JPH0427617U - - Google Patents
Info
- Publication number
- JPH0427617U JPH0427617U JP6811990U JP6811990U JPH0427617U JP H0427617 U JPH0427617 U JP H0427617U JP 6811990 U JP6811990 U JP 6811990U JP 6811990 U JP6811990 U JP 6811990U JP H0427617 U JPH0427617 U JP H0427617U
- Authority
- JP
- Japan
- Prior art keywords
- molded body
- lead wire
- wall
- glass
- airtight container
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 claims description 3
- 239000002184 metal Substances 0.000 claims description 2
- 239000011521 glass Substances 0.000 claims 2
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
Landscapes
- Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)
Description
第１図は本考案の圧電素子用気密容器の一実施
例の断面図である。第２図および第３図は別の実
施例の部分断面図である。第４図は従来例の断面
図である。
１……底面、２……壁部、４，４′……リード
線、５……水晶片、６，６′……接着剤、７……
蓋、９……金属体、１０……半田。
FIG. 1 is a sectional view of an embodiment of an airtight container for a piezoelectric element according to the present invention. 2 and 3 are partial cross-sectional views of another embodiment. FIG. 4 is a sectional view of a conventional example. 1... Bottom, 2... Wall, 4, 4'... Lead wire, 5... Crystal piece, 6, 6'... Adhesive, 7...
Lid, 9...metal body, 10...solder.
Claims (1)
る成形体と、その成形体を貫通するリード線を有
し、壁部の上面に平板状の蓋を固着してなる圧電
素子用気密容器において、 底面と壁部をガラスで一体成形するとともに、
成形体を貫通するリード線および壁部の上面に金
属体をガラスと一体溶着としたことを特徴とする
圧電素子用気密容器。[Claims for Utility Model Registration] A molded body having a flat bottom and walls around the four peripheries of the bottom, a lead wire passing through the molded body, and a flat lid fixed to the top of the wall. In this airtight container for piezoelectric elements, the bottom and walls are integrally molded with glass, and
An airtight container for a piezoelectric element, characterized in that a lead wire passing through the molded body and a metal body are integrally welded to glass on the upper surface of the wall.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6811990U JPH0427617U (en) | 1990-06-27 | 1990-06-27 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6811990U JPH0427617U (en) | 1990-06-27 | 1990-06-27 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0427617U true JPH0427617U (en) | 1992-03-05 |
Family
ID=31602285
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP6811990U Pending JPH0427617U (en) | 1990-06-27 | 1990-06-27 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0427617U (en) |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH01240450A (en) * | 1988-03-16 | 1989-09-26 | Nippon Dempa Kogyo Co Ltd | Container of electronic part |
| JPH0220045A (en) * | 1988-07-08 | 1990-01-23 | Goto Seisakusho:Kk | Semiconductor device and packaging method thereof |
-
1990
- 1990-06-27 JP JP6811990U patent/JPH0427617U/ja active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH01240450A (en) * | 1988-03-16 | 1989-09-26 | Nippon Dempa Kogyo Co Ltd | Container of electronic part |
| JPH0220045A (en) * | 1988-07-08 | 1990-01-23 | Goto Seisakusho:Kk | Semiconductor device and packaging method thereof |