JPH04279206A - Method for grinding small diameter roll for rolling mill - Google Patents

Method for grinding small diameter roll for rolling mill

Info

Publication number
JPH04279206A
JPH04279206A JP4336991A JP4336991A JPH04279206A JP H04279206 A JPH04279206 A JP H04279206A JP 4336991 A JP4336991 A JP 4336991A JP 4336991 A JP4336991 A JP 4336991A JP H04279206 A JPH04279206 A JP H04279206A
Authority
JP
Japan
Prior art keywords
polishing
roll
small diameter
film
grinding
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP4336991A
Other languages
Japanese (ja)
Inventor
Satoshi Tsuzuki
聡 都築
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
JFE Steel Corp
Original Assignee
Kawasaki Steel Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kawasaki Steel Corp filed Critical Kawasaki Steel Corp
Priority to JP4336991A priority Critical patent/JPH04279206A/en
Publication of JPH04279206A publication Critical patent/JPH04279206A/en
Pending legal-status Critical Current

Links

Abstract

PURPOSE:To improve the surface roughness of roll and to raise the efficiency of finish grinding by using a grinding wheel for rough grinding a small diameter roll and, using a abrasive film layer formed by spraying abrasive grains on the surface for finish grinding, grinding without changing contact pressure with the small diameter roll. CONSTITUTION:The grinding wheel 1 is used for rough grinding that is executed for removing flaws and sizing the small diameter roll 4 and, for finish grinding that is done for adjusting the roughness of roll 4 surface, a lapping film 14 which the layer of abrasive grains is formed on the film is formed into endless- shape and constantly fed with a roller 9 for revolving. And contact pressure of a contact roller 10 which is brought into contact with the small diameter roll 4 through the film can be kept constant by controlling a hydraulic cylinder. Thus, it is easy to grind the roll by accurately controlling the constant feeding without changing contact pressure and great care.

Description

【発明の詳細な説明】[Detailed description of the invention]

【0001】0001

【産業上の利用分野】この発明は、仕上研磨に研磨フィ
ルムを一定接触圧で使用する圧延機用小径ロールの研磨
方法に関する。
BACKGROUND OF THE INVENTION 1. Field of the Invention This invention relates to a method for polishing small diameter rolls for rolling mills, which uses a polishing film at a constant contact pressure for final polishing.

【0002】0002

【従来の技術】圧延機用小径ロールは、一般に直径20
0mm以下のものであって、その材質としてはダイス鋼
、セミハイス鋼、ハイス鋼等が用いられる。また、これ
らのロールの硬さはショア硬度でダイス鋼はHs75〜
85、セミハイス鋼Hs80〜90、ハイス鋼では  
Hs85〜95といったように非常に硬いものであり、
またロール表面粗度も中心線平均粗さRa0.03〜0
.2μm程度のかなり微細な仕上状態を必要とする。
[Prior Art] Small diameter rolls for rolling mills generally have a diameter of 20 mm.
The diameter is 0 mm or less, and the material used is die steel, semi-high speed steel, high speed steel, etc. In addition, the hardness of these rolls is Shore hardness, and the die steel is Hs75~
85, semi-high speed steel Hs80-90, high speed steel
It is very hard, such as Hs85-95,
In addition, the roll surface roughness is center line average roughness Ra0.03~0
.. A fairly fine finish of about 2 μm is required.

