JPH04280506A - Manufacture of resin package piezoelectric component - Google Patents

Manufacture of resin package piezoelectric component

Info

Publication number
JPH04280506A
JPH04280506A JP4335391A JP4335391A JPH04280506A JP H04280506 A JPH04280506 A JP H04280506A JP 4335391 A JP4335391 A JP 4335391A JP 4335391 A JP4335391 A JP 4335391A JP H04280506 A JPH04280506 A JP H04280506A
Authority
JP
Japan
Prior art keywords
wax
resin
exterior resin
cavity
absorbed
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP4335391A
Other languages
Japanese (ja)
Inventor
Kazuyuki Noto
和幸 能登
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Murata Manufacturing Co Ltd
Original Assignee
Murata Manufacturing Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Murata Manufacturing Co Ltd filed Critical Murata Manufacturing Co Ltd
Priority to JP4335391A priority Critical patent/JPH04280506A/en
Publication of JPH04280506A publication Critical patent/JPH04280506A/en
Pending legal-status Critical Current

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  • Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)

Abstract

PURPOSE:To improve the non-defective rate by employing cavity forming members whose melting points differ from each other to form a cavity so as to prevent wax from remaining on a piezoelectric vibration element. CONSTITUTION:Piezoelectric vibration elements 12,14 to which two kinds of wax 22,24 are dripped are dipped in package resin 26 made of a thermosetting resin. Then the resin 26 is heated and a solvent included in the resin 26 is evaporated and air bubbles are caused in the resin 26. When the internal temperature of the resin 26 gradually increases and reaches a melting point TA of the wax 22, the wax 22 starts being absorbed by the resin 26. When the temperature further rises and reaches a melting pint TB of the wax 22, the wax 24 starts being absorbed by the resin 26. The cavity for a vibration electrode is formed to a part to which the wax 22, 24 are dripped by the absorption of the wax 22, 24 by the resin 26. Thus, the cavity is surely formed and the remaining of the wax to the vibration electrode is avoided, the non-defective rate is improved.

Description

【発明の詳細な説明】[Detailed description of the invention]

【0001】0001

【産業上の利用分野】この発明は樹脂外装圧電部品の製
造方法に関し、特にたとえば圧電振動素子の振動空間を
確保するために2以上の空洞を形成する、樹脂外装圧電
部品の製造方法に関する。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method of manufacturing a resin-clad piezoelectric component, and more particularly to a method of manufacturing a resin-clad piezoelectric component in which two or more cavities are formed to secure a vibration space for a piezoelectric vibrating element.

【0002】0002

【従来の技術】図3には従来のこの種の圧電部品の一例
としての複合トラップが示される。この複合トラップ1
においては、圧電振動素子2に端子3の一方端が、圧電
振動素子4に端子5の一方端がそれぞれ接続され、端子
3および5はその他方端で半田6によって接続される。 そして、圧電振動素子2および4の振動部分に空洞形成
材としてのワックス7が点滴された後、圧電振動素子2
および4が外装樹脂8で覆われ、さらに外装樹脂8が加
熱硬化される。ワックス7は外装樹脂8の加熱硬化時に
、外装樹脂7内の溶剤が揮発することによって発生する
気泡内に吸収され、これによって、圧電振動素子2およ
び4の振動部分に空洞が形成される。
2. Description of the Related Art FIG. 3 shows a composite trap as an example of a conventional piezoelectric component of this type. This composite trap 1
, one end of a terminal 3 is connected to the piezoelectric vibrating element 2, one end of a terminal 5 is connected to the piezoelectric vibrating element 4, and the terminals 3 and 5 are connected with solder 6 at the other end. Then, wax 7 as a cavity forming material is dripped onto the vibrating parts of the piezoelectric vibrating elements 2 and 4, and then the piezoelectric vibrating elements 2
and 4 are covered with an exterior resin 8, and the exterior resin 8 is further heated and hardened. The wax 7 is absorbed into bubbles generated when the solvent in the exterior resin 7 evaporates when the exterior resin 8 is heated and hardened, thereby forming cavities in the vibrating portions of the piezoelectric vibrating elements 2 and 4.

【0003】0003

【発明が解決しようとする課題】しかし、外装樹脂8内
の気泡の量は加熱時間にほぼ比例して増加するのに対し
てワックス7は融点に達すると急速に溶融するため、ワ
ックス7が十分に外装樹脂8内に吸収されず、振動電極
上に残留してしまう場合がある。このことは、ワックス
7の量に対して外装樹脂8の量が少ない2つの圧電振動
素子2および4に挟まれた部分において顕著である。
[Problems to be Solved by the Invention] However, the amount of air bubbles in the exterior resin 8 increases almost in proportion to the heating time, whereas the wax 7 melts rapidly once it reaches its melting point, so it is difficult to maintain a sufficient amount of the wax 7. In some cases, it is not absorbed into the exterior resin 8 and remains on the vibrating electrode. This is remarkable in the portion sandwiched between the two piezoelectric vibrating elements 2 and 4, where the amount of exterior resin 8 is smaller than the amount of wax 7.

