2
- 239000010703 silicon Substances 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 230000002542 deteriorative effect Effects 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
Description
産業上の利用分野
本考案は、電子部品のリードに取付けられかつ
比較的優れた放熱効果を生ずる放熱器を有すると
共に、基板に高密度で実装できる同軸リード形放
熱器付電子部品に関連する。
従来の技術
第９図〜第１１図に示すように、従来の放熱器
付電子部品は、円筒状の電子部品本体１と、電子
部品本体１から外方にかつ同軸上に伸びる一対の
リード２及び３と、電子部品本体１に固定された
放熱器４とを有する。各リード２と３にはリード
フオーミングが施されており、電子部品本体１の
長さ方向に伸びる導出部２ａ，３ａと、導出部２
ａ，３ａに対し直角方向にそれぞれ屈曲して伸び
る屈曲部２ｂと３ｂとが形成されている。
放熱器４は、中心孔５を有する円筒状の放熱器
本体６と、放熱器本体６から外方へ突出する複数
の放熱フイン７とを有する。放熱器本体６及び放
熱フイン７は、アルミニウム等の金属で一体に形
成される。第９図に示す放熱フイン７は、互いに
平行に突出するが、放熱フインが放熱器本体６か
ら半径方向に突出する放熱器も使用される。放熱
器本体６の下部には、半径方向でかつ長さ方向に
伸びる切断部８が設けられる。放熱器４を電子部
品本体１に取付けるときは、適当な工具で切断部
８を拡張して、リード２又は３及び電子部品本体
１を中心孔５に挿入する。その後、上記工具を外
して放熱器４自身の弾性で放熱器４を電子部品本
体１に固定する。第１０図及び第１１図は、この
放熱器付電子部品をプリント基板９に装着した状
態である。図示するように、リードの屈曲部２
ｂ，３ｂを基板９の孔１０に挿入し、リードの屈
曲部２ｂ，３ｂを半田１１で導体１２に固定して
いる。
考案が解決しようとする問題点
上記従来の放熱器付電子部品では、放熱器４を
電子部品本体１に固定するので、電子部品本体１
から放熱器４が外側に突出する。このため、従来
の放熱器付電子部品は、プリント基板９上におい
て実質的には第１０図の領域１３を占領すること
になる。放熱器４を取り付けないときは、電子部
品の実質的占有領域は領域１４である。このよう
に、放熱器付電子部品をプリント基板９に取付け
るとき、従来の放熱器付電子部品は、大きな占領
面積を必要とし、プリント基板９への高密度実装
の現実を阻害する原因となつている。
第１１図は、電子部品本体１の長さ方向がプリ
ント基板９と平行になるように取付けた横実装の
状態を示す。第１１図の占有面積を小さくするに
は、電子部品本体１の長さ方向がプリント基板に
対し垂直となるように放熱器付電子部品を縦実装
する方法が考えられる。縦実装を行う時は、外側
に突出する放熱器４の放熱フイン７の更に外側で
かつ放熱フイン７に接触しないように一方のリー
ドを180°反対方向へ折り返すリードフオーミング
を行う必要がある。従つて、実装時の占有面積は
あまり小さくならないし、折り返す方のリードの
長さが不足して実用化できない場合も多い。
そこで本考案は、上記欠点を解消し、放熱特性
を低下することなく小さい占有面積で基板に取付
けられる放熱器付電子部品を提供することを目的
とする。
問題点を解決するための手段
本考案の放熱器付電子部品は、電子部品本体と
該電子部品本体の両端からそれぞれ外方に伸びる
少なくとも一対のリードとを設け、該リードの一
方は前記電子部品本体から所定の方向に伸び、前
記リードの他方は前記電子部品本体の長さ方向で
かつ前記所定の方向に略一致するように伸びるリ
ード折返部とを有する電子部品において、前記リ
ードの他方に放熱器が固定され、該放熱器は、前
記電子部品本体及び前記リード折返部の長さ方向
に沿つて伸びる連結部と該連結部から前記電子部
品本体側に伸びると共に前記リード折返部の伸び
る方向に見て前記電子部品本体の両側に伸びる一
対の対向壁とを有し、前記リードが前記リード折
返部において前記連結部に固定されている構成を
有する。
作 用
本考案における放熱器は、連結部とこの連結部
から伸びる一対の対向壁とを有し、放熱器を取付
けない場合の電子部品の実質的占有領域からあま
り突出しない形状に形成できる。リードの長さ
は、放熱器を付けないで縦実装が可能な電子部品
であれば不足することはない。また、電子部品で
発生する熱はリードを介して比較的効率良く放熱
器に伝達され、放熱器から大気中に放出される。
実施例
以下、本考案の実施例を第１図〜第８図につい
て説明する。これらの図面では、第９図〜第１１