【0003】一般に、圧延機用小径ロールの研磨方法は
、図5に示すような外形が400〜800mm、幅40
〜80mm、材質はAl2 O3 、SiCである回転
砥石1を用い、図6に示すような構成とした装置で研磨
を行っていた。すなわち、この装置による方法では、砥
石1をモータ3でVベルト2を介し500〜1000γ
pmの高速で回転させ、10〜100γpmの低速で回
転する圧延機用小径ロール4(以下、単にロールという
)に接触させてロール表面を研磨するもので、砥石1を
ロール押え5で軸心を支持されたロール4の軸方向に移
動させてロール4全面を研磨するようになっている。こ
こで、砥石1の上記移動は3〜5回程度で、前段の移動
は疵取り、寸法出し(ロール径出し)を目的とし、後段
の移動は表面粗度調整を目的とする。
[0003] In general, a method for polishing small diameter rolls for rolling mills is as shown in FIG.
Polishing was carried out using a rotating grindstone 1 having a diameter of 80 mm and made of Al2O3 and SiC, and an apparatus configured as shown in FIG. That is, in the method using this device, the grinding wheel 1 is moved by the motor 3 through the V-belt 2 to a 500 to 1000 γ
The grinding wheel 1 is rotated at a high speed of 100 μm and brought into contact with a small-diameter roll 4 for a rolling mill (hereinafter simply referred to as a roll) that rotates at a low speed of 10 to 100 γpm to polish the surface of the roll. The entire surface of the roll 4 is polished by moving it in the axial direction of the supported roll 4. Here, the above-mentioned movement of the grinding wheel 1 is carried out about 3 to 5 times, and the movement in the former stage is for the purpose of removing defects and determining dimensions (diameter adjustment of the roll), and the movement in the latter stage is for the purpose of adjusting the surface roughness.

【0004】また、小径ロールを研磨する場合、ロール
の撓みが問題となるため、ロール撓み調整装置8を2〜
3個、砥石1とは反対側に設置し、研磨や常時この調整
を行う。これは図7に示すように、上記調整装置8を横
方向に移動し、砥石径の減少に伴うロール4との接触圧
の減少を補償するように調整するものである。
In addition, when polishing small diameter rolls, roll deflection becomes a problem, so the roll deflection adjusting device 8 is
Three of them are installed on the opposite side of the grindstone 1 for polishing and constant adjustment. As shown in FIG. 7, this adjustment is performed by moving the adjustment device 8 laterally to compensate for the decrease in the contact pressure with the roll 4 due to the decrease in the diameter of the grindstone.

【0005】[0005]

【発明が解決しようとする課題】しかしながら、上記の
ような従来の方法では以下のような問題があった。研磨
中にロールは研削され、砥石は砥粒が脱落してそれぞれ
径が小さくなるため、絶えずロールと砥石の接触状況が
変化する。そこで変化する接触状況を調整するために、
ロール撓み調整装置や砥石回転状態(回転速度─モータ
負荷電流、砥石移動速度)を人手によって調整していた
。その結果、作業時間やロールの仕上り表面粗度に個人
差が発生した。特に小径ロールの仕上研磨ではロールの
撓みも生じ、また表面粗度が小さいため、相対的に個人
差が大きく表れることになる。
[Problems to be Solved by the Invention] However, the above conventional methods have the following problems. During polishing, the roll is ground, and the abrasive grains of the whetstone fall off and the diameter of the whetstone becomes smaller, so the contact situation between the roll and the whetstone changes constantly. In order to adjust the changing contact situation,
The roll deflection adjustment device and grinding wheel rotation status (rotation speed - motor load current, grinding wheel movement speed) were manually adjusted. As a result, there were individual differences in work time and finished surface roughness of the rolls. Particularly in the final polishing of small-diameter rolls, the rolls are deflected, and the surface roughness is small, resulting in relatively large individual differences.

【0006】また、回転砥石は、表面が磨耗した砥粒が
脱落し、新砥粒面が表面にで出て始めて研磨が可能とな
るので、新砥粒面の露出量によって研磨仕上げ状況がか
わってくる。すなわち、新砥粒面が多ければロール表面
粗度は大きくなり、少なければ粗度は小さくなる。回転
砥石はこの調整が人手に任されるため個人差が大きくな
る。特に粗度の小さい仕上研磨では個人差が大きく表れ
るため、新しい研磨方法を開発する必要があった。
[0006] Also, with a rotary whetstone, polishing is possible only when the abrasive grains whose surfaces have been worn fall off and new abrasive grain surfaces appear on the surface, so the polishing finish changes depending on the amount of exposed new abrasive grain surfaces. It's coming. That is, if there are many new abrasive grain surfaces, the roll surface roughness will increase, and if there are few, the roughness will decrease. With rotary whetstones, this adjustment is left to humans, so there are large individual differences. Particularly in final polishing with small roughness, there are large individual differences, so it was necessary to develop a new polishing method.

