JPH04283283A - Free sealing tape - Google Patents

Free sealing tape

Info

Publication number
JPH04283283A
JPH04283283A JP12562791A JP12562791A JPH04283283A JP H04283283 A JPH04283283 A JP H04283283A JP 12562791 A JP12562791 A JP 12562791A JP 12562791 A JP12562791 A JP 12562791A JP H04283283 A JPH04283283 A JP H04283283A
Authority
JP
Grant status
Application
Patent type
Prior art keywords
sealing tape
free sealing
adhesive layer
flap
free
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP12562791A
Inventor
Shinichi Tokuyama
Original Assignee
Nippon Synthetic Chem Ind Co Ltd:The
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date

Links

Abstract

PURPOSE: To provide a free sealing tape to be used as a flap of a bag made of various kinds of plastic film, paper, metallic foil, etc., and capable of sealing and unsealing the flap freely.
CONSTITUTION: A free sealing tape formed by laminating a strongly adhesive layer 6 and a weakly adhesive layer 5 doubly on a base material 4. Its production is simple and easy and it does not produce wrinkles or the like in its applied section even when it is left to stand for a long period of time.
COPYRIGHT: (C)1992,JPO&Japio
JP12562791A 1991-03-08 1991-03-08 Free sealing tape Pending JPH04283283A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP12562791A JPH04283283A (en) 1991-03-08 1991-03-08 Free sealing tape

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP12562791A JPH04283283A (en) 1991-03-08 1991-03-08 Free sealing tape

Publications (1)

Publication Number Publication Date
JPH04283283A true true JPH04283283A (en) 1992-10-08

Family

ID=14914738

Family Applications (1)

Application Number Title Priority Date Filing Date
JP12562791A Pending JPH04283283A (en) 1991-03-08 1991-03-08 Free sealing tape

Country Status (1)

Country Link
JP (1) JPH04283283A (en)

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5990291A (en) * 1996-06-11 1999-11-23 Protein Technologies International, Inc. Recovery of isoflavones from soy molasses
US6083553A (en) * 1998-06-05 2000-07-04 Protein Technologies International, Inc. Recovery of isoflavones from soy molasses
JP2007107011A (en) * 2006-11-29 2007-04-26 Nitto Denko Corp Bonding method facilitating dismantlement, adhesive member therefor and method for producing the same
JP2009155629A (en) * 2007-12-06 2009-07-16 Sekisui Chem Co Ltd Double-coated tape, and liquid crystal display device
JP2011137162A (en) * 2011-02-02 2011-07-14 Nitto Denko Corp Method for easy-to-dismantle adhesion, and self-adhesive material therefor, and method for producing the self-adhesive material
JP2013524493A (en) * 2010-03-31 2013-06-17 エーファウ・グループ・エー・タルナー・ゲーエムベーハー The method for manufacturing a wafer provided with a chip on two sides

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5990291A (en) * 1996-06-11 1999-11-23 Protein Technologies International, Inc. Recovery of isoflavones from soy molasses
US6083553A (en) * 1998-06-05 2000-07-04 Protein Technologies International, Inc. Recovery of isoflavones from soy molasses
JP2007107011A (en) * 2006-11-29 2007-04-26 Nitto Denko Corp Bonding method facilitating dismantlement, adhesive member therefor and method for producing the same
JP2009155629A (en) * 2007-12-06 2009-07-16 Sekisui Chem Co Ltd Double-coated tape, and liquid crystal display device
JP2013524493A (en) * 2010-03-31 2013-06-17 エーファウ・グループ・エー・タルナー・ゲーエムベーハー The method for manufacturing a wafer provided with a chip on two sides
US9224630B2 (en) 2010-03-31 2015-12-29 Ev Group E. Thallner Gmbh Method for producing a wafer provided with chips
JP2011137162A (en) * 2011-02-02 2011-07-14 Nitto Denko Corp Method for easy-to-dismantle adhesion, and self-adhesive material therefor, and method for producing the self-adhesive material

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