図に示す個所と同一の部分に付いては同一符号を
付して説明を省略する。
第１図は、本考案の第１の実施例を示す。電子
部品は樹脂モールド形シリコンダイオードであ
る。第２図及び第３図は、プリント基板９に実装
した状態を示す。
本考案の放熱器付電子部品は、Ｕ字形断面で樋
状に形成されたNi被覆銅材から成る放熱器１５
が、リード３側に固定される。リード３は、リー
ド導出部３ａとリード屈曲部３ｂとを有し、リー
ド屈曲部３ｂはリード屈曲部３b1とリード折返部
３b2とを有する。放熱器１５は、リード折返部３
b2に沿つて伸びる連結部１６と、連結部１６から
電子部品本体１側に伸びると共にリード折返部３
b2の伸びる方向に見てリード導出部３ａ及びリー
ド屈曲部３b1の両側に伸びる一対の対向壁１７，
１８とから成る。連結部１６のほぼ中央には内側
に窪むビード１９が形成され、ビード１９の上側
部と下側部には、一対の孔２０と２１が垂直方向
に設けられる。リード折返部３b2は、孔２０と２
１とを貫通する。リード２は、適当な長さにカツ
トされるもののリードフオーミングは行われず、
リード折返部３b2と略同一の方向に伸びている。
第３図に示すように、プリント基板９への取り
付けの際には、放熱器１５の下端がリード２とリ
ード折返部３b2を孔１０に差し込むときのストツ
パとして働くため、電子部品を適正位置に容易か
つ確実に固定することができる。
連結部１６へのリード折返部３b2の固定は、か
しめにより行うこともできるが、熱伝逹を考える
と半田付けが適している。半田付けによる固定を
行う場合、リード３の先端側を半田浴に差し込め
ばよい。こうすれば溶融半田が毛管現象によつて
吸い上げられ、リード折返部３b2のうち連結部１
６と隣接する部分は全面的に半田付が行われるの
で、作業性が良い。
第４図及び第５図は半田付けの様子を示すもの
で第４図はビード１９の部分、第５図はその他の
部分を示す。２４は半田である。なお、第４図と
第５図以外の図面では、図面を複雑化させないた
めに半田２４を図示していない。
この放熱器付電子部品は、第２図から明らかな
ように、プリント基板９上の実質的占有領域２５
が、第１０図の領域１３，１４と比べて著しく小
さく、放熱器を付けないで縦実装した場合と同等
である。即ち、この放熱器付電子部品のプリント
基板９上での占有面積は従来より大幅に減少され
ている。高さは、放熱器を付けないで縦実装した
場合と同じである。本考案の放熱器付電子部品で
は、放熱器１５を片側のリードに固定するが、リ
ードを介しての放熱のため、放熱効率は比較的良
好であり、従来例と同等の放熱能力を与えること
は、容易である。下表は、樹脂モールド形シリコ
ンダイオードの放熱特性を電流値から比較した例
である。出力電流Ioは、接合部温度が室温から80
℃上昇するときで規定した電流容量である。この
表から明らかなように、本考案の実施例による放
熱器付電子部品の占有面積は、同等の放熱能力で
ある第１０図の従来例に比べ３分の１以下であ
る。
INDUSTRIAL APPLICATION FIELD The present invention relates to an electronic component with a coaxial lead type heat sink that is attached to the lead of an electronic component and has a heat sink that produces a relatively excellent heat dissipation effect, and can be mounted on a board with high density. BACKGROUND ART As shown in FIGS. 9 to 11, a conventional electronic component with a heat sink includes a cylindrical electronic component body 1 and a pair of leads 2 coaxially extending outward from the electronic component body 1. and 3, and a heat sink 4 fixed to the electronic component main body 1. Each lead 2 and 3 is subjected to lead forming, and has lead-out portions 2a and 3a extending in the length direction of the electronic component body 1, and lead-out portion 2.