【0007】本発明は、このような従来の問題点にかん
がみてなされたものであって、仕上研磨において研磨フ
ィルムをロールとの接触圧を変えることなく一定先送り
で研磨する方法とすることにより、上記課題を解決する
ことを目的としている。
The present invention has been made in view of these conventional problems, and includes a method in which the polishing film is polished at a constant advance without changing the contact pressure with the roll during final polishing. The purpose is to solve the above issues.

【0008】[0008]

【課題を解決するための手段】この発明は、上記目的を
達成するため、圧延機用小径ロールの研磨に際し、疵取
り、寸法出しを行なう粗研磨は回転砥石を使用し、表面
の粗度調整を行なう仕上げ研磨は、表面に砥粒を吹付け
て薄く層成した研磨フィルムを、前記小径ロールとの接
触圧力を変えずに一定送りで研磨する圧延機用小径ロー
ルの研磨方法としたものである。
[Means for Solving the Problems] In order to achieve the above object, the present invention uses a rotary grindstone for rough polishing to remove defects and measure dimensions when polishing small diameter rolls for rolling mills, and adjusts the surface roughness. The final polishing is a polishing method for small-diameter rolls for rolling mills in which a thin layer of abrasive film is sprayed onto the surface and polished at a constant feed without changing the contact pressure with the small-diameter roll. be.

【0009】[0009]

【作用】本発明は、小径ロールの疵取り、寸法出しを行
う粗研磨工程では従来においても不具合を生じなかった
回転砥石を用いて従来方法により粗研磨を行ない、ロー
ル表面の粗度調整を行う仕上研磨では、フィルム上に薄
く吹付けて砥粒層を形成した研磨フィルム(ラッピング
フィルム)を、例えばエンドレス状に形成し、これを図
2に示すように回転用ローラとコンタクトローラ間に張
架し、回転用ローラをモータで定速回転させてラッピン
ングフィルムを一定送りする。また小径ロールとフィル
ムを介して接触するコンタクトローラの接触圧は、コン
タクトローラを接触方向へ押圧する流体圧シリンダを制
御して一定に保つことができる。従って、この接触圧を
変えずに一定送りを行うことを人手に依らずに正確に制
御して研磨することは容易である。以上により、仕上面
粗度の拡大された個人差やロールの撓みによる影響を解
消でき、品質、能率とも優れた研磨が可能となる。
[Operation] The present invention adjusts the roughness of the roll surface by performing rough polishing using a conventional method using a rotary grindstone, which has not caused problems in the rough polishing process for removing defects and determining dimensions of small diameter rolls. In final polishing, a polishing film (lapping film) with an abrasive layer formed by spraying a thin layer onto the film is formed into, for example, an endless shape, and this is stretched between a rotating roller and a contact roller as shown in Figure 2. Then, the rotating roller is rotated at a constant speed by a motor to feed the wrapping film at a constant rate. Further, the contact pressure of the contact roller that contacts the small diameter roll via the film can be kept constant by controlling a fluid pressure cylinder that presses the contact roller in the contact direction. Therefore, it is easy to accurately control and polish by performing constant feeding without changing the contact pressure without relying on human hands. As described above, it is possible to eliminate the influence of increased individual differences in finished surface roughness and roll deflection, and it is possible to perform polishing with excellent quality and efficiency.

【0010】0010

【実施例】以下、本発明を図面を参照して説明する。図
1は本発明の研磨方法に使用する研磨装置の実施例概要
図である。なお、従来例と同一の部分については同一符
号を付し、重複する説明を省く。
DESCRIPTION OF THE PREFERRED EMBODIMENTS The present invention will be explained below with reference to the drawings. FIG. 1 is a schematic diagram of an embodiment of a polishing apparatus used in the polishing method of the present invention. Note that the same parts as in the conventional example are given the same reference numerals, and redundant explanation will be omitted.

