JPH0428435U - - Google Patents
Info
- Publication number
- JPH0428435U JPH0428435U JP1990069661U JP6966190U JPH0428435U JP H0428435 U JPH0428435 U JP H0428435U JP 1990069661 U JP1990069661 U JP 1990069661U JP 6966190 U JP6966190 U JP 6966190U JP H0428435 U JPH0428435 U JP H0428435U
- Authority
- JP
- Japan
- Prior art keywords
- shape
- wiring board
- printed wiring
- circuit pattern
- pads
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/42—Wire connectors; Manufacturing methods related thereto
- H01L24/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L24/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
- H01L2224/491—Disposition
- H01L2224/4912—Layout
- H01L2224/49171—Fan-out arrangements
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Multi-Conductor Connections (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Wire Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1990069661U JPH0428435U (US08063081-20111122-C00044.png) | 1990-06-29 | 1990-06-29 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1990069661U JPH0428435U (US08063081-20111122-C00044.png) | 1990-06-29 | 1990-06-29 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0428435U true JPH0428435U (US08063081-20111122-C00044.png) | 1992-03-06 |
Family
ID=31605163
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1990069661U Pending JPH0428435U (US08063081-20111122-C00044.png) | 1990-06-29 | 1990-06-29 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0428435U (US08063081-20111122-C00044.png) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2005183588A (ja) * | 2003-12-18 | 2005-07-07 | Fujikura Ltd | 接合体およびその製造方法 |
| JP2005183451A (ja) * | 2003-12-16 | 2005-07-07 | Fujikura Ltd | 接合体およびその製造方法 |
| WO2017038667A1 (ja) * | 2015-08-31 | 2017-03-09 | シャープ株式会社 | 光源ユニット、照明装置及び表示装置 |
-
1990
- 1990-06-29 JP JP1990069661U patent/JPH0428435U/ja active Pending
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2005183451A (ja) * | 2003-12-16 | 2005-07-07 | Fujikura Ltd | 接合体およびその製造方法 |
| JP4526813B2 (ja) * | 2003-12-16 | 2010-08-18 | 株式会社フジクラ | 接合体の製造方法 |
| JP2005183588A (ja) * | 2003-12-18 | 2005-07-07 | Fujikura Ltd | 接合体およびその製造方法 |
| JP4526814B2 (ja) * | 2003-12-18 | 2010-08-18 | 株式会社フジクラ | 接合体の製造方法 |
| WO2017038667A1 (ja) * | 2015-08-31 | 2017-03-09 | シャープ株式会社 | 光源ユニット、照明装置及び表示装置 |
