JPH04286971A - Data inspection device - Google Patents

Data inspection device

Info

Publication number
JPH04286971A
JPH04286971A JP3076947A JP7694791A JPH04286971A JP H04286971 A JPH04286971 A JP H04286971A JP 3076947 A JP3076947 A JP 3076947A JP 7694791 A JP7694791 A JP 7694791A JP H04286971 A JPH04286971 A JP H04286971A
Authority
JP
Japan
Prior art keywords
data
inspection
circuit
verification
accuracy
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP3076947A
Other languages
Japanese (ja)
Other versions
JP2960191B2 (en
Inventor
Toru Miyauchi
徹 宮内
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Ltd
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Priority to JP3076947A priority Critical patent/JP2960191B2/en
Publication of JPH04286971A publication Critical patent/JPH04286971A/en
Application granted granted Critical
Publication of JP2960191B2 publication Critical patent/JP2960191B2/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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  • Tests Of Electronic Circuits (AREA)
  • Image Processing (AREA)
  • Image Analysis (AREA)

Abstract

PURPOSE:To obtain a positive inspection data in a short time by converting an inspection data for collating data to a data with a low accuracy and then collating it, inspecting it, and then repeating inspection only to a portion which is found to be defective. CONSTITUTION:A data at a portion for storing inspection data for data verification 1 is converted to a data with a lower accuracy by a data conversion circuit 8 and then the output data is applied to a first collating circuit 5. On the other hand, an inspection data is obtained at a product inspection portion 7 and is applied to the circuit 5. A low-accuracy inspection is performed at the inspection portion 7, both data are compared by the circuit 5, and then a defective data is stored at a storage portion 9 if there are defective products. A corresponding original data is extracted from the storage portion 1 by a data extraction portion 10 based on this data and the inspection is performed only for a portion corresponding to it at a second inspection portion 11, thus obtaining a normal- accuracy data. The original data of the storage portion 1 and the inspection data of the inspection portion 11 are compared by a second comparison circuit 12, thus achieving collating in the case of a pseudo defect and non-verification in the case of a formal defect for obtaining an inspection result data efficiently.

Description

【発明の詳細な説明】[Detailed description of the invention]

【0001】0001

【産業上の利用分野】本発明はデータ照合用検査データ
について短時間に効果的に検査するデータ検査装置に関
する。デバイスの状態を検査するとき、高精度と高速化
は当然要求される。通常は両者を同時に満足することが
困難であるが、デバイスの全体を同一精度では検査しな
くて良いときに、両者を同時に満足したい要望が起こる
。そのような場合に対処できる技術を開発することが要
望された。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a data inspection device for effectively inspecting inspection data for data verification in a short period of time. When inspecting the status of a device, high accuracy and high speed are naturally required. Normally, it is difficult to satisfy both at the same time, but when the entire device does not have to be inspected with the same accuracy, there is a desire to satisfy both at the same time. There was a desire to develop technology that could deal with such cases.

【0002】0002

【従来の技術】或るデバイスの状態を検査するとき、一
つのデータ形式で得るときはそのデータ形式による単一
の精度が設定されるのみであった。例えば図4に示すよ
うに半導体集積回路を製造する工程において使用するレ
チクルについて説明する。図4において、1はデータ照
合用検査データ格納部、2はレチクル、3は発光部、4
は受光部、5は照合回路、6は検査結果データ格納部を
示す。半導体集積回路をCADシステムを活用すること
などにより設計するとき、基本設計データに基づいてレ
チクルについての検査データと、露光データとを取り出
すことができる。データ照合用検査データ格納部1には
前記レチクルについての検査データを格納しておく。一
方、レチクルについて前記レクチルについての露光デー
タにより製作したものを、図4に示すようにその一方端
から他方端にわたって光による検査を行う。そして受光
部4から得られた逐次データについて、前記データ照合
用検査データ1とを照合回路5において照合する。レチ
クル2が正常に製作されているとき、照合回路5の照合
結果は総て正常であるという結果データも格納部6に格
納される。
2. Description of the Related Art When inspecting the status of a certain device and obtaining data in one data format, only a single precision is set according to that data format. For example, as shown in FIG. 4, a reticle used in the process of manufacturing a semiconductor integrated circuit will be described. In FIG. 4, 1 is an inspection data storage unit for data comparison, 2 is a reticle, 3 is a light emitting unit, and 4
5 indicates a light receiving section, 5 indicates a verification circuit, and 6 indicates a test result data storage section. When designing a semiconductor integrated circuit using a CAD system, inspection data and exposure data regarding a reticle can be extracted based on basic design data. Inspection data storage section 1 for data comparison stores inspection data regarding the reticle. On the other hand, a reticle manufactured based on the exposure data for the reticle is inspected by light from one end to the other as shown in FIG. Then, the sequential data obtained from the light receiving section 4 is compared with the data comparison inspection data 1 in the comparison circuit 5. When the reticle 2 is manufactured normally, result data indicating that all the verification results of the verification circuit 5 are normal is also stored in the storage section 6.