【0004】この問題を解決する方法として、使用する
ワックスを融点の低いものとして加熱時間を十分にとる
方法や、より高い温度で加熱して単位時間当たりの気泡
発生量を多くする方法が考えられる。しかし、前者の方
法では、低い温度でワックスが溶融するので、気泡に入
り込めないワックスが外装樹脂と混合して振動電極部分
に付着してしまう。また、後者の方法では、発生する気
泡の量はワックスの量に対して十分ではあるが、あまり
高温になると圧電振動素子に特性劣化を来すという問題
がある。
Possible ways to solve this problem include using a wax with a low melting point and allowing sufficient heating time, or heating at a higher temperature to increase the amount of bubbles generated per unit time. . However, in the former method, since the wax melts at a low temperature, the wax that cannot enter the bubbles mixes with the exterior resin and adheres to the vibrating electrode portion. Further, in the latter method, although the amount of bubbles generated is sufficient for the amount of wax, there is a problem that if the temperature is too high, the characteristics of the piezoelectric vibrating element will deteriorate.

【0005】それゆえに、この発明の主たる目的は、圧
電振動素子の劣化がなくしかも空洞形成材が残留しない
、樹脂外装圧電部品の製造方法を提供することである。
[0005] Therefore, the main object of the present invention is to provide a method of manufacturing a resin-clad piezoelectric component in which the piezoelectric vibrating element is not deteriorated and the cavity forming material is not left behind.

【0006】[0006]

【課題を解決するための手段】この発明は、少なくとも
1つの圧電素子を有し、圧電素子を覆う外装樹脂内に圧
電素子に関連して2以上の独立した空洞を形成する樹脂
外装圧電部品の製造方法において、空洞を形成するため
に互いに異なる融点を有する空洞形成材を用いるように
したことを特徴とする、樹脂外装圧電部品の製造方法で
ある。
[Means for Solving the Problems] The present invention provides a resin-clad piezoelectric component having at least one piezoelectric element and forming two or more independent cavities in relation to the piezoelectric element in the exterior resin covering the piezoelectric element. A method of manufacturing a resin-clad piezoelectric component is characterized in that cavity forming materials having different melting points are used to form a cavity.

【0007】[0007]

【作用】外装樹脂は約150℃で硬化するが、外装樹脂
を硬化させるために加熱を開始すると、外装樹脂内に徐
々に気泡が発生し、一方の空洞形成材が相対的に低い温
度で溶融し始める。したがって一方の空洞形成材がまず
外装樹脂内の気泡に吸収される。その後時間の経過とと
もに、外装樹脂内の気泡が増え、一方の空洞形成材はそ
れに吸収されるとともに周辺の樹脂内にも拡散していく
。そして、さらに時間が経つと他方の空洞形成材も溶融
し、したがってこれも順次気泡の中に吸収されていく。 このときには高温(≦150℃)であるので形成される
気泡も多くなっているので他方の空洞形成材も完全に吸
収される。このようにして、融点の異なる空洞形成材を
用いることによって外装樹脂への吸収に時間差が生じ、
それによってそれぞれの空洞形成材が外装樹脂の硬化が
完了する頃にはともに完全に吸収される。
[Effect] The exterior resin hardens at approximately 150°C, but when heating is started to harden the exterior resin, bubbles are gradually generated within the exterior resin, and one of the cavity forming materials melts at a relatively low temperature. Begin to. Therefore, one of the cavity forming materials is first absorbed into the air bubbles within the exterior resin. Thereafter, as time passes, the number of air bubbles in the exterior resin increases, and one of the cavity-forming materials is absorbed by the air bubbles and diffuses into the surrounding resin as well. Then, as time passes, the other cavity-forming material also melts, and is therefore also absorbed into the bubbles one after another. At this time, since the temperature is high (≦150° C.), more air bubbles are formed, and the other cavity forming material is also completely absorbed. In this way, by using cavity forming materials with different melting points, there is a time difference in absorption into the exterior resin,
As a result, each cavity forming material is completely absorbed by the time the exterior resin is completely cured.