Bent parts 2b and 3b are formed which extend in a direction perpendicular to a and 3a, respectively. The radiator 4 includes a cylindrical radiator main body 6 having a center hole 5 and a plurality of radiator fins 7 protruding outward from the radiator main body 6. The heat sink main body 6 and the heat sink fins 7 are integrally formed of metal such as aluminum. Although the heat dissipation fins 7 shown in FIG. 9 protrude parallel to each other, a heat radiator in which the heat dissipation fins protrude radially from the heat radiator body 6 may also be used. The lower part of the radiator body 6 is provided with a cutting section 8 extending in the radial direction and in the length direction. When attaching the heat sink 4 to the electronic component body 1, the cut portion 8 is expanded using a suitable tool, and the lead 2 or 3 and the electronic component body 1 are inserted into the center hole 5. Thereafter, the tool is removed and the heat radiator 4 is fixed to the electronic component main body 1 by the elasticity of the radiator 4 itself. 10 and 11 show a state in which this electronic component with a heat sink is mounted on a printed circuit board 9. FIG. As shown, the bent part 2 of the lead
The leads 2b and 3b are inserted into the holes 10 of the substrate 9, and the bent portions 2b and 3b of the leads are fixed to the conductor 12 with solder 11. Problems to be Solved by the Invention In the above-mentioned conventional electronic component with a heatsink, the heatsink 4 is fixed to the electronic component body 1.
A heat radiator 4 projects outward from there. Therefore, the conventional electronic component with a heat sink essentially occupies the area 13 in FIG. 10 on the printed circuit board 9. When the heat sink 4 is not attached, the area 14 is substantially occupied by the electronic components. As described above, when an electronic component with a heatsink is attached to the printed circuit board 9, the conventional electronic component with a heatsink requires a large occupied area, which hinders the realization of high-density mounting on the printed circuit board 9. There is. FIG. 11 shows a horizontally mounted state in which the electronic component main body 1 is mounted so that the length direction thereof is parallel to the printed circuit board 9. In order to reduce the occupied area shown in FIG. 11, it is possible to mount the electronic component with a heatsink vertically so that the length direction of the electronic component body 1 is perpendicular to the printed circuit board. When performing vertical mounting, it is necessary to perform lead forming in which one lead is folded back 180 degrees in the opposite direction so as to be further outside the radiation fins 7 of the heatsink 4 that protrude outward and not to contact the radiation fins 7. Therefore, the area occupied during mounting is not very small, and the length of the folded lead is often insufficient to put it into practical use. SUMMARY OF THE INVENTION An object of the present invention is to eliminate the above-mentioned drawbacks and to provide an electronic component with a heat sink that can be mounted on a board with a small footprint without deteriorating the heat radiation characteristics. Means for Solving the Problems The electronic component with a heatsink of the present invention includes an electronic component body and at least a pair of leads extending outward from both ends of the electronic component body, one of the leads being connected to the electronic component. In an electronic component, the electronic component has a lead folded portion extending in a predetermined direction from a main body, and the other lead of the lead extends in the length direction of the electronic component main body and substantially coincident with the predetermined direction. The heatsink has a connecting portion extending along the length of the electronic component body and the lead folded portion, and a connecting portion extending from the connecting portion toward the electronic component body and in the direction in which the lead folded portion extends. It has a pair of opposing walls extending on both sides of the electronic component main body when viewed, and has a configuration in which the lead is fixed to the connecting part at the lead folding part. Function The heat radiator according to the present invention has a connecting portion and a pair of opposing walls extending from the connecting portion, and can be formed in a shape that does not protrude too much from the area substantially occupied by the electronic component when the heat radiator is not attached. There is no shortage of lead length for electronic components that can be mounted vertically without a heatsink. Furthermore, the heat generated by the electronic components is relatively efficiently transferred to the radiator through the leads, and is emitted from the radiator into the atmosphere. Embodiments Hereinafter, embodiments of the present invention will be described with reference to FIGS. 1 to 8. In these drawings, Figures 9 to 11
Components that are the same as those shown in the figures are designated by the same reference numerals and their explanations will be omitted. FIG. 1 shows a first embodiment of the invention. The electronic component is a resin-molded silicon diode. FIGS. 2 and 3 show the state in which it is mounted on a printed circuit board 9. FIG. The electronic component with a heatsink of the present invention has a heatsink 15 made of Ni-coated copper material and formed in the shape of a gutter with a U-shaped cross section.
is fixed to the lead 3 side. The lead 3 has a lead lead-out part 3a and a lead bent part 3b, and the lead bent part 3b has a lead bent part 3b1 and a lead folded part 3b2 . The heat sink 15 is connected to the lead folding section 3
a connecting portion 16 extending along b 2 and a lead folding portion 3 extending from the connecting portion 16 toward the electronic component body 1 side.