【0003】一般にレチクルの周辺部は全体的に無地の
板状部となっていて、中央部分の開孔部と比べて大きさ
の精度は必要としない。しかし従来の場合は図4に示す
ようにレチクル2の中央部分も周辺部も全く同じやり方
で検査をしていた。
[0003] Generally, the peripheral portion of the reticle is a plain plate-like portion, and does not require greater precision in size than the aperture portion in the central portion. However, in the conventional case, as shown in FIG. 4, both the central part and the peripheral part of the reticle 2 were inspected in exactly the same manner.

【0004】0004

【発明が解決しようとする課題】デバイスのうち充分に
検査をすべき場所は検査精度を向上するため、検査装置
をハードウェアとして高精度のものを使用する必要があ
る。しかし同一デバイスであれば、充分に検査すること
を要しない場所に対しても、同一の高精度で検査を行っ
た。そのため検査は高い精度で得られたが、長時間を要
した。なおデバイスに塵埃が付着した場合はそこが高精
度に検査することを要する場所であれば、欠陥ありと判
断しなければならないが、周辺部においては同一の塵埃
を擬似欠陥と判断することで良い。周辺部のみに欠陥が
存在する場合は不良品と判断すべき欠陥ではないものを
、中央部と同様に判断すると欠陥ありと判断することが
生じた。
Problems to be Solved by the Invention In order to improve the inspection accuracy of the parts of the device that should be thoroughly inspected, it is necessary to use highly accurate inspection equipment as hardware. However, with the same device, inspections were performed with the same high precision even in locations that did not require thorough inspection. As a result, although the test was highly accurate, it took a long time. Note that if dust adheres to a device, it must be determined that there is a defect if it is a location that requires high-precision inspection, but it is sufficient to determine that the same dust is a pseudo-defect in the surrounding area. . If a defect exists only in the peripheral part, it should be determined that the product is defective, but if the defect is determined in the same way as the central part, the product is determined to be defective.

【0005】本発明の目的は前述の欠点を改善し、高精
度な検査を必要とする場所はそのように検査を行い、必
ずしも高精度を要しない所は低い精度で検査を行うよう
にした検査装置を提供することにある。
The object of the present invention is to improve the above-mentioned drawbacks, and to provide an inspection system in which locations that require high precision inspection are inspected in that manner, and locations that do not necessarily require high precision are inspected with low precision. The goal is to provide equipment.

【0006】[0006]

【課題を解決するための手段】図1は本発明の原理構成
を示す図である。図1において、1はデータ照合用検査
データ、5は第1照合回路、7は製品検査部、8はデー
タ変換回路、9は照合結果データ格納部、10はデータ
抽出回路、11は第2検査部、12は第2照合回路を示
す。データ照合用検査データ1を、製品を検査したデー
タと照合する照合回路5により検査するデータ検査装置
において、本発明は下記の構成とする。即ち、前記デー
タ照合用検査データ1を精度のより低いデータに変換し
て第1照合回路5に印加するデータ変換回路8と、第1
照合回路5により取り出して新たなデータ照合用検査デ
ータを求めるデータ抽出回路10と、データ9に対応す
る箇所について製品を検査する第2検査部11と、デー
タ照合用検査データ1と第2検査部11の検査データと
を照合する第2照合回路とで構成する。
[Means for Solving the Problems] FIG. 1 is a diagram showing the basic configuration of the present invention. In FIG. 1, 1 is inspection data for data matching, 5 is a first matching circuit, 7 is a product inspection section, 8 is a data conversion circuit, 9 is a matching result data storage section, 10 is a data extraction circuit, and 11 is a second inspection circuit. 12 indicates a second verification circuit. The present invention has the following configuration in a data inspection device that inspects inspection data 1 for data comparison by a comparison circuit 5 that compares data obtained by inspecting a product. That is, a data conversion circuit 8 converts the data verification test data 1 into less accurate data and applies it to the first verification circuit 5;
A data extraction circuit 10 that extracts new inspection data for data comparison by the comparison circuit 5, a second inspection section 11 that inspects the product at a location corresponding to data 9, and inspection data 1 and second inspection section for data comparison. and a second collation circuit that collates the test data of No. 11.

