JPH0428164Y2 - - Google Patents
Info
- Publication number
- JPH0428164Y2 JPH0428164Y2 JP13895585U JP13895585U JPH0428164Y2 JP H0428164 Y2 JPH0428164 Y2 JP H0428164Y2 JP 13895585 U JP13895585 U JP 13895585U JP 13895585 U JP13895585 U JP 13895585U JP H0428164 Y2 JPH0428164 Y2 JP H0428164Y2
- Authority
- JP
- Japan
- Prior art keywords
- interphase
- phase
- layer
- insulating layer
- barrier
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 230000016507 interphase Effects 0.000 claims description 15
- 230000004888 barrier function Effects 0.000 claims description 9
- 238000009413 insulation Methods 0.000 claims description 6
- 230000000694 effects Effects 0.000 description 3
- 239000002184 metal Substances 0.000 description 3
- 125000006850 spacer group Chemical group 0.000 description 2
- 230000007704 transition Effects 0.000 description 2
- 230000000903 blocking effect Effects 0.000 description 1
- 238000003763 carbonization Methods 0.000 description 1
- 238000011109 contamination Methods 0.000 description 1
- 238000007740 vapor deposition Methods 0.000 description 1
Landscapes
- Installation Of Bus-Bars (AREA)
- Regulation Of General Use Transformers (AREA)
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
- Patch Boards (AREA)
- Insulating Bodies (AREA)
Description
【考案の詳細な説明】
〔産業上の利用分野〕
この考案は、並設された機器間の相間絶縁を保
持するため、機器間に配設される相間絶縁用の相
間バリヤに関する。[Detailed Description of the Invention] [Industrial Field of Application] This invention relates to an interphase barrier for interphase insulation disposed between devices in order to maintain interphase insulation between devices installed in parallel.
従来、3相機器の相間絶縁は、第4図に示すよ
うになつている。
Conventionally, interphase insulation of three-phase equipment is as shown in FIG. 4.
同図において、1は底板、2はフレーム、3は
底板1上に並設された3相の機器、4は機器3の
遮断部分であり、外部端子に接続されている。5
は遮断部分4を開閉する操作軸、6は機器3間に
配設された1枚の板状の相間バリヤである。 In the figure, 1 is a bottom plate, 2 is a frame, 3 is a three-phase device arranged in parallel on the bottom plate 1, and 4 is a cutoff part of the device 3, which is connected to an external terminal. 5
is an operating shaft for opening and closing the blocking portion 4, and 6 is a plate-shaped interphase barrier disposed between the devices 3.
そして、機器3間の相間絶縁は、気中のみでは
気中寸法が大きくなるため、相間バリヤ6を設置
し、気中寸法を小さくしている。 Since the phase-to-phase insulation between the devices 3 requires only air, the size in the air becomes large, so an inter-phase barrier 6 is installed to reduce the size in the air.
しかし、相間バリヤ6が汚損すると、部分放電
を起し、バリヤ6が炭化して貫通破壊に至り、地
絡故障として検出される前に相間短絡故障を発生
し、大事故に至る。
However, when the interphase barrier 6 becomes contaminated, partial discharge occurs, and the barrier 6 becomes carbonized, leading to through-breakage, and an interphase short circuit failure occurs before it is detected as a ground fault, resulting in a major accident.
この考案は、前記の点に留意してなされたもの
であり、並設された機器間に配設される相間絶縁
用の相間バリヤにおいて、2つの絶縁層の間に接
地層を介在した相間バリヤである。
This idea was made with the above points in mind, and is an interphase barrier for interphase insulation installed between devices installed in parallel, in which a ground layer is interposed between two insulating layers. It is.
したがつて、この考案によると、絶縁層が汚損
した場合、中間の接地層により地絡故障として検
出されるため、相間短絡故障への移行が防止さ
れ、大事故が発生しない。
Therefore, according to this invention, when the insulating layer is contaminated, it is detected as a ground fault by the intermediate ground layer, so transition to a phase-to-phase short circuit fault is prevented, and a major accident does not occur.
つぎにこの考案を、その実施例を示した第1図
ないし第3図とともに、詳細に説明する。
Next, this invention will be explained in detail with reference to FIGS. 1 to 3 showing examples thereof.
