JPH04272955A - Polyester resin composition - Google Patents
Polyester resin compositionInfo
- Publication number
- JPH04272955A JPH04272955A JP5790591A JP5790591A JPH04272955A JP H04272955 A JPH04272955 A JP H04272955A JP 5790591 A JP5790591 A JP 5790591A JP 5790591 A JP5790591 A JP 5790591A JP H04272955 A JPH04272955 A JP H04272955A
- Authority
- JP
- Japan
- Prior art keywords
- polyester resin
- parts
- weight
- resin composition
- thermal conductivity
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229920001225 polyester resin Polymers 0.000 title claims abstract description 13
- 239000004645 polyester resin Substances 0.000 title claims abstract description 13
- 239000000203 mixture Substances 0.000 title claims abstract description 12
- 229910052751 metal Inorganic materials 0.000 claims abstract description 10
- 239000002184 metal Substances 0.000 claims abstract description 10
- 229910044991 metal oxide Inorganic materials 0.000 claims abstract description 9
- 150000004706 metal oxides Chemical class 0.000 claims abstract description 9
- 229910052582 BN Inorganic materials 0.000 claims abstract description 8
- PZNSFCLAULLKQX-UHFFFAOYSA-N Boron nitride Chemical compound N#B PZNSFCLAULLKQX-UHFFFAOYSA-N 0.000 claims abstract description 8
- -1 polyethylene terephthalate Polymers 0.000 claims description 14
- 150000004767 nitrides Chemical class 0.000 claims description 8
- 239000011256 inorganic filler Substances 0.000 claims description 6
- 229910003475 inorganic filler Inorganic materials 0.000 claims description 6
- 239000012779 reinforcing material Substances 0.000 claims description 6
- 229920001707 polybutylene terephthalate Polymers 0.000 claims description 4
- 229920000728 polyester Polymers 0.000 claims description 4
- 229920000139 polyethylene terephthalate Polymers 0.000 claims description 4
- 239000005020 polyethylene terephthalate Substances 0.000 claims description 4
- WSQZNZLOZXSBHA-UHFFFAOYSA-N 3,8-dioxabicyclo[8.2.2]tetradeca-1(12),10,13-triene-2,9-dione Chemical compound O=C1OCCCCOC(=O)C2=CC=C1C=C2 WSQZNZLOZXSBHA-UHFFFAOYSA-N 0.000 claims description 3
- LLLVZDVNHNWSDS-UHFFFAOYSA-N 4-methylidene-3,5-dioxabicyclo[5.2.2]undeca-1(9),7,10-triene-2,6-dione Chemical compound C1(C2=CC=C(C(=O)OC(=C)O1)C=C2)=O LLLVZDVNHNWSDS-UHFFFAOYSA-N 0.000 claims description 3
- 229920001634 Copolyester Polymers 0.000 claims description 2
- 230000017525 heat dissipation Effects 0.000 abstract description 9
- 238000010292 electrical insulation Methods 0.000 abstract description 4
- 238000000465 moulding Methods 0.000 abstract 1
- 150000002825 nitriles Chemical class 0.000 abstract 1
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 5
- 238000000034 method Methods 0.000 description 5
- 229920003002 synthetic resin Polymers 0.000 description 5
- 239000000057 synthetic resin Substances 0.000 description 5
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 4
- XLOMVQKBTHCTTD-UHFFFAOYSA-N Zinc monoxide Chemical compound [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 description 4
- 239000000835 fiber Substances 0.000 description 4
- 239000000945 filler Substances 0.000 description 4
- 238000002156 mixing Methods 0.000 description 4
- 239000011342 resin composition Substances 0.000 description 4
- 238000012546 transfer Methods 0.000 description 4
- DNIAPMSPPWPWGF-UHFFFAOYSA-N Propylene glycol Chemical compound CC(O)CO DNIAPMSPPWPWGF-UHFFFAOYSA-N 0.000 description 3
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 3
- 238000005452 bending Methods 0.000 description 3