【0008】[0008]

【発明の効果】この発明によれば、空洞形成材が完全に
外装樹脂内に吸収されるので、ワックスが圧電振動素子
上に残留せず、良品率を高くすることができる。しかも
、特に高温にする必要もないので、圧電振動素子の特性
劣化などの問題も生じない。この発明の上述の目的,そ
の他の目的,特徴および利点は、図面を参照して行う以
下の実施例の詳細な説明から一層明らかとなろう。
According to the present invention, since the cavity forming material is completely absorbed into the exterior resin, wax does not remain on the piezoelectric vibrating element, and the yield rate can be increased. Furthermore, since there is no need to raise the temperature to a particularly high temperature, problems such as deterioration of the characteristics of the piezoelectric vibrating element do not occur. The above objects, other objects, features and advantages of the present invention will become more apparent from the following detailed description of embodiments with reference to the drawings.

【0009】[0009]

【実施例】図1に示す複合トラップ10は、たとえばセ
ラミックからなる圧電基板の両主面上に振動電極(図示
せず)が形成された2つの圧電振動素子12および14
を含む。圧電振動素子12には端子16が、圧電振動素
子14には端子18がそれぞれ接続される。そして、圧
電振動素子10を側面から見て端子16および端子18
がV字状になった状態でそれぞれの端子の圧電振動素子
に接続されていない側を半田20によって接続する。
[Embodiment] The composite trap 10 shown in FIG. 1 includes two piezoelectric vibrating elements 12 and 14 in which vibrating electrodes (not shown) are formed on both principal surfaces of a piezoelectric substrate made of, for example, ceramic.
including. A terminal 16 is connected to the piezoelectric vibrating element 12, and a terminal 18 is connected to the piezoelectric vibrating element 14, respectively. When the piezoelectric vibrating element 10 is viewed from the side, the terminals 16 and 18 are
The sides of each terminal not connected to the piezoelectric vibrating element are connected with solder 20 in a V-shaped state.

【0010】このように形成された圧電振動素子12お
よび14の振動電極部分にワックスが点滴される。圧電
振動素子12の振動電極部分にはワックス22が、圧電
振動素子14の振動電極部分にはワックス24がそれぞ
れ点滴される。ワックス22および24の融点は後述の
外装樹脂26の加熱温度より適度に低く、また、ワック
ス22および24の融点はそれぞれ異なるものである。 ここでは、ワックス22の融点をTA とし、ワックス
24の融点をTB とする。それぞれの融点はどちらが
低いものであってもよいが、この実施例ではワックス2
2の融点TA の方がワックス24の融点TB よりも
低いものとする。
Wax is dripped onto the vibrating electrode portions of the piezoelectric vibrating elements 12 and 14 thus formed. Wax 22 is dripped onto the vibrating electrode portion of the piezoelectric vibrating element 12, and wax 24 is dripped onto the vibrating electrode portion of the piezoelectric vibrating element 14, respectively. The melting points of waxes 22 and 24 are moderately lower than the heating temperature of exterior resin 26, which will be described later, and the melting points of waxes 22 and 24 are different from each other. Here, the melting point of the wax 22 is TA, and the melting point of the wax 24 is TB. The melting point of each wax may be lower than the other, but in this example, wax 2
The melting point TA of wax 24 is lower than the melting point TB of wax 24.

【0011】このように、2種類のワックス22および
24が点滴された圧電振動素子12および14をたとえ
ばエポキシ樹脂などの熱硬化性樹脂からなる外装樹脂2
6でディップする。そして、外装樹脂26が加熱され約
150℃で硬化される。外装樹脂26の加熱によって外
装樹脂26内に含まれる溶剤が揮発して外装樹脂26内
に気泡が生じる。外装樹脂26の内部の温度も徐々に増
加し、ワックス22の融点TA となったところでワッ
クス22が外装樹脂26に吸収されはじめる。そして、
さらに外装樹脂26内の温度が上昇しワックス24の融
点TB となったところでワックス24が外装樹脂26
に吸収されはじめる。このワックス22および24の外
装樹脂26への吸収によって、ワックス22および24
が点滴された部分に振動電極のための空洞が形成される
In this way, the piezoelectric vibrating elements 12 and 14 on which the two types of waxes 22 and 24 have been dripped are coated with an exterior resin 2 made of a thermosetting resin such as an epoxy resin.
Dip at 6. Then, the exterior resin 26 is heated and hardened at about 150°C. By heating the exterior resin 26, the solvent contained in the exterior resin 26 evaporates and bubbles are generated within the exterior resin 26. The temperature inside the exterior resin 26 also gradually increases, and when the melting point TA of the wax 22 is reached, the wax 22 begins to be absorbed into the exterior resin 26. and,
When the temperature inside the exterior resin 26 further increases and reaches the melting point TB of the wax 24, the wax 24 melts into the exterior resin 26.
begins to be absorbed. By absorbing the waxes 22 and 24 into the exterior resin 26, the waxes 22 and 24
A cavity for the vibrating electrode is formed in the area where the liquid is injected.