まず、1実施例を示した第1図において、7は
金属板からなる接地層、8は接地層7の両側の周
縁部に設けられたスペーサ、9はスペーサ8を介
して接地層7の両側に重合された絶縁板からなる
絶縁層、10は接地層7と絶縁層9との間に形成
された気中ギヤツプである。 First, in FIG. 1 showing one embodiment, 7 is a ground layer made of a metal plate, 8 is a spacer provided on the periphery on both sides of the ground layer 7, and 9 is provided on both sides of the ground layer 7 via the spacer 8. The insulating layer 10 is an air gap formed between the ground layer 7 and the insulating layer 9.
したがつて、いずれか一方の絶縁層9が汚損
し、部分放電によつて貫通破壊しても、接地層7
により地絡故障として検出され、相間短絡故障に
移行しない。 Therefore, even if one of the insulating layers 9 is contaminated and breaks through due to partial discharge, the ground layer 7
, it is detected as a ground fault and does not progress to a phase-to-phase short circuit fault.
また、両側の絶縁層9が同時に汚損しても、汚
損度合の差異や両側の絶縁層9の差異などによ
り、微視的に全く同一の炭化があり得ないため、
いずれか一方の汚損の激しい側の絶縁層9が他方
の絶縁層9より先に貫通して破壊する。したがつ
て、相間短絡故障に移行することがない。 Furthermore, even if the insulating layers 9 on both sides are contaminated at the same time, microscopically the same carbonization cannot occur due to the difference in the degree of contamination and the difference in the insulating layers 9 on both sides.
The insulating layer 9 on one of the more heavily contaminated sides penetrates and breaks down before the other insulating layer 9. Therefore, there is no possibility of transition to phase-to-phase short circuit failure.
つぎに、他の実施例を示した第2図は、接地層
7の両面に絶縁層9を一体にモールド成型したも
のである。 Next, FIG. 2 showing another embodiment is one in which an insulating layer 9 is integrally molded on both surfaces of a ground layer 7.
つぎに、さらに他の実施例を示した第3図は、
2枚の絶縁板からなる絶縁層9の片面にそれぞれ
蒸着により金属層11を形成し、絶縁層7の両面
にそれぞれ金属層11を接合して絶縁層9を重合
したものである。 Next, FIG. 3 showing still another embodiment,
A metal layer 11 is formed by vapor deposition on one side of an insulating layer 9 consisting of two insulating plates, and the metal layer 11 is bonded to both sides of the insulating layer 7, and the insulating layer 9 is polymerized.
そして、第2図および第3図の場合も、第1図
と同様の作用効果を有する。 The cases of FIGS. 2 and 3 also have the same effects as those of FIG. 1.
以上のように、この考案の相間バリヤによる
と、外側の絶縁層が汚損しても、中間の接地層に
より地絡故障として検出することができ、相間短
絡故障の発生を完全に防止することができる。
As described above, according to the interphase barrier of this invention, even if the outer insulating layer is contaminated, it can be detected as a ground fault by the intermediate ground layer, and the occurrence of interphase short circuit faults can be completely prevented. can.
第1図、第2図および第3図はそれぞれこの考
案の相間バリヤの実施例の断面図、第4図はこの
考案の適用される機器の切断正面図である。
7……接地層、9……絶縁層。
FIGS. 1, 2, and 3 are sectional views of an embodiment of the interphase barrier of this invention, and FIG. 4 is a cutaway front view of a device to which this invention is applied. 7...Grounding layer, 9...Insulating layer.
Claims (1)
間バリヤにおいて、2つの絶縁層の間に接地層を
介在した相間バリヤ。 An interphase barrier for interphase insulation installed between devices installed in parallel, with a ground layer interposed between two insulating layers.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP13895585U JPH0428164Y2 (en) | 1985-09-10 | 1985-09-10 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP13895585U JPH0428164Y2 (en) | 1985-09-10 | 1985-09-10 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS6248107U JPS6248107U (en) | 1987-03-25 |
JPH0428164Y2 true JPH0428164Y2 (en) | 1992-07-08 |
Family
ID=31044409
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP13895585U Expired JPH0428164Y2 (en) | 1985-09-10 | 1985-09-10 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH0428164Y2 (en) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2800441B2 (en) * | 1991-02-25 | 1998-09-21 | 日立電線株式会社 | Insulated case with grounding part between phases |
-
1985
- 1985-09-10 JP JP13895585U patent/JPH0428164Y2/ja not_active Expired
Also Published As
Publication number | Publication date |
---|---|
JPS6248107U (en) | 1987-03-25 |
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