- MTHSVFCYNBDYFN-UHFFFAOYSA-N diethylene glycol Chemical compound OCCOCCO MTHSVFCYNBDYFN-UHFFFAOYSA-N 0.000 description 3
- 239000003365 glass fiber Substances 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- QPFMBZIOSGYJDE-UHFFFAOYSA-N 1,1,2,2-tetrachloroethane Chemical compound ClC(Cl)C(Cl)Cl QPFMBZIOSGYJDE-UHFFFAOYSA-N 0.000 description 2
- VTYYLEPIZMXCLO-UHFFFAOYSA-L Calcium carbonate Chemical compound [Ca+2].[O-]C([O-])=O VTYYLEPIZMXCLO-UHFFFAOYSA-L 0.000 description 2
- OFOBLEOULBTSOW-UHFFFAOYSA-N Malonic acid Chemical compound OC(=O)CC(O)=O OFOBLEOULBTSOW-UHFFFAOYSA-N 0.000 description 2
- UFWIBTONFRDIAS-UHFFFAOYSA-N Naphthalene Chemical compound C1=CC=CC2=CC=CC=C21 UFWIBTONFRDIAS-UHFFFAOYSA-N 0.000 description 2
- KKEYFWRCBNTPAC-UHFFFAOYSA-N Terephthalic acid Chemical compound OC(=O)C1=CC=C(C(O)=O)C=C1 KKEYFWRCBNTPAC-UHFFFAOYSA-N 0.000 description 2
- WNLRTRBMVRJNCN-UHFFFAOYSA-N adipic acid Chemical compound OC(=O)CCCCC(O)=O WNLRTRBMVRJNCN-UHFFFAOYSA-N 0.000 description 2
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 2
- 239000003795 chemical substances by application Substances 0.000 description 2
- 150000001875 compounds Chemical class 0.000 description 2
- USIUVYZYUHIAEV-UHFFFAOYSA-N diphenyl ether Chemical compound C=1C=CC=CC=1OC1=CC=CC=C1 USIUVYZYUHIAEV-UHFFFAOYSA-N 0.000 description 2
- QQVIHTHCMHWDBS-UHFFFAOYSA-N isophthalic acid Chemical compound OC(=O)C1=CC=CC(C(O)=O)=C1 QQVIHTHCMHWDBS-UHFFFAOYSA-N 0.000 description 2
- 238000004898 kneading Methods 0.000 description 2
- 239000007769 metal material Substances 0.000 description 2
- CXMXRPHRNRROMY-UHFFFAOYSA-N sebacic acid Chemical compound OC(=O)CCCCCCCCC(O)=O CXMXRPHRNRROMY-UHFFFAOYSA-N 0.000 description 2
- 238000012360 testing method Methods 0.000 description 2
- 239000011787 zinc oxide Substances 0.000 description 2
- PUPZLCDOIYMWBV-UHFFFAOYSA-N (+/-)-1,3-Butanediol Chemical compound CC(O)CCO PUPZLCDOIYMWBV-UHFFFAOYSA-N 0.000 description 1
- 239000005995 Aluminium silicate Substances 0.000 description 1
- 229920000049 Carbon (fiber) Polymers 0.000 description 1
- BPQQTUXANYXVAA-UHFFFAOYSA-N Orthosilicate Chemical compound [O-][Si]([O-])([O-])[O-] BPQQTUXANYXVAA-UHFFFAOYSA-N 0.000 description 1
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 1
- 229910052581 Si3N4 Inorganic materials 0.000 description 1
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 1
- ORLQHILJRHBSAY-UHFFFAOYSA-N [1-(hydroxymethyl)cyclohexyl]methanol Chemical compound OCC1(CO)CCCCC1 ORLQHILJRHBSAY-UHFFFAOYSA-N 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- 239000001361 adipic acid Substances 0.000 description 1
- 235000011037 adipic acid Nutrition 0.000 description 1
- 235000012211 aluminium silicate Nutrition 0.000 description 1
- 239000003963 antioxidant agent Substances 0.000 description 1
- 230000003078 antioxidant effect Effects 0.000 description 1
- 239000010425 asbestos Substances 0.000 description 1
- 239000011324 bead Substances 0.000 description 1
- 229910000019 calcium carbonate Inorganic materials 0.000 description 1
- 239000004917 carbon fiber Substances 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 239000004927 clay Substances 0.000 description 1
- 229910052570 clay Inorganic materials 0.000 description 1
- 239000003086 colorant Substances 0.000 description 1
- 230000000052 comparative effect Effects 0.000 description 1
- 238000007334 copolymerization reaction Methods 0.000 description 1
- PMHQVHHXPFUNSP-UHFFFAOYSA-M copper(1+);methylsulfanylmethane;bromide Chemical compound Br[Cu].CSC PMHQVHHXPFUNSP-UHFFFAOYSA-M 0.000 description 1