【0007】[0007]

【作用】図1において1点鎖線より上方は従来の検査装
置の構成と同様であり、したがってその基本的動作は同
様である。データ照合用検査データ格納部1のデータに
ついてデータ変換回路8において精度のより低いデータ
に変換する。データ変換回路8の出力データを第1照合
回路5に印加する。一方、製品検査部7において、検査
データを求め第1照合回路5に印加する。このときは製
品検査部7において精度の低い検査を行う。第1照合回
路5により両データを照合して、製品について欠陥があ
るときは欠陥データを格納部9に格納する。次に格納部
9のデータに基づきデータ抽出部10において、データ
照合用検査データ格納部1から対応する原データを抽出
する。そして第2検査部11においては、格納部9のデ
ータに対応する箇所についてのみ検査を行い、言わば欠
陥箇所について通常の精度のデータを得る。次に第2照
合回路においてデータ照合用検査データ格納部1の原デ
ータと、第2検査部11の検査データとを照合する。そ
の結果擬似欠陥であれば照合が取れ、正式欠陥であれば
照合が取れず検査結果のデータが効果的に得られる。
[Operation] In FIG. 1, the structure above the one-dot chain line is the same as that of the conventional inspection apparatus, and therefore its basic operation is the same. The data in the test data storage section 1 for data matching is converted into data with lower accuracy in the data conversion circuit 8. The output data of the data conversion circuit 8 is applied to the first matching circuit 5. On the other hand, the product inspection section 7 obtains inspection data and applies it to the first verification circuit 5. At this time, the product inspection section 7 performs an inspection with low accuracy. The first matching circuit 5 matches both data, and if there is a defect in the product, the defect data is stored in the storage section 9. Next, based on the data in the storage section 9, the data extraction section 10 extracts the corresponding original data from the data matching test data storage section 1. Then, the second inspection section 11 inspects only the locations corresponding to the data in the storage section 9, and obtains data with normal accuracy regarding the defective locations, so to speak. Next, in the second verification circuit, the original data in the data verification test data storage section 1 and the test data in the second test section 11 are verified. As a result, if it is a pseudo defect, it can be matched, but if it is a formal defect, it cannot be matched, and inspection result data can be effectively obtained.

【0008】[0008]

【実施例】図2は本発明の実施例として、データ変換回
路8に1ビットシフト回路を、製品検査部7に従来と同
様なレチクルデータの検査装置を使用する場合を説明す
る図である。図2において、1はデータ照合用検査デー
タ格納部、2はレチクル、3は発光部、5は第1照合回
路、7は製品検査部を全体的に示すもの、9は照合結果
データの格納部、13はデータ変換回路としての1ビッ
トシフト回路、14は精度の低いデータを得る受光部、
15は通常精度のデータを得る受光部で、図2において
は使用しないものを示す。
Embodiment FIG. 2 is a diagram illustrating a case where a 1-bit shift circuit is used as the data conversion circuit 8 and a reticle data inspection device similar to the conventional one is used in the product inspection section 7 as an embodiment of the present invention. In FIG. 2, 1 is an inspection data storage section for data comparison, 2 is a reticle, 3 is a light emitting section, 5 is a first comparison circuit, 7 is an overall product inspection section, and 9 is a storage section for comparison result data. , 13 is a 1-bit shift circuit as a data conversion circuit, 14 is a light receiving unit that obtains data with low precision,
Reference numeral 15 denotes a light receiving section that obtains data with normal precision, and is not used in FIG.

