JPH0428448U - - Google Patents
Info
- Publication number
- JPH0428448U JPH0428448U JP6900790U JP6900790U JPH0428448U JP H0428448 U JPH0428448 U JP H0428448U JP 6900790 U JP6900790 U JP 6900790U JP 6900790 U JP6900790 U JP 6900790U JP H0428448 U JPH0428448 U JP H0428448U
- Authority
- JP
- Japan
- Prior art keywords
- device hole
- semiconductor pellet
- tab
- type semiconductor
- inner lead
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 8
- 239000008188 pellet Substances 0.000 claims description 4
- 239000011347 resin Substances 0.000 claims description 2
- 229920005989 resin Polymers 0.000 claims description 2
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Wire Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6900790U JPH0428448U (de) | 1990-06-28 | 1990-06-28 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6900790U JPH0428448U (de) | 1990-06-28 | 1990-06-28 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0428448U true JPH0428448U (de) | 1992-03-06 |
Family
ID=31603942
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP6900790U Pending JPH0428448U (de) | 1990-06-28 | 1990-06-28 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0428448U (de) |
-
1990
- 1990-06-28 JP JP6900790U patent/JPH0428448U/ja active Pending