- 239000003431 cross linking reagent Substances 0.000 description 1
- 239000003484 crystal nucleating agent Substances 0.000 description 1
- 238000002425 crystallisation Methods 0.000 description 1
- 230000008025 crystallization Effects 0.000 description 1
- NJLLQSBAHIKGKF-UHFFFAOYSA-N dipotassium dioxido(oxo)titanium Chemical compound [K+].[K+].[O-][Ti]([O-])=O NJLLQSBAHIKGKF-UHFFFAOYSA-N 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 239000010440 gypsum Substances 0.000 description 1
- 229910052602 gypsum Inorganic materials 0.000 description 1
- WGCNASOHLSPBMP-UHFFFAOYSA-N hydroxyacetaldehyde Natural products OCC=O WGCNASOHLSPBMP-UHFFFAOYSA-N 0.000 description 1
- 239000012784 inorganic fiber Substances 0.000 description 1
- NLYAJNPCOHFWQQ-UHFFFAOYSA-N kaolin Chemical compound O.O.O=[Al]O[Si](=O)O[Si](=O)O[Al]=O NLYAJNPCOHFWQQ-UHFFFAOYSA-N 0.000 description 1
- 239000000314 lubricant Substances 0.000 description 1
- 239000000395 magnesium oxide Substances 0.000 description 1
- CPLXHLVBOLITMK-UHFFFAOYSA-N magnesium oxide Inorganic materials [Mg]=O CPLXHLVBOLITMK-UHFFFAOYSA-N 0.000 description 1
- AXZKOIWUVFPNLO-UHFFFAOYSA-N magnesium;oxygen(2-) Chemical compound [O-2].[Mg+2] AXZKOIWUVFPNLO-UHFFFAOYSA-N 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 239000010445 mica Substances 0.000 description 1
- 229910052618 mica group Inorganic materials 0.000 description 1
- 239000012046 mixed solvent Substances 0.000 description 1
- SLCVBVWXLSEKPL-UHFFFAOYSA-N neopentyl glycol Chemical compound OCC(C)(C)CO SLCVBVWXLSEKPL-UHFFFAOYSA-N 0.000 description 1
- RVTZCBVAJQQJTK-UHFFFAOYSA-N oxygen(2-);zirconium(4+) Chemical compound [O-2].[O-2].[Zr+4] RVTZCBVAJQQJTK-UHFFFAOYSA-N 0.000 description 1
- 239000008188 pellet Substances 0.000 description 1
- 230000000704 physical effect Effects 0.000 description 1
- 239000004014 plasticizer Substances 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229910052895 riebeckite Inorganic materials 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 1
- 229910052814 silicon oxide Inorganic materials 0.000 description 1
- 239000000454 talc Substances 0.000 description 1
- 229910052623 talc Inorganic materials 0.000 description 1
- 125000000383 tetramethylene group Chemical group [H]C([H])([*:1])C([H])([H])C([H])([H])C([H])([H])[*:2] 0.000 description 1
- OGIDPMRJRNCKJF-UHFFFAOYSA-N titanium oxide Inorganic materials [Ti]=O OGIDPMRJRNCKJF-UHFFFAOYSA-N 0.000 description 1
- 239000006097 ultraviolet radiation absorber Substances 0.000 description 1
- 239000010456 wollastonite Substances 0.000 description 1
- 229910052882 wollastonite Inorganic materials 0.000 description 1
- 229910001928 zirconium oxide Inorganic materials 0.000 description 1
Abstract
Description
【０００１】0001
【産業上の利用分野】本発明は樹脂組成物に関し、さら
に詳しくは熱伝導性、放熱性、成形加工性、機械的強度
等において優れたポリエステル樹脂組成物に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a resin composition, and more particularly to a polyester resin composition excellent in thermal conductivity, heat dissipation, moldability, mechanical strength, etc.
【０００２】0002
【従来の技術】ポリエステル樹脂は、耐熱性、寸法安定
性などの優れた特性を有しているため、電気、電子、精
密機器、自動車部品等の用途が拡大しており、従来から
使用されていた金属材料が合成樹脂材料に転換されつつ
ある。[Prior Art] Polyester resin has excellent properties such as heat resistance and dimensional stability, so its uses in electrical, electronic, precision equipment, automobile parts, etc. are expanding, and it has been used for a long time. Traditional metal materials are being converted to synthetic resin materials.