【0012】すなわち、外装樹脂26を硬化するために
加熱を開始すると、外装樹脂26内に徐々に気泡が発生
し、一方のワックス22が相対的に低い温度TA で溶
融し始める。したがって一方のワックス22がまず外装
樹脂26内の気泡に吸収される。その後時間の経過とと
もに、外装樹脂26内の気泡が増え、ワックス22はそ
れに吸収されるとともに周辺の樹脂内にも拡散していく
。 そして、さらに時間が経つと外装樹脂26内も高温(≦
150℃)になり、他方のワックス24も溶融し、した
がってこれも順次気泡の中に吸収されていく。このとき
には高温であるので形成される気泡も多くなっているの
でワックス24も完全に吸収される。このようにして、
融点の異なるワックス22および24を用いることによ
って外装樹脂26への吸収に時間差が生じ、それによっ
てそれぞれのワックス22および24が外装樹脂26の
硬化が完了する頃にはともに完全に外装樹脂26内に吸
収される。
That is, when heating is started to harden the exterior resin 26, bubbles are gradually generated within the exterior resin 26, and one wax 22 begins to melt at a relatively low temperature TA. Therefore, one wax 22 is first absorbed into the air bubbles within the exterior resin 26. Thereafter, as time passes, the number of bubbles in the exterior resin 26 increases, and the wax 22 is absorbed by the bubbles and diffuses into the surrounding resin. Then, as time passes, the temperature inside the exterior resin 26 also becomes high (≦
150° C.), the other wax 24 also melts, and is therefore also sequentially absorbed into the bubbles. At this time, since the temperature is high, more air bubbles are formed, and the wax 24 is also completely absorbed. In this way,
By using waxes 22 and 24 with different melting points, there is a time difference in absorption into the exterior resin 26, so that each wax 22 and 24 is completely absorbed into the exterior resin 26 by the time the exterior resin 26 is completely cured. Absorbed.

【0013】このように、ワックス22および24を2
段階に分けて外装樹脂26に吸収させるので、外装樹脂
26内の気泡の発生量と各ワックス22および24の外
装樹脂26への吸収量とがうまく適合し、各ワックス2
2および24の外装樹脂26への吸収がスムーズにかつ
完全に行われる。これによって、空洞が確実に形成され
、振動電極部分へのワックスの残留がなくなるので、良
品率が高くなる。
In this way, the waxes 22 and 24 are
Since it is absorbed into the exterior resin 26 in stages, the amount of air bubbles generated in the exterior resin 26 and the amount of each wax 22 and 24 absorbed into the exterior resin 26 match well, and each wax 2
2 and 24 are smoothly and completely absorbed into the exterior resin 26. As a result, a cavity is reliably formed and no wax remains on the vibrating electrode portion, resulting in a high yield rate.

【0014】なお、ワックス24の融点TB をワック
ス22が十分に吸収されるであろう温度に設定すると、
各ワックスの吸収が一層良好に行われる。ただし、これ
は条件ではなく、TA <TB またはTA >TB 
であればよい。この方法は、図2に示す単一トラップ3
0の製造においても利用することができる。図2に示す
単一トラップ30は1つの圧電振動素子32を含み、そ
の圧電振動素子32には端子34が接続される。そして
、圧電振動素子32の一方主面上の振動電極部分にワッ
クス22が、他方主面上の振動電極部分にワックス24
が点滴される。このように、ワックス22および24が
点滴された圧電振動素子32を前述の外装樹脂26と同
様の熱硬化性樹脂からなる外装樹脂36で覆い、外装樹
脂36が硬化される。このときにも前述と同様の2段階
のワックス22および24の吸収が行われ、すべてのワ
ックスが完全に外装樹脂36内に吸収される。
Note that if the melting point TB of the wax 24 is set at a temperature at which the wax 22 will be sufficiently absorbed,
The absorption of each wax takes place better. However, this is not a condition; TA < TB or TA > TB
That's fine. This method uses a single trap 3 as shown in Figure 2.
It can also be used in the production of 0. The single trap 30 shown in FIG. 2 includes one piezoelectric vibrating element 32 to which a terminal 34 is connected. Wax 22 is applied to the vibrating electrode portion on one main surface of the piezoelectric vibrating element 32, and wax 24 is applied to the vibrating electrode portion on the other main surface.
is instilled. In this way, the piezoelectric vibrating element 32 dripped with the waxes 22 and 24 is covered with the exterior resin 36 made of a thermosetting resin similar to the aforementioned exterior resin 26, and the exterior resin 36 is cured. At this time, the same two-stage absorption of the waxes 22 and 24 as described above is performed, and all the waxes are completely absorbed into the exterior resin 36.