【0011】図において、フレームAは従来例と同様に
回転砥石1を具えた粗研磨部、フレームBは本発明に係
るラッピングフィルム14を具えた仕上げ研磨部で、こ
の両フレームは被研磨物である小径ロール4の軸に対し
て直角方向に移動可能にフレームCに配設され、フレー
ムCはロール軸に平行に往復可能に設けられている。
In the figure, frame A is a rough polishing section equipped with a rotary grindstone 1 as in the conventional example, and frame B is a finish polishing section equipped with a lapping film 14 according to the present invention. It is disposed on a frame C so as to be movable in a direction perpendicular to the axis of a certain small diameter roll 4, and the frame C is disposed so as to be reciprocatable in parallel to the roll axis.

【0012】フレームBに具えられた仕上げ研磨部には
、図2に示すようにラッピングフィルム14がフィルム
回転用ローラ9とコンタクトローラ10間に張架され、
回転用ローラ9をモータ3で回転させてフィルム14を
一定送り(本実施例では5〜100mm/分)するよう
になっている。また、コンタクトローラ部分は、図3に
示すように流体圧シリンダ11でラッピングフィルム1
4を一定圧力(1〜50kg/cm)で小径ロール4へ
押し付けることができる。ラッピングフィルム14は、
図4に示すように厚さ数10〜数100μmのフィルム
13(材質はポリエステルなど)に砥粒12(SiO2
 、SiC)を数10〜数100μmの薄さに吹き付け
て層成し、エンドレステープ状に形成したものである。 砥粒の大きさとしては例えば220番〜1000番が好
適である。
In the final polishing section provided in the frame B, a wrapping film 14 is stretched between the film rotating roller 9 and the contact roller 10, as shown in FIG.
The rotating roller 9 is rotated by the motor 3 to feed the film 14 at a constant rate (5 to 100 mm/min in this embodiment). In addition, the contact roller portion is connected to the wrapping film 1 by a fluid pressure cylinder 11 as shown in FIG.
4 can be pressed against the small diameter roll 4 with a constant pressure (1 to 50 kg/cm). The wrapping film 14 is
As shown in FIG. 4, abrasive grains 12 (SiO2
, SiC) is sprayed to a thickness of several 10 to several 100 μm to form an endless tape. The preferred size of the abrasive grains is, for example, No. 220 to No. 1000.

【0013】上記構成の研磨装置により、小径ロール4
の研磨を行うには、先ず仕上げ研磨部であるフレームB
をロール4から後退させ、粗研磨部であるフレームAの
みをロール4に近接させ、回転砥石1をロール4に転接
させるとともにフレームCを左右に往復運動させて、従
来例と同様に疵取り、寸法出し研磨を行う。次に粗研磨
が完了したらフレームAをロール4から後退させ、フレ
ームBを移動させてラッピングフィルム14が小径ロー
ル4に転接する状態とする。このときのラッピングフィ
ルム14のロール4に対する接触圧は、流体圧シリンダ
11を公知の適宜手段により制御して研磨中、変化しな
いように維持することによって、従来のように人手によ
る個人差が生ずることなく、ロール4の表面粗度を均一
に仕上げることができる。また、ラッピングフィルム1
4はゴム等の弾性体でライニングしたコンタクトローラ
10でロール4に押付けられるので、ロールの撓みによ
る影響を解消できる。
With the polishing apparatus having the above configuration, the small diameter roll 4
To perform polishing, first frame B, which is the final polishing part,
is moved back from the roll 4, only the frame A, which is the rough polishing part, is brought close to the roll 4, and the rotary grindstone 1 is brought into rolling contact with the roll 4, and the frame C is reciprocated from side to side to remove defects as in the conventional example. , and perform dimension polishing. Next, when the rough polishing is completed, the frame A is moved back from the roll 4, and the frame B is moved so that the wrapping film 14 is in rolling contact with the small diameter roll 4. At this time, the contact pressure of the wrapping film 14 against the roll 4 is maintained so as not to change during polishing by controlling the fluid pressure cylinder 11 by appropriate known means, thereby eliminating the possibility of individual differences caused by manual labor as in the past. Therefore, the surface roughness of the roll 4 can be finished uniformly. In addition, wrapping film 1
4 is pressed against the roll 4 by a contact roller 10 lined with an elastic material such as rubber, so that the influence of deflection of the roll can be eliminated.