【０００３】しかし、合成樹脂材料は熱伝導率が金属材
料に較べて極めて小さいため、熱伝導性、放熱性に劣り
、各種機器や設備から発生する熱により合成樹脂の軟化
、溶融、劣化あるいは分解を起こしやすいという欠点が
ある。However, synthetic resin materials have extremely low thermal conductivity compared to metal materials, so they are inferior in thermal conductivity and heat dissipation, and the heat generated from various devices and equipment can cause synthetic resins to soften, melt, deteriorate, or decompose. The disadvantage is that it is easy to cause
【０００４】このため、合成樹脂に金属を配合し、合成
樹脂の熱伝導性および放熱性を付与させようとする方法
が提案されているが、この方法では同時に電気伝導性が
付与されるため、電気絶縁性を要求されるような分野に
は使用することができないという欠点がある。[0004] For this reason, a method has been proposed in which a metal is blended into a synthetic resin to impart thermal conductivity and heat dissipation to the synthetic resin, but this method also imparts electrical conductivity. It has the disadvantage that it cannot be used in fields that require electrical insulation.
【０００５】[0005]
【発明が解決しようとする課題】本発明は、このような
従来技術の欠点を克服し、熱伝導性、放熱性、成形加工
性、機械的強度等において優れたポリエステル樹脂組成
物を提供することを目的としてなされたものである。[Problems to be Solved by the Invention] An object of the present invention is to overcome these drawbacks of the prior art and provide a polyester resin composition that is excellent in thermal conductivity, heat dissipation, moldability, mechanical strength, etc. This was done for the purpose of
【０００６】[0006]
【課題を解決するための手段】本発明者らは、前記目的
を達成するために鋭意研究を重ねた結果、ポリエステル
樹脂に伝熱フィラーとして金属酸化物、金属窒化物、窒
化ホウ素より選ばれる１種以上を配合することにより、
前記目的を達成することを見出し、本発明を完成するに
到った。すなわち本発明は、ポリエチレンテレフタレー
トもしくは、８０モル％以上のエチレンテレフタレート
繰り返し単位を含む共重合ポリエステルおよび／または
ポリブチレンテレフタレートもしくは、８０モル％以上
のブチレンテレフタレート繰り返し単位を含む共重合ポ
リエステル１０〜９０重量部および金属酸化物、金属窒
化物、窒化ホウ素より選ばれる１種以上９０〜１０重量
部を合計１００重量部として、さらに繊維状強化材０〜
２００重量部および／または無機フィラー０〜２００重
量部含有することを特徴とするポリエステル樹脂組成物
である。[Means for Solving the Problems] As a result of extensive research to achieve the above object, the present inventors have developed a heat transfer filler containing a material selected from metal oxides, metal nitrides, and boron nitride for polyester resin. By blending more than one species,
The inventors have found that the above object can be achieved and have completed the present invention. That is, the present invention provides 10 to 90 parts by weight of polyethylene terephthalate or a copolyester containing 80 mol% or more of ethylene terephthalate repeating units and/or polybutylene terephthalate or a copolymerized polyester containing 80 mol% or more of butylene terephthalate repeating units. and 90 to 10 parts by weight of one or more selected from metal oxides, metal nitrides, and boron nitride, to a total of 100 parts by weight, and 0 to 10 parts by weight of fibrous reinforcing material.
A polyester resin composition characterized by containing 200 parts by weight and/or 0 to 200 parts by weight of an inorganic filler.
