JPH0428141B2 - - Google Patents
Info
- Publication number
- JPH0428141B2 JPH0428141B2 JP8260984A JP8260984A JPH0428141B2 JP H0428141 B2 JPH0428141 B2 JP H0428141B2 JP 8260984 A JP8260984 A JP 8260984A JP 8260984 A JP8260984 A JP 8260984A JP H0428141 B2 JPH0428141 B2 JP H0428141B2
- Authority
- JP
- Japan
- Prior art keywords
- pellets
- pellet
- sheet
- sorting
- bump
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000008188 pellet Substances 0.000 claims description 40
- 239000003989 dielectric material Substances 0.000 claims description 4
- 230000015572 biosynthetic process Effects 0.000 claims description 3
- 238000001179 sorption measurement Methods 0.000 claims description 2
- 239000000758 substrate Substances 0.000 description 10
- 239000011521 glass Substances 0.000 description 6
- 230000001681 protective effect Effects 0.000 description 5
- 238000000034 method Methods 0.000 description 4
- 238000007747 plating Methods 0.000 description 3
- 238000003780 insertion Methods 0.000 description 2
- 230000037431 insertion Effects 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 230000000007 visual effect Effects 0.000 description 2
- 229920001342 Bakelite® Polymers 0.000 description 1
- 229920001875 Ebonite Polymers 0.000 description 1
- RRHGJUQNOFWUDK-UHFFFAOYSA-N Isoprene Chemical compound CC(=C)C=C RRHGJUQNOFWUDK-UHFFFAOYSA-N 0.000 description 1
- 229910004298 SiO 2 Inorganic materials 0.000 description 1
- 239000004637 bakelite Substances 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 239000002985 plastic film Substances 0.000 description 1
- 229920006255 plastic film Polymers 0.000 description 1
- 238000012216 screening Methods 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 239000002699 waste material Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP8260984A JPS60225443A (ja) | 1984-04-23 | 1984-04-23 | ペレツトの良否選別方法 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP8260984A JPS60225443A (ja) | 1984-04-23 | 1984-04-23 | ペレツトの良否選別方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS60225443A JPS60225443A (ja) | 1985-11-09 |
JPH0428141B2 true JPH0428141B2 (enrdf_load_html_response) | 1992-05-13 |
Family
ID=13779214
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP8260984A Granted JPS60225443A (ja) | 1984-04-23 | 1984-04-23 | ペレツトの良否選別方法 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS60225443A (enrdf_load_html_response) |
-
1984
- 1984-04-23 JP JP8260984A patent/JPS60225443A/ja active Granted
Also Published As
Publication number | Publication date |
---|---|
JPS60225443A (ja) | 1985-11-09 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
TWI681498B (zh) | 用於晶粒接合應用的靜電載具 | |
KR100476591B1 (ko) | 웨이퍼 테이블과, 이를 이용한 웨이퍼 쏘잉/소자 접착장치와, 웨이퍼 쏘잉/소자 분류 장치 | |
JPH09283605A (ja) | 基板の吸着保持装置およびその製造方法 | |
JPS63256326A (ja) | 真空チヤツクおよびその製造方法 | |
US4247031A (en) | Method for cracking and separating pellets formed on a wafer | |
KR102804904B1 (ko) | 픽 앤 플레이스 기계 세정 시스템 및 방법 | |
JPH0428141B2 (enrdf_load_html_response) | ||
JPS61124139A (ja) | 電子素子の製造方法 | |
KR101762647B1 (ko) | 마이크로 솔더볼용 범핑툴 제조방법 | |
JPH03286549A (ja) | 板状体の保持装置 | |
JP2510024B2 (ja) | 半導体製造装置 | |
JPS59134849A (ja) | ダイシング方法および粘着シ−ト | |
JPH05243200A (ja) | ガラス基板洗浄方法 | |
TWI869824B (zh) | 晶圓的處理方法 | |
JPS621000B2 (enrdf_load_html_response) | ||
JPH04264751A (ja) | チップ保持治具 | |
DE102004021259B4 (de) | Verfahren zum Bearbeiten eines Halbleitersubstrats | |
JPS63208255A (ja) | 電子装置 | |
KR100384845B1 (ko) | 표면실장형 패키지의 리패어 방법 및 상기 방법에적용되는 딥핑장치 | |
KR100462558B1 (ko) | 인쇄회로기판 및 반도체 웨이퍼의 볼 그리드 어레이방법 | |
CN117878050A (zh) | 一种用于Taiko晶圆制程的静电吸盘和Taiko晶圆支撑环移除方法 | |
EP0412741A2 (en) | Conductive adhesive sheet used in semiconductor device manufacture | |
KR970009272B1 (ko) | 반도체의 다이본딩용 픽업툴 | |
KR200309113Y1 (ko) | 반도체 제조장비의 픽업툴 | |
JPH07106362A (ja) | 回路基板の製造方法 |