JPH0428420U - - Google Patents
Info
- Publication number
- JPH0428420U JPH0428420U JP7032990U JP7032990U JPH0428420U JP H0428420 U JPH0428420 U JP H0428420U JP 7032990 U JP7032990 U JP 7032990U JP 7032990 U JP7032990 U JP 7032990U JP H0428420 U JPH0428420 U JP H0428420U
- Authority
- JP
- Japan
- Prior art keywords
- mount component
- surface mount
- adhesive
- contact
- pad
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000853 adhesive Substances 0.000 claims 2
- 230000001070 adhesive effect Effects 0.000 claims 2
- 229910000679 solder Inorganic materials 0.000 description 1
Landscapes
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
- Lead Frames For Integrated Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7032990U JPH0428420U (no) | 1990-07-03 | 1990-07-03 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7032990U JPH0428420U (no) | 1990-07-03 | 1990-07-03 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0428420U true JPH0428420U (no) | 1992-03-06 |
Family
ID=31606399
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP7032990U Pending JPH0428420U (no) | 1990-07-03 | 1990-07-03 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0428420U (no) |
-
1990
- 1990-07-03 JP JP7032990U patent/JPH0428420U/ja active Pending