【０００７】本発明において使用されるポリエステル樹
脂としては、ポリエチレンテレフタレートもしくは、８
０モル％以上のエチレンテレフタレート繰り返し単位を
含む共重合ポリエステルおよび／またはポリブチレンテ
レフタレートもしくは、８０モル％以上のブチレンテレ
フタレート繰り返し単位を含む共重合ポリエステルであ
り、主成分であるテレフタル酸、エチレングリコールま
たはブチレングリコール以外の共重合成分としては、た
とえばイソフタル酸、ナフタレン１，４または２，６ジ
カルボン酸、ジフェニールエーテル４，４ジカルボン酸
などの芳香族ジカルボン酸、アジピン酸、セバシン酸な
どの脂肪族ジカルボン酸、プロピレングリコール、ブチ
レングリコール、ジエチレングリコール、ネオペンチル
グリコールなどの脂肪族ジオール、シクロヘキサンジメ
タノールなどの脂環族ジオール、２，２−ビス（４−ヒ
ドロキシフェニール）プロパンなどの芳香族ジオール、
Ｐ−オキシ安息香酸、Ｐ−ヒドロキシエトキシ安息香酸
などのオキシ酸等が挙げられる。なお、前記ポリエステ
ル樹脂はフェノール／テトラクロロエタン混合溶媒（６
／４重量比）により３０℃で測定して求めた固有粘度が
通常０．４以上であり、０．５以上が好ましい。The polyester resin used in the present invention is polyethylene terephthalate or 8
A copolymerized polyester containing 0 mol% or more of ethylene terephthalate repeating units and/or polybutylene terephthalate, or a copolymerized polyester containing 80 mol% or more of butylene terephthalate repeating units, the main components of which are terephthalic acid, ethylene glycol, or butylene. Examples of copolymerization components other than glycol include aromatic dicarboxylic acids such as isophthalic acid, naphthalene 1,4 or 2,6 dicarboxylic acid, and diphenyl ether 4,4 dicarboxylic acid; aliphatic dicarboxylic acids such as adipic acid and sebacic acid; , aliphatic diols such as propylene glycol, butylene glycol, diethylene glycol, and neopentyl glycol, alicyclic diols such as cyclohexanedimethanol, aromatic diols such as 2,2-bis(4-hydroxyphenyl)propane,
Examples include oxyacids such as P-oxybenzoic acid and P-hydroxyethoxybenzoic acid. The polyester resin was prepared using a phenol/tetrachloroethane mixed solvent (6
/4 weight ratio) at 30° C. is usually 0.4 or more, preferably 0.5 or more.
【０００８】本発明において使用される伝熱フィラーと
しては、金属酸化物、金属窒化物、窒化ホウ素より選ば
れる１種以上であり、金属酸化物の具体例としては、ア
ルミナ、酸化亜鉛、酸化ケイ素、酸化ジルコニウム、酸
化チタン、酸化マグネシウム等が挙げられる。また、金
属窒化物の具体例としては、窒化ケイ素、窒化アルミニ
ウムなどが挙げられる。The heat transfer filler used in the present invention is one or more selected from metal oxides, metal nitrides, and boron nitride, and specific examples of metal oxides include alumina, zinc oxide, and silicon oxide. , zirconium oxide, titanium oxide, magnesium oxide, etc. Furthermore, specific examples of metal nitrides include silicon nitride, aluminum nitride, and the like.
【０００９】さらに、本発明において使用される繊維状
強化材および／または無機フィラーは、必要に応じてポ
リエステル樹脂と金属酸化物、金属窒化物、窒化ホウ素
より選ばれる１種以上の伝熱フィラーとの合計１００重
量部に対して２００重量部を越えない範囲で配合するこ
とにより、強度、剛性、耐熱性、寸法安定性などの向上
を図ることが可能である。繊維状強化材の具体例として
は、ガラス繊維、シリカガラス繊維、アルミナ繊維、石
膏繊維、セラミック繊維、アスベスト繊維などの無機繊
維、チタン酸カリウムウィスカー、酸化亜鉛ウィスカー
などのウィスカーおよび炭素繊維などが挙げられる。ま
た、無機フィラーの具体例としては、ワラストナイト、
カオリン、マイカ、セリサイト、クレー、タルク、アル
ミナシリケート、ガラスビーズ、ミルドガラスファイバ
ー、炭酸カルシウム、シリカなどが挙げられる。Furthermore, the fibrous reinforcing material and/or inorganic filler used in the present invention may optionally be a polyester resin and one or more heat transfer fillers selected from metal oxides, metal nitrides, and boron nitride. By adding not more than 200 parts by weight to a total of 100 parts by weight, it is possible to improve strength, rigidity, heat resistance, dimensional stability, etc. Specific examples of fibrous reinforcing materials include inorganic fibers such as glass fibers, silica glass fibers, alumina fibers, gypsum fibers, ceramic fibers, and asbestos fibers, whiskers such as potassium titanate whiskers and zinc oxide whiskers, and carbon fibers. It will be done. In addition, specific examples of inorganic fillers include wollastonite,
Examples include kaolin, mica, sericite, clay, talc, alumina silicate, glass beads, milled glass fiber, calcium carbonate, and silica.