A pair of opposing walls 17 extending on both sides of the lead lead-out portion 3a and the lead bending portion 3b1 when viewed in the extending direction of b2 ,
It consists of 18. An inwardly recessed bead 19 is formed approximately at the center of the connecting portion 16, and a pair of holes 20 and 21 are vertically provided at the upper and lower sides of the bead 19. The lead folding part 3b2 has holes 20 and 2.
1. Although lead 2 is cut to an appropriate length, lead forming is not performed.
It extends in substantially the same direction as the lead folded portion 3b2 . As shown in FIG. 3, when mounting the electronic component on the printed circuit board 9, the lower end of the heatsink 15 acts as a stopper when inserting the lead 2 and the lead folded part 3b2 into the hole 10, so that the electronic component can be placed in the correct position. can be fixed easily and reliably. Although the lead folded portion 3b2 can be fixed to the connecting portion 16 by caulking, soldering is suitable in consideration of heat transfer. When fixing by soldering, the tip end of the lead 3 may be inserted into a solder bath. In this way, the molten solder is sucked up by capillary action, and the connecting part 1 of the lead folded part 3b2
Since the part adjacent to 6 is entirely soldered, workability is good. 4 and 5 show the soldering process, with FIG. 4 showing the bead 19 and FIG. 5 showing the other parts. 24 is solder. Note that the solder 24 is not shown in the drawings other than FIGS. 4 and 5 in order not to complicate the drawings. As is clear from FIG. 2, this electronic component with a heatsink has a substantially occupied area 25
However, it is significantly smaller than regions 13 and 14 in FIG. 10, and is equivalent to vertical mounting without a heat sink. That is, the area occupied by this electronic component with a heatsink on the printed circuit board 9 is significantly reduced compared to the conventional one. The height is the same as when mounted vertically without a heatsink. In the electronic component with a heatsink of the present invention, the heatsink 15 is fixed to the leads on one side, but because the heat is radiated through the leads, the heat radiation efficiency is relatively good, and it provides the same heat radiation ability as the conventional example. is easy. The table below is an example comparing the heat dissipation characteristics of resin molded silicon diodes based on current values. Output current Io varies from room temperature to 80°C with junction temperature
This is the current capacity specified when the temperature rises by ℃. As is clear from this table, the area occupied by the electronic component with a heat sink according to the embodiment of the present invention is less than one-third that of the conventional example shown in FIG. 10, which has the same heat dissipation ability.
【表】
第６図は、本考案の第２の実施例を示す。放熱
器１５は略コ字形断面の樋状金属部材で形成さ
れ、ビード１９は、連結部１６において外側に突
出するように形成される。また、リード屈曲部３
b1は、連結部１６に形成された垂直切欠き部２６
を通つて放熱器１５の外側に導かれ、リード折返
部３b2はビード１９の部分を除いて放熱器１５の
外側で連結部１６と隣接する。一対の対向壁１
７，１８は、これらの間に電子部品本体１が含ま
れるように電子部品本体１の両側部に伸びる。電
子部品本体１の表面を介してリード２と３の間の
絶縁耐圧が低下することを防止するため、対向壁
１７，１８の下部にそれぞれ切欠き部２２，２３
が設けられる。
第７図及び第８図に示すように第６図の放熱器
付電子部品をプリント基板９に取付けた場合、プ
リント基板９上での実質的占有領域２７は、第２
図の領域２５と比較して一対の対向壁１７，１８
の厚さ分だけ両側に増加するが、第１０図の領域
１３，１４と比べると大幅に小さい。第２の実施
例では、対向壁１７，１８の放熱面積が第１の実
施例より増加しているので、放熱能力も向上す
る。また、垂直切欠き部２６は、リード折曲部３
b1の下方へのストツパとして正確に働き、放熱器
１５の取り付け作業を容易にする。その他の点に
ついては、第１の実施例と同様である。
本考案は、その趣旨の範囲で変更が可能であ
る。例えば、対向壁１７，１８を波形に形成して
放熱面積を増加させることができる。対向壁１
７，１８を電子部品本体１に巻き付ければ、電子
部品本体１からの熱放散も向上させることができ
る。また、円弧状にリード折曲部３b1のリードフ
オーミングを施してもよい。
考案の効果