【0014】次に、圧延機用小径ロールとして、直径1
20mm、バレル長さ1700mm、材質セミハイス鋼
(硬度Hs89)のものに研磨を行った例を示す。回転
砥石は粗さ220番、幅80mm、外径810mmのも
のを使用し、ラッピングフィルムは粗さ1000番、幅
80mmのものを使用した。
Next, as a small diameter roll for a rolling mill, a diameter of 1
An example in which polishing was performed on a material with a diameter of 20 mm, a barrel length of 1700 mm, and a material made of semi-high-speed steel (hardness Hs 89) is shown. The rotating grindstone used had a roughness of No. 220, a width of 80 mm, and an outer diameter of 810 mm, and the wrapping film had a roughness of No. 1000 and a width of 80 mm.

【0015】[0015]

【表1】[Table 1]

【0016】研磨前はロールの粗さをRa≒0.3μm
にし、研磨後の粗さをRa≒0.1μmを目標として従
来方法は回転砥石のみで、一方、本発明方法では疵取り
、寸法出しの粗研磨は回転砥石で、仕上研磨はラッピン
グフィルムで行った。このときの研磨条件を表1に示す
[0016] Before polishing, the roughness of the roll is Ra≒0.3 μm.
The target roughness after polishing is Ra≒0.1μm.The conventional method uses only a rotary grindstone, whereas in the method of the present invention, rough polishing for removing defects and dimensioning is performed using a rotary grindstone, and final polishing is performed using a lapping film. Ta. Table 1 shows the polishing conditions at this time.

【0017】表1は粗研磨は同条件で回転砥石で研磨し
た後、仕上研磨のみ、従来方法と本発明の方法で比較研
磨したものである。従来方法では研磨状況が刻々と変化
するため、ロール撓み調整を使わざるを得なかった。こ
の場合、撓み調整は熟練者が行い、再研磨は無かった。
Table 1 shows rough polishing using a rotary grindstone under the same conditions, followed by final polishing, which is a comparison between the conventional method and the method of the present invention. In the conventional method, because the polishing conditions change every moment, roll deflection adjustment had to be used. In this case, the deflection adjustment was performed by a skilled person, and there was no repolishing.

【0018】結果は、従来方法ではRa=1.13μm
(N=22の平均)、σ=0,25μmとなり、本方法
ではRa=1.08μm(N=18の平均)、σ=0.
07μmとなり、明らかに本方法によるものがバラツキ
が少なく品質向上を図ることができた。なお、コストを
無視すれば粗研磨から仕上研磨までフィルム研磨が可能
で、例えば仕上の異なるフィルムを並列し、粗研磨と仕
上研磨でフィルムを変えれば完全な省力化が可能となる
The result is that in the conventional method, Ra = 1.13 μm.
(average of N=22), σ=0.25 μm, and in this method, Ra=1.08 μm (average of N=18), σ=0.
07 μm, clearly indicating that the method according to the present invention had less variation and was able to improve the quality. Note that if cost is ignored, film polishing from rough polishing to final polishing is possible. For example, if films with different finishes are placed side by side and the films are changed between rough polishing and final polishing, complete labor savings are possible.

【0019】[0019]

【発明の効果】以上説明したように、本発明による方法
で研磨することによってロール表面粗度のバラツキが小
さくなった。(実験例において、Ra=0.1μm目標
に対し、従来方法ではσ=0.25μm、本発明方法で
はσ=0.07μm)。また、仕上研磨でのロール撓み
調整が不必要となった。さらに、従来方法では約3%程
度、仕上研磨のやり直しを要したが、本方法では全く不
要であった。
[Effects of the Invention] As explained above, by polishing according to the method of the present invention, the variation in roll surface roughness is reduced. (In the experimental example, for the target Ra=0.1 μm, σ=0.25 μm in the conventional method and σ=0.07 μm in the method of the present invention). Additionally, roll deflection adjustment during final polishing is no longer necessary. Furthermore, while the conventional method required redoing the final polishing by about 3%, this method did not require it at all.