【００１０】本発明組成物には、用途、目的等に応じて
、例えば、結晶化促進剤、結晶核剤、酸化防止剤、紫外
線吸収剤、可塑剤、滑剤、着色剤、摺動性付与剤、多官
能性架橋剤、耐衝撃性付与剤等を配合してもよい。さら
に本発明の目的を損なわない程度の他の種類の樹脂をブ
レンドすることもできる。The composition of the present invention may contain, depending on the use and purpose, for example, a crystallization accelerator, a crystal nucleating agent, an antioxidant, an ultraviolet absorber, a plasticizer, a lubricant, a coloring agent, and a sliding property imparting agent. , a polyfunctional crosslinking agent, an impact resistance imparting agent, etc. may be added. Furthermore, other types of resins may be blended as long as they do not impede the purpose of the present invention.
【００１１】本発明組成物の製造方法としては、特に限
定されるものではなく、任意の方法で行なうことができ
る。例えば、全成分を予備混合した後、押出機やニーダ
中で混練する方法や、予め任意の数成分を押出機やニー
ダ中で混練配合して得たペレットに、更に他の成分を溶
融混合する方法等が挙げられる。The method for producing the composition of the present invention is not particularly limited, and any method can be used. For example, after premixing all the components, kneading them in an extruder or kneader, or by kneading and blending any number of components in an extruder or kneader in advance and then melt-mixing other components into pellets. Examples include methods.
【００１２】0012
【作 用】本発明の組成物は、ポリエステル樹脂に伝
熱フィラーとして金属酸化物、金属窒化物、窒化ホウ素
より選ばれる１種以上を配合し、さらに必要に応じて、
繊維状強化材および／または無機フィラーを配合するこ
とにより、熱伝導性、放熱性、成形加工性、機械的強度
等において優れた樹脂組成物を得ることができる。[Function] The composition of the present invention contains one or more heat transfer fillers selected from metal oxides, metal nitrides, and boron nitride in a polyester resin, and if necessary,
By blending a fibrous reinforcing material and/or an inorganic filler, a resin composition excellent in thermal conductivity, heat dissipation, moldability, mechanical strength, etc. can be obtained.
【００１３】[0013]
【実施例】以下、実施例をあげて本発明をさらに具体的
に説明するが、本発明は、これにより限定されるもので
はない。なお、実施例中の各種物性値は、以下の方法に
よって測定した。
（１） 曲げ強度および曲げ弾性率
ＡＳＴＭ Ｄ−７９０ に準じて測定した。
（２） 熱伝導率
１００×１００×３ｍｍｔ の平板を成形し、それを３
枚重ね合わせた試料を作成し、京都電子工業社製の迅速
熱伝導率計（Ｋｅｍｔｈｅｒｍ ＱＴＭ−Ｄ３ ）を用
いて、熱伝導率を測定した。
（３） 体積固有抵抗の測定
ＡＳＴＭ Ｄ−２５７ に準じて測定した。[Examples] The present invention will be explained in more detail with reference to Examples below, but the present invention is not limited thereto. In addition, various physical property values in Examples were measured by the following methods. (1) Bending strength and bending modulus Measured according to ASTM D-790. (2) Form a flat plate with a thermal conductivity of 100 x 100 x 3 mmt, and
A sample was prepared by stacking the sheets, and the thermal conductivity was measured using a rapid thermal conductivity meter (Kemtherm QTM-D3) manufactured by Kyoto Electronics Industry Co., Ltd. (3) Measurement of volume resistivity Measured according to ASTM D-257.
【００１４】実施例１〜６、比較例１〜６”表１”に示
した配合割合のポリエチレンテレフタレート（極限粘度
０．６２）、ポリブチレンテレフタレート（極限粘度１
．１）、各種の金属酸化物、金属窒化物、窒化ホウ素、
繊維状強化材および／または無機フィラーを予備混合し
た後、２軸押出機のホッパーに投入し、シリンダー温度
２７０℃にて溶融混練してコンパウンドチップを得た。
このコンパウンドチップを１３０℃で４時間乾燥した後
、シリンダー温度２６０−２６５−２７０℃に調節した
射出成形機によりテストピースおよび１００×１００×
３ｍｍｔ 平板を成形し、曲げ試験、熱伝導率および体
積固有抵抗を測定した。その結果を”表１”に示す。Examples 1 to 6, Comparative Examples 1 to 6 Polyethylene terephthalate (intrinsic viscosity 0.62) and polybutylene terephthalate (intrinsic viscosity 1
．． 1) Various metal oxides, metal nitrides, boron nitride,
After premixing the fibrous reinforcing material and/or inorganic filler, the mixture was charged into a hopper of a twin-screw extruder and melt-kneaded at a cylinder temperature of 270° C. to obtain compound chips. After drying this compound chip at 130℃ for 4 hours, a test piece and a 100×100×
A 3 mmt flat plate was formed, and the bending test, thermal conductivity, and volume resistivity were measured. The results are shown in "Table 1".