本考案の放熱器付電子部品は、その放熱器の形
状に基づいて、基板への取り付けの際に実質的占
有面積が小さく、基板への実装密度の向上に寄与
できる。この場合、リードに放熱器を固定するこ
とにより、従来に比べて放熱能力が低下すること
はない。従つて、本考案は、小形かつ許容電力の
大きい放熱器付電子部品（換言すれば、許容電流
容量の増大の割には大形化しない放熱器付電子部
品）を提供できる。[Table] FIG. 6 shows a second embodiment of the present invention. The heat radiator 15 is formed of a gutter-like metal member having a substantially U-shaped cross section, and the bead 19 is formed so as to protrude outward at the connecting portion 16 . In addition, the lead bending portion 3
b 1 is a vertical notch 26 formed in the connecting portion 16;
The lead folded portion 3b 2 is guided to the outside of the heat radiator 15 through the lead folding portion 3b 2 and adjoins the connecting portion 16 on the outside of the heat radiator 15 except for the bead 19 portion. A pair of opposing walls 1
7 and 18 extend to both sides of the electronic component body 1 so that the electronic component body 1 is included between them. In order to prevent the dielectric strength between the leads 2 and 3 from decreasing through the surface of the electronic component body 1, cutouts 22 and 23 are provided at the bottom of the opposing walls 17 and 18, respectively.
is provided. When the electronic component with a heatsink shown in FIG. 6 is mounted on the printed circuit board 9 as shown in FIGS. 7 and 8, the substantial occupied area 27 on the printed circuit board 9 is
A pair of opposing walls 17, 18 compared to region 25 in the figure
However, it is significantly smaller than regions 13 and 14 in FIG. 10. In the second embodiment, the heat dissipation area of the opposing walls 17 and 18 is increased compared to the first embodiment, so that the heat dissipation ability is also improved. Further, the vertical notch 26 is located at the lead bending portion 3.
It functions accurately as a downward stopper for b 1 and facilitates the installation work of the heat sink 15. Other points are similar to the first embodiment. The present invention can be modified within the scope of its spirit. For example, the opposing walls 17 and 18 can be formed in a corrugated shape to increase the heat dissipation area. Opposing wall 1
By wrapping the wires 7 and 18 around the electronic component body 1, heat dissipation from the electronic component body 1 can also be improved. Further, the lead bending portion 3b1 may be formed into an arc shape. Effects of the Invention Based on the shape of the heatsink, the electronic component with a heatsink of the present invention occupies a small practical area when attached to a board, and can contribute to improving the mounting density on the board. In this case, by fixing the heat radiator to the lead, the heat dissipation ability will not be lowered compared to the conventional case. Therefore, the present invention can provide an electronic component with a heat sink that is small and has a large allowable power (in other words, an electronic component with a heat sink that does not increase in size even though the allowable current capacity increases).
第１図は本考案の一実施例を示す放熱器付電子
部品の斜視図、第２図は第１図の放熱器付電子部
品を基板に取付けた場合の平面図、第３図は第２
図の正面図、第４図は半田でリードに放熱器を取
付けた実施例の一部を示す断面図、第５図は第４
図の実施例の他の部分を示す断面図、第６図は本
考案の他の実施例を示す斜視図、第７図は第６図
の放熱器付電子部品を基板に取付けた場合の平面
図、第８図は第７図の正面図、第９図は従来の放
熱器付電子部品の斜視図、第１０図は従来の放熱
器付電子部品を基板に取付けた場合の平面図、第
１１図は第１０図の正面図である。
１……電子部品本体、２，３……リード、３ａ
……リード導出部、３ｂ……リード屈曲部、３b1
……リード折曲部、３b2……リード折返部、１５
……放熱器、１６……連結部、１７，１８……対
向壁、１９……ビード、２０，２１……孔、２４
……半田。
Fig. 1 is a perspective view of an electronic component with a heat sink showing an embodiment of the present invention, Fig. 2 is a plan view of the electronic component with a heat sink shown in Fig. 1 attached to a board, and Fig.