【0020】以上により、ロール表面粗度品質の向上、
ロール撓み調整の省力、仕上研磨のやり直し減による能
率向上が図られた。
[0020] As a result of the above, the roll surface roughness quality can be improved;
Efficiency has been improved by saving labor in adjusting roll deflection and reducing rework of final polishing.

【図面の簡単な説明】[Brief explanation of the drawing]

【図1】本発明による研磨を行うための研磨装置の概要
図である。
FIG. 1 is a schematic diagram of a polishing apparatus for performing polishing according to the present invention.

【図2】本発明による仕上研磨部の斜視図である。FIG. 2 is a perspective view of a final polishing section according to the present invention.

【図3】研磨フィルムの接触圧を一定に保つ手段の側面
図である。
FIG. 3 is a side view of means for keeping the contact pressure of the polishing film constant.

【図4】研磨フィルムの拡大断面図である。FIG. 4 is an enlarged cross-sectional view of the polishing film.

【図5】回転砥石の斜視図である。FIG. 5 is a perspective view of a rotating grindstone.

【図6】従来例による研磨装置の概要図である。FIG. 6 is a schematic diagram of a conventional polishing apparatus.

【図7】従来例におけるロール撓み装置の作用を示す断
面図である。
FIG. 7 is a sectional view showing the operation of a roll deflecting device in a conventional example.

【符号の説明】[Explanation of symbols]

1    回転砥石 4    圧延機用小径ロール 14  研磨フィルム 1 Rotating whetstone 4 Small diameter roll for rolling mill 14 Polishing film

Claims (1)

【特許請求の範囲】[Claims] 【請求項1】  圧延機用小径ロールの研磨に際し、疵
取り、寸法出しを行う粗研磨は回転砥石を使用し、表面
の粗度調整を行なう仕上研磨は表面に砥粒を吹付けて薄
く層成した研磨フィルムを、前記小径ロールとの接触圧
力を変えずに一定送りで研磨することを特徴とする圧延
機用小径ロールの研磨方法。
Claim 1: When polishing small-diameter rolls for rolling mills, a rotary grindstone is used for rough polishing to remove defects and size, and for final polishing to adjust the surface roughness, a thin layer is sprayed onto the surface by spraying abrasive grains. A method for polishing a small-diameter roll for a rolling mill, comprising polishing the resulting polishing film at a constant feed without changing the contact pressure with the small-diameter roll.
JP4336991A 1991-03-08 1991-03-08 Method for grinding small diameter roll for rolling mill Pending JPH04279206A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP4336991A JPH04279206A (en) 1991-03-08 1991-03-08 Method for grinding small diameter roll for rolling mill

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP4336991A JPH04279206A (en) 1991-03-08 1991-03-08 Method for grinding small diameter roll for rolling mill

Publications (1)

Publication Number Publication Date
JPH04279206A true JPH04279206A (en) 1992-10-05

Family

ID=12661931

Family Applications (1)

Application Number Title Priority Date Filing Date
JP4336991A Pending JPH04279206A (en) 1991-03-08 1991-03-08 Method for grinding small diameter roll for rolling mill

Country Status (1)

Country Link
JP (1) JPH04279206A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009142955A (en) * 2007-12-17 2009-07-02 Shin Etsu Polymer Co Ltd Grinding device, and conductive roller manufacturing method
CN104942011A (en) * 2015-06-17 2015-09-30 铜陵市大明玛钢有限责任公司 Surface maintenance method for high chrome roller

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009142955A (en) * 2007-12-17 2009-07-02 Shin Etsu Polymer Co Ltd Grinding device, and conductive roller manufacturing method
CN104942011A (en) * 2015-06-17 2015-09-30 铜陵市大明玛钢有限责任公司 Surface maintenance method for high chrome roller

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