【００１５】[0015]
【表１】[Table 1]
【００１６】[0016]
【発明の効果】本発明樹脂組成物を用いて製造した成形
品は、電気絶縁性を有すると共に、熱伝導性、放熱性に
優れ、かつ優れた機械的特性を有している。したがって
、本発明樹脂組成物は、電子部品のハウジングなどの機
械的強度、電気絶縁性及び放熱性を要求される部分への
利用が期待され、産業界に寄与すること大である。[Effects of the Invention] Molded articles manufactured using the resin composition of the present invention have electrical insulation properties, excellent thermal conductivity and heat dissipation properties, and excellent mechanical properties. Therefore, the resin composition of the present invention is expected to be used in parts that require mechanical strength, electrical insulation, and heat dissipation properties, such as housings of electronic parts, and will greatly contribute to the industrial world.
Claims (1)
、８０モル％以上のエチレンテレフタレート繰り返し単
位を含む共重合ポリエステルおよび／またはポリブチレ
ンテレフタレートもしくは、８０モル％以上のブチレン
テレフタレート繰り返し単位を含む共重合ポリエステル
１０〜９０重量部および金属酸化物、金属窒化物、窒化
ホウ素より選ばれる１種以上９０〜１０重量部を合計１
００重量部として、さらに繊維状強化材０〜２００重量
部および／または無機フィラー０〜２００重量部含有す
ることを特徴とするポリエステル樹脂組成物。Claim 1: 10 to 90 parts by weight of polyethylene terephthalate or a copolyester containing 80 mol% or more of ethylene terephthalate repeating units and/or polybutylene terephthalate or a copolymerized polyester containing 80 mol% or more of butylene terephthalate repeating units. and a total of 90 to 10 parts by weight of one or more selected from metal oxides, metal nitrides, and boron nitride.
A polyester resin composition further containing 0 to 200 parts by weight of a fibrous reinforcing material and/or 0 to 200 parts by weight of an inorganic filler.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5790591A JPH04272955A (en) | 1991-02-27 | 1991-02-27 | Polyester resin composition |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5790591A JPH04272955A (en) | 1991-02-27 | 1991-02-27 | Polyester resin composition |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH04272955A true JPH04272955A (en) | 1992-09-29 |
Family
ID=13069007
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP5790591A Pending JPH04272955A (en) | 1991-02-27 | 1991-02-27 | Polyester resin composition |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH04272955A (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0782415A (en) * | 1993-07-23 | 1995-03-28 | Otsuka Chem Co Ltd | Resin composition for electronic part |
| JP2008239898A (en) * | 2007-03-28 | 2008-10-09 | Techno Polymer Co Ltd | Heat-radiating resin composition and molded article containing the same |
| JP2011148917A (en) * | 2010-01-22 | 2011-08-04 | Mitsubishi Engineering Plastics Corp | Thermally conductive polyalkylene terephthalate resin composition and resin molded body |
| CN110256819A (en) * | 2014-05-05 | 2019-09-20 | 朗盛德国有限责任公司 | Polymer blend |
-
1991
- 1991-02-27 JP JP5790591A patent/JPH04272955A/en active Pending
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0782415A (en) * | 1993-07-23 | 1995-03-28 | Otsuka Chem Co Ltd | Resin composition for electronic part |
| JP2008239898A (en) * | 2007-03-28 | 2008-10-09 | Techno Polymer Co Ltd | Heat-radiating resin composition and molded article containing the same |
| JP2011148917A (en) * | 2010-01-22 | 2011-08-04 | Mitsubishi Engineering Plastics Corp | Thermally conductive polyalkylene terephthalate resin composition and resin molded body |
| CN110256819A (en) * | 2014-05-05 | 2019-09-20 | 朗盛德国有限责任公司 | Polymer blend |
| JP2020090670A (en) * | 2014-05-05 | 2020-06-11 | ランクセス・ドイチュランド・ゲーエムベーハー | Polyester compositions |
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