【0009】図2において、データ照合用検査データの
格納部1には表1に示すデータ例が格納されているとす
る。アドレスのように示すX,Y,H,Wはそれぞれレ
クチルの或る範囲データのデータのX座標、Y座標、高
さデータ、幅データを示す。またLSBから数えて3桁
と4桁との間に小数点を考える。検査データ格納部1に
おけるデータ例について、1ビットシフト回路3により
LSBの1ビットを削り、表2に示すデータ例に変換す
る。その結果、当初の検査データは精度が1/8となっ
て第1照合回路5に印加される。製品検査部7における
受光部14から、精度の低いデータが第1照合回路5に
印加され、前記印加データと照合される。照合の結果、
一致・不一致が判明するため不一致のデータに対し、そ
のデータがデータ照合用検査データ1において、当初か
ら何番目のデータであったかを示す位置データと欠陥デ
ータとを照合結果データ格納部9に格納する。
[0009] In FIG. 2, it is assumed that the data example shown in Table 1 is stored in the storage unit 1 for data verification test data. X, Y, H, and W shown as an address respectively indicate the X coordinate, Y coordinate, height data, and width data of a certain range of data of the reticle. Also, consider the decimal point between the 3rd and 4th digits counting from the LSB. The 1-bit shift circuit 3 removes 1 bit of the LSB from the data example in the test data storage section 1 and converts it into the data example shown in Table 2. As a result, the original test data is applied to the first verification circuit 5 with an accuracy of 1/8. Data with low accuracy is applied from the light receiving section 14 in the product inspection section 7 to the first verification circuit 5, and is verified against the applied data. As a result of matching,
Since matching/mismatching is determined, for the mismatched data, position data indicating the number of the data from the beginning in the inspection data 1 for data matching and defect data are stored in the matching result data storage section 9. .

【0010】0010

【表1】[Table 1]

【0011】[0011]

【表2】[Table 2]

【0012】次に図3は第2検査部とその近辺について
の具体例を示す図であって、図2と結合してデータ検査
装置を形成する。図3において、2,3,14,15は
図2と同一のものを示す。11は第2検査部を全体的に
示し、図3の場合は通常の精度の受光部15からの出力
データのみを得ている。12は第2照合回路、16はレ
チクルを保持するステージの制御部、17は検査するこ
とを要するデータの格納部、18は最終結果のデータ格
納部を示す。
Next, FIG. 3 is a diagram showing a specific example of the second inspection section and its vicinity, and is combined with FIG. 2 to form a data inspection device. In FIG. 3, 2, 3, 14, and 15 are the same as those in FIG. Reference numeral 11 shows the second inspection section as a whole, and in the case of FIG. 3, only the output data from the light receiving section 15 with normal accuracy is obtained. Reference numeral 12 indicates a second collation circuit, 16 a control unit for a stage that holds a reticle, 17 a storage unit for data required to be inspected, and 18 a data storage unit for final results.

【0013】図3において、ステージ制御部16は照合
結果データ格納部9に格納されたデータにより、欠陥デ
ータの位置を知って、レチクル2を検査するようにステ
ージの位置を制御する。図3においては受光部15が通
常の精度のものであるが、受光すべきレチクルの対象位
置が図2と比べて少量であるから、第2照合回路12に
印加されるデータの総量も図2の場合より少ない。デー
タ抽出回路10において、照合結果データ格納部9のデ
ータに基づき欠陥データに対応するデータ照合用の原検
査データをデータ格納部1から抽出する。そのデータを
必要に応じ、データ格納部17に格納してから第2照合
回路12へ印加する。第2照合回路12の照合は図2の
場合の不一致データについての照合であるから、通常の
精度で少量のデータを照合するのみで良い。したがって
照合結果は、通常の精度で速やかに得られる。
In FIG. 3, the stage control section 16 knows the position of defect data from the data stored in the verification result data storage section 9, and controls the position of the stage so that the reticle 2 is inspected. In FIG. 3, the light receiving unit 15 is of normal precision, but since the target position of the reticle to receive light is small compared to that in FIG. 2, the total amount of data applied to the second matching circuit 12 is also Less than. The data extraction circuit 10 extracts original inspection data for data verification corresponding to the defect data from the data storage section 1 based on the data in the verification result data storage section 9 . The data is stored in the data storage section 17 as required and then applied to the second matching circuit 12. Since the second matching circuit 12 matches the mismatched data in the case of FIG. 2, it is only necessary to match a small amount of data with normal accuracy. Therefore, matching results can be obtained quickly and with normal accuracy.

【0014】以上は検査データとしてレチクルの場合に
ついて説明したが、本発明はレチクルの検査データに限
らず一般のデータに対しても適用することが出来る。
[0014] The above description has been made regarding the case of a reticle as the inspection data, but the present invention can be applied not only to reticle inspection data but also to general data.