Figure 4 is a front view, Figure 4 is a sectional view showing a part of an embodiment in which a heatsink is attached to the leads with solder, and Figure 5 is a
6 is a perspective view showing another embodiment of the present invention, and FIG. 7 is a plan view of the electronic component with a heatsink shown in FIG. 6 attached to a board. 8 is a front view of FIG. 7, FIG. 9 is a perspective view of a conventional electronic component with a heat sink, FIG. 10 is a plan view of a conventional electronic component with a heat sink attached to a board, and FIG. FIG. 11 is a front view of FIG. 10. 1... Electronic component body, 2, 3... Lead, 3a
...Lead lead-out part, 3b...Lead bending part, 3b 1
...Lead folding part, 3b 2 ...Lead folding part, 15
... Heat radiator, 16 ... Connection part, 17, 18 ... Opposing wall, 19 ... Bead, 20, 21 ... Hole, 24
……solder.
Claims (1)
れぞれ外方に伸びる少なくとも一対のリードと
を設け、該リードの一方は前記電子部品本体か
ら所定の方向に伸び、前記リードの他方は前記
電子部品本体の長さ方向でかつ前記所定の方向
に略一致するように伸びるリード折返部とを有
する電子部品において、前記リードの他方に放
熱器が固定され、該放熱器は、前記電子部品本
体及び前記リード折返部の長さ方向に沿つて伸
びる連結部と該連結部から前記電子部品本体側
に伸びると共に前記リード折返部の伸びる方向
に見て前記電子部品本体の両側に伸びる一対の
対向壁とを有し、前記リードが前記リード折返
部において前記連結部に固定されていることを
特徴とする放熱器付電子部品。 (2) 前記放熱器は、Ｕ字形断面又はコ字形断面の
樋状金属部材である実用新案登録請求の範囲第
(1)項記載の放熱器付電子部品。 (3) 前記リードの前記リード折返部においての前
記連結部への固定は半田付による固定である実
用新案登録請求の範囲第(1)項又は第(2)項記載の
放熱器付電子部品。 (4) 前記連結部は、前記放熱器に形成されたビー
ドと、該ビードの側部に設けられた一対の孔と
を有し、該一対の孔に前記リードが貫通する実
用新案登録請求の範囲第(1)項、第(2)項又は第(3)
項記載の放熱器付電子部品。 (5) 前記ビードは、前記連結部に対し内側に窪む
か又は外側に突出する実用新案登録請求の範囲
第(4)項記載の放熱器付電子部品。[Claims for Utility Model Registration] (1) An electronic component body and at least a pair of leads extending outward from both ends of the electronic component body, one of the leads extending in a predetermined direction from the electronic component body. , in the electronic component, the other of the leads has a lead folded part extending in the length direction of the electronic component body and substantially coincident with the predetermined direction, a heat radiator is fixed to the other of the leads, the heat radiator The device includes a connecting portion extending along the length of the electronic component main body and the lead folding portion, and a connecting portion extending from the connecting portion toward the electronic component main body side, and a connecting portion of the electronic component main body when viewed in the direction in which the lead folding portion extends. 1. An electronic component with a heat sink, comprising a pair of opposing walls extending on both sides, and wherein the lead is fixed to the connecting part at the lead folding part. (2) The radiator is a gutter-like metal member with a U-shaped cross section or a U-shaped cross section.
Electronic components with heat sinks as described in (1). (3) The electronic component with a radiator according to claim 1 or 2, wherein the lead is fixed to the connecting portion at the lead folded portion by soldering. (4) The connecting portion has a bead formed on the radiator and a pair of holes provided on the side of the bead, and the lead passes through the pair of holes. Scope paragraph (1), paragraph (2) or paragraph (3)
Electronic components with heatsinks as described in section. (5) The electronic component with a radiator according to claim 4, wherein the bead is recessed inward or protrudes outward with respect to the connecting portion.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14182686U JPH0429573Y2 (en) | 1986-09-18 | 1986-09-18 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14182686U JPH0429573Y2 (en) | 1986-09-18 | 1986-09-18 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6349244U JPS6349244U (en) | 1988-04-04 |
| JPH0429573Y2 true JPH0429573Y2 (en) | 1992-07-17 |
Family
ID=31049975
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP14182686U Expired JPH0429573Y2 (en) | 1986-09-18 | 1986-09-18 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0429573Y2 (en) |
-
1986
- 1986-09-18 JP JP14182686U patent/JPH0429573Y2/ja not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6349244U (en) | 1988-04-04 |
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