【0015】なお、上述の実施例ではいずれもエネルギ
閉じ込め形圧電振動素子を用いたトラップについて説明
したが、この発明は、同様のエネルギ閉じ込め形圧電振
動素子(または共振素子)を用いる任意の圧電部品たと
えば圧電フィルタなどにも利用できることはもちろんで
ある。さらに、空洞形成材としてワックスを用いたが、
この発明では、ワックスの他に、パラフィンなど公知の
空洞形成材が用いられ得る。ただし、パラフィンは固体
から気体に液相を経ないで変相するので、「融点」の語
は固体から液体になる温度の他、固体から直接気体にな
る温度も含むものとして理解されたい。
[0015] In each of the above embodiments, a trap using an energy trapping type piezoelectric vibrating element has been described, but the present invention is applicable to any piezoelectric component using a similar energy trapping type piezoelectric vibrating element (or resonant element). Of course, it can also be used for piezoelectric filters, for example. Furthermore, although wax was used as a cavity forming material,
In this invention, other than wax, known cavity forming materials such as paraffin may be used. However, since paraffin undergoes a phase change from a solid to a gas without passing through a liquid phase, the term "melting point" should be understood to include not only the temperature at which it changes from a solid to a liquid, but also the temperature at which it directly changes from a solid to a gas.

【図面の簡単な説明】[Brief explanation of the drawing]

【図1】この発明の一実施例を示す側面断面図解図であ
る。
FIG. 1 is an illustrative side cross-sectional view showing one embodiment of the present invention.

【図2】この発明の他の実施例を示す側面断面図解図で
ある。
FIG. 2 is an illustrative side cross-sectional view showing another embodiment of the invention.

【図3】従来の技術を示す側面断面図解図である。FIG. 3 is an illustrative side cross-sectional view showing a conventional technique.

【符号の説明】[Explanation of symbols]

10            …複合トラップ12,1
4,32…圧電振動素子 16,18,34…端子 22,24      …ワックス 26,36      …外装樹脂
10...Composite trap 12,1
4, 32...Piezoelectric vibration element 16, 18, 34...Terminal 22, 24...Wax 26, 36...Exterior resin

Claims (1)

【特許請求の範囲】[Claims] 【請求項1】少なくとも1つの圧電素子を有し、前記圧
電素子を覆う外装樹脂内に前記圧電素子に関連して2以
上の独立した空洞を形成する樹脂外装圧電部品の製造方
法において、前記空洞を形成するために互いに異なる融
点を有する空洞形成材を用いるようにしたことを特徴と
する、樹脂外装圧電部品の製造方法。
1. A method of manufacturing a resin-clad piezoelectric component having at least one piezoelectric element and forming two or more independent cavities in association with the piezoelectric element in an exterior resin covering the piezoelectric element, wherein the cavity 1. A method for manufacturing a resin-clad piezoelectric component, characterized in that cavity forming materials having different melting points are used to form the piezoelectric component.
JP4335391A 1991-03-08 1991-03-08 Manufacture of resin package piezoelectric component Pending JPH04280506A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP4335391A JPH04280506A (en) 1991-03-08 1991-03-08 Manufacture of resin package piezoelectric component

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP4335391A JPH04280506A (en) 1991-03-08 1991-03-08 Manufacture of resin package piezoelectric component

Publications (1)

Publication Number Publication Date
JPH04280506A true JPH04280506A (en) 1992-10-06

Family

ID=12661492

Family Applications (1)

Application Number Title Priority Date Filing Date
JP4335391A Pending JPH04280506A (en) 1991-03-08 1991-03-08 Manufacture of resin package piezoelectric component

Country Status (1)

Country Link
JP (1) JPH04280506A (en)

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62142408A (en) * 1985-12-17 1987-06-25 Murata Mfg Co Ltd Piezo-electric vibration parts
JPH036910A (en) * 1989-06-02 1991-01-14 Murata Mfg Co Ltd Cavity forming method for resin dip

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62142408A (en) * 1985-12-17 1987-06-25 Murata Mfg Co Ltd Piezo-electric vibration parts
JPH036910A (en) * 1989-06-02 1991-01-14 Murata Mfg Co Ltd Cavity forming method for resin dip

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