【0015】[0015]

【発明の効果】このようにして本発明によると、全デー
タを精度高く検査するのでは無く、一旦精度の低い検査
を行い、欠陥と判断したデータについてのみ、改めて通
常の検査を行う。そのため確実な検査データが短時間に
得られる。検査モードとして精度を高くすれば、それだ
け高精度なデータが得られ、しかも高精度な検査を行う
箇所が少なくて済む。また不必要に高精度な検査を行う
ことがなく、精度を変えて検査するため擬似欠陥を拾う
ことが少ない。
As described above, according to the present invention, instead of inspecting all data with high accuracy, a low-accuracy inspection is first performed, and only the data determined to be defective is subjected to a normal inspection again. Therefore, reliable inspection data can be obtained in a short time. The higher the accuracy of the inspection mode, the more accurate data can be obtained, and the fewer places need to be inspected with high precision. In addition, unnecessary high-precision inspection is not performed, and since inspection is performed with varying precision, false defects are less likely to be picked up.

【図面の簡単な説明】[Brief explanation of the drawing]

【図1】本発明の原理構成を示す図である。FIG. 1 is a diagram showing the principle configuration of the present invention.

【図2】本発明の実施例の構成の一部を示す図である。FIG. 2 is a diagram showing a part of the configuration of an embodiment of the present invention.

【図3】本発明の実施例の構成の他部を示す図である。FIG. 3 is a diagram showing other parts of the configuration of the embodiment of the present invention.

【図4】従来のデータ検査装置を説明する図である。FIG. 4 is a diagram illustrating a conventional data inspection device.

【符号の説明】[Explanation of symbols]

1  データ照合用検査データ・格納部5  第1照合
回路 7  製品検査部 8  データ変換回路 9  照合結果データ・格納部 10  データ抽出回路 11  第2検査部 12  第2照合回路
1 Inspection data/storage section for data comparison 5 First comparison circuit 7 Product inspection section 8 Data conversion circuit 9 Verification result data/storage section 10 Data extraction circuit 11 Second inspection section 12 Second comparison circuit

Claims (1)

【特許請求の範囲】[Claims] 【請求項1】データ照合用検査データ(1) を、製品
を検査したデータと照合する照合回路(5) により検
査するデータ検査装置において、前記データ照合用検査
データ(1) を精度のより低いデータに変換して前記
照合回路に印加するデータ変換回路(8) と、前記照
合回路(5) により照合した後のデータ(9) によ
り、前記データ照合用検査データ(1) 中から所望デ
ータを取り出して新たなデータ照合用検査データを求め
るデータ抽出回路(10)と、データ(9) に対応す
る箇所について製品を検査する第2検査部(11)と、
データ照合用検査データ(1) と第2検査部(11)
の検査データとを照合する第2照合回路(12)と、で
構成することを特徴とするデータ検査装置。
Claim 1: A data inspection device that inspects data comparison inspection data (1) with a comparison circuit (5) that compares data obtained by inspecting a product, wherein the data comparison inspection data (1) is compared with data obtained by inspecting a product. Desired data is extracted from the data verification test data (1) by a data conversion circuit (8) that converts it into data and applies it to the verification circuit, and data (9) after verification by the verification circuit (5). a data extraction circuit (10) that extracts and obtains new inspection data for data comparison; a second inspection section (11) that inspects the product at locations corresponding to the data (9);
Inspection data for data comparison (1) and second inspection part (11)
A data inspection device comprising: a second collation circuit (12) that collates the inspection data of the data.
JP3076947A 1991-03-16 1991-03-16 Data inspection device Expired - Fee Related JP2960191B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP3076947A JP2960191B2 (en) 1991-03-16 1991-03-16 Data inspection device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP3076947A JP2960191B2 (en) 1991-03-16 1991-03-16 Data inspection device

Publications (2)

Publication Number Publication Date
JPH04286971A true JPH04286971A (en) 1992-10-12
JP2960191B2 JP2960191B2 (en) 1999-10-06

Family

ID=13619958

Family Applications (1)

Application Number Title Priority Date Filing Date
JP3076947A Expired - Fee Related JP2960191B2 (en) 1991-03-16 1991-03-16 Data inspection device

Country Status (1)

Country Link
JP (1) JP2960191B2 (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0855218A (en) * 1994-08-09 1996-02-27 Fujitsu Ltd Method and device for pattern inspection
JP2011039012A (en) * 2009-08-18 2011-02-24 Nuflare Technology Inc Inspection device

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0855218A (en) * 1994-08-09 1996-02-27 Fujitsu Ltd Method and device for pattern inspection
JP2011039012A (en) * 2009-08-18 2011-02-24 Nuflare Technology Inc Inspection device

Also Published As

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JP2960191B2 (en) 1999-10-06

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